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ClassOne Technology, global supplier of high-performance semiconductor electroplating and surface preparation systems, announced the sale of its Solstice® S8 system to South Korean chip manufacturer, Point Engineering Co. The eight-chambered Solstice plating tool will be installed at Point Engineering’s manufacturing facility in Asan City, South Korea. The announcement was made by ClassOne‘s CEO, Byron Exarcos, and PEC‘s CEO, Bum-Mo Ahn.

"Our products call for unique manufacturing approaches,” said Bum-Mo. “In addition to copper, we require plating of palladium cobalt alloy into highly variant features; and this plating is done on a proprietary substrate. We needed a volume-manufacturing platform that has the necessary flexibility without sacrificing reliability. The Solstice S8 covers these needs very well, and it also has a compact footprint to conserve fab space."

Exarcos pointed out that Point Engineering's new Solstice configuration includes a CopperMax™ processing chamber, a ClassOne-proprietary feature specifically designed to optimize copper plating. The chamber enables consistent high-quality, high-rate copper plating, while maximizing uptime and dramatically reducing bottom-line operating costs.

“Point Engineering has gained considerable respect in the industry for its semiconductor parts, which frequently go into probe pins and micro power inductors," said Exarcos. “In today’s semiconductor industry, we’re seeing that new product categories often drive the need for novel approaches in manufacturing. Point Engineering’s groundbreaking new products demand a process-experienced equipment provider and a flexible platform. We’re gratified that Point Engineering has chosen ClassOne and Solstice to partner with them on their next-generation products.”

The Solstice S8 is an 8-chambered system designed and built by ClassOne for high-performance, fully-automated electroplating and surface preparation, specifically for ≤200mm semiconductor wafer processing. The Solstice series also includes the S4, which provides up to four processing chambers, and the LT, with up to three chambers. In addition to electroplating, Solstice systems also provide Plating-Plus™ surface preparation capabilities, including wafer cleaning, high-pressure metal lift-off, resist strip, UBM etch and more. This multi-processing flexibility allows users to streamline wafer production and increase cost efficiencies by reducing the number of different processing tools required in the fab.

Japan
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SEMIジャパン
市ヶ谷
1-17
千代田区 九段南, Tokyo
1020074
Japan

Standards

 

Automation Technology Japan TC Chapter meeting

Thursday, January 28, 2021 13:30-17:30 Japan Standard Time

SEMI Japan office, Tokyo

AGENDA

1.0         Welcome / Call to Order

1.1    Introductions

1.2    Meeting Reminders (Membership Requirement, Antitrust and Intellectual Property Reminders, Effective Meeting Guidelines)

1.3    Agenda Review

2.0         Review and Approval of Previous Meeting Minutes

3.0         Technical Committee Award

4.0         Committee Leadership Change

5.0         Liaison Report

5.1    Taiwan TC Chapter

5.2    FM Forum

5.3    Staff Report

6.0         Ballot Review

6.1    6672 - Line Item Revisions to SEMI A2-1020: Specification for Surface Mount Assembler Smart Hookup (SMASH)

6.2    6673 - New Standard: Specification for Factory Operation Extension for SEMI A2 SMASH (SMASH-FOX)

6.3    6692 - Line Item Revisions to SEMI A1-1020: Specification for Production Equipment Smart Connection Interface (PESCI)

7.0         Subcommittee & Task Force Reports

7.1    A1 TF

7.2    Surface Mount Technology (SMT) TF

7.3    Flow shop Generic Equipment Model (F-GEM) TF

8.0         Old Business

8.1    Project period Review

8.2    5-year Review

9.0         New Business

9.1         Simulation of the Official Virtual TC Chapter Meeting (per Procedure Manual ¶4.3.6.2)

10.0      Action Item Review

10.1 Open Action Items

10.2 New Action Items

11.0      Next Meeting and Adjournment

 

STANDARDS CONTACT INFORMATION:

Hirofumi Kanno
Manager, Standards, SEMI Japan
Email: [email protected] 

Note: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please join the Standards Program and start making a big contribution to the industry’s progress, complete an application form today.

1:30 pm - 5:00 pm Off Add to Calendar 2021-01-28 13:30:00 2021-01-28 17:00:00 Automation Technology Japan TC Chapter Meeting   Automation Technology Japan TC Chapter meeting Thursday, January 28, 2021 13:30-17:30 Japan Standard Time SEMI Japan office, Tokyo AGENDA 1.0         Welcome / Call to Order 1.1    Introductions 1.2    Meeting Reminders (Membership Requirement, Antitrust and Intellectual Property Reminders, Effective Meeting Guidelines) 1.3    Agenda Review 2.0         Review and Approval of Previous Meeting Minutes 3.0         Technical Committee Award 4.0         Committee Leadership Change 5.0         Liaison Report 5.1    Taiwan TC Chapter 5.2    FM Forum 5.3    Staff Report 6.0         Ballot Review 6.1    6672 - Line Item Revisions to SEMI A2-1020: Specification for Surface Mount Assembler Smart Hookup (SMASH) 6.2    6673 - New Standard: Specification for Factory Operation Extension for SEMI A2 SMASH (SMASH-FOX) 6.3    6692 - Line Item Revisions to SEMI A1-1020: Specification for Production Equipment Smart Connection Interface (PESCI) 7.0         Subcommittee & Task Force Reports 7.1    A1 TF 7.2    Surface Mount Technology (SMT) TF 7.3    Flow shop Generic Equipment Model (F-GEM) TF 8.0         Old Business 8.1    Project period Review 8.2    5-year Review 9.0         New Business 9.1         Simulation of the Official Virtual TC Chapter Meeting (per Procedure Manual ¶4.3.6.2) 10.0      Action Item Review 10.1 Open Action Items 10.2 New Action Items 11.0      Next Meeting and Adjournment   STANDARDS CONTACT INFORMATION: Hirofumi Kanno Manager, Standards, SEMI Japan Email: [email protected]  Note: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please join the Standards Program and start making a big contribution to the industry’s progress, complete an application form today. SEMIジャパン 市ヶ谷 1-17 千代田区 九段南, Tokyo 1020074 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
Japan Standards_ns
Highlighted content

SEMIジャパン
市ヶ谷
1-17
千代田区 九段南, Tokyo
1020074
Japan

Standards

Information and Control Japan TC Chapter Meeting


Date: Tuesday, April 19, 2022 

Time: 09:30 - 12:00noon [Japan Standard Time]
via Virtual Meeting


AGENDA

 

Standards Contact Information:

Mami Nakajo

Coordinator, SEMI Japan

Email: [email protected] 

Phone: 81.3.3222.5949

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

9:30 am - 12:00 pm Off Add to Calendar 2022-04-19 09:30:00 2022-04-19 12:00:00 Information & Control Japan TC Chapter Meeting Information and Control Japan TC Chapter Meeting Date: Tuesday, April 19, 2022  Time: 09:30 - 12:00noon [Japan Standard Time] via Virtual Meeting AGENDA   Standards Contact Information: Mami Nakajo Coordinator, SEMI Japan Email: [email protected]  Phone: 81.3.3222.5949   NOTE: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Questions? Contact your local staff coordinator: Click here SEMIジャパン 市ヶ谷 1-17 千代田区 九段南, Tokyo 1020074 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
Japan Standards_ns
Highlighted content

SEMIジャパン
市ヶ谷
1-17
千代田区 九段南, Tokyo
1020074
Japan

Standards

Information and Control Japan TC Chapter Meeting


Date: Thursday, January 13, 2022 

Time: 09:30 - 12:00noon [Japan Standard Time]
via Virtual Meeting


AGENDA

 

Standards Contact Information:

Mami Nakajo

Coordinator, SEMI Japan

Email: [email protected] 

Phone: 81.3.3222.5949

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

9:30 am - 12:00 pm Off Add to Calendar 2022-01-13 09:30:00 2022-01-13 12:00:00 Information & Control Japan TC Chapter Meeting Information and Control Japan TC Chapter Meeting Date: Thursday, January 13, 2022  Time: 09:30 - 12:00noon [Japan Standard Time] via Virtual Meeting AGENDA   Standards Contact Information: Mami Nakajo Coordinator, SEMI Japan Email: [email protected]  Phone: 81.3.3222.5949   NOTE: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Questions? Contact your local staff coordinator: Click here SEMIジャパン 市ヶ谷 1-17 千代田区 九段南, Tokyo 1020074 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
Japan Standards_ns
Highlighted content

SEMIジャパン
市ヶ谷
1-17
千代田区 九段南, Tokyo
1020074
Japan

Standards

Information and Control Japan TC Chapter Meeting


Date: Tuesday, September 28, 2021 

Time: 09:30 - 12:00noon [Japan Standard Time]
via Web Conference


AGENDA 

 

Standards Contact Information:

Mami Nakajo

Coordinator, SEMI Japan

Email: [email protected] 

Phone: 81.3.3222.5949

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

9:30 am - 12:00 pm Off Add to Calendar 2021-09-28 09:30:00 2021-09-28 12:00:00 Information & Control Japan TC Chapter Meeting Information and Control Japan TC Chapter Meeting Date: Tuesday, September 28, 2021  Time: 09:30 - 12:00noon [Japan Standard Time] via Web Conference AGENDA    Standards Contact Information: Mami Nakajo Coordinator, SEMI Japan Email: [email protected]  Phone: 81.3.3222.5949   NOTE: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Questions? Contact your local staff coordinator: Click here SEMIジャパン 市ヶ谷 1-17 千代田区 九段南, Tokyo 1020074 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
Japan Standards_ns
Highlighted content

SEMIジャパン
市ヶ谷
1-17
千代田区 九段南, Tokyo
1020074
Japan

Standards

Information and Control Japan TC Chapter Meeting


Date: Thursday, April 15, 2021 

Time: 14:00 - 17:00 [Japan Standard Time]
via Web Conference


AGENDA 

 

Standards Contact Information:

Mami Nakajo

Coordinator, SEMI Japan

Email: [email protected] 

Phone: 81.3.3222.5949

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

2:00 pm - 5:00 pm Off Add to Calendar 2021-04-15 14:00:00 2021-04-15 17:00:00 Information & Control Japan TC Chapter Meeting Information and Control Japan TC Chapter Meeting Date: Thursday, April 15, 2021  Time: 14:00 - 17:00 [Japan Standard Time] via Web Conference AGENDA    Standards Contact Information: Mami Nakajo Coordinator, SEMI Japan Email: [email protected]  Phone: 81.3.3222.5949   NOTE: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Questions? Contact your local staff coordinator: Click here SEMIジャパン 市ヶ谷 1-17 千代田区 九段南, Tokyo 1020074 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo

Villach, Austria, 20 Jan 2021 — mechatronic systemtechnik, a leading global supplier of automation equipment for semiconductor wafer handling, today announces the availability of the mWL.cs mechatronic calotte loader. A fully automated stand-alone system for transferring wafers between cassettes and calottes, the mWL.cs provides integrated device manufacturers (IDMs) an opportunity to increase yield and improve process traceability at a high throughput.

Evaporation process tools often utilize spherical carriers and rings to meet uniformity and defectivity targets. However, the design of these tools has made it challenging to introduce automated wafer handling in this step of the manufacturing process. IDMs invariably default to manual wafer loading, which has resulted in yield degradation and an increased risk for misprocessing.

“Automating the wafer loading and unloading system for evaporation type metal deposition is a step that bears much potential,” shared Stefan Detterbeck, Sales Director. “By eliminating human error from the equation, our system enables manufacturers to achieve higher yield and reduce damage to wafers. Enhanced process traceability also supports quality improvement measures to meet the conformity requirements of critical customer industries.”

Key features of the mWL.cs mechatronic calotte loader include:
 Superior handling accuracy and repeatability — hand-off position measurement and auto-teaching capabilities (About mechatronic systemtechnik
mechatronic systemtechnik, headquartered in Villach, Austria, is a leading global supplier of automation equipment for semiconductor wafer handling. Founded in 1998, the company specializes in addressing the industry’s needs for reliable, safe, and fully automated handling of non-standard substrates — including stacked, thin, or warped wafers, and also eWLP, MEMS, TAIKO, bumped, and film frames. Through a modular approach, mechatronic offers its customers cost-efficient handling systems that feature its proprietary technology. These solutions are capable of accommodating a wide range of substrate types and their specific characteristics. Major OEMs and fabrication plants across the globe rely on mechatronic’s unique solutions for some of their most complex wafer handling needs.

For more information, please visit www.mechatronic.at or connect with us on social media:

LinkedIn: www.linkedin.com/company/mechatronic-systemtechnik
YouTube: www.youtube.com/user/MechatronicAustria

mechatronic systemtechnik is a subsidiary of Accuron Industrial Technologies.

Editorial Contact:

Ms Gracine Wee | e: [email protected] | t: +65 6220 4787

HAYWARD, CA, JANUARY 06, 2021: Delphon, a worldwide provider of engineered polymer and adhesive products for the semiconductor, photonics, medical and aerospace industries, announced today the appointment of Joseph Montano as President. Reporting directly to CEO Jeanne Beacham, Joe will serve a critical role in the company’s leadership team as Delphon continues to grow through new product innovations and future acquisitions.

Joe has spent more than 25 years in the electronics and electronic materials technology segments. He has an extensive technical and commercial background, with experience spanning from the R&D bench to executive management. Most recently Joe served as Sr. Vice President of Sales and Marketing at Intermolecular where he was instrumental in returning the company to profitability and orchestrating its acquisition by Merck KGaA, Darmstadt, Germany in 2019. Prior to working for Intermolecular, Joe was the Global Business Director for MacDermid Enthone’s Advanced Electronics division. Joe holds a Bachelor of Science degree in Chemical Engineering from Northeastern University in Boston.

“I am very excited to have Joe join us. As Delphon continues to grow and expand into new markets, I am confident that Joe’s extensive experience in semiconductor materials and business development will be an asset to our leadership team,” says Jeanne Beacham, Delphon CEO.

About Delphon
Delphon provides innovative polymer and adhesive solutions to the semiconductor, photonics, medical and aerospace industries. Through its Gel-Pak®, UltraTape®, and TouchMark divisions, the company has developed breakthrough products that provide solutions for manufacturing processes in a wide range of markets. Customers from around the globe know that they can trust these products even in the most critical environments.

For more information, please contact Jennifer Dossee Nunes, Sr. Director of Marketing, at [email protected] or visit www.delphon.com

Totowa, New Jersey – January 6, 2020 – ECI Technology, Inc. a leading manufacturer of chemical management systems for the semiconductor, printed circuit board (PCB), and other high-technology industries, announced today that it has received the Best Cooperation Supplier Award from one of Korea’s largest semiconductor manufacturing foundries. This award is in recognition of the development of process control for new applications and for the strategic role ECI Technology R&D and ECI Korea regional support teams play in supporting the foundry’s wafer manufacturing processes. The award recognizes companies that have made an outstanding contribution to its ability to drive superior products. ECI was measured on its best-in-class R&D technology for unique chemical metrology for new manufacturing processes. This supplier relationship between the two companies spans over 20 years and stands as testimony to the foundry’s confidence in ECI Technology and recognition of its value.

“We are dedicated to continue delivering the most advanced solutions and strategic value to our customers and this award confirms our vital relationship with a global leader in advanced semiconductor technology,” stated Marianna Rabinovitch, CEO, ECI Technology. “It is an honor to be recognized for the value our technology and service teams provide. ECI Technology strives to continue meeting and exceeding our customers’ technology advancements.”

About ECI Technology
ECI Technology is a leading provider of chemical management systems for semiconductor, PV, and PCB industries. Our technologies making possible the manufacturing of the most advanced semiconductors, flat panels, solar panels, printed circuit boards, and more. ECI has global operations and is ISO 9001 certified. It has R&D facilities, manufacturing, and customer service in the United States with regional sales and customer support teams in Japan, Korea, and Taiwan with representatives in China, Europe, Southeast Asia, and Israel. For additional information visit www.ecitechnology.com.