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SEMI Press Release
SEMI 3D & Systems Summit to Spotlight Heterogeneous Integration as Key to Europe's Semiconductor Future
Industry Leaders to Gather in Dresden Next Week to Bolster Europe’s Industry AmbitionsDRESDEN, Germany — June 12, 2026 — The SEMI 3D & Systems Summit, taking place June 17–19, 2026 in...
SEMI Press Release
SEMICON Taiwan 2026 to Serve as Global Stage Where the Semiconductor Industry Defines What’s Next
Registration is Now OpenHSINCHU, Taiwan – June 15, 2026 – SEMICON Taiwan 2026, one of the global semiconductor industry’s flagship annual events, will be held September 2-4 at the Nangang...
Member Press Release
Brewer Science Releases 2026 Impact Report, Marks Eleventh Consecutive Year of Zero Waste to Landfill Certification
ESG progress, industry-first sustainability leadership and long-term governance goals
Rolla, Mo. — June 2, 2026 — Brewer Science, a global leader in developing and manufacturing next-generation...
Blog
Accelerating Sustainability with SEMI Smart Manufacturing: An Industry 4.0 Technology Roadmap for Semiconductor Device Makers to Improve Sustainability
The SEMI Smart Manufacturing Initiative is a global effort focused on leveraging the most advanced technology to enhance productivity of electronics manufacturing facilities. Among the key...
SEMI Press Release
European Commission Presents Chips Act 2.0 at SEMI Europe Policy Forum to Accelerate Semiconductor Innovation and Investment
Updated Framework Underscores Importance of Industry-Government Collaboration to Strengthen Europe’s CompetitivenessBRUSSELS – June 3, 2026 – The European Commission today officially...
SEMI Press Release
SEMI Reports Global Semiconductor Equipment Billings Increased 14% Year-Over-Year in Q1 2026
Record Quarterly Equipment Billings Reflect Continued AI-Driven InvestmentMILPITAS, Calif. – June 4, 2026 – SEMI, the industry association serving the global semiconductor and electronics design...
Blog
From Static Compliance to Operational Proof: The Next Phase of Semiconductor Manufacturing Cybersecurity
For years, cybersecurity in manufacturing was often treated as a mere compliance issue. Suppliers filled out questionnaires. A scan report was produced before shipment. A checklist was reviewed...
SEMI Press Release
SEMI Foundation and the U.S. National Science Foundation Launch First Four Regional Nodes of the National Network for Microelectronics Education (NNME)
National Workforce Infrastructure Initiative Activates More Than 325 Organizations Across the United States to Accelerate America’s Microelectronics Talent PipelineMILPITAS, Calif., May 26, 2026 —...
Blog
Enabling Co-Packaged Optics at Scale: The Critical Role of Wet Processing in Photonics Manufacturing
As artificial intelligence (AI) workloads surge and hyperscale data centers expand, the semiconductor industry is confronting fundamental limits in electrical interconnects. Co-packaged optics (CPO)...
SEMI Press Release
SEMI and Global Net Corp. Release New Report on Glass Core Substrate Market and Development Trends for Semiconductors
Report Projects 67.2% CAGR for Glass Core Substrates from 2028 to 2040 as AI and HPC Accelerate Demand for Advanced Packaging TechnologiesMILPITAS, Calif. — May 27, 2026 — SEMI, the industry...
Blog
SEMI Standards Update: Flexible Hybrid Electronics, Substrate Mapping, and New Activities Reflecting Industry Needs
The SEMI Standards team hit the ground running in 2026, starting this year with an important milestone to our Flexible Hybrid Electronics (FHE) standardization efforts. As FHE technology continues to...
Blog
From a Deck of Cards to a Company Movement
How imec turned a climate literacy workshop into a blueprint for sustainability engagement across the semiconductor industry. The StoryWouter de Groot had spent 9 years at imec in Business...