ESPOO, Finland, 22nd of March 2022 – Picosun Atomic Layer Deposition (ALD) has been demonstrated to be a suitable solution for protection of surfaces exposed to atomic oxygen degradation in Low Earth Orbit. High material survivability is a requirement for objects sent to space as they are faced with a number of degrading circumstances, such as exposure to atomic oxygen.

Researchers at the European Space Agency (ESA) have tested and analysed various material samples provided by Picosun to verify the protective coatings’ suitability for protection against atomic oxygen. This testing was performed in the ESTEC TEC-QEE Laboratory LEOX facility as part of an “open lab” test campaign. These campaigns are intended to provide access to ESA’s unique space environmental test facilities and allow collaboration with ESA’s research fellows, especially for SMEs and institutes new to the space business.

The test simulates the corroding effect of atomic oxygen, for which satellites, including the International Space Station (ISS), are exposed to. The results of the tests, performed on Kapton® HN polyimide film, silicon pieces and PCBs (Printed Circuitry Boards) protected with Picosun ALD coating clearly demonstrated the erosion protection provided by the ALD coating. The demonstrated low temperature (125 °C) film was relatively thin (20 nm) enabling coating of different relevant materials. Decreased thickness of ALD coating is known to withstand more deformation required for flexible materials than thick layers. Also, ALD coating can be applied to a 3D surface with extreme aspect ratios. The analysis performed by ESTEC consisted of mass measurement, Scanning Electron Microscope (SEM) inspection and thermo-optical properties measurement, partially, before and after the test.

“Atomic oxygen erosion has a major impact on the choice of external materials available for spacecrafts and satellites operating in Low Earth Orbit. Picosun ALD showed atomic oxygen resistance in the tests and forms a suitable protective coating for extreme environmental conditions, applicable also for flexible materials”, explains Adrian Tighe, Senior Materials Engineer in the Materials’ Physics and Chemistry Section at ESA.

“ALD is an advanced thin film coating method for ultra-thin, highly uniform and conformal material layers. It has proved to be the coating solution of choice already in production in solutions and innovations operating in extreme environments. Today, they can be found everywhere from deep seabed to Mars”, says Juhana Kostamo, VP, Industrial Business Area of Picosun Group.

More information:
Juhana Kostamo
Vice President, Industrial Business Area, Picosun Group
Tel: +358 50 369 9565
Email: [email protected]
www.picosun.com

About Picosun
Picosun provides the most advanced ALD (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

• Read more about Picosun ALD demonstrates effective surface protection for materials in space conditions in ESA's tests.

With fab construction activity at its highest level in many years, it is not surprising that there has been talk of a market crash coming from too much capacity being added. The new Global Wafer Capacity 2022 report makes the case that, while fab expansion plans are certainly aggressive and could lead to some downward pricing pressure in 2024, a significant market downturn caused by too many fabs sitting with idle capacity is not expected.

In 2021, IC manufacturers responded to widespread shortages by increasing capacity 8.6%. This was the highest rate since 8.0% in 2011 or 10.4% in 2008. For 2022, an 8.7% expansion of capacity is expected, followed by 8.2% growth in 2023.

Capital spending for fabs and equipment, expressed as a percent of semiconductor revenue, was at 25% in 2021, the highest rate since 2001 when the ratio was 26%. In the past, very high spending-to-sales ratios usually indicated too much capacity was being added and a market correction was coming soon. In 2001, capacity utilization rates tumbled sharply from 2000 when chip demand crashed. However, in contrast to 2001, unit shipments in 2021 were very strong, resulting in a high overall utilization rate of nearly 94%.

The capex-to-sales ratio is forecast to remain high in 2022 as chip manufactures continue adding wafer capacity to address on-going shortages. Because of the depth and length of the shortages, there has been a revival in the global interest of building fabs. Governments in countries that have spent the past decade de-emphasizing the business of making chips have renewed interests in providing incentives for companies to build fabs in their countries.

Naturally, the current elevated status of fab construction activity and flood of new fab construction plans raise some concern that too much capacity will be added in the next couple years, leading potentially to downward pricing pressure from supply exceeding demand. However, Knometa Research partner IC Insights predicts good growth for IC unit demand in 2022 and 2023, followed by a lower but still positive increase in 2024.

A 5% decline in the IC average selling price in 2024 is forecast by IC Insights and a falling ASP is a sign of supply outstripping demand. However, unit shipments that year are still expected to increase 4%, resulting in a market contraction of just 2%. Furthermore, IC Insights is projecting a return to growth in 2025 and 2026.

Based on continuing healthy demand for integrated circuits and the fact that manufacturers are still working to address the vast shortage situations, the industry’s capacity current expansion plans do not seem overly excessive.

About Global Wafer Capacity 2022
Global Wafer Capacity provides a detailed examination of existing fab capacity along with a five-year forecast. The report has been published on an annual basis since 2007, initially by IC Insights. In December 2021, IC Insights transferred business associated with Global Wafer Capacity to co-founder Trevor Yancey. Mr. Yancey became an independent contractor in 2014 but continued as the principal analyst and project manager for Global Wafer Capacity. Published in February 2022, Global Wafer Capacity 2022 is sold by Mr. Yancey’s company Knometa Research. For more information, visit https://knometa.com/gwc.

About Knometa Research
Knometa Research is a semiconductor technology and market analysis firm led by former IC Insights executive, Trevor Yancey. Mr. Yancey co-founded IC Insights in 1997 with Bill McClean and Brian Matas. In 2014, Mr. Yancey established Knometa Research to serve as an independent contractor for IC Insights and TechSearch International. For more information, visit https://knometa.com.

Contact
Trevor Yancey, President
Knometa Research Corp.
+1-619-378-9898
[email protected]

• Read more about Industry’s aggressive fab expansion plans do not necessarily mean a capacity glut is looming

At the end of 2021, there were 153 semiconductor fabs processing 300mm wafers for the fabrication of ICs, including CMOS image sensors, and non-IC products such as power discretes.

The 300mm wafer fab count increased by 14 in 2021, the most in one year since the same number opened in 2005. There are 10 fabs scheduled to open in 2022, followed by another 13 in 2023 and 10 in 2024. This puts the industry on pace to have more than 200 300mm fab lines in operation by 2026. These are projections made in Knometa’s new Global Wafer Capacity 2022 report.

An increasing number of 300mm fabs are being built to fabricate non-IC devices, and power transistors in particular. The manufacturing cost benefits of processing chips on the large wafers come into play for device types characterized by large die sizes and high volumes. Examples of integrated circuits with these characteristics include DRAMs, flash memory, image sensors, complex logic and microcomponent ICs, PMICs, baseband processors, audio CODECs, and display drivers. While large-size power transistors are still small compared to the die sizes of these ICs, they ship in high volumes and are big enough to keep a 300mm fab loaded at a cost-effective production level. According to IC Insights, unit demand for power transistors in 2021 reached 43.5 billion for power MOSFETs and 2.2 billion for IGBTs.

300mm Wafer Fabs Opening in 2022

• CR Micro (Runxin Microelectronics) fab in Chongqing, China, for power semiconductors
• Silan Microelectronics fab in Xiamen, Fujian, China for power discretes and sensors
• SK Hynix M15 Phase 2 fab in Cheongju, Korea, for 3D NAND flash
• SMIC fab in Shenzhen for foundry services
• ST/Tower joint venture fab in Agrate, Italy, for mixed-signal, power, and RF ICs and foundry services
• TI RFAB2 in Richardson, Texas, USA, for analog ICs
• TSMC Fab 18 Phase 4 in Tainan, Taiwan, for foundry services
• TSMC Fab 16 Phase 2 in Nanjing, Jiangsu, China, for foundry services
• TSMC Fab 18 Phase 5 in Tainan, Taiwan, for foundry services
  Winbond fab in Kaohsiung, Taiwan, for DRAMs

Of the 10 300mm wafer fabs scheduled to begin operations in 2022, two will be focused on the production of non-IC products. One is a CR Micro fab in Chongqing, China, and the other a fab in Xiamen, China, owned by Silan Microelectronics.

One-third of the new 300mm fabs opening this year are being built by TSMC. Responding to high demand for its foundry services, the company increased its capital spending 74% in 2021 to $30 billion. Much of that spending went toward equipping the Phase 4 and Phase 5 fabs at its Fab 18 campus in Tainan. TSMC is also finishing up a second fab at it Fab 16 site in Nanjing, China, to meet demand for mature technologies, especially 28nm CMOS.

Texas Instruments and STMicroelectronics (and its new fab partner Tower Semiconductor) are completing the construction of 300mm fabs targeted at analog and mixed-signal IC production. TI reported a huge increase in capital spending for 2021 with 279% more spent during the year than in 2020. Most of the money was used to buy new equipment for the company’s second fab in Richardson, Texas, and third 300mm fab overall. The RFAB2 facility will more than double wafer capacity at the Richardson site.

Only two of the new 300mm fabs scheduled to open in 2022 are for memory products. SK Hynix is expected to begin operations on a Phase 2 line for 3D NAND at its M15 fab site in Cheongju, Korea, while Winbond plans to start up a new DRAM fab in Kaohsiung, Taiwan.

View more information about Global Wafer Capacity 2022 at https://knometa.com/gwc

• Read more about Count of semiconductor fabs using 300mm wafers projected to exceed 200 by 2026

BENEQ, PRESS RELEASE, March 10, 2022, 14.00 EEST

Beneq, the home of Atomic Layer Deposition (ALD), has introduced BeneqCare, a new modular solution to offer support and maintenance services to organizations that own and operate Beneq ALD equipment.

Beneq leads the market with ALD products for R&D, semiconductor device fabrication, 3D and batch production, ultra-fast spatial ALD (C2R), and roll-to-roll ALD. Today, the company has launched BeneqCare to help customers in the EU, Asia and the USA maximize the value of their ALD tools throughout their equipment’s life cycles.

“We have been investing heavily in widening our service capabilities worldwide. Now, we offer service coverage in all regions. We have also established spare part hubs in every region at Beneq offices,” says Hans Fabritius, Vice President, Life Cycle Services at Beneq.

“BeneqCare simplifies ALD equipment ownership by helping our customers maximize uptime and gain access to the right support at every stage of their tool’s life cycle. We are ready to assist our customers in meeting their productivity requirements –from training personnel in using the equipment to meeting any unscheduled maintenance or spare parts needs,” asserts Fabritius.

BeneqCare provides Beneq customers who operate in the industrial and research sectors with a wide range of service modules to suit their operations, from extended warranty and training services to remote or onsite support.

“Our customers have high expectations for the performance of their Beneq ALD tools. BeneqCare brings them versatile support and service plans that grow with their businesses,” says Fabritius.

Companies and research facilities that have commissioned Beneq ALD equipment can avail of a variety of BeneqCare service modules to suit their unique requirements. Among the BeneqCare modules are technical support services, including remote support via Augmented Reality (AR); spare part services; extended warranties; preventive as well as unscheduled maintenance services; and training.

Learn more about BeneqCare: www.beneq.com/beneqcare/

Further information
Lie Luo, Head of Marketing, [email protected]

About Beneq
Beneq is the home of atomic layer deposition. In 1984, we established the world’s first industrial production using ALD. Today, we lead the market with products for R&D (TFS 200, TFS 500, R2), semiconductor device fabrication (Transform®), 3D and batch production (P400A, P800, P1500), ultra-fast spatial ALD (C2R), and roll-to-roll ALD (Genesis).

Beneq’s unique Development Service simplifies customer adoption and proof-of-concept for new ALD processes, while our Coating Service cuts down time to market by outsourcing state of the art ALD production. Our team of engineers and experts is dedicated to making ALD tools accessible for researchers.

• Read more about Beneq fulfills customer demand for tailored ALD equipment services and support with BeneqCare (TM)

ESPOO, Finland, 17th of February 2022 – Fraunhofer Institute for Silicon Technology (ISIT) has taken PICOSUN® P-300B ALD system into use as their powder MEMS technology platform.

Fraunhofer ISIT PowderMEMS is a new innovative technology for creating three-dimensional microstructures from a multitude of materials on wafer level. The technology is based on bonding together µm-sized powder particles in a cavity with Atomic Layer Deposition (ALD). It has many advantages compared to other manufacturing techniques as it allows using much lower process temperatures compared to a traditional sintering process. The bonded porous structures are thermally and chemically resistant thus enabling their extensive post-processing in a clean room.

"The technology can be used for various applications, such as microelectronics, MEMS sensors, MEMS actuators and microfluidics. For example, it enables the integration of porous and magnetic 3D microstructures on wafer level", explains Dr. Björn Gojdka, Group Leader at Fraunhofer ISIT.

“We were looking for a solution for conformal high surface area coating of powder located in trenches. Picosun solution is a perfect fit for this need as we are also looking into scaling up the technology. We are especially happy about the tool’s hot wall reactor, versatile precursor sources and its easy maintenance”, states Dr. Thomas Lisec, Chief Scientist at Fraunhofer ISIT.

“We are excited over this new technology coming to life and all the opportunities it will bring. I am especially impressed by the potential applications for the Fraunhofer ISIT PowderMEMS as they are exceptionally diverse. I’m looking forward to continuing working closely with Fraunhofer ISIT on bringing the technology up to industrial production”, says Dr. Christoph Hossbach, General Manager of Picosun Europe GmbH.

More information:
Dr. Christoph Hossbach, General Manager, Picosun Europe GmbH
Tel. +49 1522 449 49 11
Email: [email protected]
Web: www.picosun.com

About Picosun
Picosun provides the most advanced ALD (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

About Fraunhofer ISIT
Fraunhofer ISIT in Itzehoe is one of Europe's most modern research facilities for microelectronics and microsystems technology. At the heart of the institute are the clean room facilities, large enough not only to conduct research but also to manufacture the developed microchips on an industrial scale. In close cooperation with partners from industry, 160 scientists at ISIT develop power electronics components and microsystems with fine moving structures for sensor technology and actuator technology, including the necessary packaging technology. www.isit.fraunhofer.de

• Read more about Picosun delivers powder MEMS technology platform to Fraunhofer ISIT

BENEQ, PRESS RELEASE, December 6, 2021

Beneq revolutionized ALD cluster tools for More-than-Moore device makers with the highly successful Beneq Transform® family of products. Today, Beneq broadens its product portfolio further with two new distinct solutions: the Transform® 300 and ProdigyTM.

The Beneq Transform 300 and Prodigy were each created in response to specific technology requirements in the semiconductor manufacturing sector.

“The Transform 300 is designed to meet the growing demand of emerging semiconductor applications at 300 mm for devices such as CMOS image sensors, Power Devices, Micro-OLED/LED, and Advanced Packaging, which call for a high degree of versatility,” explains Patrick Rabinzohn, Vice President, Semiconductor ALD at Beneq.

“We created Prodigy to address those market segments that need a simple solution supported by high-end technology. It inherits the ALD design and processing knowhow we at Beneq have developed over the last 15 years, packing advanced features in a simpler, targeted industrial form factor,” continues Rabinzohn.

Beneq Transform® 300
Beneq Transform 300 is the only 300 mm ALD cluster tool that combines thermal ALD (batch) and plasma ALD (single wafer) technologies to provide a highly versatile platform for IDMs and foundries. It is dedicated to advanced thin-film applications in CIS, Power, Micro-OLED/LED, Advanced Packaging and other MtM applications.

Beneq Transform 300 is a highly configurable platform that caters to multiple advanced thin-film applications ranging from gate dielectric including in high aspect ratio trenches, to anti-reflection coating, final passivation or encapsulation, Chip-Scale-Packaging and beyond.

Beneq Prodigy
Beneq Prodigy is the deal manufacturing solution for compound semiconductor including RF IC’s (GaAs/GaN/InP), LED, VCSEL, Light Detectors and for MEMS manufacturers and foundries looking to enhance device performance and reliability through an affordable stand-alone ALD batch tool. Beneq Prodigy provides best-of-breed passivation and encapsulation films across multiple wafer types and sizes.

To learn more, visit:

Beneq Transform 300:  https://beneq.com/en/products/semiconductors/transform300/

Beneq Prodigy: https://beneq.com/en/products/semiconductors/prodigy/

Further information:
Lie Luo, Head of Marketing, [email protected]

About Beneq
Beneq is the home of atomic layer deposition. In 1984, we established the world’s first industrial production using ALD. Today, we lead the market with products for R&D (TFS 200, TFS 500, R2), semiconductor device fabrication (Transform®), 3D and batch production (P400A, P800, P1500), ultra-fast spatial ALD (C2R), and roll-to-roll ALD (Genesis).  Beneq’s unique Development Service simplifies customer adoption and proof-of-concept for new ALD processes, while our Coating Service cuts down time to market by outsourcing state of the art ALD production. Our team of engineers and experts is dedicated to making ALD tools accessible for researchers. 

• Read more about Beneq unveils two new ALD products for 300mm and compound semiconductor device fabrication respectively

FREMONT, Calif. - YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that it has set up Engineering Centers of Excellence at two locations in India: Coimbatore and Bangalore. A sales office will also be located in the Bangalore area.

“It is no secret that high-caliber engineering expertise is in high demand in Silicon Valley,” said Ramakanth Alapati, Chairman and CEO of YES. “Our company’s rapid growth has inspired us to widen our technical recruitment efforts to include global engineering talent powerhouses like India. In addition, we feel there is a strong market for reliable, cost-effective YES systems within India’s domestic semiconductor industry.”

Leading YES’s efforts in India will be Dr. Ankineedu Velaga, a high-tech engineering executive with more than 35 years of experience spanning engineering and fab operations, customer interaction and retention, and business development support in the US and Asia.

“Ankineedu’s experience in driving teams to improve processes will be a great resource for YES as we scale to meet the challenges of worldwide growth. We will be looking to him to draw upon his impressive track record of building organizations to develop complex semiconductor capital equipment as well as leading organizations to achieve better process development, yields, process control, cycle time, cost, and product quality,” said Rezwan Lateef, President of YES.

Dr. Velaga has held leadership roles with BRIDG, imec, SilTerra, Applied Materials, Avago, and Lucent (among others), and his global management experience extends from the US and the European Union to Malaysia and Singapore. His educational background includes a Ph.D. in Chemical Engineering from the University of Arkansas, an M.S. in Chemical Engineering from the Indian Institute of Technology in Madras, and a B.S in Chemical Engineering from the Regional Engineering College in Warangal, India.

“I am pleased and honored to be embarking on this exciting endeavor with YES,” commented Velaga. “We expect to build our India team quickly, and I look forward to talking with high-potential candidates. To see our current job postings for YES India, please visit Careers at yieldengineering.com and scroll down to the ‘YES India’ heading. If you don’t see a job there at the moment that aligns with your skills and interests, but you are a qualified candidate with a technical background and semiconductor experience, I encourage you to submit your resumé to [email protected] and include ‘YES India’ in the subject line.”

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials, and interfaces. The company’s product lines include thermal processing systems, chemical vapor deposition (CVD) systems, plasma etching tools, and wet process equipment used for the precise surface modification of semiconductor substrates, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit www.yieldengineering.com.

• Read more about YES Establishes Engineering, Design and Sales Presence in India; Ankineedu Velaga to Lead YES India as Country Head and Managing Director

Heidelberg/Würzburg – "1 - 10 - 100 - 1000" – Achievable component heights of over 1 cm, surfaces with roughness in the order of 10 nm, structure sizes of less than 100 nm, and writing speeds over 1000 mm/s: At the SPIE Photonics West in San Francisco, from January 25th to 27th, Heidelberg Instruments will be presenting, for the first time, the new two-photon polymerization MPO 100, a multi-user tool that combines both the requirements of 3D lithography with resolutions in the 100 nm range and 3D microprinting with structure heights of over one centimeter, all in one device.

"The MPO 100 is a unique tool for microfabrication and achieves the highest resolution among additive manufacturing processes at 100 nanometers. Furthermore, the 1-10-100-1000 capability of the MPO 100 will enable users at universities, R&D institutions, as well as the industry and offer significant advantages for new developments in areas such as micro-optics, microfluidics, and biomedicine," says Dr. Benedikt Stender of Multiphoton Optics GmbH, the subsidiary of Heidelberg Instruments where the development of the MPO 100 was carried out.

The MPO 100 works with a laser wavelength in the green spectral range, which is ideally suited for the 3D structuring of typical photoresists. Furthermore, MPO 100 is optimized to use the hybrid polymers (ORMOCER®s), particularly important for various applications. In addition to sophisticated algorithms to maximize structure quality, the synchronized scanning system offers the possibility of stitching-free patterning. In addition, the MPO 100 is currently the only tool in the market equipped with a flowbox that guarantees temperature stability of up to 0.1°C and thus provides the necessary stability for large-scale exposures. Application-specific writing modes enable customer-specific printing requirements and distinguish the MPO 100 as a multi-user tool.

"With the MPO 100, we have combined the strengths of both companies in one system: Multiphoton Optics' sophisticated exposure unit for two-photon polymerization and Heidelberg Instruments' industrial platform, which guarantees the required stability and meets the necessary industry standards. The capabilities of the MPO 100 are already very popular with our customers, who benefit from the worldwide support from our service organization and ISO-certified production," says Steffen Diez, COO of Heidelberg Instruments.

Contact for further questions:
Veronika Loose, Marketing and Communications
[email protected]
+49 931 90879288

More information:
https://heidelberg-instruments.com/
https://multiphoton.de

About Heidelberg Instruments Mikrotechnik GmbH
With over 35 years of experience and more than 1,000 installed systems, Heidelberg Instruments is one of the leading international players in the development and production of high-precision photolithography systems and nanofabrication tools. Heidelberg Instruments systems are installed in industrial and scientific facilities around the world. They are used for efficient direct writing, as well as for photomask fabrication for a wide range of industries - including semiconductors, quantum computing, photonics, 2D materials, IoT, and many related application fields.

About Multiphoton Optics
Multiphoton Optics GmbH, a wholly owned subsidiary of Heidelberg Instruments Mikrotechnik GmbH, is a global solution provider for 3D lithography via two-photon polymerization (TPP). This disruptive technology enables the production of complex functional structures in micro-optics and microsystems technology, optical interconnect technology, micromechanics, and biomedical technology. The modular 3D printing platform enables the high-precision fabrication of structures in the submicrometer to millimeter range with very high throughput.
 

• Read more about MPO 100 - Multi-User Tool for 3D Lithography and 3D Microprinting

ESPOO, Finland, 3rd of February 2022 – Picosun Group and Shincron Co., Ltd. have joined forces for development and commercialization of Atomic Layer Deposition (ALD) for optical coatings. ALD technology provides uniform and conformal coatings to the even most challenging structures and is therefore well suited for high-end optical applications.

The R&D teams from both companies have worked together to tailor existing ALD processes optimizing them for the use in optical applications. In addition to standard ALD optical films, ALD magnesium fluoride (MgF2) has been researched and is now available for commercial use for the first time. So far, ALD MgF2 processes have been only presented in academic research by universities and science institutes. MgF2 is a desired material in optical applications due to its low refractive index at visible light and high transmittance in FUV optical region. It can be used as a single layer or as part of an optical stack combining low and high refractive index materials. It has also other features, such as barrier properties and high chemical stability, which bring big advantages in some applications.

The collaboration agreement was first signed in 2019 including the appointment of Shincron as Picosun’s sales representative and ALD product distributor in Japan. The collaboration was extended with Joint Development Agreement (JDA) in 2020 with the aim to develop novel and advanced ALD coatings for optical applications.

“We are very excited about the collaboration. The teamwork has been fruitful, and the results obtained now are excellent. We see optical coatings as one of the emerging ALD applications and believe in strong growth in this market”, says Jussi Rautee, CEO of Picosun.

“We are happy to add ALD technology to our offering. This way we can increase our services for our customers. We have set up a demo capability for ALD optical coatings and Japanese optical companies have shown high interest for this process”, says Masaya Narita, CEO of Shincron.

Read more: picosun.com/optics/magnesiumfluoride

More information:
Jussi Rautee
CEO, Picosun Group
Tel: +358 50 345 4457
Email: [email protected]
www.picosun.com

Masaya Narita
CEO, Shincron Co., Ltd.
Tel: +81 45 650 2411
Email: [email protected]
www.shincron.co.jp/en/

About Picosun
Picosun provides the most advanced ALD (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

About Shincron
Shincron is a leading global supplier of innovative vacuum thin film deposition equipment. Visit www.shincron.co.jp/en/ for more information.

• Read more about Picosun and Shincron join forces for ALD optical coating development