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SEMIジャパン
市ヶ谷
1-17
千代田区 九段南, Tokyo
1020074
Japan

Standards

Information and Control Japan TC Chapter Meeting


Date: Thursday, April 15, 2021 

Time: 14:00 - 17:00 [Japan Standard Time]
via Web Conference


AGENDA 

 

Standards Contact Information:

Mami Nakajo

Coordinator, SEMI Japan

Email: [email protected] 

Phone: 81.3.3222.5949

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

2:00 pm - 5:00 pm Off Add to Calendar 2021-04-15 14:00:00 2021-04-15 17:00:00 Information & Control Japan TC Chapter Meeting Information and Control Japan TC Chapter Meeting Date: Thursday, April 15, 2021  Time: 14:00 - 17:00 [Japan Standard Time] via Web Conference AGENDA    Standards Contact Information: Mami Nakajo Coordinator, SEMI Japan Email: [email protected]  Phone: 81.3.3222.5949   NOTE: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Questions? Contact your local staff coordinator: Click here SEMIジャパン 市ヶ谷 1-17 千代田区 九段南, Tokyo 1020074 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo

Villach, Austria, 20 Jan 2021 — mechatronic systemtechnik, a leading global supplier of automation equipment for semiconductor wafer handling, today announces the availability of the mWL.cs mechatronic calotte loader. A fully automated stand-alone system for transferring wafers between cassettes and calottes, the mWL.cs provides integrated device manufacturers (IDMs) an opportunity to increase yield and improve process traceability at a high throughput.

Evaporation process tools often utilize spherical carriers and rings to meet uniformity and defectivity targets. However, the design of these tools has made it challenging to introduce automated wafer handling in this step of the manufacturing process. IDMs invariably default to manual wafer loading, which has resulted in yield degradation and an increased risk for misprocessing.

“Automating the wafer loading and unloading system for evaporation type metal deposition is a step that bears much potential,” shared Stefan Detterbeck, Sales Director. “By eliminating human error from the equation, our system enables manufacturers to achieve higher yield and reduce damage to wafers. Enhanced process traceability also supports quality improvement measures to meet the conformity requirements of critical customer industries.”

Key features of the mWL.cs mechatronic calotte loader include:
 Superior handling accuracy and repeatability — hand-off position measurement and auto-teaching capabilities (About mechatronic systemtechnik
mechatronic systemtechnik, headquartered in Villach, Austria, is a leading global supplier of automation equipment for semiconductor wafer handling. Founded in 1998, the company specializes in addressing the industry’s needs for reliable, safe, and fully automated handling of non-standard substrates — including stacked, thin, or warped wafers, and also eWLP, MEMS, TAIKO, bumped, and film frames. Through a modular approach, mechatronic offers its customers cost-efficient handling systems that feature its proprietary technology. These solutions are capable of accommodating a wide range of substrate types and their specific characteristics. Major OEMs and fabrication plants across the globe rely on mechatronic’s unique solutions for some of their most complex wafer handling needs.

For more information, please visit www.mechatronic.at or connect with us on social media:

LinkedIn: www.linkedin.com/company/mechatronic-systemtechnik
YouTube: www.youtube.com/user/MechatronicAustria

mechatronic systemtechnik is a subsidiary of Accuron Industrial Technologies.

Editorial Contact:

Ms Gracine Wee | e: [email protected] | t: +65 6220 4787

HAYWARD, CA, JANUARY 06, 2021: Delphon, a worldwide provider of engineered polymer and adhesive products for the semiconductor, photonics, medical and aerospace industries, announced today the appointment of Joseph Montano as President. Reporting directly to CEO Jeanne Beacham, Joe will serve a critical role in the company’s leadership team as Delphon continues to grow through new product innovations and future acquisitions.

Joe has spent more than 25 years in the electronics and electronic materials technology segments. He has an extensive technical and commercial background, with experience spanning from the R&D bench to executive management. Most recently Joe served as Sr. Vice President of Sales and Marketing at Intermolecular where he was instrumental in returning the company to profitability and orchestrating its acquisition by Merck KGaA, Darmstadt, Germany in 2019. Prior to working for Intermolecular, Joe was the Global Business Director for MacDermid Enthone’s Advanced Electronics division. Joe holds a Bachelor of Science degree in Chemical Engineering from Northeastern University in Boston.

“I am very excited to have Joe join us. As Delphon continues to grow and expand into new markets, I am confident that Joe’s extensive experience in semiconductor materials and business development will be an asset to our leadership team,” says Jeanne Beacham, Delphon CEO.

About Delphon
Delphon provides innovative polymer and adhesive solutions to the semiconductor, photonics, medical and aerospace industries. Through its Gel-Pak®, UltraTape®, and TouchMark divisions, the company has developed breakthrough products that provide solutions for manufacturing processes in a wide range of markets. Customers from around the globe know that they can trust these products even in the most critical environments.

For more information, please contact Jennifer Dossee Nunes, Sr. Director of Marketing, at [email protected] or visit www.delphon.com

Totowa, New Jersey – January 6, 2020 – ECI Technology, Inc. a leading manufacturer of chemical management systems for the semiconductor, printed circuit board (PCB), and other high-technology industries, announced today that it has received the Best Cooperation Supplier Award from one of Korea’s largest semiconductor manufacturing foundries. This award is in recognition of the development of process control for new applications and for the strategic role ECI Technology R&D and ECI Korea regional support teams play in supporting the foundry’s wafer manufacturing processes. The award recognizes companies that have made an outstanding contribution to its ability to drive superior products. ECI was measured on its best-in-class R&D technology for unique chemical metrology for new manufacturing processes. This supplier relationship between the two companies spans over 20 years and stands as testimony to the foundry’s confidence in ECI Technology and recognition of its value.

“We are dedicated to continue delivering the most advanced solutions and strategic value to our customers and this award confirms our vital relationship with a global leader in advanced semiconductor technology,” stated Marianna Rabinovitch, CEO, ECI Technology. “It is an honor to be recognized for the value our technology and service teams provide. ECI Technology strives to continue meeting and exceeding our customers’ technology advancements.”

About ECI Technology
ECI Technology is a leading provider of chemical management systems for semiconductor, PV, and PCB industries. Our technologies making possible the manufacturing of the most advanced semiconductors, flat panels, solar panels, printed circuit boards, and more. ECI has global operations and is ISO 9001 certified. It has R&D facilities, manufacturing, and customer service in the United States with regional sales and customer support teams in Japan, Korea, and Taiwan with representatives in China, Europe, Southeast Asia, and Israel. For additional information visit www.ecitechnology.com.

Totowa, New Jersey – January 6, 2021 – ECI Technology, Inc. a leading manufacturer of chemical management systems for the semiconductor, printed circuit board (PCB), and other high-technology industries, was commended and received a Certificate of Appreciation Best Partner Award from one of the world’s largest semiconductor manufacturing foundries. ECI Technology’s Taiwan office was established in 2015 and its Taichung team was honored for its prompt, high-quality service in support of ECI’s online analyzers. ECI’s tools are used to optimize bath chemistry in high-volume FinFET semiconductor manufacturing that delivers advanced chips used in critical technologies such as artificial intelligence, data centers, 5G communications, and smartphones.

ECI’s Taiwan teams are well-positioned to be responsive to customers’ process needs through scientific and engineering collaboration to develop process solutions for the most complex chemical materials – qualifying incoming chemical supplies, managing tool inputs, adjusting chamber/ bath conditions, and monitoring process waste – all critical enablers to accelerate development and production ramp.

“Our sincerest thanks for recognition from this world-leading wafer foundry. ECI has developed long-term partnerships with semiconductor manufacturers around the world, providing advanced process technologies tailored to meet customers’ precise specifications," stated Marianna Rabinovitch, CEO, ECI Technology. “As we look ahead, we are eager to continue to serve customers with process control solutions for volume production. That’s been a core philosophy of ECI throughout its 34-year history.”

About ECI Technology
ECI Technology is a world-class provider of chemical management systems for semiconductor, PV, and PCB industries. Our technologies making possible the manufacturing of the most advanced semiconductors, flat panels, solar panels, printed circuit boards, and more. ECI has global operations and is ISO 9001 certified. It has R&D facilities, manufacturing, and customer service in the United States with regional sales and customer support teams in Japan, Korea, and Taiwan with representatives in China, Europe, Southeast Asia, and Israel. For additional information visit www.ecitechnology.com.

Japan
Highlighted content

SEMIジャパン
市ヶ谷
1-17
千代田区 九段南, Tokyo
1020074
Japan

Standards

Liquid Chemical Japan TC Chapter meeting

Friday, January 29, 2021, 13:00-15:00 [JST]

SEMI Japan office, Tokyo, Japan

Agenda

1.0    Welcome / Call to Order
          1.1    Introductions
          1.2    Meeting Reminders
          1.3    Agenda Review

2.0    Review and Approval of Previous Meeting Minutes

3.0    Committee Leadership Change

4.0    Liaison Report
          4.1    Europe TC Chapter
          4.2    North America TC Chapter
          4.3    Staff Report

5.0    Ballot Review - None

6.0    Subcommittee & Task Force Reports – No Report
          6.1    Liquid Filter TF
          6.2    Liquid-Borne Particle Counter TF
          6.3    Diaphragm Valve TF
          6.4    Welding Fitting TF
          6.5    Trace Metal Analysis for High Pure IPA TF

7.0    Old Business

8.0    New Business

9.0    Action Item Review
         9.1    Open Action Items
         9.2    New Action Items

10.0  Next Meeting and Adjournment
 

STANDARDS CONTACT INFORMATION:

Hirofumi Kanno
Manager, Standards, SEMI Japan
Email: [email protected] 

Note: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please join the Standards Program and start making a big contribution to the industry’s progress, complete an application form today.

1:00 pm - 3:00 pm Off Add to Calendar 2021-01-29 13:00:00 2021-01-29 15:00:00 Liquid Chemicals Japan TC Chapter Meeting Liquid Chemical Japan TC Chapter meeting Friday, January 29, 2021, 13:00-15:00 [JST] SEMI Japan office, Tokyo, Japan Agenda 1.0    Welcome / Call to Order           1.1    Introductions           1.2    Meeting Reminders           1.3    Agenda Review 2.0    Review and Approval of Previous Meeting Minutes 3.0    Committee Leadership Change 4.0    Liaison Report           4.1    Europe TC Chapter           4.2    North America TC Chapter           4.3    Staff Report 5.0    Ballot Review - None 6.0    Subcommittee & Task Force Reports – No Report           6.1    Liquid Filter TF           6.2    Liquid-Borne Particle Counter TF           6.3    Diaphragm Valve TF           6.4    Welding Fitting TF           6.5    Trace Metal Analysis for High Pure IPA TF 7.0    Old Business 8.0    New Business 9.0    Action Item Review          9.1    Open Action Items          9.2    New Action Items 10.0  Next Meeting and Adjournment   STANDARDS CONTACT INFORMATION: Hirofumi Kanno Manager, Standards, SEMI Japan Email: [email protected]  Note: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please join the Standards Program and start making a big contribution to the industry’s progress, complete an application form today. SEMIジャパン 市ヶ谷 1-17 千代田区 九段南, Tokyo 1020074 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo

ESPOO, Finland, 16th December 2020 – Picosun Group, the leading supplier of AGILE ALD® (Atomic Layer Deposition) thin film coating technology, has established a new business area, PicoMedical, for medical and healthcare ALD segments.

The newly established business area will reinforce and streamline Picosun Group’s activities in the medical field. These activities include product and solutions development for medical ALD applications, driving the profitable growth from the medical segment, and increasing the Picosun brand awareness in the healthcare and medical industries. PicoMedical will also manage the Group’s extensive medical ALD patent portfolio of 18 patent families, and coordinate and execute research activities and collaboration projects in the medical field.

Picosun has appointed Mr. Juhani Taskinen to lead the PicoMedical business area. The appointment was made in the Picosun Board meeting. Mr. Taskinen will start in his position 5th January 2021. Mr. Taskinen has extensive international career and background in the medical field, and proven track record in driving profitable business growth and leading successful collaboration activities in these industries. He has held various leading general management, sales and marketing, and business development positions in pharma, biotech, and healthcare companies such as Johnson & Johnson, Merck KGaA, Darmstadt, Germany, and Abbott.

“Right now, ALD is disrupting healthcare technologies just like it did to microelectronics in the early 2000’s. Picosun is the trailblazer and spearhead in medical ALD solutions. I’m happy to start in my new position as the head of Picosun’s PicoMedical business area to speed this company into even greater success in the healthcare segment,” states Mr. Taskinen.

“It’s great to welcome Mr. Juhani Taskinen into our team. ALD has amazing possibilities to offer to the healthcare industries. We are sure that with Mr. Taskinen’s skills, background and expertise we can truly make several new breakthroughs in this field,” continues Mr. Jussi Rautee, CEO of Picosun Group.

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Mr. Jussi Rautee
CEO, Picosun Group
Tel: +358 50 345 4457
Email: [email protected]
Web: www.picosun.com

Semiconductor equipment manufacturer ClassOne Technology announced the sale of its Solstice® S8 electroplating system to a major semiconductor foundry service based in Taiwan. This is the second S8 to be purchased by the company. The 8-chambered Solstice platform is designed specifically for ≤200mm wafer processing. The new tool will be used to produce Heterojunction Bipolar Transistors (HBTs) and Vertical Cavity Surface Emitting Lasers (VCSELs). The announcement was made by ClassOne’s CEO, Byron Exarcos, and Senior Technology Director, John Ghekiere.

“This user is a high-volume semiconductor manufacturer,” said Ghekiere. "So they are interested not only in the Solstice's superior plating performance, but also in its reliable, fully-automated high throughput. The tool is being used for wafer level packaging processes, including copper pillar and solder bump electroplating.”

“This customer has been using our Solstice S8 electroplating equipment for several years now," said Exarcos. “The tool has been fully qualified for their processes and is meeting their aggressive performance goals. Now, their business is rapidly expanding, and they've chosen to bring in a second S8 to support that growth. We're actually seeing this pattern across the industry today. As Solstice is becoming embedded into customer processes, the repeat orders are coming in with increased frequency. We're very gratified by this vote of confidence in the Solstice and in ClassOne.”

Ghekiere noted that today’s HBT devices are used in many ultrafast circuits and those requiring high power efficiency, including next-generation RF power amplifiers, 5G cellular phones, etc. VCSELs are used in 2D and 3D imaging, facial recognition, smart-glasses, fiber optic communications, LiDAR, and much more.

The ClassOne Solstice S8 is an 8-chamber system for high-performance, fully-automated electroplating and surface preparation. The Solstice series, which was specifically designed for ≤200mm wafer processing, also includes the S4, which provides up to four processing chambers, and the LT, with up to three chambers. In addition to electroplating, the tool’s special Plating-Plus™ capabilities enable it to handle a number of other surface preparation functions, including wafer cleaning, high-pressure metal lift-off, resist strip, UBM etch and more. This multi-processing flexibility serves to streamline process production and can reduce the number of different tools a user needs to purchase.

About ClassOne Technology
ClassOne Technology (classone.com) provides innovative wet-chemical equipment solutions, including electroplaters, spin-rinse-dryers, spray solvent tools and more. The company focuses on making advanced processing technology available to users of ≤200mm wafers, such as compound semiconductor and many emerging markets, who traditionally have been underserved by the larger equipment manufacturers. ClassOne Technology’s equipment has become known for its unique combination of advanced performance, flexibility and cost-efficiency Based in Kalispell, Montana, ClassOne Technology is built upon decades of experience from industry veterans creating high-performance semiconductor equipment. ClassOne Technology is a sister company to ClassOne Equipment (ClassOneEquipment.com), the industry’s premier provider of refurbished name-brand processing tools, with over 2,500 systems installed worldwide.

For more information, contact:
Byron Exarcos
ClassOne Technology
109 Cooperative Way
Kalispell, MT 59901
tel: +1 (678) 772-9086
email: [email protected]

Japan
Highlighted content

SEMIジャパン
市ヶ谷
1-17
千代田区 九段南, Tokyo
102-0074
Japan

Standards

Traceability Japan TC Chapter Meeting 

Date: Thursday, December 24, 2020

Time: 13:00-16:00 [JST]

 

AGENDA (Tentative)

1. Welcome / Call to Order

1.1 Introductions

1.2 Meeting Reminders (Membership Requirement, Antitrust and Intellectual Property Reminders, Effective Meeting Guidelines)

1.3 Agenda Review

 

2. Review and Approval of Previous Meeting Minutes

 

3. Liaison Report

3.1 North America TC Chapter

 

4. Staff Report

 

5. Technical Committee Award

 

6. Ballot Review

None

 

7. Subcommittee & Task Force Reports

7.1 5 Year Review Task Force

7.2 Japan Single Device Traceability (SDT) liaison TF

7.3 Japan Equipment and Materials Traceability (EMT) liaison TF

7.4 Panel Level Packaging (PLP) Glass Carrier ID Marking Task Force

 

8. Old Business

8.1 5 Year Review Check

8.2 SNARF Project Period Check

 

9. New Business

9.1 Proposal for Submission of Ballot #6674: New Standard: Specification of ID Marking for Glass Carrier Characteristics of Panel Level Packaging (PLP) Applications

9.2 Simulation of the Official Virtual TC Chapter Meeting (per Procedure Manual ¶4.3.6.2)

 

10. Action Item Review

10.1 Open Action Items

10.2 New Action Items

 

11. Next Meeting and Adjournment

1:00 pm - 4:00 pm Off Add to Calendar 2020-12-24 13:00:00 2020-12-24 16:00:00 Traceability Japan TC Chapter Meeting Traceability Japan TC Chapter Meeting  Date: Thursday, December 24, 2020 Time: 13:00-16:00 [JST]   AGENDA (Tentative) 1. Welcome / Call to Order 1.1 Introductions 1.2 Meeting Reminders (Membership Requirement, Antitrust and Intellectual Property Reminders, Effective Meeting Guidelines) 1.3 Agenda Review   2. Review and Approval of Previous Meeting Minutes   3. Liaison Report 3.1 North America TC Chapter   4. Staff Report   5. Technical Committee Award   6. Ballot Review None   7. Subcommittee & Task Force Reports 7.1 5 Year Review Task Force 7.2 Japan Single Device Traceability (SDT) liaison TF 7.3 Japan Equipment and Materials Traceability (EMT) liaison TF 7.4 Panel Level Packaging (PLP) Glass Carrier ID Marking Task Force   8. Old Business 8.1 5 Year Review Check 8.2 SNARF Project Period Check   9. New Business 9.1 Proposal for Submission of Ballot #6674: New Standard: Specification of ID Marking for Glass Carrier Characteristics of Panel Level Packaging (PLP) Applications 9.2 Simulation of the Official Virtual TC Chapter Meeting (per Procedure Manual ¶4.3.6.2)   10. Action Item Review 10.1 Open Action Items 10.2 New Action Items   11. Next Meeting and Adjournment SEMIジャパン 市ヶ谷 1-17 千代田区 九段南, Tokyo 102-0074 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo

ST. PETERSBURG, Fla. (Dec. 3, 2020) — Plasma-Therm, a leading manufacturer of plasma-process equipment for the semiconductor industry, announced today the acquisition of OEM Group’s dry process equipment business.

With the acquisition, Plasma-Therm has acquired all original OEM licenses and intellectual property rights for SFI Endeavor, AG Heatpulse, MRC Eclipse, and Tegal brand equipment. Plasma-Therm will continue to support existing customers through spare parts and upgrades, while offering new and refurbished tools to the wider market.

“The acquisition allows Plasma-Therm’s award-winning customer service teams to support the large and global install base,” said Abdul Lateef, CEO of Plasma-Therm. “Additionally, PVD and RTP technologies align perfectly with our etch and deposition products and process solutions, which will further support the manufacturing and R&D needs and requirements of our customers.”

Michael Correra, CEO of OEM Group, said, “We are delighted to have had these outstanding products acquired by Plasma-Therm, ensuring a strong path to market for our newly developed Endeavor M series PVD platform, and the continued availability and support of the MRC Eclipse, AG Heatpulse, and Tegal products. This acquisition allows OEM Group to strategically focus on our wet chemical process and ion implant technologies.”

About Plasma-Therm
Established in 1974, Plasma-Therm is a manufacturer of advanced plasma processing equipment for specialty semiconductor markets, including advanced packaging, wireless communication, photonics, solid-state lighting, MEMS/NEMS, nanotechnology, renewable energy, data storage, photomask, and R&D. Plasma-Therm offers leading etch and deposition technologies and solutions for these markets. Sales and service locations throughout North America, Europe, and Asia-Pacific meet the diverse needs of Plasma-Therm’s global customer base. Visit www.plasmatherm.com for more information.

About OEM Group
Established in 1999, OEM Group is a semiconductor capital equipment manufacturer and innovator in new and remanufactured 75mm – 300mm tools, spare parts, upgrades, and services. We serve the LED, MEMS, Wireless, Power, Energy Harvesting, WLP, Data Storage, and Logic markets. OEM Group's current portfolio of products includes the Semitool & Cintillio Spray Ozone Tool, Spray Acid Tool, and Spray Solvent Tool, Spin Rinse Dryer and Storm, Varian Implant, and AMAT P5000 CVD & Etch.