RoodMicrotec N.V. publishes the Interim Report for 2023

• Total income grew by 18.5% to EUR 8.7 million (HY1 2022: EUR 7.3 million)
• EBITDA increased to EUR 1.8 million (HY1 2022: EUR 1.4 million)
• Net profit rose to EUR 0.9 million (HY1 2022: EUR 0.6 million)

Deventer, July 20, 2023 – RoodMicrotec N.V., a leading independent company for semiconductor supply and quality services, today publishes the Interim Report for the six-month period ended June 30, 2023.
RoodMicrotec reports a total income of EUR 8.7 million for the first half-year of 2023, which is 18.5% higher than the total income reported for the first half-year of 2022 and 6% lower than for the second half-year of 2022. The increase in total income is driven by a continued strong delivery level, especially by the Test Operations unit. The slight reduction between the second half-year of 2022 and the first half-year of 2023 is predominantly due to the normal cyclical business in the semiconductor industry, where the second half of the year typically can be characterized by stronger demand.

Operational Unit (x EUR 1,000) HY1 2023 HY1 2022 Change
Test Operations 5,845 4,496 30.0%
Supply Chain Management 1,466 1,398 4.9%
Qualification & Failure Analysis 1,356 1,423 -4.7%
Total 8,667 7,317 18.5%

Total operating expenses for the first half-year of 2023 amounted to EUR 6.8 million against EUR 5.9 million for the first half-year of 2022, while cost for raw materials and consumables remained stable at EUR 1.1 million. Personnel expenses increased to EUR 4.0 million (HY1 2022: EUR 3.6 million) due to bonus expenses and an increase in the number of employees. Other operating expenses increased to EUR 1.7 million (HY1 2022: EUR 1.2 million), predominantly due to the costs incurred for financial and legal advice and support in relation to the Public Offering process in the amount of EUR 0.5 million for the first half-year of 2023.

EBITDA increased from EUR 1.4 million for the first half-year of 2022 to EUR 1.8 million for the first half-year of 2023. Through excellent cost control we have succeeded in further reducing the overall costs as a percentage of total income by 1.4% in the first half-year of 2023. The cost of raw materials stayed at EUR 1.1 million in the first half-year of 2023, but as percentage of total income came down by 2%-points to 13% compared to first half-year of 2022.

Depreciation charges of EUR 0.8 million were higher in the first half-year of 2023 (HY1 2022: EUR 0.7 million) due to capital expenditure during the second half-year of 2022 and the first half-year of 2023. Total financial expenses maintained at the same level of EUR 0.1 million for the first half-year of 2023 and 2022.

Net profit for the first half-year of 2023 increased by 35% to EUR 0.9 million compared to the first half-year of 2022.

Adjusting for non-recurring costs incurred for financial and legal advice and support in relation to the Public Offering process in the amount of EUR 0.5 million in the first half-year of 2023, the adjusted EBITDA would have been EUR 2.3 million (HY1 2022: EUR 1.4 million) and the adjusted net profit would have been EUR 1.4 million (HY1 2022: EUR 0.6 million).

Financial data (x EUR 1,000) Note HY1 2023 HY1 2022
Total Income 8,667 7,317
EBITDA 1,825 1,440
Adjusted EBITDA 1 2,286 1,440
Net profit 869 644
Adjusted net profit 1 1,330 644

Note 1: after excluding non-recurring costs incurred for financial and legal advice and support in relation to the Public Offering process in the amount of EUR 0.5 million in the first half-year 2023

Net cash flow from operating activities for the first half-year of 2023 was positive with EUR 1.8 million (HY1 2022: EUR 0.3 million). The increase results from higher net profit and reduced working capital compared to the first half-year of 2022. Cash flow from investing activities was EUR 0.5 million negative (HY1 2022: EUR 0.4 million negative). Cash flow from financing activities for the first half-year of 2023 amounted to EUR 1.2 million negative (HY1 2022: EUR 0.5 million negative), including EUR 1.1 million for redemption of the non-controlling interest (HY1 2022: EUR 0.4 million negative). Total net cash flow for the first half-year of 2023 amounted to EUR 0.1 million positive (HY1 2022: EUR 0.6 million negative). Cash and cash equivalents at the end of the half-year of 2023 amounted to EUR 3.7 million (December 31, 2022: EUR 3.6 million; June 30, 2022: EUR 1.9 million).

“The first six months of 2023 have continued to run at the same level as the second half-year of 2022 which meant a good start for the whole year. We still see some supply challenges in the world, but we have been able to continue our Test Operations at a high utilization level. The load situation at the end of the second quarter, in combination with our current order book level provide a solid base for the second half-year of 2023.”, says Martin Sallenhag, CEO of RoodMicrotec.

Interim Report 2023 (reviewed by KPMG Accountants N.V. due to Public Offering process)
You will find the complete Interim Report 2023, which is available in English only, on our corporate website: www.roodmicrotec.com/en/investor-relations-en/financial-publications.
The Interim Report 2023 has been reviewed by KPMG Accountants N.V. pursuant to the provisions of Appendix B, Paragraph 2 sub 2.4 of the Dutch Decree on Public Takeover Bids (Besluit openbare biedingen Wft). The review opinion issued by KPMG Accountants N.V. is attached to the Interim Report 2023.

Outlook
RoodMicrotec expects the total income for 2023 to be in the range of EUR 17.0 million to EUR 17.5 million, with a profit before tax of 5-10%. The geopolitical situation in the world and the current energy crisis throughout Europe could have an impact on the Company’s business. RoodMicrotec is keeping a close eye on the situation and is doing everything possible to mitigate any potential negative impact.

Financial calendar
July 20, 2023 Conference call for media, analysts and shareholders
October 19, 2023 Trading update for the third quarter of 2023
[Date to be determined] Extraordinary General Meeting of Shareholders (in relation to the Public Offer by Microtest)
Conference call
CEO Martin Sallenhag and CFO Arvid Ladega will present the Interim Report 2023 and hold a Q&A session. You are invited to join RoodMicrotec’s conference call for media, analysts and shareholders (a Microsoft TEAMS event) on
Thursday, July 20, 2023 at 9:30 CEST

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+49 69 509544247 Germany, Frankfurt am Main
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+32 2 895 09 68 Belgium, Bruxelles
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+39 02 3206 8489 Italy, Milano
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Phone Conference ID: 236 111 572#

Forward-looking statements
This press release contains a number of forward-looking statements. These statements are based on current expectations, estimates and prognoses by the Board of Management as well as on the information currently available to the Company. The statements are subject to certain risks and uncertainties, which are hard to evaluate, such as the general economic conditions, interest rates, exchange rates and amendments to statutory laws and regulations. The Board of Management of RoodMicrotec cannot guarantee that its expectations will materialize. Furthermore, RoodMicrotec does not accept any obligation to update the statements made in this press release.

About RoodMicrotec
With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is a leading independent company for semiconductor supply and quality services. RoodMicrotec is a highly valued partner for many companies worldwide and offers specifically tailored turnkey solutions for each single customer's requirements. The turnkey services include project management, wafer test, assembly, final test, qualification, failure analysis, and logistics. All services provided by RoodMicrotec meet the high quality standards of the automotive, industrial, healthcare, and high reliability aerospace sectors. RoodMicrotec is headquartered in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information, please visit https://www.roodmicrotec.com

Further information
Martin Sallenhag, CEO or Arvid Ladega, CFO
Phone +31 570 745623, E-mail [email protected]

This press release is published in English only. This communication contains information that qualifies as inside information within the meaning of Article 7(1) of the EU Market Abuse Regulation. The company’s managing director and CEO Martin Sallenhag, is responsible for arranging the release of this document on behalf of RoodMicrotec.

• Read more about RoodMicrotec N.V. publishes the Interim Report for 2023

At the end of 2022, there were 167 semiconductor fabs processing 300mm wafers for the fabrication of ICs, including CMOS image sensors, and non-IC products such as power discretes.

While the semiconductor market downturn persists, 13 new 300mm wafer fabs are still being brought online in 2023. These new fabs are mostly for the production of power transistors, advanced logic, and foundry services.

Based on construction schedules as of late 2022, 15 300mm fabs will be brought online in 2024, 13 of them for production of ICs. A record number of fabs are expected to open in 2025 with 17 scheduled to begin production. With cutbacks in spending during 2023, some fabs previously scheduled to open in 2024 could be delayed to 2025. By 2027, the number of 300mm fabs in operation should exceed 230. These are projections made in Knometa’s Global Wafer Capacity 2023 report.

An increasing number of 300mm fabs are being built to fabricate non-IC devices, and power transistors in particular. The manufacturing cost benefits of processing chips on the large wafers come into play for device types characterized by large die sizes and high volumes. Examples of integrated circuits with these characteristics include DRAMs, flash memory, image sensors, complex logic and microcomponent ICs, PMICs, baseband processors, audio CODECs, and display drivers. While large-size power transistors are still small compared to the die sizes of these ICs, they ship in high volumes and are big enough to keep a 300mm fab loaded at a cost-effective production level.

Of the 13 300mm wafer fabs opening in 2023, five are focused on the production of non-IC products, with three of them located in China and two in Japan.

Two-thirds of the new 300mm fabs opening this year are for foundry services, with four of them wholly dedicated to the service of fabricating semiconductors for other companies on a foundry basis.

ST formed two separate partnerships to add new 300mm fab capacity at existing sites in Crolles, France, and Agrate, Italy. In Crolles, ST is working with GlobalFoundries to add new capacity for advanced logic and foundry services. In Agrate, ST and Tower Semiconductor are adding capacity for mixed-signal, power, RF, and foundry services.

Much of the pain from the current market contraction is being felt in the memory chip arena. Not surprisingly, there are no new 300mm fabs for memory opening in 2023.

About Global Wafer Capacity 2023
Global Wafer Capacity provides a detailed examination of existing fab capacity along with a five-year forecast to 2027. The report has been published on an annual basis since 2007, initially by IC Insights. In December 2021, IC Insights transferred business associated with Global Wafer Capacity to co-founder Trevor Yancey. Mr. Yancey became an independent contractor in 2014 but continued as the principal analyst and project manager for Global Wafer Capacity. Published in January 2023, Global Wafer Capacity 2023 is sold by Mr. Yancey’s company Knometa Research. For more information, visit https://knometa.com/gwc.

About Knometa Research
Knometa Research is a semiconductor technology and market analysis firm led by former IC Insights executive, Trevor Yancey. Mr. Yancey co-founded IC Insights in 1997 with Bill McClean and Brian Matas. In 2014, Mr. Yancey established Knometa Research to serve as an independent contractor for IC Insights and TechSearch International. For more information, visit https://knometa.com.

• Read more about Despite market weakness, new 300mm fabs still opening in 2023, many for power discretes

Effective July 1st, Photodigm is reducing the retail price of its Distributed Bragg Reflector (DBR) semiconductor laser diodes by 25% and showcasing a new product strategy to deliver savings and simplicity to its global customer base.

JUNE 26, 2023 (RICHARDSON, TX) –– Photodigm is thrilled to announce that as of July 1st, its entire product portfolio of Distributed Bragg Reflector (DBR) laser diodes will receive a historic 25% price reduction and new strategic approach to deliver savings and simplicity to its global customer base.

The semiconductor manufacturer announced a progressive tiered pricing strategy earlier this year to provide discounts on higher-volume orders of 100 units or more. As customer demand continued to increase, Photodigm intentionally invested in R&D projects partnering with the Office of Naval Research (ONR) to raise yields and overall volume of their fab, evolving from the company’s early years of on-demand production where it operated much like a university research lab.

“As we continue our journey to ever-improving laser lifetimes with better quality, higher yields, and gains in our overall production process, we are intentionally leveraging every opportunity to drive value to our customers,” said Bill Stuart, President and CEO of Photodigm.

Photodigm’s product portfolio now boasts thirty-two wavelengths of DBR laser diodes including Spectroscopy Certified devices tuned to unique elements like Rubidium which is often used in biomedical sensing applications or atomic clocks in GPS-denied environments for military applications.

To empower its customers, Photodigm restructured its product line around four simple decisions –– application (wavelength), functionality (chip architecture), added customization, and device packaging all with transparent pricing to provide a clear understanding of the added value in each selection.

“We’re putting our customers in the driver's seat by providing them with greater insight into our product capabilities and pricing than ever before,” says Mandy Eaton, VP of Sales & Marketing at Photodigm. “One of our core tenets at Photodigm is to foster innovation through collaboration and our new strategic approach to our product [portfolio] invites customers to shop, but also prompts them to ask themselves what they really need our technology to provide, which helps us evolve together.”

Photodigm, Inc. is the only 100% U.S.-based commercial manufacturer of semiconductor DBR laser diodes 730–1090nm with a global clientele of corporations, government entities, space programs, research labs, and universities. View the new catalog offering and updated pricing at www.photodigm.com/DBR.

About Photodigm, Inc.
For over 20 years Photodigm, Inc. has been the only 100% U.S.-based semiconductor manufacturer of single spatial and longitudinal mode Distributed Bragg Reflector (DBR) laser diodes. DBR lasers are essential to quantum sensing and atomic clock manufacturers, optical metrology and sensing, and laser spectroscopy. Headquartered in Richardson, Texas, they design and produce fixed wavelength diode lasers best known for their accuracy and reliability. Learn more at Photodigm.com.

• Read more about PHOTODIGM UNVEILS A STRATEGIC PRODUCT RESTRUCTURING PAIRED WITH A 25% PRICE REDUCTION AS CUSTOMER DEMAND CONTINUES TO DRIVE INCREASED PRODUCTION

Dresden, 21 June 2023. On 19 June, Masao Hodai, Chief Operating Officer of EBARA Precision Machinery Company Tokyo, visited EBARA’s German site in Dresden-Weixdorf. After a welcome by Dr Reinhart Richter, Managing Director of EBARA Precision Machinery Europe, an informative tour followed, during which Masao Hodai inspected the Overhaul Centre for vacuum pumps, built in 2021, the warehouse, the training facilities currently being built, and representatives from the most important product divisions. A joint lunch with members of Dresden’s staff rounded off his visit.

Strong signal for the Dresden location
“The visit of COO Masao Hodai reinforces our location within the Silicon Saxony region and shows the significant status of the semiconductor industry in Dresden for EBARA’s headquarters in Japan. Our progress in terms of safety, quality, CO2 reduction and market acquisition has made a deep impression. All EBARA employees in Dresden feel very honoured by this visit from Japan”, said Dr Reinhart Richter, happily. In the afternoon, in-depth client meetings were on the agenda at the Dresden site before Masao Hodai returned home to Tokyo.

About EBARA
EBARA Precision Machinery Europe (EPME) GmbH, headquartered in Sauerlach near Munich, is the European sales and service company of EBARA Corporation Tokyo. EBARA is a leading global manufacturer of vacuum and semiconductor systems used to produce wafers, liquid crystals, solar cells and other high-tech products. EBARA Corporation was founded in 1912 by Issey Hatakeyama and employs over 19,000 people worldwide. With an annual turnover of 4.7 billion euros, EBARA is one of the largest companies in the industry. EBARA supplies 16 of the top 20 manufacturers in the chip industry.

About EBARA Precision Machinery Europe
The EPME portfolio includes dry and turbomolecular vacuum pumps as well as modern gas abatement systems for the chemical industry, for example. In addition, EPME distributes state-of-the-art CMP tools, wafer bevel polishing and substrate coating systems for chip manufacturing. In 2021 EBARA opened its second modern overhaul centre for vacuum pumps in Dresden. EPME has been operating a vacuum pump overhaul centre in Livingston (UK) since 1993. EPME employs over 250 people in Europe and Israel.
Photo: EBARA / Tommy Halfter

• Read more about Important visitor from Japan – from parent company EBARA Corporation Tokyo

Brewer Science’s High-Temperature-Stable, Gapfilling Planarizing Material Revolutionizes Advanced ArF and EUV Processes

OptiStack® SOC450 material provides zero shrinkage up to 550°C when baking in N2

June 15, 2023 – Rolla, MO – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials for the microelectronics and optoelectronics industries, is thrilled to announce the latest breakthrough in high-temperature gapfilling materials – OptiStack® SOC450 material, enabling advanced node processes by providing unparalleled performance at extreme temperatures.

A basic overview of a spin-on carbon and the need for a high-temperature stable material.
Overcoming the Industry Compromise: Thermal Stability for Planarization and Gapfilling

One of the greatest challenges in the advanced ArF and EUV industries has been finding a material that can withstand high temperatures without sacrificing its planarization and gapfilling capabilities.

Shrinkage in spin-on glass (SOG) coatings, or annealing processes, can result in incomplete coverage, pattern distortion, delamination, or cracking. Insufficient thermal stability properties can affect subsequent process steps, compromising the overall performance and reliability of the device. To prevent significant yield loss caused by unstable materials during high-temperature annealing, such as those necessary in self-aligned double patterning (SADP) applications, it’s important to ensure gapfilling materials are stable over 400°C.

A typical low-temperature SOC has 50% weight loss when baked to 400°C which makes planarization suffer due to the film shrink.

OptiStack® SOC450 Material Enables SADP Processing with High Thermal Stability

With OptiStack® SOC450 material EUV processes will no longer have to sacrifice temperature stability for superior gapfilling and planarization.

OptiStack® SOC450 material is a carbon-based high-aspect-ratio spin-on-carbon material designed to withstand high temperatures and provide low shrinkage, offering significant benefits to ArF, EUV, SADP, SAQP, 3D NAND, and advanced memory processes.

The following simplified example illustrates one potential application of OptiStack® SOC450 material to improve a SADP process by utilizing high-temperature CVD deposition of the spacer.

The following simplified example illustrates one potential application of OptiStack® SOC450 material to improve a SADP process by utilizing high-temperature CVD deposition of the spacer.

Key Features and Benefits of OptiStack® SOC450 Material

Zero Shrinkage: Unlike traditional SOC materials, OptiStack® SOC450 material boasts a remarkable 0% shrinkage when subjected to high-temperature baking, up to 550°C when baking in N2 after a 170°C soft bake step. This means precise planarization and gapfilling are possible without worrying about dimensional changes, maintaining the integrity of valuable components.

High Thermal Stability: OptiStack® SOC450 material can withstand high-temperature vacuum-deposited SiXn films over 200 nm. The high thermal stability enables integration schemes utilizing chemical vapor deposition (CVD) and/or atomic layer deposition (ALD) processes.

OptiStack® SOC450 material offers narrow trench and high-aspect ratio gapfilling, including a complete fill, without void or delamination.

CMP Compatibility: When a strict global-level planarization is needed, OptiStack® SOC450 material can be further planarized by chemical mechanical planarization (CMP) for use in high topography, and/or highly variable pattern density devices. With many spin-on carbons facing challenges with long-range planarization, the ability to OptiStack® SOC450 material enables superior planarization by controlling the rate of removal, based on the slurry and pad type.

CVD Processing: Chemical vapor deposition (CVD) can pose many problems if the spin-on carbon material vaporizes or sublimates, including contamination that leads to defects. Ineffective CVD can cause film thickness variation or that challenge the integrity of the device. Off-gassing, delamination, and cracking are also seen with traditional SOC thermal decompositions. OptiStack® SOC450 material does not sublimate or vaporize in conditions up to 400°C, and demonstrates superior stability in conditions up to 550°C.

Increase Efficiency: High carbon content of OptiStack® SOC450 material enables CF4 plasma etch rates better than SiOx. Ultralow metal ions less than 1,000 part-per-trillion ensure decreased post-etch defects. Additionally, the solubility in fab-friendly solvents and compatibility with other spin-on materials eliminates potential drain clogging issues.

OptiStack® SOC450 material will redefine what you expect from high-temperature-stable, gapfilling planarizing materials. Its unique combination of thermal stability, zero shrinkage, and exceptional performance will enable new possibilities for your products, helping you achieve unprecedented levels of quality and reliability. Don’t settle for compromises between thermal stability and superior gapfilling when you can have it all with OptiStack® SOC450 material. Connect with a product expert or learn more by visiting our website.

About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique monitoring systems for industrial, environmental, and air applications. Our relationship-focused approach provides outcomes that facilitate and deliver critical information. Our headquarters are in Rolla, Missouri, with customer support throughout the world. We invite you to learn more about Brewer Science at www.brewerscience.com.

• Read more about Brewer Science’s High-Temperature-Stable, Gapfilling Planarizing Material Revolutionizes Advanced ArF and EUV Processes

Axiomise, the leading provider of cutting-edge formal verification solutions that include training, consulting, services and custom apps, today launched its next-generation formalISA® app with open-source, formally verified RISC-V processors such as cv32e40p and WARP-V.

Also announced today is a new RISC-V Studio Portal with real-world formalISA applications and product demonstrations to help the RISC-V ecosystem understand the necessity of exhaustive formal and the kind of bugs that can be caught with formal methods.

“We are excited to share the app launch in conjunction with a new studio portal with real-world applications of formalISA and product demos,” remarks Dr. Darbari. “The app will enable the wider ecosystem of RISC-V to see why exhaustive formal verification is a necessity and what kind of bugs can be caught with formal methods. formalISA app is a powerful offering in realizing our vision of making formal normal. Axiomise has the tools and the skills to become the ‘go to’ RISC-V Verification expert.”

Dr. Darbari and his team will be at the RISC-V Summit Europe to demonstrate formalISA in Bay 7 from Tuesday, June 6, to Thursday, June 8, at Hotel Barcelo Sants in Barcelona, Spain.

About formalISA
Axiomise’s formalISA is a push-button formal verification solution used for architectural and micro-architectural verification of RISC-V processor cores. Initially launched four years ago, it has been used to formally verify numerous open-source and commercial RISC-V processors by identifying deep corner-case bugs and mathematically proving the absence of bugs on complex out-of-order and in-order cores.

A state-of-the-art proof status dashboard captures reporting and coverage information and provides full automation, saving time and cost. formalISA is powered by i-RADAR®, and a reporting and coverage solution called SURF.

formalISA is available now. Pricing is available upon request.

About Axiomise
Axiomise is accelerating formal verification adoption through its unique combination of training, consulting, services and specialized verification solutions for RISC-V. Axiomise was founded by Dr. Ashish Darbari, FBCS, FIETE, DPhil (Oxford), who has been a formal verification practitioner for more than two decades with 60 patents in formal verification and over 70 publications.

Engage with Axiomise at:
Website: www.axiomise.com
Twitter: @axiomise
LinkedIn: https://www.linkedin.com/company/axiomise/
Facebook: https://www.facebook.com/axiomise
Axiomise, formalISA and the Axiomise logo are trademarks of Axiomise Limited, UK.
Making formal normal is a registered trademark of Axiomise Limited, UK.

• Read more about Axiomise Launches Next-Generation formalISA App for RISC-V Processors

Virginia Beach, Virginia - Busch Vacuum Solutions, a leading provider of reliable solutions for SubFab Management, is proud to exhibit at this year's SEMICON West show and conference. As a reliable partner for vacuum pumps, gas abatement systems, leak detection and more, Busch provides the semiconductor industry with the highest quality solutions and services.

At SEMICON West, Busch is showcasing their comprehensive subfab management services. Critical SubFab systems are monitored and predictively maintained by Busch. Their SubFab management minimizes production downtime and enables energy-efficient operation and cost savings. Continuous monitoring extends maintenance intervals and the entire product life cycle. All Busch on-site service teams are certified to ISO9001:2016, ISO14001:2016 and ISO45001:2018 standards.

"We are proud of our comprehensive solutions for the semiconductor industry," said Mark Magill, Vice President of Medium High Vacuum at Busch Vacuum Solutions. "SubFab service capabilities and innovative products provide customers with reliable performance and maximum process safety to achieve optimal yields."

Magill also said they are featuring a new patented redundancy vacuum system at the show, “It uses an optimized combination of two pumps plus one booster to minimize changes in chamber pressure in case of pump failure.” This vacuum system eliminates wafer scrap and process excursion.

Visit Busch Vacuum Solutions at SEMICON WEST from July 11-15 in San Francisco, CA. Meet their experienced vacuum experts, exchange ideas and get valuable advice at booth #541.

About Busch
For more than 50 years, Busch has been an integral part of the global semiconductor industry by providing reliable solutions that enable manufacturers to produce advanced microchips. Their commitment to quality is in every product they offer and service provided. Continuous advancements ensure that Busch solutions are always state-of-the-art and used by hundreds of subfabs worldwide. www.buschusa.com | [email protected]

• Read more about Busch Vacuum Solutions Exhibiting at SEMICON West 2023

A NEW CHAPTER IN MANUFACTURING INNOVATION

AMSTERDAM — DataProphet, a global leader in data-driven performance optimization solutions for digital-era manufacturing, is excited to announce the addition of Prof. Dr. Jürgen Grotepass to its esteemed industry advisory board.
Through his network and connections within the German Platform Industrie 4.0, ZVEI, and DIGITALEUROPE, Prof. Dr. Grotepass will help DataProphet extend its global footprint in the smart manufacturing space and establish additional strategic partnerships.

IMPACT EXPERIENCE WITH LEADING-EDGE 4IR INNOVATIONS
DataProphet’s inclusion of Prof. Dr. Grotepass in the broader team is a puzzle piece toward accelerating the adoption of solutions that move the needle on digital success in the manufacturing sector globally.

Prof. Dr. Grotepass brings over 30 years of experience in the manufacturing sector, with a strong background in machine vision technology. He holds a Ph.D. in electrical engineering from RWTH Aachen, focusing on Machine Vision.

The new advisory board member has been instrumental in driving digital transformation in the manufacturing industry as Chief Strategy Officer of Manufacturing Europe at HUAWEI Technologies Duesseldorf GmbH and the European Research Center (ERC) in Munich.

Prof. Dr. Grotepass has developed many AI supported and 5G-enabled Industry 4.0 use case innovations. A noteworthy example is via SmartFactory-KL in cooperation with 15+ industry partners. These showcased during Hannover Messe exhibits between 2018 and 2023. One of Prof. Dr. Grotepass’s projects solves for quality assurance. It uses machine vision to optimize the quality inspection of customized products by deploying secure cloud services and a federated learning approach.

DEMYSTIFYING MANUFACTURING’S DIGITAL-ERA — SOLUTION PROVISION, GUIDANCE, AND ALLIANCE
When asked what attracted him to collaborate with DataProphet in driving innovation in sustainable manufacturing performance, Prof. Dr. Grotepass shared this insight:

“Industries are currently progressing in the twin transition process (digital and green) with the carbon footprint of products and processes becoming a new currency. With access to data, AI will be a key enabler in turning empirical process knowledge into predictive solutions. Such solutions will yield savings for customers and related value chains.”

Prof. Dr. Grotepass points out that the electronics industry is spearheading digitalization and, therefore, is a good starting point for other verticals to frame their own digital maturity trajectory:

“In more traditional industries, such as steel and rubber, model creation for predictive and prescriptive AI still is a journey. Experience accumulates collaboratively over time. This is because process data in front end processes are still missing, calling for sensor integration to generate them.”

For traditional industries to evolve, Prof. Dr. Grotepass highlights the importance of multiple stakeholder collaboration and the role an AI-as-a-Service company like DataProphet plays in this context:

“Digitalization and the interaction between the three key players — solution provider, integrator, and end-user/operator — are becoming success indicators. DataProphet’s offerings in this domain serve as a solution provider, guide, and ally to customers on their journey.”

“With DataProphet, success is achieved with measurable KPIs. These include the OEE of processes and material as well as energy and carbon footprint savings, all demonstrated on customers’ premises,” Prof. Dr. Grotepass concludes.

NEXT-GENERATION MANUFACTURING PERFORMANCE SYNERGY
There is great synergy with DataProphet in Prof. Dr. Grotepass’s results-driven approach to manufacturing performance optimization. The AI-enabled quality assurance innovation mentioned earlier delivered a 30-40% productivity increase and lead time reduction.

Likewise, DataProphet prides itself on guaranteed value generation, its manufacturing customers enjoying a measurable return on assets and bottom line with the company’s data-driven solutions.

Prof. Dr. Grotepass’s background in academia, research, and industry leadership will provide DataProphet with unique insights, offering a well-rounded perspective on current trends, challenges, and opportunities in manufacturing.

In addition to his role at HUAWEI Technologies, Prof. Dr. Grotepass is a guest professor at Tongji University (CDHK: Chinese German College) in Shanghai. He is also an expert at the German Platform Industrie 4.0, as part of a working group on ‘Technology and Application Scenarios.’ Finally, at the ZVEI working Group ‘AI in Automation’ he acts as chairman, and is a DIGITALEUROPE Digital Manufacturing Executive Council member.

EXPANDING COLLABORATIVE MANUFACTURING INNOVATION FOR DIGITAL ERA SUCCESS
Prof. Dr. Grotepass’s wealth of expertise and experience will prove invaluable to DataProphet as it continues to innovate and expand its AI and ML offerings for the manufacturing sector. As Frans Cronje, CEO and co-founder at DataProphet, said of this development:

“We are honored to welcome Prof. Dr. Jürgen Grotepass to our industry advisory board. His vast experience and leadership in the manufacturing industry — particularly in machine vision, AI, and Industry 4.0 — will provide valuable insights and guidance. These will be brought to bear as we continue to develop end-to-end, cutting-edge AI and ML performance optimization solutions for our clients to realize value from the digital transition.”

And as Andrea Böhmert, Chairperson of the board of DataProphet, adds, “DataProphet is privileged to count a number of thought leaders in their respective fields as members of our Industry Advisory Board. These are our supporters, champions and guides in this fast changing industry and have been instrumental in ensuring that we as a team stay ahead of industry trends. Adding Prof. Dr. Jürgen Grotepass to this circle will help us to obtain even further insights into the latest thinking of some of Europe’s most active umbrella organizations driving industry initiatives. We couldn’t be closer to the pulse.”

Undoubtedly, Prof. Dr. Grotepass’s appointment to the industry advisory board will be a factor in extending DataProphet’s global footprint. His input will help ensure the company remains at the forefront of technological innovation in manufacturing worldwide.

Prof. Dr. Grotepass’s diverse experience working with multiple stakeholders, including OEMs, Tier 1 suppliers, and research institutions, shines a light on cross-industry collaboration. This is a strategy DataProphet passionately believes in.

About DataProphet
DataProphet is a global leader in AI-as-a-Service (AIaaS) process performance optimization for digital-era manufacturing success. Its IIoT platform and prescriptive AI technology measurably enhance efficiency, minimize waste, and improve product quality across industries. Clients experience a 40%+ increase in value with DataProphet PRESCRIBE, the company’s award-winning, results-driven, end-to-end prescription engine.

DataProphet tailors its solutions to each unique smart factory journey, supporting and accelerating digitalization roadmaps through consultation and collaboration. Manufacturers, Machine Builders, OEMs, and Tier 1 suppliers partner with its machine learning specialists to digitize processes, elevate their teams’ digital maturity, and realize their goals for sustainable production.

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PEER Group® has announced an upcoming webinar designed to help semiconductor equipment manufacturers prepare for the increasing demand from backend factories for automation capabilities and SEMI® Standards compliance in assembly and test processes.

Taking place on June 22, 2023, at 1:00 p.m. ET/11:00 a.m. MT, the webinar, Standardizing the Assembly and Test Process, will feature an in-depth discussion between Jason Cicero, Micron Technology’s Senior IT Domain Architect, and PEER Group’s Director of Marketing, Doug Suerich.

Topics covered will include: why the backend, including assembly and test, needs more automation and standardization, how this will impact equipment design and integration, common issues faced by factories when integrating new tools, and how equipment suppliers can help solve these issues. There will also be a live Q&A for attendees to ask questions during the webinar.

“The SEMI Standards Program has been around for more than 40 years,” says Suerich. “During that time, these standards have evolved into the guiding principles which ensure compatibility and interoperability across suppliers and factories, improving manufacturing productivity, quality, and reliability, and reducing the cost and pain of integrating new equipment onto the factory floor. Universally adopted in the frontend, we are starting to notice increasing demand from factories to implement standards in the backend, including assembly and test processes.”

Evidence of this shift is seen as major players in the frontend enter the assembly and test market while established facilities announce major capital investments into their operations. This expansion introduces new, high-value processes to assembly and test and closer integration with the frontend – both of which are enabled through the application of standards. Meanwhile, the SEMI Advanced Backend Factory Integration task force continues to investigate and promote the adoption of SEMI Standards for assembly and test.

The webinar is scheduled to last 30 minutes followed by a 15-minute Q&A. All registrants will have the opportunity to access a recording of the webinar. For more information, including how to register, visit: https://bit.ly/3mq2yf3

About PEER Group
PEER Group® is the largest supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. A multi-award winning company, PEER Group has been named a Best Workplace by Great Place to Work Canada 11 times, and most recently was one of six recipients of Intel’s 2022 EPIC Outstanding Supplier Award, which recognizes the absolute top performers in the Intel supply chain. Follow PEER Group on LinkedIn and Twitter at @PEERgroup_Inc..

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