MEMBER DIRECTORY

Cast Aluminum Solutions (CAS) designs and manufactures precision-engineered thermal components for the global semiconductor market. CAS products are at the heart of the industry’s most advanced approaches to silicon wafer processing. We are a preferred supplier of chamber heating solutions and wafer pedestal heaters, with features such as multiple heat zones, cooling channels, and precision surface finishing. Our list of innovations includes devices for heating liquids and gases, such as our PUR-X Circulation Heater (featuring a field-replaceable PFA flow-tube), the Universal Solvent Heater (compatible with low-flashpoint solvents), and our PUR-Therm Gas Delivery Heater (for high-purity carrier & process gas heating). The CAS Engineering Team utilizes the latest software for thermal and structural FEA (finite element analysis) and 3-D solid modeling. CAS supports new product development and testing with an R&D test lab that incorporates infrared thermal imaging, x-ray and ultrasound technology, vacuum chamber testing, accelerated life-cycle testing, and more. Our robust manufacturing operation features proprietary pressure-casting systems, CNC machining centers, precision surface finishing, CMM inspection stations, and a cleanroom for specialty assembly and packaging. CAS cu(more...)

Fit-Line Global™ is a trusted supplier, designer, research and development resource for SEMI-F57-0301 compliant PFA and PVDF fittings. They employ efficient manufacturing processes to create products that meet the most demanding applications. Fit-Line has been a trusted supplier to the Semiconductor industry for more than 25 years. Headquartered in Santa Ana, California, Fit-Line dedicates itself to providing quality products, on-time delivery, and at the right price. The company exclusively produces ultra-high purity PFA and PVDF components to eliminate the possibility of cross-contamination.

Process Materials: Dopants.

Process Equipment: Handling/Transfer/Linear Motion Systems - Ball bushing, Slide guide, Slideways, Shafts, Housings, Rail assemblies.

Process Materials: Quartzware & Accessories for Single Wafer/Epitaxy/ALD and Diffusion Processes Assembly/Hybrid Equipment: Cleaning Equipment, UV curing unit. Assembly/Hybrid Materials: UV lamps-low pressure mercury vapor and UV ozone cleaner/hybrid cleaning. Clean Room: Cleaning Equipment. FLAT PANEL DISPLAY (FPD) Assembly Equipment: Tape Automated Bonding. FLAT PANEL DISPLAY (FPD) - Processing Equipment: Annealing, Drying/Curing, Exposure, Gate Oxidation, Dry Etching/Stripping, curing and cleaning. Photomask Equipment/Materials: Cleaning Equipment. Process Equipment: Cleaning Equipment, Exposure Sources, UV ozone cleaner/wafer cleaning. Test: PROM Programmers. Wafer Handling/Storage: EPROM eraser/wafer erasing/large industrial size.

Vacuum Engineering & Materials, Inc. is a full service, high purity PVD Materials supplier and stocking distributor serving the semiconductor, III-V compound, Photonics, Disk Media, Microwave and Hybrid Industries. Included within the product offering are sputtering targets and evaporation materials- available in single element metals, alloys, precious metals, composites, intermetallics, dielectrics, and ceramics. Other products and services include E-Beam crucible liners, bulk high purity in organics, backing plates, precious metals reclaim and in-house target bonding.

Inline heating and power supply product solutions for ultra-pure environments, clean rooms, semiconductor wafer cleaning, etching, medical device electroplating, flat panel display production and more. Suitable for DI Water, Chemical, Solvent, Acid, IA, and Gas processes. Featuring our Lufran, Frontier, and Dynatronix product lines. Engineered with quality, performance, and safety in mind.

We buy and sell used semiconductor fabrication and test and assembly equipment. We also provide refurbishment and site services for selected tools

MRSI Systems (a part of Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We leverage over 40 years of industry expertise in high-accuracy die bonders, active aligners, and fluid dispensers to deliver unparalleled precision and reliability for R&D, NPI, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, silicon photonics, co-packaging optics, and optical imaging products. We provide the most flexible assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. Our commitment to excellence ensures we meet our customers' needs with meticulous attention to detail and 24/7 field support. For more information visit www.mycronic.com/product-areas/die-bonding/.

FSM provides wafer metrology systems including FSM 413AA for thickness, TTV, TSV, roughness, step height, and bump height. FSM 128, 500, and 900 Series measure film stress from room temperature up to 900°C, with 900 Series supporting vacuum and TDS/CTE analysis. FSM 125RAFT provides nanoscale topography, roughness, and local stress variation. FSM R/SE measures film thickness using reflectometry/ellipsometry for transparent and multi-layer films. Adhesion testers include AquaFlex (quantitative 4 Point Bend) and Laminar (qualitative). FSM 900TC-VAC supports vacuum-based material characterization and 4 Point Probe integration. Electrical testers include FSM Eddy Current (non-contact Rs) and FSM 4 Point Probe (contact Rs mapping). Systems support wafer sizes up to 450mm and bonded substrates. AI and inline inspection options available per system.

Assembly/Hybrid Materials: Paste and film adhesives, including: 'B-stageable' paste and z-axis conductive adhesives. Adhesive materials, Preforms/Lids, Die Attach Compounds. Services: Subcontracting services: Integrating adhesives with manufactured assemblies.

Parker Hannifin manufactures a complete line of Ultra High Purity fittings, diaphragm and bellows valves, bulk gas valve components, high purity cylinder connections, regulators, TEFLON® fittings, valves and tubing, Instrument quick couplers, stainless steel filters, ceramic filter elements, membrane filter cartridges, capsules and electropolished filter housings, pneumatic and liquid valves, digital and proportional valves, pressure switches, electric and pneumatic cylinders, vacuum and pneumatic logic products, air preparation units and multiple-axis positioning tables, bridge and gantry systems, high speed belt driven positioners, clean room and vacuum prepared tables, miniature positioners, operator interface hardware and software machine control systems.

The Kurt J. Lesker Company® (KJLC®) is a global manufacturer and distributor of vacuum components for the Semiconductor market. KJLC operates world-class manufacturing and logistics facilities from six global offices, providing quick access to high quality vacuum products and systems. The Kurt J. Lesker Company has four core business divisions: Manufacturing Division, Vacuum Products (Vacuum Mart Division), the Process Equipment Division and the Materials Division. KJLC is expanding quickly in the rapidly growing Semiconductor market with an extensive range of vacuum products. We are ISO 9001 certified, Copy Exactly (CE!) compliant, and quality is always a top priority. At Kurt J. Lesker Company we are “Enabling Technology for a Better World.”

Founded in 2003, Rogue Valley Microdevices is the first company to establish a microelectronics manufacturing facility in beautiful Southern Oregon. Headquartered in Medford Oregon, we have quickly established ourselves as one of the premier MEMS Companies in the United States. Our MEMS foundry & manufacturing facility contains processing equipment capable of volume manufacturing yet flexible enough to accommodate wafer sizes from 50.8mm to 300mm. We offer full Device Fabrication and Design services along with a variety of individual processes to support our growing network of satisfied customers.