semiconductors

The semiconductor industry continues to push the envelope to meet demands of key applications such as advanced computing, consumer electronics, and defense, as well as environmental sustainability. There remain several critical challenges that our industry is working diligently to address, but how can these issues be tackled more effectively and at a pace that can keep up with this ever-evolving landscape?SEMI sat down with Supika Mashiro, Advisor at Tokyo Electron, where she shares her perspective on the importance of strengthening industry collaboration and what SEMI is doing through its first-ever SEMI Global Standards Summit – “Innovating Tomorrow: Standards for Future Factories” – of which she chairs the Planning Committee responsible for organizing this Summit.Trio: What is the SEMI Global Standards Summit and why is this event timely?Mashiro-san: Topics such as advanced packaging, cybersecurity, as well as supply chain and materials innovation (and their impact to the environment) are considered strategic areas requiring more industry collaboration. Many of these areas also greatly benefit from standards, and the next generation specifications and guidelines will need to be engineered to meet the technical challenges we face today and in the future. The magnitude of these standardization efforts will require engagement from all stakeholders in the design-to-manufacturing value chain as well as multiple Standards Developing Organizations (SDOs) coordinating and collaborating with each other.This is the driving force behind the Summit, and the need to bring together industry stakeholders to identify standards-critical areas and align on developing an industry standardization strategy for the next 3- and 7-year time horizons. We are excited to host this inaugural event on December 12, 2024, in conjunction with SEMICON Japan 2024. Trio: What is the focus of the Summit?Mashiro-san: The Global Standards Summit will cover three main themes: Smart Manufacturing for Future Factories, Packaging Architectures Materials, Environmental Sustainability.Factories are increasing their use of digital twins, predictive maintenance, and AI/ML to improve productivity and yield across the entire manufacturing environment. To take full advantage of these approaches, factories must reduce cybersecurity risks and secure the transfer of “smart” data across the entire supply chain while protecting IP. There is a need for standards to address these risk areas, as well as help diverse advanced analytics systems interoperate to assist personnel in increasing factory productivity. In the Smart Manufacturing for Future Factories session, we will be focusing on autonomous fabs, cybersecurity, and flow-oriented manufacturing.Similarly, packaging technologies have been progressing since the early stages of semiconductor device development more than 70 years ago. More recently, where packaging occurs in the semiconductor process has evolved, and some of the packaging processes are now done as an extension of front-end manufacturing. Moving forward, packaging architecture and materials are becoming increasingly important, driven by the adoption of heterogenous integration to address demands for more complex functionality and reduced power consumption as well as enabling chiplet integration. In the Packaging Architecture Materials session, we will discuss what kind of standardization our industry requires for copper-copper (Cu-Cu) direct interconnection, hybrid bonding, and panel-level packaging. We will also explore glass substrates as well as standards needed to enable semiconductor assembly and test automation.Our third session recognizes that the semiconductor industry is heading into an era of NetZero, in which quantification of environmental performance can have meaningful financial impact. The methods of measuring and accounting the environmental impact such as carbon emissions and the presence of substances of concern in manufacturing and products are not uniformly consistent across the industry. In order for the semiconductor industry to better navigate and make a positive impact in this arena, a consistent set of standards will be crucial. In the Environmental Sustainability session, thought leaders will present on communicating substance of concern (SOC), reporting of process emissions from factories, as well as lifecycle assessment of materials and substances used in semiconductor manufacturing, including equipment.Last but not the least, we will feature a panel session where we will explore all of these topics in a discussion with our panelists.Trio: Who should attend the Summit and why?Mashiro-san: The Summit is intended for leaders who are interested in these standardization topics to come and engage. Attendees will hear and learn about the issues critical to the future advancements of semiconductor manufacturing, what’s happening to address them, as well as new standards development. Attendee engagement is critical as we want our participants to influence and be able to contribute to the direction of standards development by providing valuable insights to help optimize future factories. To facilitate industry collaboration, we have organized networking events with other stakeholders from suppliers and solutions providers to end customers. The Summit is just one of many compelling reasons for industry stakeholders and thought leaders to come to SEMICON Japan. There are several sessions on many related topics that we are covering in the Global Standards Summit. Ultimately, at the conclusion of the Summit, we expect to have identified lists of critical standards areas, and we would like for those leaders to be able to assign and dedicate resources to these standardization efforts.For more information about the inaugural SEMI Global Standards Summit, please visit the SEMICON Japan 2024 site and register today!Supika Mashiro works as an Advisor for Strategic Planning of Industry Initiative Group at Tokyo Electron Limited.She has been involved in Factory Integration (FI) IFT of IRDS since its inauguration in 2016 and a co-chair since 2017. Her area of interest and involvement encompasses “smart” technology applications in manufacturing equipment, its co-optimization with Fab operation as well as ESH/S (Environment, Safety, and Health/ Sustainability) road-mapping and related industry standard development. For the latter, she has taken a couple of leadership roles in SEMI Standards Program as well as IEC TC/44.Paul Trio is Director of the SEMI Standards program.

The silicon wafer market showed promising signs of recovery in Q2 2024, bouncing back after a prolonged downturn. The growth is fueled by seasonal factors and strong demand from investments in AI data centers, however, the consumer, automotive, and industrial segments are experiencing a slower pace of recovery. Historically, year-over-year (YoY) growth in semiconductor equipment investments tends to hit a low point before rebounding and typically contributing to an upward trend in wafer shipments. Figure 1 depicts this trend since 2001, with the only exceptions to wafer shipments following the rebound of fab equipment spending coming in the periods of the second and third quarters in 2002 and 2013, which are highlighted in gray. Figure 1* Notes 1) Data source: SEMI WWSEMS and SMG wafer shipments data 2) For semiconductor equipment spending, data from 2001 to 2024 is based on WWSEMS wafer processing equipment billing data 3) Equipment spending is updated through August 2024 This pattern underscores the crucial role of equipment investments in expanding production capacity and driving wafer demand. Following the rebound in equipment investment growth rates observed in 2024, projections indicate continued growth into 2025. This recovery in investments is expected to translate into increased wafer shipments, reinforcing a positive outlook for the silicon wafer market’s sustained growth.Additionally, the influence of DRAM Blended ASP (Average Selling Price) growth trends on wafer demand is significant. The historical data in Figure 2 shows that when DRAM ASP growth rates peak and then decline, wafer shipment growth tends to slow down after a lag. Figure 2* Remarks 1) Data source: SEMI SMG wafer shipments data and the Bank of Korea 2) DRAM ASP is updated through September 2024. With DRAM pricing potentially entering a downward trend in early 2025, this poses a key risk to the pace of the wafer market’s recovery. Looking ahead, wafer shipment growth is expected to vary by wafer type and diameter, with low to mid-double-digit growth projected for 2025, mid-to-high single-digit growth for 2026, and a notable slowdown in 2027. This forecast reflects evolving demand dynamics and ongoing market adjustments.In conclusion, the sustained recovery of the silicon wafer market hinges on a combination of increasing semiconductor equipment investments, the stabilization of raw material inventory levels among chipmakers, and careful monitoring of DRAM pricing trends. While the current upward trend in equipment investments is a positive driver for wafer shipments, the potential deceleration of DRAM Blended ASP growth poses a significant downside risk. If DRAM pricing exerts a sustained negative influence, it could shorten both the amplitude and duration of the current wafer market upcycle more than anticipated. This report not only examines these key investment and shipment dynamics but also provides an in-depth analysis of broader market trends, including supply-demand balances and pricing dynamics. By addressing these interconnected factors, it offers a comprehensive and forward-looking perspective on the long-term growth potential of the silicon wafer market.SEMI’s Silicon Wafer Market Monitor Report offers unique insights into global silicon wafer shipments, supply and demand dynamics, and average selling price (ASP) projections. This comprehensive quarterly report breaks down silicon shipments by region and wafer size, including 300mm, 200mm, and 150mm wafers, providing a detailed view of the market landscape.Semiconductor manufacturers, investors, and industry analysts rely on this report as an essential tool for making informed business decisions and exploring the latest data and trends shaping the future of the semiconductor industry.Download a sample of the Semiconductor Manufacturing Monitor report. For more information on the report or to subscribe, please contact the SEMI Market Intelligence Team at [email protected]. Details on SEMI market data are available at SEMI Market Data. Sungho Yoon is Principal Analyst on the SEMI Market Intelligence team.

How Cool is That - Northrop Grumman’s “World’s Fastest Microchip” won the 2024 “Coolest Thing Made in California” contest, organized by the California Manufacturers Technology Association (CMTA). Public votes were cast for 138 California-made products in four rounds, culminating in this microchip—boasting speeds up to 1 terahertz—being crowned the winner. Manufactured in Redondo Beach, CA, the chip is 1,000 times faster than smartphone processors and represents California’s cutting-edge manufacturing sector. The contest and award ceremony were celebrated during CMTA’s MakingCA Conference, honoring manufacturing’s $310 billion contribution to the state’s economy. Doing the Green Wave - NIST scientists have successfully created a compact, full-spectrum laser covering the green-yellow-orange wavelengths, long considered challenging to produce. Traditional semiconductor lasers struggled with green wavelengths due to material limitations, so NIST turned to nonlinear optics, producing different wavelengths by adjusting silicon nitride device geometry and laser input. This breakthrough enables more precise, pure wavelengths ideal for quantum computing, medical devices, and underwater communications. Their method combines pump laser tuning and device adjustments, achieving 150+ wavelengths, demonstrating a significant advancement in accessible, high-quality lasers.Source: NIST’s Compact Green Semiconductor Laser - IEEE SpectrumEnergy Hero - At the 2024 ITF World conference, AMD CEO Lisa Su spotlighted a new goal: a 100x boost in computing efficiency by 2027. As shrinking transistor sizes yield diminishing returns, materials innovation has become essential for boosting performance and efficiency. Applied Materials has responded with advanced materials engineering solutions, harnessing exotic elements and 3D chip designs to improve efficiency. For instance, Applied’s Integrated Materials Solution™ combines six process technologies to reduce chip wiring resistance by 25%, a critical advance as semiconductor nodes shrink to the atomic scale. These methods promise breakthroughs in power efficiency across AI, personal electronics, and more. Building Automation of the Future - Imagine a future where every device in newly built structures— from HVAC systems and appliances to light switches and sensors—is equipped with a microprocessor and linked through a reliable communication network. This could transform how buildings operate, yielding substantial benefits across various sectors. Chip manufacturers would see new growth opportunities, while builders could offer smarter, more efficient homes. Consumers would gain convenience and comfort, as buildings could dynamically adjust to personal preferences and real-time needs. For instance, rooms would automatically adapt their temperature as people move through them, making manual thermostat adjustments obsolete. This automated approach wouldn’t just create a more comfortable environment but would also optimize energy use, potentially lowering costs and benefiting the environment.Source: Building Automation of the Future - EE TimesDo you have a fun fact to share? We invite SEMI members to share fun facts about the industry or their company. We’ll consider your tidbits for inclusion in future blog articles and or posting on social media. Complete our survey form or email [email protected]. Learn more about the SEMI Foundation and its initiatives to promote industry awareness and help provide a path for those interested in rewarding careers in microelectronics. Follow the SEMI Foundation on LinkedIn, Instagram, X and Facebook. Margaret Kindling is Senior Program Manager for Diversity, Equity, and Inclusion at the SEMI Foundation. She promotes inclusion and belonging via Women in Semiconductors, Semiconductor PRIDE and SEMICON West Workforce Development Pavilion programming.

SEMI Korea Members Day 2025 in September featured a wealth of insights on semiconductor industry market and technology trends. As the two-year semiconductor inventory correction eases, Soo-Kyoum Kim, vice president at International Data Corporation (IDC), provided a market update during his address to the event’s 400 attendees at the Suwon Convention Center. He highlighted that the semiconductor market is showing signs of gradual recovery, with growth predicted for the second half of 2024 and into 2025. This growth, he said, is being fueled by rising demand for artificial intelligence (AI) and high bandwidth memory (HBM). He projected that the total semiconductor market would grow to $779.8 billion in 2025, marking a 15.8% increase from this year's estimate of $673 billion. By next year, the memory market is expected to rise by 24%, largely driven by demand for AI. Although consumer demand will likely weaken due to a slowdown in the Chinese market, Kim shared that easing inventory adjustments will lead to a rebound during the second half of 2024, particularly in the growth of DRAM and NAND. Kim also predicted that the non-memory market, which reached $503.4 billion this year, will grow to $569.4 billion by 2025.Additionally, the compound annual growth rate (CAGR) for semiconductor network and data center sales is projected to be 26.4% and 16.2% by 2028, respectively. Kim explained that the strong demand for AI semiconductors in data centers and networks will help the semiconductor market maintain an 8% CAGR over the next five years, following the 2023 market adjustment.SEMI Korea Members Day HighlightsH.D. ChoThe AI-driven industrial transformation is demanding more advanced processes. To accommodate AI, the industry has shifted its focus away from miniaturization toward back-end processes. However, the challenges facing Korea's semiconductor industry have also intensified. Leading semiconductor research firms shared in-depth market forecasts and presented their latest semiconductor technology roadmaps, offering insights on business strategies for Korea’s semiconductor ecosystem.In his opening remarks, H.D. Cho, president of SEMI Korea, expressed deep gratitude for the exceptional resilience of SEMI Korea’s members, who continue to overcome roadblocks despite global uncertainties. He also highlighted the growth of SEMI Korea’s member companies, emphasizing their positive role in the global semiconductor supply chain, as well as SEMI's ongoing commitment in supporting their innovations.Call for Renewable Energy Policy Reform to Achieve Net ZeroBora Lee, leader of Solutions For Our Climate (SFOC), emphasized the strong correlation between the semiconductor industry and Korea's economic growth. Lee also outlined key factors contributing to the high costs that hinder renewable energy adoption in the semiconductor sector. "Korea's levelized cost of electricity (LCOE) for renewable energy is about 2-3 times higher than the global average," she said. "The establishment of a policy council involving semiconductor companies is a crucial step in developing cooperative strategies to promote the use of renewable energy." In addition, Lee stressed that collaboration among suppliers, consumers, and policymakers is necessary to address these barriers and accelerate the transition to renewable energy within the industry. AI is Reshaping the Global Memory MarketPeter Lee of CITI Group shared that the convergence of cloud and edge computing is helping support new demands from AI, the metaverse, and automotive applications. As a result, this will increase long-term demand for memory. "The growing demand for AI is diversifying the memory market," Lee said. "This includes products such as HBM, LLW, LPDDR5T, and CXL, all of which are expected to see increased adoption according to AI computing requirements."As the need for parallel processing in AI training and inference tasks grows, Lee predicted the demand for HBM3 and DDR5 will significantly rise. HBM's share of total DRAM revenue is expected to increase dramatically – from 11% in 2023, to 30% by 2027. Expected Growth of the GaN Power Semiconductor MarketHo-Young Cha, a professor at Hongik University and co-founder and CTO of ChipsK, highlighted that the GaN power semiconductor market is expected to see continuous growth due to its advantages over silicon-based devices. The expansion of GaN technology applications in various industries, including consumer electronics, automotive, and telecommunications, he said, will drive additional growth."The GaN power semiconductor market will grow from $180 million in 2022 to $2.04 billion by 2028," said Cha. Growth Outlook for the Semiconductor Equipment and Materials Market in 2025 Clark Tseng, director of the SEMI Market Intelligence Team, projected that the short-term outlook for the global semiconductor market will gradually recover due to improvements in end-demand for major electronic product sectors and surging demand for AI chips. "The equipment and materials markets are expected to show a slight improvement in 2024, with a strong recovery anticipated in 2025," Tseng stated. He noted that the equipment market would grow by approximately 3% in 2024 from $95 billion in 2023 and is expected to grow by 15% in 2025. Regarding wafer fab materials, the silicon wafer market is expected to decline from $14.1 billion in 2023 to $13.2 billion in 2024. However, recovery is anticipated to begin in the second half of 2024, with the market projected to reach a new record of $48 billion in 2025. For more insights on Korea and the industry, attend SEMICON Korea from February 19-21, 2025 at COEX Convention Exhibit Center. Visionaries and leaders will gather to discuss the latest developments, innovations, and business opportunities within the industry. As the region’s premier microelectronics event, SEMICON Korea 2025 is expected to host 70,000 attendees, 500 exhibitors, and 200 speakers. More event information, including registration details, will be available soon.Jaegwan Shim is Senior Specialist, Marketing at SEMI.

In the rapidly-evolving semiconductor industry, maintaining a competitive edge is crucial. To position Europe at the forefront of global semiconductor innovation, imec is leading the NanoIC pilot line initiative. Aligned with the European Chips Act, this initiative is a strategic move to bolster Europe's leadership in key markets like high performance computing, automotive, and healthcare.SEMI spoke with Srikanth Samavedam and Jo De Boeck from imec, Belgium, to learn more about the NanoIC pilot line and to better understand its goals, challenges, and prospects. From transitioning to gate-all-around (GAA) nanosheet devices, to developing advanced memory technologies and interconnects, this conversation highlights the cutting-edge advancements made possible through collaboration across the industry’s value chain.SEMI: How is the NanoIC pilot line working to revolutionize the semiconductor industry, and what are its main objectives?Samavedam: The NanoIC pilot line is a European initiative aimed at bridging the gap between R D and industrial innovation. The project is creating a beyond-2nm system-on-chip (SoC) pilot line, developing advanced logic, memory, and interconnect technologies. This effort supports the European Chips Act's vision for leadership and competitiveness in global semiconductor innovation, particularly in critical markets like high performance computing, communication, automotive, energy, and healthcare. However, advanced technologies come with more complexity, and addressing these complexity challenges requires more mature module baseline flows. By improving baseline flow repeatability and variability while reducing defectivity, we can accelerate the development of future technologies. The NanoIC pilot line is working to provide access to these advanced technologies and baselines to develop future compute systems. This will help ensure European competitiveness across the industry – from semiconductor materials, equipment and design to systems and applications.SEMI: Who are the core partners involved in this initiative?De Boeck: Key partners of the pilot line include CEA-Leti, Fraunhofer-Gesellschaft, VTT Technical Research Centre of Finland, Tyndall National Institute, and the Center for Surface Science and Nanotechnology of the University POLITEHNICA of Bucharest. This project is also supported by the Flemish government, other participating states, and the Chips Joint Undertaking of the EU Chips Act.These institutions and organizations bring a wealth of knowledge and resources, and imec compliments their efforts by providing access to its global partnerships with key industry leaders. The NanoIC pilot line is helping strengthen Europe’s global semiconductor industry leadership while aligning efforts with other regional Chips Acts. SEMI: Can you elaborate on the significance of transitioning from field-effect transistors (FinFETs) transistors to GAA nanosheet devices in CMOS technology?Samavedam: The transition from FinFETs to GAA nanosheet devices is a significant advancement in CMOS device technology. FinFETs have been the backbone of CMOS technology from the 22nm to the 3nm node. But starting at the 2nm node, nanosheet devices will need to be introduced. Nanosheet devices, including variants like Forksheet devices, are expected to drive scaling and performance through three generations – 2nm, A14, and A10. Complementary FET (CFET) architectures are also expected to be introduced around 2031 at the A7 node, which will represent another major inflection point in CMOS device design. This progression requires extensive research into new materials, process modules, equipment, and advanced patterning capabilities using high numerical aperture extreme ultraviolet (high NA EUV) lithography – all of which will be implemented on the NanoIC pilot line. FIGURE PROVIDED BY IMEC │ SCHEMATIC ILLUSTRATION OF A FUTURE COMPUTE SYSTEM. THE SYSTEM IS MADE OF LARGE MULTI-DIE ELECTRICAL-OPTICAL INTERPOSER PROVIDING ELECTRICAL AND OPTICAL INTERCONNECTS BETWEEN THE VARIOUS CHIPLETS (CPUS, GPUS, HBM). ALSO SHOWN ARE CONNECTIONS TO PACKAGE SUBSTRATE, AS WELL AS FIBER CONNECTORS AND AN INTEGRATED LASER SOURCE. CENTRAL PROCESSING UNIT (CPU); GRAPHICS PROCESSING UNIT (GPU); HIGH BANDWITH MEMORY (HBM); PROCESSING UNIT THAT CAN INCLUDE CPUS, GPUS, AND OTHER SPECIALIZED PROCESSORS (XPU); APPLICATION-SPECIFIC INTEGRATED CIRCUIT (ASIC); ELECTRONIC INTEGRATED CIRCUIT (EIC); FF-LEVEL: FEMTOFARAD-LEVEL; FIELD-PROGRAMMABLE GATE ARRAY (FGPA); GAAS QD: GALLIUM ARSENIDE QUANTUM DOT; INTEGRATED SILICON PHOTONICS PLATFORM 300MM (ISIPP300); REDISTRIBUTION LAYER (RDL); SILICON PHOTONICS (SIPHO); THROUGH PACKAGE VIA (TPV). SEMI: What are the key innovations necessary for advancing memory technology?Samavedam: As SRAM scaling slows, the exploration of novel, dense embedded memory concepts will become imperative. Technologies like spin orbit torque magnetic RAM (SOT-MRAM) and 2-transistor 0-capacitor (2T0C) embedded DRAM using deposited semiconductors like indium gallium zinc oxide (IGZO) are promising. These innovations address memory capacity and bandwidth challenges from new workloads in compute systems. Additionally, developing a 3D memory platform to explore future memory options will be essential for improving SRAM and DRAM. These advancements will help meet the demands of new applications like machine learning, augmented and virtual reality, and autonomous vehicles.SEMI: How do advanced interconnect technologies contribute to the future of semiconductor design?Samavedam: Advanced interconnect technologies, like chip-to-chip lateral (2.5D or interposer technologies) and vertical interconnects (3D technologies), play a crucial role in addressing memory capacity and bandwidth challenges. These technologies enable the partitioning of SoC functions into separate dies, allowing for more efficient and scalable designs. Advances like pitch scaling of micro-bumps and copper (Cu) hybrid bonding are facilitating this fine-grained partitioning of SoC functions. Additionally, optical interconnects and 3D interconnect-enabled co-packaging provide high-bandwidth and low-power connectivity at wafer scale. The rise of chiplet architectures and standardization will also increase the demand for low-cost, tight-pitch interconnect technologies like Cu/polymer redistribution layers.SEMI: How do your collaborators benefit from the NanoIC pilot line? De Boeck: One of the biggest collaborator benefits is the pilot line’s commitment to knowledge sharing through R D access and training. We invite foundries, IDMs, materials suppliers, equipment suppliers, and system companies/OEMs to jointly develop the materials, process modules, and integration flows to accelerate the development of beyond-2nm SoC technology pillars.Design pathfinding and system exploration process design kits (PDKs) will be available for start-ups, small- and medium enterprises, universities, and design and system companies to aid in prototyping and testing their designs. The NanoIC pilot line will also offer comprehensive training programs, including virtual PDK training, bootcamps for faculty, and internships and expert courses for students. To learn more, experts and key partners of the NanoIC pilot line will be presenting from 14 -16:40 at SEMICON Europa on November 12. imec’s program, ITF Chip into the Future, will highlight advancements in digital technology, capacity building through the European Chips Act, and the role of the NanoIC pilot line in accelerating beyond-2nm innovation. The conversation will also address industry requirements for pilot lines, emerging initiatives boosting Europe’s innovation and competitiveness, and perspectives on advanced materials and semiconductor equipment. Srikanth Samavedam, Senior Vice President of Semiconductor Technologies at imec, oversees programs in logic, memory, photonics, and 3D integration. Previously, he was a senior director at GlobalFoundries, leading 14nm FinFET technology into production and developing 7nm CMOS. Starting his career at Motorola, he worked on strained silicon and other advanced materials. He holds a Ph.D. in materials science and engineering from MIT and a master's degree from Purdue University. Jo De Boeck, Executive Vice President and Chief Strategy Officer at imec, oversees the company’s strategic direction and serves on its executive board. He joined imec in 1991 after earning his Ph.D. from KU Leuven and has since held various leadership roles, including head of imec’s Smart Systems and Energy Technology business unit and CTO. De Boeck is also a part-time professor at KU Leuven. Maria Daniela Perez / Communications Manager, SEMI EuropePhone: +49 160 2562977Email: [email protected]

Gone are the days when companies were said to go “beyond compliance” if they had sustainability ambitions and operated in a largely voluntary space.Corporate sustainability now sits in a tangle of business priorities, stakeholder expectations, and regulatory obligations. New landmark legislation and policies have changed the game in many markets where semiconductor value chain companies do business. Today, accuracy of information, threshold-setting, evaluation criteria, and due diligence are subject to scrutiny, fines, and litigation.A myriad of compliance risks are now linked to business actions that were historically voluntary in a sustainability context. Fueling the shift are regulations such as the EU’s Corporate Sustainability Due Diligence Directive (CSDDD) and Corporate Sustainability Reporting Directive (CSRD).Across the semiconductor value chain, it is crucial for companies to have a solid regulatory strategy for their sustainability activities. They must take into account, for example, mandatory rules that drive up risks from selectively taking action on some sustainability issues while demoting others.Semiconductor manufacturing and design firms, together with their business partners, face heightened pressure to navigate business and sustainability priorities around the climate transition, human capital management, supply chain management, and a host of other environmental, social, and governance issues that are high on regulatory agendas.The SEMI Sustainability Initiative hosts several working groups that bring to light common concerns and provide a forum for sharing response strategies. To sharpen the guidance that SEMI offers, the Sustainability Initiative is launching the webinar series, Global State of Play: Sustainability Regulations, Reporting, Incentives. This series offers semiconductor industry professionals the chance to learn from top-tier experts on the most pressing challenges in compliance, disclosure, and strategy for sustainable business.The first webinar, Developing a Regulatory Strategy for Sustainability: How to Navigate Key Sustainability Decisions, will feature Ashley Walter, Partner and Chief Sustainability Officer at Orrick Herrington Sutcliffe LLP.As the global business association for the electronics design and manufacturing value chain, SEMI is pleased to convene experts to address improving sustainability strategies for our industry. The SEMI Sustainability Initiative invites industry stakeholders to see the importance of building a regulatory strategy that coordinates across functions, from engineering to the boardroom.Learn more and register.Jordan Famularo, PhD, is Programs Manager, Sustainability at SEMI.

The Rising Stars: 20 Under 30 blog series celebrates the brightest young leaders shaping the future of the semiconductor industry. These exceptional individuals have earned the SEMI Europe 20 Under 30 Award for making a remarkable impact across the supply chain—whether in engineering, sales, marketing, or R D. The series spotlights these rising stars for their career achievements, commitment to innovation, leadership skills, and dedication to driving both business success and community growth.Follow their inspiring journeys, and discover how they are thriving and paving the way for future generations in the semiconductor world.Introducing Marieke Vermeulen: Product Quality Assurance Engineer at MelexisMarieke Vermeulen's journey into the semiconductor industry is a testament to curiosity, adaptability, and self-driven learning. With a background in classical philology, her entry into Melexis as a customer quality technician was unexpected, yet she quickly embraced the challenges of the industry. Through her commitment to growth and innovation, Marieke has risen to the role of Product Engineer, demonstrating leadership and a passion for continuous improvement. Her contributions, particularly in product ownership and driving business growth, highlight her as a dynamic force within Melexis, embodying both technical excellence and a collaborative spirit.SEMI: What inspired you to join the semiconductor industry? Vermeulen: My entry into the semiconductor industry was actually quite accidental. After completing my master’s degree in classical philology, I was still unsure about which direction I wanted my professional life to take. Then, an opportunity arose to join Melexis as a customer quality technician.I did not have anyone in my immediate circle with experience in the industry, so I entered the field without really knowing what to expect. I had only a vague idea of what a semiconductor company did. However, from those early days onwards, I have not looked back. It is my love of knowledge and the desire for a deeper understanding that continues to drive me in my role within Melexis’s quality department. During my literature studies, I was motivated by the idea that there is no absolute, uncontestable truth. Meaning will change with time and place. This perspective aligns closely with the mindset of the semiconductor industry. With new inventions and concepts constantly emerging, the industry is always evolving. We must challenge what we believe to be true yesterday and adapt to the discoveries and advancements for today.So, while there was no direct inspiration that led me to join, more of a stumble into the field, I have since developed a deep respect for how the industry operates. I In particular, I respect how people in the industry do not hesitate to question in order to keep pushing the boundaries of innovation.SEMI: How did your early experiences and education shape your career path?Vermeulen: There was no direct experience. During my school years, STEM was just beginning to earn its place in my educational framework, and we were only introduced to the basic principles. Fortunately, this has changed significantly since then. However, my background hasn’t held me back, in fact, quite the opposite.One main principle from my studies stands out: in language, nothing is set in stone. There is no single truth, no single solution and no single voice. At its heart, language is shaped by human interaction. My studies taught me to think critically and to understand that there is always more than one answer to a question. This approach directly influences the way we work in the product quality department. Our goal is to develop and produce products that meet a customer’s needs as closely as possible. But it is a continuous process and very rarely a straight line. We learn from our past experience to improve the next iteration, again and again. We regularly consult with our peers to gather different ideas, and we listen to the industry to understand where the needs are. Then, we translate those insights into an effective solution.SEMI: Can you share a professional accomplishment you’re most proud of, and explain why it’s significant to you?Vermeulen: Our products go through two main stages in their lifecycle: development and production. As a product engineer, I am responsible during the production stage. However, before we reach this point, there is a transition period where the development and production teams come together to prepare the product for the best possible launch. This period is often hectic, but it clearly demonstrates how much of a team effort our products represent. Every team member understands their role and works towards the collective goal. Being part of such a diverse team and seeing our products succeed is always a thrill for me. While the products are made with metals, silicon, and other elements, it is the human factor that truly brings them to life. The very first spark is always the idea to create. SEMI: As a young professional in the industry, what is your greatest challenge? Vermeulen: As a young woman in STEM, the most obvious answer is that I have to prove myself more than my male colleagues or more experienced peers. However, at Melexis, I have found strong support in overcoming this challenge. Our voices are heard, and we are an active and valued part of our teams. We can express our ideas freely, knowing they will be considered just as seriously as anyone else’s. I can only hope this trend continues throughout the industry.SEMI: What advice would you give to younger generations aspiring to make an impact in this industry?Vermeulen: To those who are unsure if STEM is truly for them, I would say: We need engineers, but we also need dreamers to bring the ideas to life. We need designers and coders who can make the device function, but we also need people who can communicate these concepts to the world. Moreover, we need educators who can inspire and teach the next generations. There is a place for many different minds within the industry, so I encourage you to step in this direction. I’m sure you will find a place.And for those inspired by the semiconductor world and are sure this is where they want to be: don’t be afraid to look beyond the industry. Listen to those around you and take their ideas to heart. Be the inventor for those who cannot bring ideas to life, and offer solutions to those who feel stuck.Cooperation has made our industry great, and it is essential for building a strong foundation moving forward. SEMI: How do you envision future work environments?Vermeulen: The past few years have demonstrated how advanced technology has made the world much smaller. With just a click of a button, a camera, and a microphone, we can connect to the world, ignoring the constrains of time, space and borders. This accessibility opens the door for many more people to enter the industry from all around the globe. A hybrid and flexible work environment enhances this even further, accommodating those who might face physical or logistical restrictions. We need to continue on this path. By embracing diversity, we allow new ideas to emerge at the intersection of different minds. Why exclude a brilliant mind simply because they are on the other side of the continent? Why overlook someone whose mother tongue differs from yours when we can find a common language?At Melexis, we already welcome many different cultures, and it is amazing to see how vibrant this makes our offices. New team members bring their own experiences and blend them with ours. Just as alloys often retain characteristics of their base metals, these newly melded ideas will enrich our collective innovation.SEMI: What impact has the 20 Under 30 Award had on your career? Vermeulen: The award has connected me with wonderful peers and highlighted how we all strive to improve the industry, each in our own way and from our unique areas of expertise. It also has provided me an opportunity to demonstrate that the industry is welcoming to a variety of experiences and is willing to invest in its people. The goal was to foster connections, and it has truly jumpstarted this for me. Following 20 Under 30 JourneysMarieke Vermeulen's story is an inspiring example of how passion for learning and a willingness to embrace new challenges can lead to remarkable success. From her unexpected entry into the semiconductor industry to her achievements as a Product Engineer at Melexis, she has consistently demonstrated leadership, innovation, and dedication. Her journey highlights the importance of curiosity and adaptability in driving both personal and professional growth, making her a role model for others in the industry.The Rising Stars: 20 Under 30 blog series celebrates the exceptional talent and leadership driving the future of the semiconductor industry. Each of the young innovators honored is excelling in their respective fields while shaping the landscape of technology and business with their visionary approaches and dedication. Their stories exemplify the remarkable achievements and unwavering commitment that define the next generation of industry leaders. The series is intended to inspire and motivate future professionals to pursue their passions and embrace the opportunities within this dynamic industry. Stay tuned for more stories of rising stars who are paving the way for continued growth and innovation in the semiconductor world.Learn more about the SEMI Europe 20 Under 30 Award and the recipients honored at SEMICON Europa. For more information contact Maria Daniela Perez at [email protected] Daniela Perez is Communications Manager at SEMI Europe.

In an era where technology permeates every aspect of our lives, the semiconductor industry serves as the backbone of innovation. From IoT devices to data centers, every piece of technology relies on integrated circuits (ICs) such as intellectual property (IP) cores and system on chips (SoCs). As these technologies become increasingly pervasive, the importance of hardware security assurance in the design and development of IP and SoCs cannot be overstated. Evolving cyber threats and sophisticated attacks make it essential for vendors to integrate advanced security measures into their workflows.Market Pressures Driving Demand for Enhanced Hardware Security The semiconductor market is projected to reach $1 trillion by 2030. At the same time, semiconductor devices and system designs are becoming increasingly complex. With that complexity comes the added difficulty and effort required to conduct thorough security analyses. Additionally, competitive pressure to reduce time-to-market means that vulnerabilities can be more easily overlooked or exploited, making it crucial for the industry to adopt automated security solutions. As more products are deployed in critical systems, from consumer electronics to national infrastructure, the stakes become even higher, underscoring the necessity for robust security measures.According to the SEMI Electronic Design Market Data (EDMD) report, in 2023, the electronic design automation (EDA), semiconductor IP, and related services market reached $17.1 billion, fueled by the increasing complexity of semiconductor designs and the growing emphasis on security. While the overall EDA market is growing at a 7.4% compound annual growth rate (CAGR), the semiconductor IP segment is expanding at 9.7%, and in comparison, the logic verification tools market alone is surging ahead at 24.2%. Deeper verification processes and tools are needed to not only handle the rising complexity of semiconductor designs, but also to support the growing emphasis on secure-by-design principles to ensure robust and reliable products in an evolving technological, security, and threat landscape. As a result, the market for logic verification tools — a key component of the EDA market — is surging. The Rising Cost of Cyber Threats from Data Breaches and Architectural Flaws Pavani Jella, Silicon AssuranceThe average cost of a data breach is $4.88 million1, encompassing lost business, regulatory fines, legal fees, and damage to brand reputation. As the semiconductor market grows, the potential financial impact of security breaches due to hardware vulnerabilities also escalates. Companies must invest in robust security measures to mitigate these risks and protect their financial health.Cyber threats from the exploitation of architectural flaws are another threat. Plundervolt is one example of an architectural flaw that could lead to hardware exploitation. Discovered by ethical hackers, Plundervolt is the name of an attack that exploited voltage fault injection to compromise the security of Intel processors. By manipulating the voltage supplied to the CPU cores, attackers could induce errors in the SGX enclave, allowing them to leak sensitive data or even bypass security protections intended by the enclave. This flaw was particularly concerning because it operated at the hardware level, making traditional software security measures ineffective. The attack leveraged the SoCs’ power management features, specifically dynamic voltage and frequency scaling (DVFS), to achieve its malicious objectives.Exploiting such a vulnerability could lead to the exposure of sensitive data, such as cryptographic keys and proprietary information, compromising the confidentiality of secure enclaves. This breach could erode trust in an IP or SoC provider’s security features, particularly in environments that rely on using the IP or SoC for protecting critical data. In cloud environments, a successful exploit could result in multi-tenant data breaches, impacting numerous users.The vulnerability also poses risks to secure applications, potentially leading to manipulated outcomes and decrypted communications. Businesses could face significant financial losses, operational disruptions, and regulatory consequences due to such an attack. It is a stark reminder of how architectural flaws in SoCs can be exploited, leading to severe security breaches that are challenging to mitigate without hardware-level fixes.Industry Believes Hardware Security Assurance Is a Key Priority A majority of security professionals from a diverse group across industry, defense, government, and academia rate hardware Trojan detection, IP piracy protection, and SoC vulnerability assessment as high priorities. This prioritization reflects the industry's awareness of the critical importance of security measures in maintaining the integrity and reliability of semiconductor products.As a result of this awareness, investments in cybersecurity are expected to reach $345.4 billion by 2026, growing at a CAGR of 9.7%2. This substantial investment demonstrates the global commitment to enhancing security measures across all industries, including semiconductors, to combat the escalating threat landscape.New EDA Tools and Investments Needed to Combat Cyber Threats The adoption of new EDA solutions is essential, despite the initial costs. Costs can range from $100,000 to $1 million per license for general EDA design and verification tools, depending on the complexity and capabilities of the software. Pre-silicon security EDA tools can detect vulnerabilities early in the design phase, significantly reducing the risk of exploitation and the need for costly post-production fixes while enhancing product reliability. Secure-by-design principles ensure that security measures are integrated throughout the development process, rather than added as afterthoughts.Integrating these new tools also requires investment in training and potential adjustments to existing workflows. However, the improved security and efficiency provided by these tools can offset these initial costs.While the costs of acquiring advanced EDA tools and deploying them in the workflow is significant, the investment is justified by the long-term benefits of enhanced security and reduced risk of costly breaches. Secure-by-design practices can prevent significant financial losses from security breaches, offering substantial long-term savings. Companies that invest in robust security measures are better positioned to demonstrate market leadership and build customer trust and loyalty, while avoiding the reputational and financial damage associated with breaches.ConclusionThe semiconductor industry is at a critical juncture where the application of advanced EDA solutions for hardware security is not just beneficial, but essential. The time to act is now.The increasing sophistication of cyber threats and the financial repercussions of security breaches make it imperative for IP and SoC vendors to adopt advanced EDA security assurance solutions to secure their designs. By investing in cutting-edge EDA tools and prioritizing security from the earliest stages of design, vendors can safeguard their products, maintain market competitiveness, and protect against the ever-evolving landscape of cyber threats.References1. IBM Cost of a Data Breach Report 20242. KPMG 2024 Global Semiconductor Industry OutlookPavani Jella is the Vice President of Business Development at Silicon Assurance, a member of the Electronic System Design Alliance (ESDA) a SEMI Technology Community. Silicon Assurance specializes in hardware security assurance solutions. With a strong background in the semiconductor and EDA industries, Pavani plays a pivotal role in driving strategic growth and fostering innovative partnerships. Passionate about the intersection of technology and security, she helps organizations adopt state-of-the-art solutions that ensure the resilience and trustworthiness of their hardware systems.

The semiconductor industry, once a hidden force in technology, is now recognized as a pivotal driver of the modern economy. As the engine behind everything from smartphones to smart cities, semiconductors fuel innovation and shape how students learn, play, and engage with the world, making chips a crucial factor in shaping our collective future as the climate changes.In line with SEMI Sustainability Initiative participation at Climate Week NYC, we are preparing a groundbreaking pilot program at the intersection of youth empowerment, workforce development, and climate action. To help the semiconductor industry develop a climate-literate workforce, the SEMI Climate Equity Social Impact Working Group and the SEMI Foundation have partnered to develop a global K-12 program open to all SEMI members for participation and sponsorship. The program will share best practices and resources such as those that follow in this article.SEMI will announce the program at the 29th United Nations Climate Change Conference, more commonly known as COP29, which will be held in Baku, Azerbaijan from November 11-22, 2024. SEMI members are encouraged to become partners and help shape the program ahead of COP29. Contact us to learn more and participate in the announcement.The Opportunity for Semiconductor Industry Climate Leadership It’s not enough for students to simply be aware of climate change and the United Nations Sustainable Development Goals. Awareness alone won’t protect communities or help solve the problems we may all face in the future. We must prepare the next generation to be climate-literate — providing them with the knowledge, tools, and skills to understand complex issues, work collaboratively across the globe, and develop practical, real-world solutions. With this foundation in place, young people become proactive global citizens with the skills to solve problems.The semiconductor industry doesn’t need to reinvent the wheel or build new networks to drive partnership at the intersection of sustainability and workforce development. Companies in our value chain are already well positioned to scale equitable opportunities, promote STEM and AI skills, and empower students to tackle real-world climate challenges as we help prepare them for future careers. Global networks of sustainable schools focused on climate action are well-established in key semiconductor regions. In Taiwan alone, over 330,000 students will participate this year.Sustainable schools networks engage teachers and students with programs that are fun, motivating, and spark curiosity by providing ownership over solving real-world challenges. These mostly free programs can also help drive gender and racial equity into the tech, science and engineering fields for communities and schools that might otherwise be left behind.Examples of programs with youth-designed climate actions are all around us. Students in one New Taipei City, Taiwan school conducted their own energy audits to reduce energy consumption in their medium-income community. Students in a North Pennsylvania, U.S. school of limited resources created a community garden that sparked interest in biodiversity and STEM.Our industry has a unique opportunity to tap into existing sustainable schools networks and help them grow, while amplifying youth-led climate action. These efforts will empower the next generation to drive meaningful change in their communities and inspire young people of every demographic to see the semiconductor industry as a place where they can build impactful careers.Leading the Way: Why the Semiconductor Industry is PivotalGiven the essential role of semiconductor companies in the global electronics design and manufacturing value chain, industry leaders have a unique opportunity to lead the way in cultivating a climate-literate generation of students for the future workforce. Early education on sustainability and technology integration is crucial, positioning leading companies and their partners to shape the emerging global workforce. The long-term semiconductor workforce development effort must cultivate global citizens who understand how to apply their skills in solving challenges. Opportunities for All Schools: Making Climate Education InclusiveWhile some high-resource schools may be able to integrate advanced environmental science and technology projects, it’s important to ensure that all students have access to meaningful climate learning opportunities. For example, students at schools with fewer resources can engage in projects like programming inexpensive micro:bit sensors to measure local water quality or sample moisture levels in their community gardens. Projects such as these are affordable, scalable, and can be implemented in any school, providing students with hands-on experience in environmental science and technology.More importantly, they build critical thinking and problem-solving skills that empower students to take ownership of climate issues affecting their communities.Additional powerful examples already in existence that provide a basis for scalable teaching, learning and partnership for schools globally include:1. Global Climate Pathways (GCP) is a program where various middle schools around the world work together to solve climate problems. Schools that participate receive learning opportunities and tangible STEM learning tools, including STEM kits. These innovative tools provide learning opportunities in coding and circuits.2. EcoSchools U.S. is a global sustainability education program run by the National Wildlife Federation (NWF). This transformative program is student-led, integrating green STEM through project-based learning. It provides opportunities for students to take ownership of their learning by addressing real-world challenges, drives student and teacher engagement, and creates tangible sustainability impacts across school communities. EcoSchools US fosters the development of transferable skills highly valued by employers, such as problem-solving, critical thinking, and interpersonal skills.3. Global Classroom Project is an initiative by Fairfax County Public Schools in Virginia, USA, designed to enhance students' global awareness and cultural understanding. It typically involves integrating international perspectives and global issues into the curriculum, promoting cross-cultural exchanges, and connecting students with peers from around the world.New Jersey Institute of Technology President Teik C. Lim hosts an exchange of Taiwan educators during their visit to advance global collaboration for students.A Common Ground for All Stakeholders: Education with a PurposeA challenge in K-12 engagement is the differing perspectives on its purpose among stakeholders. Companies in the semiconductor value chain may view this student outreach as a way to develop technical talent, while green nonprofits often emphasize climate education and sustainability.Bridging these perspectives requires building a platform that any classroom or school can access if they choose. Adopting a public-private partnership approach brings together corporate, government, and nonprofit stakeholders around a shared set of values. This collaborative effort aims to create opportunities and solutions for communities globally.By investing in early education, the semiconductor industry will not only prepare young people to tackle environmental and technical challenges but also ensure they are ready for future job opportunities and educational pathways. These efforts will help attract students to become part of an industry that values their contributions and future, shaping a workforce equipped to lead and innovate in a rapidly evolving world.This is the moment for companies in the semiconductor value chain to lead by example, demonstrating their investment not just in technology but in the sustainability and health of our planet. By supporting K-12 education with a focus on climate literacy, international partnership, sustainability, and STEM, companies in our value chain can build a brighter, more sustainable future for us all—while ensuring that today’s students are prepared to address the challenges of tomorrow. Justin Harris is Senior Advisor for Climate Equity Social Impact at SEMI, Bia Hamed, Ph.D. is Program Manager, Global Education Initiatives at the SEMI Foundation, and Marley Hauser is senior coordinator for the Climate Equity Collaborative. Acknowledgements Partners We thank our first round of partners for the SEMI global K-12 climate engagement program for their contributions of time and thought leadership to this effort: SEMI members, Climate Equity Collaborative, National Wildlife Federation, ARCedTech, Fairfax County Public Schools, Kaohsiung City Education Bureau, U.S. Environmental Protection Agency, Taiwan Ministry of Environment, Sustainable Jersey for Schools, New Jersey Department of Education, Dr. Prabhakar Shrestha of New Jersey Institute of Technology (NJIT), Dr. Tim Hsu of Global Environmental Enhancement (GEE) in Taiwan, New Jersey Audubon, and the students of NJIT and Readington Middle School in Whitehouse, New Jersey. Special thanks to Shari Liss, Vice President for Workforce Development at SEMI Foundation, and Dr. Mousumi Bhat, SEMI Vice President for Sustainability.

The Rising Stars: 20 Under 30 blog series celebrates the brightest young leaders shaping the future of the semiconductor industry. These exceptional individuals have earned the SEMI Europe 20 Under 30 Award for making a remarkable impact across the supply chain—whether in engineering, sales, marketing, or R D. The series spotlights these rising stars for their career achievements, commitment to innovation, leadership skills, and dedication to driving both business success and community growth.Follow their inspiring journeys, and discover how they are thriving and paving the way for future generations in the semiconductor world.Introducing Kai Hahn: Project Manager R D at Comet, Industrial X-Ray Systems DivisionKai Hahn’s journey began when he joined the company as a bachelor’s thesis student. His early drive and exceptional contributions quickly set him apart, earning him a role as a cooperative student while simultaneously serving as a "Change Manager." In this capacity, Hahn led high-impact business excellence initiatives, overseeing cross-functional projects at the executive level. Now, as a Project Manager in R D, Hahn leads agile teams developing cutting-edge automated inspection solutions. His leadership, marked by a commitment to innovation, collaboration, and customer satisfaction, drives both personal and organizational growth, making him a standout in the semiconductor industry.SEMI: What inspired you to join the semiconductor industry? Hahn: I didn't actively choose the semiconductor industry; rather, I grew into it together with our brands Comet Yxlon Dragonfly. Beyond the pioneering spirit our X-Ray System division has, what excites me the most is our direct connection to semiconductors. From turning off your morning alarm to driving to work, staying connected with friends and family, or watching a sports game on TV — semiconductors are everywhere and shape our daily lives. Working in this industry is both exciting and challenging. Every day, I look forward tackling new projects that push the boundaries of innovation. But what inspires me the most is the transformation that our division is undergoing. We are continuously adapting our processes and procedures to meet the growing demands of the market and our customers. Being part of this dynamic evolution is rewarding and exhilarating. SEMI: How did your early experiences and education shape your career path?Hahn: With my degree in business and engineering, I chose a program that covered a wide range of subjects. While I gained knowledge from a broad field, by the end of my bachelor's degree, I realized I lacked practical experience and a clear direction for my career.Joining Comet as an intern during my final year helped me anchor my career path. I decided to pursue my master's degree while working part-time for the company. This decision allowed me to gain relevant professional experience early on and apply the knowledge from my studies directly to real-world challenges. SEMI: Can you share a professional accomplishment you’re most proud of, and explain why it’s significant to you?Hahn: Combining the strengths of Comet Yxlon’s software and Dragonfly’s AI powerhouse — I was the dedicated project manager to support the global technological cooperation of our two software environments to accelerate the 3D IC go to market challenge. My goal was to facilitate methodological collaboration to develop new software inspection workflows for the semiconductor industry.Looking back, I am proud of what we accomplished: building a cohesive team from different cultures, working across time zones, adapting to various working styles, and successfully launching our first product.SEMI: As a young professional in the industry, what is your greatest challenge? Hahn: One of the biggest challenges is the rapid pace of industry change. For development teams, this means shorter development cycles and closer collaboration with international customers. For young professionals, it's essential to maintain a continuous learning cycle to stay current and develop the ability to work effectively across diverse cultures. This ensures we understand the different customer requirements and can implement them effectively.SEMI: What advice would you give to younger generations aspiring to make an impact in this industry?Hahn: Gaining practical experience alongside your studies as early as possible is crucial. Internships or working student positions offer valuable opportunities, and sometimes, it’s beneficial to proactively reach out to companies, even if no vacancies are advertised. For me, these experiences made my studies more engaging by linking theory to real-world applications and deepening my understanding of the subjects. Beyond acquiring practical skills and expanding your network, this approach helps clarify the career path you want to pursue after graduation.SEMI: How do you envision future work environments? Hahn: Working from home has increasingly become the standard in recent years. While offering many advantages, a significant challenge for companies is maintaining a sense of community. This is easier to achieve when employees are physically present, as in-person interactions tend to be more impactful. It raises the question of how companies can foster a strong sense of community and belonging in the long term without requiring workers to be physically present in the office.SEMI: What impact has the 20 Under 30 Award had on your career? Hahn: Overall, this recognition has been both a validation of my efforts and a source of inspiration to continue pushing the boundaries in my work. Beyond the recognition of my contributions and achievements, the award provided a platform to engage with like-minded young professionals beyond my usual network.Following 20 Under 30 JourneysKai Hahn’s journey from a bachelor’s student to a leading Project Manager at Comet, Industrial X-Ray Division is a testament to his dedication, innovation, and leadership in the semiconductor industry. His achievements in integrating teams, developing cutting-edge solutions, and driving organizational transformation highlight the significant impact young professionals can make. Hahn’s story is an inspiring example of how passion and perseverance can lead to remarkable accomplishments. As he continues to push boundaries and shape the future, SEMI looks forward to seeing the continued influence of his work in the semiconductor field.The Rising Stars: 20 Under 30 blog series celebrates the exceptional talent and leadership driving the future of the semiconductor industry. Each of the young innovators honored is not only excelling in their respective fields but also shaping the landscape of technology and business with their visionary approaches and dedication. Their stories exemplify the remarkable achievements and unwavering commitment that define the next generation of industry leaders. The series is intended to inspire and motivate future professionals to pursue their passions and embrace the opportunities within this dynamic industry. Stay tuned for more stories of rising stars who are paving the way for continued growth and innovation in the semiconductor world.Learn more about the SEMI Europe 20 Under 30 Award and the recipients honored at SEMICON Europa 2023. Nominations for the 20 Under 30 program at SEMICON Europa 2024 close on September 30.Maria Daniela Perez is Communications Manager at SEMI Europe.