semiconductor industry

While Artificial Intelligence (AI) emerged in the 1950s, only in recent years have AI applications proliferated with the explosion of data and continuing improvements in Moore’s law that have driven rising processing speeds. Voice assistants, image analysis software, search engines, and speech and facial recognition systems were among the first applications to use AI. Today, adoption has spread to sectors such as agriculture, cybersecurity, healthcare, software development, e-government and the intelligent enterprise to generate jobs and help spur economic growth. The Edge AI Opportunity and the Microelectronics IndustryAI can be embedded in hardware devices such as advanced robots, autonomous cars, drones or Internet of Things (IoT) applications. Today, according to the EU’s digital strategy, data centres and other centralized computing facilities account for the vast majority – 80% – of AI data processing and analysis, with smart connected objects such as automobiles, home appliances and manufacturing robots that bring the compute function closer to the user representing 20%. The latter, known as Edge AI applications, are powered by edge-based machine learning chipsets, not the AI chipsets designed to run cloud-based machine learning algorithms.The EU’s white paper on AI published in February 2020 anticipates that the way data are stored and processed for AI applications will change significantly over the coming five years as edge computing applications proliferate. Most AI applications need to connect with devices that collect data and manage data flows. When the applications connect with cloud infrastructures to train large volumes of data for a machine learning model, the interface devices often require hardware support. Edge AI can minimize data transport by processing data directly from local devices to accelerate data analysis and decision-making and make data transport or accelerator hardware unnecessary, critical in reducing power consumption and enhancing data security for applications such as autonomous driving. Over the past 40 years, the ICT sector has been continuously increasing greenhouse gas (GHG) emissions despite efforts to shift to renewable energy. Cloud-based AI applications require an ICT infrastructure for high-performance computing and high-speed connectivity. According to MIT Technology Review, data centres’ AI workloads could account for a tenth of the world’s electricity usage by 2025. a mass update of cloud-based AI applications may significantly increase energy consumption, unlike with Edge AI. This is why the strategy for developing Edge AI is well-aligned with the EU’s Green Deal objectives. Europe aspires to play a leadership role in Edge AI to strengthen the sector’s competitiveness and protect the European digital sovereignty. Europe’s strong industrial competencies in embedded systems and microcontrollers will help the region promote development of European domestic AI solutions for emerging high-value IoT applications in industrial processes such as Industry 4.0, Connected and Automated driving (CSA), smart cities, climate action, healthcare, and national defence and security. With this strong strategic position in technology, Europe is well-positioned to invest to become the leader in the Edge AI global market.Preparing the Workforce for the Microelectronics IndustryTo design and manufacture leading Edge AI chipsets, European education providers and industry will need to work closely together to train the current and future workforces. Within the framework of the METIS project, a four-year project co-funded by the European Commission through the Erasmus+ programme, SEMI and imec deployed experts in the field to survey and interview focus groups. The survey identified the following key focus areas for workforce development: 1. True Capability of AI and Data Science With AI’s heavy dependence on data, the workforce of the future must be trained in areas of data science including data integrity to ensure quality, unbiased sourcing, collection and accurate analysis necessary to interpret huge volumes of data. Europe also needs to train the next generation of AI chip designers in data security and privacy – key challenges to the widespread deployment of Edge AI chips. 2. Climate Change, Sustainable Development Goals (SDGs) and Social Inclusion TrainingSince the industry must be able to develop Edge AI solutions to enable the digital transformation while limiting GHG emissions, microelectronics engineers need to be schooled in climate change and understand how their work contributes to meeting the United Nation’s Sustainable Development Goals (SDGs). Workplace diversity and social inclusion are also important target areas for education since Edge AI applications should serve various groups of people with different needs.3. EthicsChip industry workers must also be educated in ethical issues of AI related to the technology’s potential societal impact in the near future[1]. With AI applications capable of monitoring Internet searches based on users’ personal preferences and biases to deliver tailored advertising, news and other information, developers must recognize how the technology can influence thinking and behaviour of individuals and groups. This awareness can help developers strike a balance between supporting commercial interests and societal good so the microelectronics industry can ensure ethical implementation of AI. 4. Cross-disciplinary Skills Required for AIAI development requires a comprehensive, cross-disciplinary skill-set to be able to integrate the work of specialists from diverse educational, cultural and professional backgrounds critical to developing non-biased AI solutions. For example, in addition to technical expertise, microelectronics AI developers must be able to communicate clearly and work in close-knit teams with non-technical experts from business, law, medicine and the social sciences.What’s Next?The microelectronics industry has a tremendous opportunity to develop new chip-based solutions for AI architectures, and apply AI techniques to improve operational efficiencies of design and manufacturing. To seize this opportunity, the industry must work closely with education providers to groom the next generation of skilled workers. This tight collaboration is critical to designing and delivering specialised courses to college and university students as well as engineers now working in the chip sector. The stakes are high. By preparing workers to develop Edge AI chipsets, the microelectronics industry can help the world confront some of the greatest challenges it faces today.For more information, see SEMI Responds to European Commission White Paper on Artificial Intelligence.METIS is a Sector Skills Alliance project co-funded by the European Commission’s Erasmus+ Program and coordinated by SEMI. The four year project, launched in November 2019, will develop a Microelectronics Skills Strategy. Based on the strategy, the METIS project will design 43 training modules for 1,100 hours learning in four key areas of the microelectronics sector.We thank Patrick Blouet (STMicroelectronics) and Jeroen Geusens (imec) for their valuable contributions to this article.[1] Ethics of Artificial Intelligence and Robotics, Stanford Encyclopedia of PhilosophyDr. Yanying Li is senior manager of Collaborative Projects at SEMI Europe.Dr. Pushkar P. Apte is the strategic technology advisor for the Smart Data AI Initiative at SEMI

The global economy has started down a gradual path to recovery from COVID-19 in recent months as the world continues to combat the virus. Yet one sector – semiconductors – has shown impressive growth powered by a transformation hastened by the pandemic across industries ranging from education and work-from-home to healthcare.Semiconductor sales increased 12% in September to mark a second consecutive month of double-digit growth, and year-to-date semiconductor receipts as of September jumped 5.5% compared to the same period in 2019, according to SIA/WSTS.While this upward trajectory is encouraging, it pales compared to 2020 semiconductor equipment billings growth, with results from SEMI showing worldwide global chip equipment billings in September soaring to a new high of $7.6 billion this year. During the first nine months of 2020, aggregate equipment billings logged a 23.6% rise compared to the same stretch in 2019, surpassing $51 billion. Better still, the total semiconductor equipment market in 2020 is on track to beat the previous high of $64.5 billion set in 2018.Investments in China, Taiwan and Korea are fueling the chipmaking equipment spending surge. With big domestic and international fab projects in the works, China this year is projected to become the world’s largest capital equipment market for the first time, surpassing Taiwan, which will follow at a close second. Korea will rank third in equipment investments. Taiwan and Korea growth will come on the strength of equipment spending for manufacturing leading-edge semiconductors.Equipment billings in North America and Europe declined year-over-year as the automotive and industrial sectors suffered the heaviest blows from COVID-19. Investment momentum in both regions is expected to pick up in 2021 after automotive production recovers to pre-pandemic levels while factory automation will boost industrial demand.For more information about monthly equipment billing trends by region and equipment segment, please see the SEMI Equipment Market Data Subscription.Clark Tseng is director of Industry Research and Statistics at SEMI.

Over the next five years the Taiwan government plans to invest NT$1.546 billion to build the workforce direly needed for future semiconductor industry research and development. The largesse is a tribute to efforts by SEMI president and CEO Ajit Manocha to enhance the competitiveness of the semiconductor industry by stressing the importance of talent development during his annual visits with the Taiwan president. He has been instrumental in bringing together Taiwan government agencies and local industry representatives – two players in developing the talent pool of the future – to discuss workforce initiatives.As the talent gaps threatens to choke the long-term growth potential of the chip industry, Manocha has emerged as a passionate champion of workforce development. In a letter to more than 2,000 semiconductor companies worldwide, he urged to executives act together to build the workforce vital to industry growth. In 2018, he met with Taiwan President Tsai Ing-wen to discuss ideas for attracting and retaining skilled workers to help ensure Taiwan remains a top investment destination for high-tech multinationals.In early 2019, SEMI Taiwan established its SEMI Taiwan Workforce Development Council to promote talent and career development. Already, the group’s work is resonating in the global semiconductor industry. In September last year, Manocha joined executives from industry heavyweights ASE, MediaTek and TSMC in a visit to President Tsai to urge the government to pursue industry sustainability through talent development. President Tsai responded by instructing her staff to review government resources available for talent development, help drive public-private dialogue and partnerships, and form talent development projects involving the government, industry, academia and research institutes.To carry out comprehensive workforce initiatives, SEMI Taiwan continues to work with the National Security Council and the Executive Yuan (the cabinet). We also launched the Semiconductor Industry Development Council in partnership with leading high-tech companies in Taiwan including ASE, TSMC, MediaTek, PSMC, VIS, MXIC, Nanya, Etron and UMC. Focused on developing semiconductor talent and technology, localizing equipment sourcing, and improving cybersecurity, the council has formed the following seven initiatives: Make existing government talent development programs more flexible to better meet the industry’s workforce needs. Recruit outstanding scholars and leading experts in scientific research, and solicit world-class scientific research teams. Extend age restrictions and other requirements for the Einstein Program (established by the Taiwan MOST, Ministry of Science and Technology) to attract outstanding foreign scholars to Taiwan. Establish a domestic semiconductor research ecosystem and provide sufficient research funding to cultivate R D talent. Strengthen female education in STEM (science, technology, engineering, mathematics) and encourage women to re-join the workforce to help meet the industry’s workforce needs. Continue to promote MOST University-Industry Collaboration Projects (Large Alliance) to connect the upstream academic and research sector with downstream industries. Encourage cooperation between science and technology universities and the chip industry to develop the talent necessary for smart manufacturing to thrive. SEMI’s advocacy efforts with the Taiwan government, the industry and academia are clearly paying off. The Executive Yuan recently announced three major talent development strategies – expanding the talent development capabilities of higher education institutions, promoting industrial-academic cooperation and encouraging businesses to strengthen recruiting efforts and increase funding for semiconductor talent development.The building momentum includes plans by the Taiwan Ministry of Education plans to establish semiconductor technology research centers at several national universities. By passing the sandbox law and loosening regulations organizational personnel, finance and education, the government is freeing up more funding to support semiconductor industry talent development. The ministry also plans to gradually expand the number of students enrolled in STEM curriculum and continues to promote talent training programs and recruiting strategies to help close the workforce gaps and reduce related industry risks. A highly skilled workforce is indispensable to the development of the semiconductor industry and among the most strategic resources in any region. It’s only through long-term partnerships between the government, industry and academia that impactful and sustainable workforce development goals and initiatives can be developed to help the chip industry realize its full potential to innovate and solve some of the world’s greatest challenges. The programs are key to the ability of Taiwan’s semiconductor industry to sharpen its competitive edge. More importantly, they are also the center of gravity in the region’s pursuit of its position as the global semiconductor hub. Jo-Ann Su is senior director and Winnie Chang is marketing and public relations specialist at SEMI Taiwan.

As the United States government has expanded semiconductor-related export controls, companies in the global electronics manufacturing and design supply chain have had to spend considerable time and effort navigating restrictions and managing significant new uncertainties emanating from recent policies. On November 9, SEMI submitted comments to the Department of Commerce’s Bureau of Industry and Security (BIS) urging the agency to proceed cautiously and adopt regulatory best practices and microelectronics industry recommendations to ensure that its identification of foundational technologies does not restrain U.S. innovation and exports without furthering essential U.S. national security interests. The comments specifically respond to the August 27 Advance Notice of Proposed Rulemaking (ANPRM), Identification and Review of Controls for Certain Foundational Technologies. The Export Control Reform Act (ECRA) of 2018 required BIS identify certain emerging and foundational technology that is “essential” to U.S. national security and requires such technology to be controlled to China and other nations subject to a U.S. arms embargo. Congress did not provide a specific definition for emerging or foundational technology, nor the term essential, further complicating the process to identify such technology.BIS has already implemented or proposed several emerging technology controls and the ANPRM starts the process to identify potential foundational technology controls. The SEMI comments focus on the fundamental question of how to define foundational technology, and are organized into three main sections: Requirements of ECRA Guidance from ECRA Regulatory best practices and industry recommendations Applying the statutory requirements and guidance, together with best practices and recommendations, to the identification of foundational technology indicates that most semiconductor-related technology, particularly semiconductor manufacturing equipment and materials, should be outside the bounds of the foundational technology initiative. In general, most technology related to semiconductor devices, manufacturing equipment, materials and design software is not essential to U.S. national security and, in cases where such technology does present material national security issues, it is generally subject to the U.S. list review process and multilateral controls. This technology is widely available outside the United States and due to substantial foreign availability, unilateral U.S. controls on such technology are likely to be ineffective in limiting its proliferation and harm U.S. development of or threaten U.S. leadership in this technology.While the SEMI comments focus on the effort to identify foundational technology, the recommendations and best practices apply in all export control contexts. Several of the statements pertain to policy in ECRA, including its imposition of controls to further specific essential U.S. national security interests only after full consideration of their impact on the economy.Other statements derive from factors ECRA requires BIS to consider, such as not seeking to control technology that’s already available outside the U.S. and not imposing controls that would harm U.S. technological development or leadership. An additional key factor is not imposing controls before multilateral controls are agreed to, nor when it is unlikely the relevant multilateral regimes will adopt similar controls, as is likely for technology that has been decontrolled by a regime.Finally, regulatory best practices suggest that technology-based controls should not be imposed when more targeted end-use or end-user controls can address national security concerns and duplicative controls in addition to recent, significant expansions of existing controls are unnecessary.SEMI is pleased to work with the U.S. Department of Commerce and other regulatory agencies, providing industry data, trends and perspectives to ensure export controls effectively serve national security interests without undue harm to technological development and leadership in this dynamic, globally competitive industry.Ways to Stay Connected and Learn MoreSEMI is committed to serving the global electronics manufacturing and design supply chain and present the collective voice of members to governments worldwide.The SEMI Global Update weekly newsletter provides updates on advocacy issues and technology trends and is available to all.Additionally, SEMI hosts live and virtual events that offer analysis and insights of geopolitical trends by industry experts, with the next opportunity to participate coming on December 3 with the SEMI CEO Webinar: Analyzing the Impact of the U.S. Election on the Microelectronics Industry.Joe Pasetti is Vice President of Global Public Policy and Advocacy at SEMI.

Global business conditions continued to improve through October although the rate of improvement slowed a bit as pandemic concerns increased (Chart 1).Electronic Equipment Shipments RecoveringThird-quarter world electronic equipment shipment growth showed a big improvement over the second quarter but was still down an estimated 1.4% compared to the same quarter in 2019 (Chart 2).Based on regional electronic equipment shipment data, October 2020 sales were up 3.5% versus October 2019 and up 6.1% sequentially versus September 2020 (Chart 3). As the traditional autumn busy season winds down, the key impediment to a strong recovery is the rising COVID-19 infection rates, especially in the United States and Europe. The world awaits the deployment of a much-needed vaccine.Semiconductor Growth May be EbbingSemiconductor chip shipments continue to increase but their global rate of growth has leveled off to mid-single digits (Chart 4). Wafer foundry sales growth also appears to be peaking (Chart 5), pointing to slower chip growth in coming months.SEMI Equipment ShinesSemiconductor capital equipment shipments continue to outshine both electronic equipment and semiconductors. Third-quarter 2020 SEMI global sales were up a whopping 31% compared to the same quarter in 2019 and up 16% versus the second quarter of 2020 (Chart 6). SEMI equipment shipments are definitely outpacing semiconductors on a 3/12 growth basis (Chart 7).SEMI Outpaces Electronic Supply ChainGlobal electronic supply chain growth is improving but the semiconductor sector is clearly the winner this autumn (Chart 8).Looking Forward, Pandemic Spread is Biggest WorryBusiness conditions definitely look brighter. Even stronger growth is likely if we can get COVID-19 under control.Walt Custer of Custer Consulting Group is an analyst focused on the global electronics [email protected].

Not long after STMicroelectronics opened its first semiconductor plant in Singapore more than 50 years ago, a facility chiefly focused on chip assembly and packaging, the company realized that it had constructed the site in an area with a blossoming chip ecosystem with a bright future. Before long, the company became the first to start a wafer fab facility in the so-called Little Red Dot. Today, our STMicroelectronics Singapore campus sports several buildings that dwarf the original site in the sprawling Ang Mo Kio Industrial Park 2. The facilities feature advanced 200mm manufacturing lines but still produce huge volumes of chips with more than 1,000 pieces of 150mm manufacturing equipment.Much of the wafer equipment dates back to the past century so is no longer supported by the manufacturers, if they’re still even in existence. Yet decades later the chipmaking gear continues to operate with a surprising reliability that far surpasses the longevity called for in its manufacturing specifications thanks to replacement parts and frequent upgrades with more sophisticated handling robots and chucks. Now, as smart manufacturing begins to establish a foothold in the semiconductor industry, Industry 4.0 technology is breathing new life into these aging workhorses.Despite its age, all of the equipment adheres to industry manufacturing standards. The gear is remotely controlled using the SECS/GEM interface protocol that was either originally integrated with the equipment controller or custom-made. We’ve also maximized its usage through advanced recipe management, advanced alarm and event handling, and secured lot identification.Crucially, we decided to systematically deploy a real-time fault detection and classification (FDC) solution using a third-party product based on what today is known as an edge computing architecture. Every piece of critical processing equipment is progressively paired with its dedicated FDC instance running on a virtual machine in the wafer fab data center, and the FDC solution monitors vital equipment parameters at high frequency – depending on the SECS/GEM capabilities of the equipment – and analyzes incoming manufacturing data in real time using classic SPC (statistical process control) algorithms and even AI-class protocols.Our use of the FDC edge solution as a sensor signal aggregator has given our equipment a second life. The solution processes real-time signals from sensors connected through a typical TCP-IP. Sensors have been the old equipment’s saving grace with their ability to de-multiply equipment capabilities and overcome fundamental shortcomings and design weaknesses. The STMicroelectronics Singapore plant first used off-the-shelf sensor nodes with built-in power amplifier and analog input nodes. While very practical and easy to implement, deploying the nodes can be costly. After developing more expertise in sensor integration using FDC, our wafer fab equipment experts decided to design an in-house solution based on the famed STM32 microcontroller. Leveraging Arduino – an open-source electronics platform with easy-to-use hardware and software – the equipment teams can now design and program a variety of in-house sensors for measurements including temperature, humidity, waterflow and pressure. The sensors are integrated with process equipment using the FDC solution. Integrating the sensors with the FDC engine on the edge computer extends the capabilities of old equipment without jeopardizing the integrity of the machines themselves. While the integration can be quick, it must be robust to ensure the reliability of the new measurements. Similarly, ever-increasing connectivity requirements present clear cybersecurity risks that must be managed upfront and each solution must be hardened to minimize security vulnerabilities. Even so, the challenges and risks pale in comparison to the benefits! Jean-Marc PHILIPPE is DIT Director at STMicroelectronics Pte Ltd. He oversees the deployment and support of Digital Solutions to enable STMicroelectronics front-end operations in Singapore and manages manufacturing productivity and automation programs at site level.

As the world combats climate change, the chip industry continues to build momentum in becoming a better steward of the environment. In July, Taiwan chip giant TSMC became the world’s first semiconductor company to join RE100, the global initiative to move away from a widespread reliance on fossil fuels and toward 100% renewable electricity. Applied Materials soon followed with a commitment to expand its renewable energy capacity. For the past four years, ASE Group, the largest outsourced semiconductor assembly and test (OSAT) provider, was named an industry leader in the Dow Jones Sustainability Indices (DJSI), making clear its commitment to protecting the environment. For its part, TEL was selected to be part of the FTSE4Good, a series of ethical investment stock market indices, and FTSE Blossom Japan, an index that gauges the performance of Japanese companies demonstrating strong Environmental, Social and Governance (ESG) practices.SEMI bolsters commitment to green energySEMI has also strengthened its commitment to promoting renewable energy in the semiconductor industry by adding the Green Power Pavilion at this year’s SEMICON Taiwan and continues to support the green energy movement as a co-organizer of Energy Taiwan. The largest renewable energy event in Taiwan, Energy Taiwan features international exhibitions, forums, policy initiatives and business matching events. This year the event attracted more than 12,000 visitors from 50 countries to highlight renewable energy breakthroughs and new products. The SEMI events complement RE100, which works across a wide range of industries that include financial services and retail. The initiative connects more than 260 members that count among them the world’s most influential businesses such as Apple, Google and Facebook and their suppliers through educational events.In many respects, TSMC is becoming a beacon of green energy in the chip industry. In July, the company committed to 20-year agreement to buy offshore wind power gear made by energy firm Ørsted in Taiwan, the global leader in the wind power industry. According to the purchase agreement, TSMC will offtake full production from 920-megawatt wind farms off the coast of Changhua County in western Taiwan expected to start operations in 2025 or 2026. The agreement will by far mark the world’s largest corporate green energy order in the semiconductor manufacturing and renewable energy industries and demonstrates TSMC’s long-term commitment to environmental sustainability.In addition to sourcing renewable energy, TSMC has been working closely with its downstream and upstream suppliers to help drive supply chain improvements geared toward a greener industry by offering on-site coaching, energy audits and educational resources. But the company's focus on energy efficiency is nothing new. For years, its Supply Chain Management forum has promoted industry sustainability and corporate responsibility. Moreover, TSMC worked with SEMI at this year’s SEMICON Taiwan to generate greater awareness of the importance of green energy to the industry and encourage SEMI members to become more involved in the movement.Supply chains expand eco-friendly practicesThe drive toward greener semiconductor manufacturing is also expanding to encompass entire supply chains. One notable initiative is Green Supply Chain Management (GrSCM), an effort to integrate environmental thinking into every level of the supply chain, from product concept to distribution. GrSCM involves the retooling of product design, materials sourcing, manufacturing and processes to reduce the ecological footprint of factories. So far, the results are encouraging. More companies are factoring environmental sustainability into their purchasing decisions to urge suppliers to better manage their power usage and join the green energy movement – an important step in curbing the unavoidable consequences of climate change. Terry Tsao is Global Chief Marketing Officer at SEMI and President of SEMI Taiwan.

SEMI is pleased to welcome Singapore-based UTAC Holdings Ltd., formed nearly 50 years ago, as a new member. UTAC is a leading independent provider of assembly and test services for a broad range of semiconductor chips, offering a full range of semiconductor assembly and test services across analog, mixed-signal and logic, and memory. Its customers are primarily fabless companies, integrated device manufacturers and wafer foundries. The company has production facilities in Singapore, Thailand, China, Indonesia and Malaysia as well as sales offices in five regions: the United States, Japan, China, Taiwan, the rest of Asia and Europe.I recently spoke with Dr. Nathapong Suthiwongsunthorn, Vice President and General Manager of UTAC Thailand, about UTAC’s smart manufacturing advances, the company’s role in the semiconductor industry’s transformation, and the industry outlook for Thailand over the next year.Ng: How does UTAC Thailand complement your other facilities?Dr. Nathapong: As one of the world’s largest producers of quad-flat-no-leads (QFN), UTAC Thailand has significant capability in assembly and test of advanced leadframe products including power products such as Cu Clip packages as well as MEMS products. We also serve top global IDMs and have the largest share of assembly and test for the automotive market among all UTAC operations. UTAC’s other facilities have expertise in wafer-level packages and system-in-a-package and serves the communication and consumer market not only for IDMs but also for the fabless and foundry companies. The Thailand factory nicely complements the other UTAC facilities both from the standpoint of operational and marketing diversity. Ng: UTAC Holdings Ltd. announced in August this year that it has completed its sale to Wise Road Capital, a global private equity firm. Will this in any way change the operation and business strategy of UTAC Thailand?Dr. Nathapong: I don’t believe it will change the way we operate. However, the acquisition is very positive for us from a financial perspective. With the benefit of significantly reduced debt and interest expenses, we will be able to expand our business to grow with and hopefully beyond the semiconductor market. Ng: To what extent has UTAC adopted smart manufacturing?Dr. Nathapong: UTAC Thailand is leading the way in terms of automation, smart manufacturing and Industry 4.0 with our in-house automation team and unique expertise. For example, we have built our own inspection equipment that is much faster and cheaper than what is commercially available. We also working on many programs such as mobile robot, AGV, auto inspection and office automation to help drive greater production efficiency. We are replicating our manufacturing advances and fanning them out to other UTAC facilities.UTAC Thailand Ng: What are some of the challenges you face in pushing for the industrial transformation in Thailand?Dr. Nathapong: I think the key challenge is to find skilled engineers who can perform hardware- and software-related tasks critical to the industrial transformation. But frankly, we have done a good job in managing this challenge by hiring very smart people, providing them with the required in-house training, and using outside training for new recruits as necessary. We have developed partnerships with capable vendors in this regard as well.Ng: What are the key differentiating elements (e.g. talent, tax, technology, trade, EHS) in Thailand that have been instrumental in supporting the E E ecosystem?Dr. Nathapong: There are two key differentiating elements for us. Firstly, UTAC has been around for over 47 years and is very well-established in Thailand with a positive reputation as an employer. This makes hiring talented people relatively easy. Secondly, and perhaps more importantly, the nature of the Thai people and also the benefits the company provides make it relatively painless to retain key employees. I also believe that we have a significant number of engineers available in Thailand. Finally, labour costs in Thailand are still very reasonable and stable. So we are able to acquire talent at a very competitive rate compared to other countries. Ng: What is the industry outlook for E E industry in Thailand over the next year?Dr. Nathapong: Surprisingly, the current sad predicament of COVID-19 has shown no negative impact for the global semiconductor industry – people seem to be buying more electronics with the lockdown. Our outlook for the Thailand’s E E industry is similarly very positive. Most semiconductor companies including UTAC see significant growth this year and I hope it will continue.Ng: With the recent semiconductor geopolitical and trade tensions, are more customers moving their business to Thailand?Dr. Nathapong: I believe so. We do see some of our key customers move manufacturing out of China and into Thailand. The relocations help them offset or avoid any potential fallout from current geopolitical tensions.Ng: In what areas do you think SEMI Southeast Asia can play a role to help our members companies in Thailand like UTAC?Dr. Nathapong: The semiconductor industry has been in Thailand for a long time. In fact, UTAC Thailand is 47 years old this year! However, I feel that Thailand never really worked with a strong establishment organization like SEMI that can connect various companies together to help drive innovation. I think SEMI Southeast Asia can truly help Thailand to move up to the next level of providing semiconductor solutions globally. We welcome SEMI Southeast Asia’s help in this regard.About Dr. Nathapong SuthiwongsunthornDr. Nathapong Suthiwongsunthorn joined UTAC in 2009 and is currently General Manager of UTAC Thailand, UTAC’s largest operation site. Before taking over the management of Thailand operations, he was Vice President of Research and Development, running UTAC’s global R D group. Dr. Nathapong has more than 20 years of experience in the semiconductor industry. He holds more than 40 international patents and publications in wafer-level and advanced packaging.Prior to joining UTAC, Dr. Nathapong held several key leadership positions in research and development at Schott, STATS ChipPAC and Infineon. Dr. Nathapong has a Ph.D. in Electronics Engineering from Oxford Brookes University, England.Bee Bee Ng is president of SEMI Southeast Asia.

The International Monetary Fund (IMF) just raised its regional GDP growth forecasts. For the world it predicts a 4.4% global GDP decline this year followed by a 5.2% expansion next year. This economic turnaround hinges on being guided by good science, political leadership and popular acceptance.

I recently spoke with Chan Pin CHONG, Executive Vice President and General Manager of Products and Solutions at Kulicke Soffa, about how smart manufacturing is driving new production efficiencies in the semiconductor industry. During our conversation, he also provided practical steps for factory operators to follow in evaluating their smart manufacturing needs in order to ensure successful implementation and discussed the potential payoffs. Based in Singapore, Kulicke Soffa is a leading global provider of ball bonding, advanced packaging, wedge bonding, and electronic assembly equipment for the semiconductor, power and automotive industries.Ng: Industry 4.0 and smart manufacturing are critical to the growth of the semiconductor industry. What does the smart manufacturing movement mean to you or Kulicke Soffa?Chong: The future of smart manufacturing is the vision of building a digital connected factory to drive new manufacturing efficiencies by combining physical and cyber technologies. Industry 4.0 integrates discrete systems and harnesses the power of large volumes of data to move towards greater automation.At K S, we define smart manufacturing across the following four key areas embedded in our roadmap for all K S products, from wire bonders and advance placement tools to pick and place machines: Interoperability – This is about machines, devices and sensors connecting to each other. In fact, the very basis of smart manufacturing is that all devices are connected. Information transparency – Through simulation, various artificial intelligence (AI) tools use contextual information to emulate the actual world. Technical assistance – Robots or machines support humans in making decisions or solving problems. Autonomous decision-making – This is our vision that robots or machines can learn from machines to make decisions on their own. Ng: Please elaborate on some of these areas and how they’re the relevant to smart manufacturing. Chong: The need for machines, devices and people to communicate with each other forms the basis of connectivity, the idea of all machines communicating with each other or a host. Connectivity protocols now in place for machine-to-machine connectivity include SEMA, SECS/GEM, SEMI-ELS and IPC-CFX. Machine technology uses various sensing technologies. For example, for a pick and place machine such as SMT platform on K S Hybrid, the algorithm to recognize and align processes is part of the sensor needed in each machine before to can process and add thousands of components to the substrate or panel. In a wire bonder, the ultrasonics or EFO signal can provide some form of sensing technology for a machine to detect process conditions. Importantly, these sensing technologies can be used to collect feedback for process improvements.One example of how K S machines are connected to the host is our use of an intermediate server or host named KNeXt to connects to all assembly equipment in the fab. The equipment can then, in turn, connect to an external secured cloud or K S Global Cloud.Ng: What are the objectives for smart manufacturing?Chong: The ultimate goal is to achieve higher factory productivity or better OEE (Overall Equipment Effectiveness) by improving machine yields, productivity and efficiency. The key is to leverage AI, 5G, the Internet of Things (Iot) and other industry 4.0 technologies to drive automation and process improvements. Ultimately, each factory must meet productivity, yield and cost goals. Smart manufacturing enables factory operators to meet these goals. That is the focus of smart manufacturing.Ng: What is the biggest potential benefit of smart manufacturing?Chong: Smart manufacturing uses data to predict outcomes of a process step or machine operation. Once data is available in the global cloud, analytics can start to build data sets to run statistical modelling and examine factory operation trends. We can also use the data to identify past machine behaviors in order anticipate outcomes, including undesirable ones that we can then prevent.In the SMT example, if we can systematically examine days or weeks of historical performance, we can plot some statistical variations in the process specifically to a pick or placer or a robot and anticipate or avoid problems. However, all sensors must be in place in the bond head or the robot so that we can detect changes or variations in the robot’s movements.Kulicke Soffa smart manufacturing facility Ng: What are some recent factory improvements smart manufacturing has enabled? Chong: Kulicke Soffa has contributed to the hierarchical architecture of the smart factory and key technologies. COVID-19 is driving demand for greater factory connectivity, and K S offers solutions that are key to remote management and full control of smart equipment from a central control and embedding Internet of Things (IoT), big data, cloud computing and sensors in manufacturing. Using these technologies, a small smart factory can be remotely operated and managed.With COVID-19 limiting air travel around the world and access to support engineers, the need has grown for remote machine access to reduce the downtime per machine. Remote factory access enables off-site engineers to remotely identify and diagnose machine problems.Ng: What are barriers to faster adoption of smart factories?Chong: While most smart factories are capable of network connectivity and data collection, a key challenge is the lack of a business model for smart factories and smart equipment. Most factories must justify major capital investments by demonstrating ROI (Return of investments) potential. Capital improvements for every factory usually take several years to implement and are based on a complex business model. Factory connectivity requires substantial investments and years to implement. The same is true of the cloud infrastructure buildouts necessary to generate big data and meaningful analytics. The executive mandate for factory management to install capability usually calls for specific business targets in the planning stage.Another longstanding barrier to entry is the lack of compatibility of existing tools with new factory protocols, raising the question of whether the cost of replacing legacy tools justifies the need for a smart factory. If new factory investment is required for the latest tools to support the production of new products, the ROI will be much easier to justify.Ng: How is AI is important in smart manufacturing?Chong: AI interprets and learn from data to perform tasks and meet specific goals. Good examples of AI implementations include Amazon’s Siri and Alexa voice-command devices and self-driving cars being developed by Google and Tesla.At K S, over the years we’ve implemented AI in our smart wire bonders to reduce human intervention in our ProCu-7, PSP-2, ProCu Loop 2, Pro Bump and overhang processes.Thanks to AI, with senses of signals from the bonder, we can reduce the amount of parameters that an engineer or technician have to do trial and error. With on bonder metrology, PBI, loop height, wire sway features, AI allows us to measure process efficiency and provide feedback.Over several years of AI development, we have leveraged the technology to monitor machines and provide real-time performance feedback in order to provide better closed loop control such as short tail recovery in our bonder process. We can also use the data to predict machine behavior, monitor its health and track maintenance. Ultimately, AI enables fabs to improve manufacturing efficiency, productivity, yields and device quality.Ng: What’s an example of how AI has solved your manufacturing equipment problems?Chong: We’ve used AI to set RPM (real time monitor) limits, identify defective P-parts and monitor various conditions such as wire size and capillaries. These types of cases can arise in any manufacturing environment as humans make process mistakes or use the wrong part for a machine. With AI, we can prevent these problems and reduce the risk of further material lost from the wire bonding process.Ng: What advice do you have for factories looking to implement smart manufacturing systems?Chong: To build a smart factory, start by focusing on a clear set of business objectives and how smart manufacturing will help minimize or eliminate current factory inefficiencies. In other words, start with the end in mind – the problems that needs to be solved and the business goals – and identify the information you need to demonstrate ROI. Do you need to resolve, automate or improve processes or just to be more efficient? Before investing millions or billions of dollars to build a smart factory, identify those clear goals upfront. Then map out the particulars of implementation to avoid major problems around standards, protocols and connectivity.Bee Bee Ng is president of SEMI Southeast Asia.