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Article
Technical Deep Dive: Devices, Materials, and Manufacturing for Sustainable AI
As AI workloads continue to scale, gains in performance and efficiency are increasingly determined by physical design choices at the device, materials, and manufacturing levels. This technical deep...
Blog
Large-Field Lithography: Imaging at the Intersection of Scale, Precision, and Throughput
Based on the SEMICON West session “Large-Field Lithography Tools for Dense Package Interconnects on Panels”Large-field lithography emerged as a focal point in the Advanced Imaging sessions,...
Blog
Securing Fab Data: From IP Protection to Vendor Governance
At SEMICON West, NY CREATES provided a deep examination of data security risks across semiconductor fabrication ecosystems. Their perspective reflected a reality that is becoming increasingly clear...
Blog
AI & Energy: Bending the Curve
Artificial intelligence (AI) is scaling at a pace that is reshaping semiconductor roadmaps, data center design, and long-term infrastructure strategy. AI promises many economic and social benefits;...
SEMI Press Release
SEMI 3D & Systems Summit to Advance Heterogeneous Systems Integration with Focus on AI, Hybrid Bonding, and Europe's Chiplet Ecosystem
DRESDEN, Germany — May 6, 2026 — Global experts in advanced semiconductor packaging and 3D integration will convene at the annual SEMI 3D & Systems Summit, June 17–19, 2026, in Dresden,...
Member Press Release
Brewer Science Earns 2026 USA TODAY Top Workplaces Award
Brewer Science Earns 2026 USA TODAY Top Workplaces Award
Employee-Owner Feedback Recognizes Company’s People-First Culture
Rolla, MO – April 14, 2026 – Brewer Science, Inc., a global leader in...
Member Press Release
Closing the Loop – Integrated Waste Gas & Water Treatment Solutions at SEMICON Southeast Asia 2026
Kuala Lumpur, Malaysia, 29 April 2026 – DAS Environmental Experts presents its latest sustainable technologies at SEMICON SEA 2026 (May 5–7, MITEC, Booth 1174). The focus is on closing resource loops...
Blog
Edge AI in Semiconductor Manufacturing: Powering Smart, Resilient Fabs
With edge AI emerging as a clear driver of smart manufacturing, SEMI hosted a two-day workshop detailing the future of this technology. The workshop, Smarter Sensors, Smarter Fabs: AI at...
SEMI Press Release
SEMI Europe Highlights Six Key Policy Recommendations to Optimize the Chips Act 2.0 into a Strategic Instrument for Europe
BRUSSELS – April 27, 2026 – SEMI Europe today announced the publication of its Position Paper on the Chips Act 2.0, presenting a set of strategic recommendations aimed at reinforcing...
SEMI Press Release
SEMI Appoints Julie Rogers Executive Director of the ESD Alliance
SEMI Veteran to Lead Global Programs Supporting EDA and Semiconductor EcosystemMILPITAS, Calif. — April 30, 2026 — SEMI, the industry association serving the global semiconductor...