Showing 25-36 of 2598
Blog
Enabling Co-Packaged Optics at Scale: The Critical Role of Wet Processing in Photonics Manufacturing
As artificial intelligence (AI) workloads surge and hyperscale data centers expand, the semiconductor industry is confronting fundamental limits in electrical interconnects. Co-packaged optics (CPO)...
SEMI Press Release
SEMI and Global Net Corp. Release New Report on Glass Core Substrate Market and Development Trends for Semiconductors
Report Projects 67.2% CAGR for Glass Core Substrates from 2028 to 2040 as AI and HPC Accelerate Demand for Advanced Packaging TechnologiesMILPITAS, Calif. — May 27, 2026 — SEMI, the industry...
Blog
SEMI Standards Update: Flexible Hybrid Electronics, Substrate Mapping, and New Activities Reflecting Industry Needs
The SEMI Standards team hit the ground running in 2026, starting this year with an important milestone to our Flexible Hybrid Electronics (FHE) standardization efforts. As FHE technology continues to...
Blog
From a Deck of Cards to a Company Movement
How imec turned a climate literacy workshop into a blueprint for sustainability engagement across the semiconductor industry. The StoryWouter de Groot had spent 9 years at imec in Business...
Blog
SEMI Energy Collaborative Recognised at the 2026 Renewable Energy Markets Asia Awards
The SEMI Energy Collaborative (EC) is proud to have earned a 2026 Renewable Energy Markets (REM™) Asia Award, one of the region’s most respected honours for organisations driving meaningful...
SEMI Press Release
SEMI FlexTech Solicits Proposals for Advancing the Future of Flexible Hybrid Electronics
Request for Proposals Open Until July 6; Informational Webinar on May 20MILPITAS, Calif. – May 19, 2026 – FlexTech, a SEMI Technology Coalition, today issued a request for proposals (RFP) to...
SEMI Press Release
SEMI and 23 Member Companies Urge U.S. Congress to Extend Advanced Manufacturing Investment Credit
Multi-year AMIC Extension Critical to Bolster Domestic Semiconductor Growth, Competitiveness and Innovation Across Supply ChainWASHINGTON, D.C. – May 14, 2026 — SEMI, the industry association...
Member Press Release
yieldWerx and WATS Partner to Bridge PCB Test with Chip-Level Manufacturing Data
Date: May 8, 2026
Location: Drammen, Norway
Board-level and semiconductor test data are often analyzed separately, limiting correlation across the product lifecycle. Linking PCB assembly (PCBA)...
SEMI Press Release
Global Semiconductor Materials Market Revenue Reaches Record $73.2 Billion in 2025, SEMI Reports
Wafer Fab and Packaging Materials Segments Both Grew Fueled by Manufacturing Demand for Advanced Processes, Computing and MemoryMILPITAS, Calif. — May 12, 2026 — Global semiconductor materials market...
Blog
Inspiring Semiconductor Talent: SEMI on Campus at the University of Catania
This blog series explores how collaboration between industry and academia can empower the next generation of semiconductor innovators. Through insights from leaders, educators, and students, we’ll...
Member Press Release
Beneq Appoints Dr. Jason Harrison as Chief Executive Officer
Semiconductor industry leader takes the helm to accelerate Beneq’s next phase of growth in atomic layer deposition
Espoo, Finland, 8 May, 2026 – Beneq Oy, the home of atomic layer deposition (ALD),...
Member Press Release
esmo group Launches X-change Cart for Single-Operator Load Board Handling
ROSENHEIM, Germany / KUALA LUMPUR, 5 May 2026 — esmo group (esmo), a leading global full-service systems integrator, developer, and supplier of advanced automation solutions for the semiconductor...