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Japan

Japan Standards

SEMI Japan Office
千代田区
九段南4-7-15
Tokyo
1020074
Japan

Standards

3D Packaging & Integration  Japan TC Chapter Meeting 

Date: Monday, January 18, 2021

Time: 14:00-17:30[JST]

via Web Conference

 

AGENDA

(subject to change)

 

Standards Contact Information:

Mami Nakajo

Coordinator, SEMI Japan

Email: [email protected] 

Phone: 81.3.3222.5949

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

2:00 pm - 5:30 pm Off Add to Calendar 2021-01-18 14:00:00 2021-01-18 17:30:00 3D Packaging & Integration Japan TC Chapter Meeting 3D Packaging & Integration  Japan TC Chapter Meeting  Date: Monday, January 18, 2021 Time: 14:00-17:30[JST] via Web Conference   AGENDA (subject to change)   Standards Contact Information: Mami Nakajo Coordinator, SEMI Japan Email: [email protected]  Phone: 81.3.3222.5949   NOTE: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Questions? Contact your local staff coordinator: Click here SEMI Japan Office 千代田区 九段南4-7-15 Tokyo 1020074 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
Japan Standards

SEMI Japan Office
千代田区
九段南4-7-15
Tokyo
1020074
Japan

Standards

Silicon Wafer  Japan TC Chapter Meeting 

Date: Friday, January 15, 2021

Time: 10:00-16:00[JST]

via Web Conference

 

AGENDA

(subject to change)

 

Standards Contact Information:

Mami Nakajo

Coordinator, SEMI Japan

Email: [email protected] 

Phone: 81.3.3222.5949

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

10:00 am - 4:00 pm Off Add to Calendar 2021-01-15 10:00:00 2021-01-15 16:00:00 Silicon Wafer Japan TC Chapter Meeting Silicon Wafer  Japan TC Chapter Meeting  Date: Friday, January 15, 2021 Time: 10:00-16:00[JST] via Web Conference   AGENDA (subject to change)   Standards Contact Information: Mami Nakajo Coordinator, SEMI Japan Email: [email protected]  Phone: 81.3.3222.5949   NOTE: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Questions? Contact your local staff coordinator: Click here SEMI Japan Office 千代田区 九段南4-7-15 Tokyo 1020074 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo

ESPOO, Finland, 19th October 2020 – The Chairman of the Board and founder of Picosun Group, Mr. Kustaa Poutiainen, has been awarded as Finland’s Entrepreneur of the Year 2020. Mr. Poutiainen received the National Entrepreneur Award in the annual meeting of the Federation of Finnish Enterprises in Jyväskylä on 17th October. The award is given every year to four Finnish entrepreneurs as a recognition of exceptional entrepreneurship.

Picosun provides ALD (Atomic Layer Deposition) thin film coating solutions to global microelectronics and other industries. ALD was invented in Finland in 1974 by Picosun Board Member Dr. Tuomo Suntola, who in 2018 received the Millennium Technology Prize in recognition of his invention. ALD is a mature, key enabling technology in today’s semiconductor manufacturing, realizing the development of modern microelectronics according to the Moore’s Law. ALD is expanding rapidly to other fields of industry as well, and it is expected to bring a fundamental disruption especially to healthcare technologies, where Picosun’s PicoMEDICAL™ solutions have already enabled several new innovations.

“Even if we had great premises to start manufacturing ALD equipment, not everyone believed in us in the beginning. Our personnel did and showed what they are capable of. It has taken us to a path of excellent growth,” says Poutiainen.

Picosun’s first customers, when the company entered the ALD business in 2004, were universities and research institutes. Now, the world’s leading electronics manufacturers and other companies turn to Picosun when they need the most advanced thin film coating technology to stay spearheading their own industries. Even in the middle of the global pandemic, Picosun’s turnover is expected to grow 50%, which is remarkably higher than the market’s average of 15%.

“Since day one, our vision was to be the best in the world. We have already achieved this with our R&D ALD tools, and now we are heading further. We invest a significant amount of our turnover in development of our ALD solutions and our personnel so that we can always exceed the expectations of our customers. It is an honor to receive the National Entrepreneurship Award of Finland, and it is an honor to be a part in steering Picosun towards the future, which looks very bright indeed,” continues Poutiainen.

“The whole Picosun team wants to congratulate our Chairman, Kustaa Poutiainen, on this prestigious award. We are very proud of his significant contributions and role in enabling the international breakthrough of Finnish originated ALD technology. I am sure that the entire global ALD community appreciates his efforts and joins our congratulations,” summarizes Mr. Jussi Rautee, CEO of Picosun Group.

More information:
Mr. Jussi Rautee
CEO, Picosun Group
Tel: +358 50 345 4457
Email: [email protected]
Web: www.picosun.com

Japan Standards_ns

SEMI Japan Office
Tokyo
Japan

Standards

SEMI® International Standards Program

GASES & FACILITIES JAPAN TC CHAPTER JOINT MEETING

Wednesday, November 24, 2021

13:00 – 16:00 [JST]

via Web Conference

 

AGENDA

Standards Contact Information:

Mami Nakajo
Coordinator, Standards, SEMI Japan
Email: [email protected] 

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

 

1:00 pm - 4:00 pm Off Add to Calendar 2021-11-24 13:00:00 2021-11-24 16:00:00 Gases & Facilities Japan TC Chapter Joint Meeting SEMI® International Standards Program GASES & FACILITIES JAPAN TC CHAPTER JOINT MEETING Wednesday, November 24, 2021 13:00 – 16:00 [JST] via Web Conference   AGENDA Standards Contact Information: Mami Nakajo Coordinator, Standards, SEMI Japan Email: [email protected]    NOTE: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Questions? Contact your local staff coordinator: Click here   SEMI Japan Office Tokyo Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
Japan Standards_ns

SEMI Japan Office
Tokyo
Japan

Standards

SEMI® International Standards Program

FPD Materials & Components JAPAN TC CHAPTER MEETING

Friday, March 19, 2021

14:30 – 16:30 [JST]

SEMI Japan office, Tokyo, Japan

 

AGENDA

Standards Contact Information:

Mami Nakajo
Coordinator, Standards, SEMI Japan
Email: [email protected] 

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

 

2:30 pm - 4:30 pm Off Add to Calendar 2021-03-19 14:30:00 2021-03-19 16:30:00 FPD Materials & Components Japan TC Chapter Meeting SEMI® International Standards Program FPD Materials & Components JAPAN TC CHAPTER MEETING Friday, March 19, 2021 14:30 – 16:30 [JST] SEMI Japan office, Tokyo, Japan   AGENDA Standards Contact Information: Mami Nakajo Coordinator, Standards, SEMI Japan Email: [email protected]    NOTE: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Questions? Contact your local staff coordinator: Click here   SEMI Japan Office Tokyo Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
Japan Standards_ns

SEMI Japan Office
Tokyo
Japan

Standards

SEMI® International Standards Program

GASES & FACILITIES JAPAN TC CHAPTER JOINT MEETING

Friday, May 14, 2021

13:00 – 16:00 [JST]

via Web Conference

 

AGENDA

Standards Contact Information:

Mami Nakajo
Coordinator, Standards, SEMI Japan
Email: [email protected] 

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

 

1:00 pm - 4:00 pm Off Add to Calendar 2021-05-14 13:00:00 2021-05-14 16:00:00 Gases & Facilities Japan TC Chapter Joint Meeting SEMI® International Standards Program GASES & FACILITIES JAPAN TC CHAPTER JOINT MEETING Friday, May 14, 2021 13:00 – 16:00 [JST] via Web Conference   AGENDA Standards Contact Information: Mami Nakajo Coordinator, Standards, SEMI Japan Email: [email protected]    NOTE: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Questions? Contact your local staff coordinator: Click here   SEMI Japan Office Tokyo Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
Japan Standards_ns

SEMI Japan Office
Tokyo
Japan

Standards

SEMI® International Standards Program

GASES & FACILITIES JAPAN TC CHAPTER JOINT MEETING

Friday, December 11, 2020

13:00 – 16:00 [JST]

SEMI Japan office, Tokyo, Japan

 

AGENDA

Standards Contact Information:

Mami Nakajo
Coordinator, Standards, SEMI Japan
Email: [email protected] 

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

 

1:00 pm - 4:00 pm Off Add to Calendar 2020-12-11 13:00:00 2020-12-11 16:00:00 Gases & Facilities Japan TC Chapter Joint Meeting SEMI® International Standards Program GASES & FACILITIES JAPAN TC CHAPTER JOINT MEETING Friday, December 11, 2020 13:00 – 16:00 [JST] SEMI Japan office, Tokyo, Japan   AGENDA Standards Contact Information: Mami Nakajo Coordinator, Standards, SEMI Japan Email: [email protected]    NOTE: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Questions? Contact your local staff coordinator: Click here   SEMI Japan Office Tokyo Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo

ESPOO, Finland, 6th October 2020 – Picosun Group, the leading supplier of AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries, strengthens its position in power electronics market with several cluster ALD system sales to prominent manufacturers in Europe, USA and Asia.

“Power electronics is an important, fast growing market for Picosun. ALD has potential to solve various challenges manufacturers are facing in this field, and our solutions have enabled our customers to create significant added value in terms of device quality and throughput. At Picosun, we have developed several turn-key production ALD solutions specifically for 4-8 inch wafer markets such as power devices. Especially our cluster ALD systems, such as the PICOSUN® Morpher which we launched last year, have been extremely well received by our customers,” says Juhana Kostamo, Head of Customer Solutions/Deputy CEO of Picosun.

Power components are crucial in a wide range of applications from consumer electronics to transportation, energy production and distribution, including renewables such as wind and solar power generation. These components are typically manufactured on 4-8 inch compound semiconductor wafers such as GaN and SiC. These materials provide various benefits compared to pure silicon, for example higher electron mobility, higher threshold voltage, and ability to operate at higher temperatures. Challenges do exist, however, as GaN and SiC power devices are prone to high interface trap density (leading to parasitic currents and reduced electron mobility) and gate leakage current, and poor threshold voltage stability.

Interface trap density can be reduced by combining pre-cleaning methods with high permittivity, large bandgap insulators. High quality, defect-free high-k dielectric layers such as Al2O3, AlN or ZrO2 etc. are key in reducing power devices’ gate leakage current and to improve electron mobility and threshold voltage stability. A good example here are GaN-based HEMTs (high electron mobility transistors), which are important in various large scale practical applications, and which require efficient gate insulation and surface passivation to achieve optimal functionality.

ALD stands as a superior deposition method here compared to other thin film coating technologies such as PECVD, as ALD produces the most conformal, uniform, and defect-free films with accurate, digitally repeatable thickness control and sharp interfaces. With the right selection of ALD deposition equipment, even multilayer processing is possible i.e. various functional material layers and/or stacked films/nanolaminates can be manufactured in one process run.

PICOSUN® Morpher is a disruptive ALD production platform designed for up to 8 inch wafer industries such as power electronics, MEMS, sensors, LEDs, lasers, optics, and 5G components. Morpher’s operational agility makes the system adaptable to various and changing manufacturing needs, on all business verticals from corporate internal R&D to production and foundry manufacturing, where both the end products and/or customers’ requirements may change rapidly. Morpher can handle several substrate materials, batch and substrate sizes, and ALD materials with leading process quality. Multilayer deposition is possible, and cluster design allows integration of also other processing units such as pre-clean, RIE etc. for fully automated, high throughput continuous vacuum operation.

“In its versatility and transformability, Morpher is the epitome of our principle ‘Agile ALD’. Innovation, constant development and improvement of our ALD solutions to enable our customers’ success is our driving force at Picosun. This applies also to Morpher platform and we have some truly exciting additions to this product family coming in the near future,” summarizes Kostamo.

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Taiwan, China, Korea and Japan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Juhana Kostamo
Head of Customer Solutions/Deputy CEO, Picosun Group
Tel: +358 50 3699 565
Email: [email protected]
Web: www.picosun.com

Japan

SEMIジャパン
市ヶ谷
1-17
Tokyo, Tokyo
1020074
Japan

Standards

Japan TC Chapter Meeting of
Automation Technology Global Technical Committee

Thursday, November 5, 2020

13:30-15:30

SEMI Japan office, Tokyo

AGENDA

  • Welcome / Call to Order
    • Introductions
    • Meeting Reminders (Membership Requirement, Antitrust and Intellectual Property Reminders, Effective Meeting Guidelines)
    • Agenda Review
  • Review and Approval of Previous Meeting Minutes
  • Committee Leadership Change
  • Liaison Report
    • Europe TC Chapter
    • Taiwan TC Chapter
    • FM Forum
    • Staff Report
  • Ballot Review - None
  • Subcommittee & Task Force Reports
    • A1 TF
    • Surface Mount Technology (SMT) TF
    • Flow shop Generic Equipment Model (F-GEM) TF
  • Old Business
    • Project period Review
    • 5-year Review
  • New Business
    • New SNARF approval for Line Item Revision to SEMI A1
  • Action Item Review
    • Open Action Items
    • New Action Items
  • Next Meeting and Adjournment

 

STANDARDS CONTACT INFORMATION:

Hirofumi Kanno
Standards, SEMI Japan
Email: [email protected] 

Note: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please join the Standards Program and start making a big contribution to the industry’s progress, complete an application form today.

1:30 pm - 3:30 pm Off Add to Calendar 2020-11-05 13:30:00 2020-11-05 15:30:00 Automation Technology Japan TC Chapter Meeting Japan TC Chapter Meeting of Automation Technology Global Technical Committee Thursday, November 5, 2020 13:30-15:30 SEMI Japan office, Tokyo AGENDA Welcome / Call to Order Introductions Meeting Reminders (Membership Requirement, Antitrust and Intellectual Property Reminders, Effective Meeting Guidelines) Agenda Review Review and Approval of Previous Meeting Minutes Committee Leadership Change Liaison Report Europe TC Chapter Taiwan TC Chapter FM Forum Staff Report Ballot Review - None Subcommittee & Task Force Reports A1 TF Surface Mount Technology (SMT) TF Flow shop Generic Equipment Model (F-GEM) TF Old Business Project period Review 5-year Review New Business New SNARF approval for Line Item Revision to SEMI A1 Action Item Review Open Action Items New Action Items Next Meeting and Adjournment   STANDARDS CONTACT INFORMATION: Hirofumi Kanno Standards, SEMI Japan Email: [email protected]  Note: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please join the Standards Program and start making a big contribution to the industry’s progress, complete an application form today. SEMIジャパン 市ヶ谷 1-17 Tokyo, Tokyo 1020074 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo

At IMAPS 2020 MRSI Systems will introduce a new 5 micrometer die bonder product, MRSI-705 high-volume configuration. The MRSI-705 was first introduced in 2012 and has enjoyed a dominant position in the die bonding industry offering customers multiple application solutions in one machine. This new configuration offers an innovative horizontal turret feature to significantly increase the speed and throughput from the machine without sacrificing its renowned flexibility, accuracy, or reliability.

The new MRSI proprietary design delivers an “on-the-fly” tool change with up to 12 tools with zero tool changeover downtime, which has been an integral part of MRSI’s popular high-speed product lines MRSI-HVM and MRSI-H. This leads to increased machine efficiency, higher production output, and lower manufacturing costs.

This flexible 5 micrometer die bonder retains its comprehensive appeal across a wide range of applications including photonic packaging, microwave modules, RF power amplifiers, and infrared sensors.

“The addition of this new high-speed 5 micrometer die bonder re-enforces MRSI’s industry-leading position in the field of manufacturing automation for advanced microelectronic and optoelectronic devices. We look forward to working with customers to help them to scale their production,” said Dr. Yi Qian, VP & GM MRSI Systems, Mycronic.

To schedule an appointment and discuss a prototype demonstration, please contact us at [email protected].

For additional information, please contact:
Dr. Limin Zhou
Senior Director, Strategic Marketing, MRSI Systems
Tel: +86 135 0289 9401, e-mail: [email protected]
Time Zone: CST – China Standard Time

About MRSI Systems
MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high- volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. www.mrsisystems.com

About Mycronic
Mycronic AB is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Singapore, South Korea, the Netherlands, United Kingdom and the United States. Mycronic AB (publ) is listed on NASDAQ Stockholm. www.mycronic.com

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