SEMICON Europa 2026 to Spotlight Advanced Packaging, Fab Management, and Europe's Semiconductor Strategy for the AI Era

Key Attractions Include the Advanced Packaging Conference, Fab Management Forum, and Voices from the Industry Sessions 

MUNICH — October 27, 2026 — Semiconductor experts will convene at SEMICON Europa 2026 from November 10-13 at Messe München in Munich, Germany, to strategize next steps for boosting Europe’s industry competitiveness amidst rapid technological innovation.  The Advanced Packaging Conference (APC), Fab Management Forum (FMF), and Voices from the Industry Sessions at SEMICON Europa will focus on the technologies, strategies, and collaborations needed to sustain Europe's semiconductor competitiveness in the AI era. Co-located with electronica, SEMICON Europa is the region's premier event connecting the entire electronics design and manufacturing supply chain. Registration is open.

“As Europe navigates an increasingly complex geopolitical and technological landscape, advanced packaging is becoming a strategic pillar of semiconductor supply chain resilience,” said Laith Altimime, President of SEMI Europe. “By bringing together key technologies such as photonics, chiplets, and compound semiconductors, advanced packaging enables new levels of system integration, performance, and energy efficiency. Building these capabilities is essential to reducing supply chain vulnerabilities, securing access to strategic technologies, and reinforcing Europe’s technological sovereignty and industrial competitiveness.”

"The semiconductor industry is entering a new phase where advancements in AI, computing, and heterogeneous systems are redefining the boundaries of innovation,” said Patrick Vandenameele, CEO of imec, which is hosting the co-located imec Technology Forum (ITF). “Breakthroughs in areas such as chiplets, advanced packaging, silicon photonics, and next-generation memory will not happen in isolation but at the intersection of different technology domains. Strong ecosystems are essential to connect research, technology development, startups, and industry, and to turn pioneering ideas into innovations that have scalable impact."

SEMICON Europa 2026 Featured Programs

Advanced Packaging Conference

APC will examine how advanced packaging and test technologies are enabling continued performance gains as traditional device scaling reaches its limit. Key themes for APC 2026 include: 

• Europe’s Advanced Packaging Ecosystem: Market trends, pilot lines, supply chain developments, and material innovations shaping Europe’s advanced packaging capabilities.
• Heterogeneous Integration and Chiplets: Advances in wafer-and panel-level packaging, hybrid bonding, and scalable manufacturing for the AI-era.
• Inspection, Metrology, and Test: AI-powered inspection, high-resolution metrology, and advanced testing approaches for improving yield and reliability.
• Power Delivery and Thermal Management: Co-designed solutions for managing power and heat in increasingly complex semiconductor systems.
• Co-Packaged Optics and Photonic Integration: Technologies connecting silicon photonics and advanced packaging with a focus on scaling solutions into high-volume production.
• Sustainable Advanced Packaging: Materials and manufacturing approaches supporting reliability, performance, and sustainability goals.

APC is sponsored by ACCRETECH, ASE, MKS Atotech, Comet, Merck KGaA, Novanta, Onto Innovation, and SCREEN.

See the full APC agenda and list of speakers.

Fab Management Forum

FMF will bring together senior fab managers, industry leaders, and technology pioneers for a one-day program on November 11 to discuss the future of semiconductor manufacturing. Key themes include: 

• Fab Strategies for Europe: Geopolitical shifts, capacity, and market dynamics influencing European fab competitiveness.
• Smart Manufacturing, Automation, and AI: AI-driven solutions for improving fab productivity, resilience, and sustainability, with an update on progress toward autonomous manufacturing. 
• Disruptive Technologies and Market Applications: Innovations in silicon carbide, wide-bandgap semiconductors, photonics, and advanced foundry services that are creating new opportunities for the European semiconductor market. 

FMF is sponsored by AirLiquide, D-Simlab Technologies, DSV, Flexciton, INFICON, MAX, Planimize, Seeq,SCREEN, Siemens, Spotfire, VAT, and Watlow.

See the full FMF agenda and list of speakers.

Voices from the Industry

SEMICON Europa 2026 will feature a series of Voices from the Industry presentations from leading organizations across the semiconductor ecosystem. Speakers will share insights and updates throughout the following discussions. 

imec Technology Forum (ITF) Chip into the Future: Industry experts will highlight emerging chiplet architectures, sustainable manufacturing solutions, and the policy frameworks needed to scale Europe’s AI ecosystem. 

CHERITech'26: As cybersecurity increasingly becomes a hardware challenge, leaders from the CHERI Alliance will showcase the processors, software, standards, and products enabling a new generation of secure-by-design computing.

Eyelit Technologies: Semiconductor Supply Chain Planning, Scheduling, and Execution in the Age of AI: Industry practitioners from Melexis and LFoundry will share how agentic AI is transforming semiconductor supply chain management across fabless and foundry environments.

Advanced Packaging: From Strategic Imperative to Scalable Reality in Europe: Experts from Porsche Consulting and Entegris will examine how Europe can bridge the gap between advanced packaging innovation and industrialization at scale. This session will include an executive panel discussion on advanced packaging for Europe's future competitiveness.

Building Europe's Trusted Semiconductor Corridor in the Baltic Sea Region: Ecosystem leaders, industry representatives, and investment promotion organizations from Invest in Pomerania and the Nordic Chip Collaboration will explore how cross-border partnerships and regional strengths can position Northern Europe as a resilient semiconductor corridor.

CEA-Leti: Engineering the Semiconductor Foundations of the AI Era: Researchers and technology leaders from CEA-Leti will showcase deep tech innovations enabling AI. This session will cover advanced compute, 3D integration, silicon photonics, and power-efficient packaging, with live demonstrations and a forward-looking perspective on sustainable AI infrastructure.

Arizona: Powering the Future of Global Semiconductor Innovation: Representatives from the Arizona Commerce Authority will share how the state supports international growth through advanced manufacturing, end-to-end supply chain expansion, and transatlantic collaboration opportunities for European companies.

The full conference agenda can be found here. Press and media partners can register for free by contacting Sitong He at [email protected]. 

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About SEMI

SEMI® is the global industry association connecting over 4,000 companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members' business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org or contact a regional office to learn more.