Rogue Valley Microdevices (RVM) and the MiQro Innovation Collaborative Centre (C2MI) have signed a Memorandum of Understanding (MOU) to strengthen collaboration in MEMS and semiconductor manufacturing. By combining complementary expertise, the organizations will accelerate innovation and expand customer access to advanced technologies.

Rogue Valley Microdevices is a MEMS foundry specializing in the design, prototyping, and manufacture of MEMS devices for a diverse global customer base. C2MI is a world-class innovation centre in manufacturing MEMS, advanced semiconductor assembly, printed electronics and quantum superconductive chips. Together, they will create a stronger value chain for organizations in the MEMS and semiconductor fields—supporting the journey from ideas to proof of concept, in order to speed up commercialization of new technologies and products.

“This partnership between Rogue Valley Microdevices and C2MI allows us to collaborate and share resources,” said Jessica Gomez, CEO and founder of Rogue Valley Microdevices. “By leveraging each other’s facilities and complementary capabilities, we can fast track the creation and deployment of next-generation MEMS platforms, including advancements in 300mm technology.”

Marie-Josée Turgeon, CEO of C2MI added, “We are delighted to join forces with Rogue Valley Microdevices. By combining our strengths and sharing access to our world-class facilities, we will be opening new opportunities for customers on both sides of the border. This collaboration exemplifies our commitment to supporting our partners’ growth and to advancing innovation in the next generation of MEMS.”

Through this MOU, the two organizations will pool expertise and infrastructure to give customers greater access to essential resources. As demand for 300mm technology grows, Rogue Valley Microdevices and C2MI will collaborate to open new pathways for innovation in advanced microelectronics and MEMS.

Update on RVM’s 300mm-capable MEMS Fab

Rogue Valley Microdevices is continuing the build-out of its new 50,000-square-foot microfabrication facility in Palm Bay, Florida—expected to become the first 300mm-capable pure-play MEMS foundry in the U.S. Since 2003, RVM has partnered with customers to take designs from lab to fab, successfully commercializing MEMS and sensor technologies from its Medford, Oregon facility. With the addition of Palm Bay, the company will offer a strategically located second source, strengthening both manufacturing excellence and supply chain resilience. As the facility nears its anticipated opening, RVM expects to begin accepting orders for dielectric and conductive films in December, followed by MEMS devices and post-CMOS processing in early 2026.

Today, MEMS and related devices are central to industries ranging from biotechnology and industrial sensing to photonics. With the migration to larger substrates, RVM’s new facility will deliver modern capabilities and scalable manufacturing to meet the evolving needs of its customers.

Update on C2MI Fab

Anchored in Canada’s semiconductor manufacturing ecosystem, C2MI nears completion of new 11,000 square feet extension, mostly made of class ISO4 cleanroom. The extension will host advanced packaging and wafer post-processing capabilities on both 200mm and 300mm wafers, while also establishing the first pure play industrial-scale facility for superconducting quantum chips.

With this extension, C2MI will continue to offer a truly unique bridge between academia and industry—combining a collaborative research environment with an innovative approach to intellectual-property management and a fully integrated industrial development chain, accelerating the creation of cutting-edge technologies and significantly reducing commercialization risks for our customers.

Visit Rogue Valley Microdevices at SEMICON West

Rogue Valley Microdevices welcomes meeting with prospective customers and partners at SEMICON West, October 7-9 in Phoenix, AZ, at booth #777. Please email [email protected] to set up a meeting or just drop by the booth. To schedule a media briefing with Jessica Gomez during SEMICON West, please reach out to Maria Doyle at [email protected].

About C2MI

The MiQro Innovation Collaborative Centre (C2MI) serves as a reference in research and development to accelerate the commercialization of components essential to digital technologies, being a transversal vector for all the economic sectors and critical to wealth creation. Backed by a world-class infrastructure in the manufacturing fields of micro-electro-mechanical systems (MEMS), advanced semiconductor packaging, quantum and printed electronics, C2MI is at the core of all industry sectors integrating components essential for the use and deployment of digital technologies. The Centre is strongly committed to being a unique model of collaboration, where synergy between industrial and academic partners is necessary, even essential, for the development of next-generation products. Visit: www.c2mi.ca

About Rogue Valley Microdevices

Rogue Valley Microdevices is a full-service precision MEMS and photonics foundry that combines state-of-the-art process modules with the engineering expertise to go seamlessly from custom design to manufacturing. RVM also maintains the broadest and most comprehensive set of wafer services commercially available—with over 50 unique dielectric and conductive thin films and all services performed in its own Class 100 cleanroom. With headquarters in Medford, Oregon, and a new 300 mm fab under construction in Palm Bay, Florida, RVM offers a flexible, customer-focused approach to manufacturing. Visit: www.roguevalleymicro.com and follow us on LinkedIn.

RVM Media Contact:
Maria Doyle
Doyle Strategic Communications
781-964-3536
[email protected]

C2MI Media Contact:
Maryse Demers
C2MI
450-534-8000 ext. 1000
[email protected]

• Read more about Rogue Valley Microdevices and C2MI Sign MOU to Offer Fast-Track MEMS Platform Creation and Deployment

SEMICON West – PHOENIX — October 8, 2025 — Global 300mm fab equipment spending is expected to reach $374 billion from 2026 to 2028, SEMI reported today in its latest 300mm Fab Outlook. This robust investment reflects fab regionalization and surging AI chip demand for data centers and edge devices, while underscoring the growing commitment to semiconductor self-sufficiency across key regions through localized industrial ecosystems and supply chain restructuring.

Worldwide 300mm fab equipment spending is expected to surpass $100 billion for the first time in 2025, growing 7% to $107 billion. The report projects investment will increase 9% to $116 billion in 2026, 4% to $120 billion in 2027, and 15% to $138 billion in 2028.

“The semiconductor industry is entering a pivotal era of transformation, driven by unprecedented demand for AI-enabled technologies and a renewed focus on regional self-sufficiency,” said Ajit Manocha, President and CEO of SEMI. “Strategic global investments and collaboration are driving robust, advanced supply chains and faster deployment of next-generation semiconductor manufacturing technologies. The global expansion of 300mm fabs will enable progress in data centers, edge devices, and the digital economy.”

Segment Growth

The Logic & Micro segment is projected to lead equipment expansion with $175 billion in total investments from 2026 to 2028. Foundries are expected to be the primary drivers of this growth, fueled by sub-2nm capacity build-outs. Key enablers include advanced technologies such as gate-all-around (GAA) architecture and backside power delivery, which are essential to enhancing chip performance and power efficiency for increasingly demanding AI workloads. More advanced 1.4nm process technology is expected to enter volume production by 2028-2029. Additionally, AI performance improvements are anticipated to drive massive growth in edge-devices including automotive electronics, IoT applications, and robotics. Beyond advanced processes, demand across all nodes and various electronics devices is expected to surge significantly, fueling mature process equipment investment.

The Memory segment is projected to rank second with $136 billion in spending over the three-year period, marking the beginning of a new growth cycle for the segment. DRAM-related equipment investment is expected to exceed $79 billion from 2026 to 2028, with 3D NAND investment reaching $56 billion over the same period. AI training and inference have driven comprehensive demand increases across various types of memory. AI training requires greater data transmission bandwidth and extremely low latency, significantly boosting high bandwidth memory (HBM) demand. Moreover, model inference generates higher quality and more diverse AI digital content, creating substantial demand for end storage capacity and driving 3D NAND Flash requirements. This robust demand has sustained elevated levels of supply chain investment in memory over the medium to long term, helping to mitigate potential downturns from traditional memory cycle fluctuations.

Analog-related segments’ anticipated investment is projected to exceed $41 billion over the next three years.

Including Compound semiconductors, the power-related segment is expected to invest $27 billion from 2026 to 2028.

Regional Growth

China is expected to continue to lead in 300mm equipment spending with $94 billion in projected investments from 2026 to 2028, sustained by national self-sufficiency policies. 

Korea is projected to rank second in global 300mm equipment spending over the three-year period with $86 billion invested, supporting industries worldwide in generative AI demand. 

Taiwan is expected to invest $75 billion in 300mm equipment over the three years, ranking third. Investment will concentrate primarily on 2nm and sub-2nm capacity to maintain dominance in advanced foundry capacity and technology leadership.

The report projects Americas to invest $60 billion from 2026 to 2028, rising to fourth position. U.S. suppliers are expanding advanced process capacity to meet surging AI application demands while catalyzing domestic industrial and investment upgrades to maintain global technology development leadership.

Japan, Europe & Middle East, and Southeast Asia are projected to invest $32 billion, $14 billion, and $12 billion, respectively, over the three-year period. Policy incentives aimed at alleviating critical semiconductor supply concerns are expected to increase equipment investment by more than 60% in these regions by 2028 compared to 2024.

Part of the SEMI Fab Forecast database, the SEMI 300mm Fab Outlook lists 391 facilities and lines globally. The report reflects 173 updates and nine new fabs/lines projects since its last publication in January 2025.

For more information on the report or to subscribe to SEMI market data, visit SEMI Market Data or contact the SEMI Market Intelligence Team (MIT) at [email protected].

About SEMI

SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

• Read more about SEMI Reports Global 300mm Fab Equipment Spending Expected to Total $374 Billion Over Next Three Years

FOR IMMEDIATE RELEASE
Busch Group Expands US Footprint with nearly 60,000 sqft. Service Center in Tempe, Arizona

Tempe, AZ – August 14, 2025 – Busch Vacuum Solutions, part of the Busch Group, a global leader in vacuum and overpressure technology, is proud to announce the development of its newest U.S. facility: almost 60,000-square-foot Arizona Service Center located in Tempe. This strategic expansion underscores Busch’s continued investment in innovation, customer service, and regional growth across North America. The state-of-the-art facility is scheduled to open in October 2025.

The new Tempe facility will serve as a key regional hub specializing in the repair, service, and overhaul of vacuum pumps, vacuum systems, and overpressure equipment including turbo molecular pumps, leak detectors, valves and accessories etc. - supporting all major brands. This expanded capability brings greater flexibility, technical expertise, and responsiveness to customers across the semiconductor, industrial, medical, and environmental sectors. Designed to meet the growing demands of the region, the Tempe Service Center will provide faster turnaround times, expert support, and more efficient service delivery tailored to the unique operational needs of customers not just in the Southwest but across the US.

"This investment represents more than just added square footage. It’s about proximity, partnership, and performance," said Turgay Ozan, President & CEO, Busch Group USA. "With the launch of our Tempe location, we’re better positioned to deliver unmatched value to customers who rely on advanced vacuum technologies in high-performance environments."

“We’re excited to welcome Busch Vacuum Solutions, a global leader in advanced manufacturing, to Tempe. Their decision to invest here speaks to the strength of Arizona’s semiconductor ecosystem, diversity of thriving industries located here, and the spirit of innovation that defines our community. The new Tempe Service Center will create skilled employment opportunities, strengthen business partnerships, and keep Tempe at the forefront of high-tech growth and excellence. We are grateful to Busch Group for selecting Tempe as the location for its Southwest service hub and look forward to supporting their continued success.” said Corey Woods, Mayor of Tempe, AZ.

With more than 8,000 employees globally and over 1,200 in the United States, Busch continues to expand its network of facilities to support mission-critical operations across a diverse range of industries. In addition to semiconductor and industrial markets, Busch's vacuum technology supports automotive, food and beverage, packaging, metallurgy, pharmaceuticals, plastics, and large-scale distribution. These capabilities enable more localized production and increase operational resilience across essential supply chains.

The new Tempe facility reinforces the Busch Group’s ongoing mission to drive industry forward through cutting-edge vacuum solutions and service excellence.

Busch Group USA’s newest facility in Tempe, Arizona – a state-of-the-art service center designed to expand capabilities, enhance customer support, and strengthen the company’s national presence.

About the Busch Group
The Busch Group is one of the world’s largest manufacturers of vacuum pumps, vacuum systems, blowers, compressors and gas abatement systems. Under its umbrella, the group houses two well-known brands: Busch Vacuum Solutions and Pfeiffer Vacuum+Fab Solutions. The gas abatement systems previously offered by centrotherm clean solutions – a former Busch Group brand – are now part of the Pfeiffer portfolio.

The extensive product and service offer includes solutions for vacuum, overpressure and abatement applications in all industries, such as food, semiconductors, analytics, chemicals, plastics, and aerospace. This also includes the design and construction of tailor-made vacuum systems and a worldwide service network.

The Busch Group is a family business that is managed by the Busch family. More than 8,000 employees in 44 countries worldwide work for the group. Busch is headquartered in Maulburg, Baden-Württemberg, in the tri-country region of Germany, France and Switzerland.

The Busch Group manufactures in its 23 own production plants in China, the Czech Republic, France, Germany, India, Romania, South Korea, Switzerland, the United Kingdom, the USA and Vietnam. The Busch Group has an annual consolidated revenue of close to 2 billion Euro.

Media Contact:
Jake Young
Marketing Business Partner
Busch Group USA
[email protected]
+1-800-872-7867
www.buschgroup.com

• Read more about Busch Group Expands US Footprint with nearly 60,000 sqft. Service Center in Tempe, Arizona

Lightium, MPI Corporation, and Axiomatic_AI Announce Strategic Partnership to Revolutionize Photonic Integrated Circuit (PIC) Device Testing with AI-Driven Solutions
Zurich, Switzerland; Hsinchu, Taiwan; and Boston, USA – January 6, 2025 – Lightium AG, MPI Corporation, and Axiomatic_AI Inc. have entered into a Memorandum of Understanding (MoU) to jointly develop the world's first Intelligent, Autonomous, and Integrated Test Solution (IAITS) for photonic devices.
This strategic collaboration aims to revolutionize the testing and qualification processes of photonic integrated circuit (PIC) devices by uniting state-of-the-art artificial intelligence, next-generation hardware, and deep domain expertise. The IAITS platform will deliver breakthrough performance in testing workflows—enabling unmatched efficiency, precision, and scalability to meet the ever-evolving demands of the photonics industry.
A Unified Vision for the Future of Photonics Testing
This partnership is driven by a shared commitment to deliver groundbreaking AI driven and self-optimizing solutions to the photonics industry. By combining Axiomatic_AI’s cutting-edge, reasoning-based, self-learning artificial intelligence with MPI Corporation’s industry-leading wafer probing systems and automation software, and leveraging Lightium AG’s advanced testing infrastructure and deep expertise in ultra-high-speed photonic device measurements, the collaboration aims to bring fully integrated, intelligent photonic integrated circuit (PIC) test solutions to market.
Together, the three companies are creating a unified AI platform that addresses the growing complexity and performance demands of characterizing photonic integrated circuits—unlocking new levels of automation, precision, and scalability for next-generation applications.
Disruptive Value Creation Across Hardware and Human Resources
The Intelligent, Autonomous, and Integrated Test Solution (IAITS) introduces a new paradigm in photonic integrated circuit (PIC) testing, delivering transformative value across both technology infrastructure and human capital.
Key Benefits of IAITS:
• Increased Throughput: By automating complex test routines, minimizing downtime, and optimizing measurement system utilization, IAITS significantly accelerates test cycles and reduces iteration times.
• Enhanced Human Efficiency: The system reduces reliance on manual operation, programming, and debugging—freeing skilled personnel to focus on high-value engineering and strategic innovation tasks.
IAITS will be commercially available as an advanced software add-on package for MPI Corporation’s wafer probing systems. Designed to support both R&D and high-volume production environments, the solution sets a new industry benchmark for efficiency, precision, and scalability—ultimately lowering the total cost of testing and accelerating time-to-market for next-generation PIC devices.
About Lightium AG
Lightium AG is a Swiss-based startup specializing in Photonic Integrated Circuit (PIC) foundry and design services, built on its proprietary, production-grade Thin-Film Lithium Niobate (TFLN) platform. Lightium accelerates customer innovation by delivering unmatched photonic performance, a streamlined and cost-efficient supply chain, and seamless scalability from prototyping to high-volume manufacturing.
As Europe’s first production-grade TFLN foundry, Lightium plays a pivotal role in enabling next-generation photonic solutions across a diverse range of industries, including telecommunications, data communications, quantum computing, artificial intelligence, and space technologies.
Further information can be found at: Lightium - Thin Film Lithium Niobate (TFLN) Photonic Foundry
About MPI Corporation
MPI Corporation, headquartered in Taiwan, is a global leader in advanced probe systems and testing solutions for the semiconductor, photonic, and photonic integrated circuit (PIC) industries. The company designs and manufactures high-performance wafer probing systems known for their exceptional precision, automation capabilities, and scalability—empowering cutting-edge testing across research, development, and high-volume production.
MPI’s innovations play a critical role in advancing next-generation technologies in wireless communication, electronics, and photonics. The company is publicly listed on the Taipei Exchange (TAIEX: 6223).
For more information, please visit: About MPI Corporation – Global Semiconductor Testing Leader
About Axiomatic_AI Inc.
Axiomatic_AI Inc., headquartered in Boston, is a pioneering startup developing physics-based reasoning artificial intelligence to accelerate innovation and reduce the cost and risk associated with deep-tech development. Its cutting-edge AI technologies are redefining how high-tech industries design, measure, and optimize complex systems—enabling faster, smarter decision-making across R&D and production environments.
Axiomatic_AI’s mission is to unlock new efficiencies and capabilities in fields where precision and complexity are paramount.
Learn more at: https://axiomatic-ai.com/mission/

• Read more about Lightium, MPI Corporation, and Axiomatic_AI Announce Strategic Partnership to Revolutionize Photonic Integrated Circuit (PIC) Device Testing with AI-Driven Solutions

This cutting-edge panel-level wet processing demo tool handles large 510 × 515 mm substrates, delivering world class, high density Through Glass Vias (TGV) formation and ultra-small taper angles essential for advanced packaging in high performance computing.

Gütenbach, Germany – July 15, 2025 – RENA Technologies, a leading manufacturer of wet processing equipment for semiconductor and advanced packaging production, today announced the ramp-up of its dedicated glass core substrates facility in Germany. This new line, designed for substrates up to 510 × 515 mm, immediately opens for customer test lots, underscoring RENA's proven expertise in glass processing and creating new opportunities for process development and customer sample production. “As experts in precision wet processing, we can now offer large panel demo services for high aspect ratio through glass via (TGV) formation on various glass types,” said Dr. Holger H. Kuehnlein, SVP Technology at RENA. “Our alkaline based TGV process delivers extremely small taper angles, low sidewall roughness, and exceptional dimensional control at panel scale, enabling high density via applications. Customers can begin validating these capabilities today.”

Why Glass, and Why Wet Processing?
Glass substrates offer significant advantages for advanced electronics, including ultra-flat surfaces, low dielectric loss, and superior thermal stability. However, realizing these benefits at scale requires defect free surface preparation and the formation of uniform, high density TGVs with minimal taper angles. RENA's wet processing systems are specifically designed to address both challenges:
1. Surface Engineering – Our systems ensure precise cleaning and stress relief across 600 x 600mm panels with submicron total thickness variation (TTV).
2. Chemically Formed TGVs – Following initial laser modifications performed by our specialist partners, RENA’s proprietary chemistries form, enlarge and shape each via to exact specifications. This process consistently delivers very small taper angles and smooth sidewalls, ideal for subsequent metallization.

By collaborating with leading German and international laser partners, RENA offers customers the flexibility to choose their preferred laser vendor while ensuring all downstream wet processing steps are handled by our advanced equipment.

Key Highlights of the New Facility
Panel Size: Focus on 510 x 515mm and up to 600 × 600mm, smaller possible
Tool Set: Alkaline TGV etching, advanced rinse/dry, optical inspection & metrology
Field-Proven Recipes: Process conditions migrated from high volume tools
On-Demand Access: Customers may run demo substrates, qualify custom chemistries, or request full process flows
Sustainability: Low temperature chemistries and closed loop water reclamation reduce energy and ultrapure water (UPW) consumption

Market Impact
High-Performance Computing (HPC) as well as 5G/6G RF modules increasingly require new package designs, including panel-level fan-out and trend towards more complex chiplet architectures. Glass substrates, long considered the “holy grail” for core and interposer material, effectively eliminate the limitations imposed by warpage and dielectric loss in organic substrates. By combining laser modification from our vetted partners with RENA's chemistry driven via shaping, designers can now validate glass packaging concepts on the lab-platform proven at 600x600mm dimensions.
“With this lab-tool, we've created a great opportunity for semiconductor manufacturers to perform demos on panel level glass substrates,” added Peter Schneidewind, CEO of RENA. “From surface preparation to via formation, our wet process flow is ready for customers substrates to support TGV technology breakthroughs. This is world class made in Black Forest.”

Availability & Engagement Model
• Testing available now
• Flexible collaboration: Bring your own laser modified substrates, or leverage RENA’s ecosystem partners to benefit from joint process development support, and metrology services for process validation.

About RENA Technologies GmbH
RENA Technologies is a leading global supplier of production machines for wet chemical surface preparation. RENA products are used in path-breaking application fields such as semiconductors, MedTech, renewable energies, the glass industry and additive manufacturing. RENA equipment is used to treat or modify surfaces of, for example, semiconductor wafers, solar cells, glass, optical substrates, 3D-printed metal components or other high-tech products using wet chemical processes. RENA offers proven standard machines as well as customer-specific solutions and process support.

CONTACT
Sales:
Felix Fink
Phone: +49 7723 9313-403
E-Mail: [email protected]

Press:
Dirk Hensel
Phone:+49 7723 9313-914
E-Mail: [email protected]
www.rena.com

• Read more about RENA Technologies Commissions High-Tech-Processing Facility for TGV Glass Substrates

MILPITAS, Calif. — March 25, 2025 — Global fab equipment spending for front-end facilities in 2025 is anticipated to increase by 2% year-over-year (YoY) to $110 billion, marking the sixth consecutive year of growth since 2020, SEMI announced today in its latest quarterly World Fab Forecast report. 

Fab equipment spending is projected to rise by 18% in the following year, reaching $130 billion. This growth in investment is driven not only by demand in the high-performance computing (HPC) and memory sectors to support data center expansions, but also by the increasing integration of artificial intelligence (AI), which is driving up the silicon content required for edge devices.

“The global semiconductor industry’s investments in fab equipment have been edging up for six straight years, and spending is poised to see a strong 18% increase in 2026 as production ramps to meet booming AI-related chip demand,” said Ajit Manocha, SEMI President and CEO. “This forecasted capex growth signals an urgent need for intensified workforce development initiatives throughout 2025 and 2026 to deliver skilled workers necessary for the approximately 50 new fabs expected to come online during these two years.” 

Logic & Micro Segment Lead Semiconductor Industry Expansion

The Logic & Micro segment is anticipated to be a key driver of growth in fab investments. This growth is primarily fueled by investments in cutting-edge technologies, such as 2-nanometer process and backside power delivery technology, which are expected to enter production by 2026. The Logic & Micro segment is projected to see an 11% increase in investments, reaching $52 billion in 2025, followed by a 14% increase to $59 billion in 2026.

Overall Memory segment spending is expected to grow steadily the next two years, increasing by 2% to reach $32 billion by 2025, with an even stronger growth forecast of 27% in 2026. Investments in the DRAM segment are projected to decline by 6% year-over-year, totaling $21 billion in 2025, but are anticipated to rebound with a 19% increase to $25 billion in 2026. Conversely, NAND segment spending is expected to recover significantly, rising by 54% year-over-year to $10 billion in 2025, and further increasing by 47% to $15 billion in 2026. 

China Continues to Lead in Regional Fab Equipment Spending 

Despite a decline from a peak of $50 billion in 2024, China is expected to maintain its position as the leader in global semiconductor equipment spending, with projections of $38 billion in 2025 representing a 24% year-over-year decrease. By 2026, spending is forecast to decline further 5% year-over-year to $36 billion.

With the growing penetration of AI technology driving higher memory adoption, Korean chipmakers are planning to invest more in equipment for capacity expansion and technology upgrades, which is expected to position the region as the second highest spending through 2026. Korean investment is forecasted to grow by 29% to $21.5 billion in 2025 and by 26% to $27 billion in 2026.

Taiwan is set to secure third place in spending as its chipmakers aim to enhance their leadership in advanced technology and production capabilities. Taiwan is projected to spend $21 billion in 2025 and $24.5 billion in 2026 to meet the growing demand for AI applications across cloud services and edge devices.

The Americas region ranks fourth, with expected spending of $14 billion in 2025 and $20 billion in 2026. Japan, Europe and the Middle East, and Southeast Asia follow in investments, projected to spend $14 billion, $9 billion, and $4 billion in 2025, and $11 billion, $7 billion, and $4 billion in 2026, respectively.

The latest update of the SEMI World Fab Forecast report, published in March, lists more than 1,500 facilities and lines globally, including 156 facilities and lines with various probabilities expected to start operation in 2025 or later.  

Download a sample of the SEMI World Fab Forecast report.

For details about SEMI reports on other semiconductor sectors, visit SEMI Market Data or contact the SEMI Market Intelligence Team (MIT) at [email protected].

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.  

Association Contacts

Christian G. Dieseldorff/SEMI US
Phone: 1.408.943.7940
Email: [email protected]  

Chih-Wen Liu/SEMI Taiwan
Phone: 886.3.560.1777
Email: [email protected]

Samer Bahou/SEMI Corporate 
Phone: 1.408.943.7870
Email: [email protected]

• Read more about Global Fab Equipment Investment Expected to Reach $110 Billion in 2025

MILPITAS, Calif. — January 7, 2025 — The semiconductor industry is expected to start 18 new fab construction projects in 2025*, according to SEMI's latest quarterly World Fab Forecast report. The new projects include three 200mm and fifteen 300mm facilities, the majority of which are expected to begin operations from 2026 to 2027. 

In 2025, the Americas and Japan are the leading regions with four projects each. The China and Europe & Middle East regions are each tied for third place with three planned construction projects. Taiwan has two planned projects, while Korea and Southeast Asia have one project each for 2025.

“The semiconductor industry has reached a pivotal juncture, with investments driving both leading-edge and mainstream technologies to meet evolving global demands,” said Ajit Manocha, SEMI President and CEO. “Generative AI and high-performance computing are fueling advancements in the leading-edge logic and memory segments, while mainstream nodes continue to underpin critical applications in automotive, IoT and power electronics. The construction of 18 new semiconductor fabs set to begin in 2025 demonstrates the industry’s commitment to support innovation and significant economic growth.”

Covering 2023 to 2025, the 4Q 2024 edition of World Fab Forecast report shows that the global semiconductor industry plans to begin operation of 97 new high-volume fabs. This includes 48 projects in 2024 and 32 projects set to launch in 2025, with wafer sizes ranging from 300mm to 50mm.

Advanced Nodes Lead Semiconductor Industry Expansion 

Semiconductor capacity is projected to further accelerate, with a 6.6% yearly growth rate forecast to total 33.6 million wafers per month (wpm)** for 2025. This expansion will be primarily driven by leading-edge logic technologies in high-performance computing (HPC) applications and the increasing penetration of generative AI in edge devices.

The semiconductor industry is intensifying efforts to build advanced computing capabilities, responding to the escalating computational demands of large language models (LLMs). Chip manufacturers are aggressively expanding advanced node capacities (7nm and below), which are expected to see an industry-leading 16% yearly growth rate for an increase of more than 300,000 wpm to total 2.2 million wpm in 2025.

Boosted by China’s chip self-sufficiency strategy and expected demand from automotive and IoT applications, mainstream nodes (8nm~45nm) are predicted to add another 6% capacity, surpassing the 15 million wpm milestone in 2025.

Mature technology nodes (50nm and above) are experiencing a more conservative expansion, reflecting the market’s slow recovery and low utilization rates. This segment is expected to grow 5%, reaching 14 million wpm in 2025.

Foundry Segment Continues Strong Capacity Growth 

Foundry suppliers are expected to remain the leaders in semiconductor equipment purchases. The Foundry segment is projected to increase capacity by 10.9% year-over-year, rising from 11.3 million wpm in 2024 to a record 12.6 million wpm in 2025.

The overall memory segment shows a measured capacity expansion, with modest growth of 3.5% in 2024 and 2.9% in 2025. However, strong generative AI demand is driving significant changes in memory markets. High-bandwidth memory (HBM) is experiencing a notable surge, creating divergent capacity growth trends between the DRAM and NAND flash segments.

The DRAM segment is expected to maintain robust growth, projecting approximately a 7% year-over-year increase to 4.5 million wpm in 2025. Conversely, the installed capacity for 3D NAND is anticipated to grow 5%, reaching 3.7 million wpm in the same period.

The latest update of the SEMI World Fab Forecast report, published in December 2024, lists more than 1,500 facilities and lines globally, including 180 volume facilities and lines with various probabilities expected to start operation in 2025 or later.  

Download a sample of the SEMI World Fab Forecast report.

For details about SEMI reports on other semiconductor sectors, visit SEMI Market Intelligence or contact us at [email protected].

*The fab count does not include research and development (R&D) lines

**200mm equivalent

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.  

Association Contacts

Samer Bahou/SEMI Corporate
Phone: 1.408.943.7870
Email: [email protected] 

Christian G. Dieseldorff/SEMI US
Phone: 1.408.943.7940
Email: [email protected]  

Chih-Wen Liu/SEMI Taiwan
Phone: 886.3.560.1777
Email: [email protected]

• Read more about Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI Reports

MILPITAS, Calif. — September 26, 2024 — Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, SEMI highlighted today in its quarterly 300mm Fab Outlook Report to 2027 report. The robust spending is being driven by the regionalization of semiconductor fabs and the increasing demand for artificial intelligence (AI) chips used in data centers and edge devices.

Worldwide, 300mm fab equipment spending is projected to grow by 4% to US$99.3 billion in 2024, and further increase by 24% to US$123.2 billion in 2025, surpassing the US$100 billion level for the first time. Spending is forecast to experience 11% growth to US$136.2 billion in 2026 followed by a 3% increase to US$140.8 billion in 2027.

“The magnitude of the expected ramp of global 300mm fab equipment spending in 2025 sets the stage for a record-setting three-year period of semiconductor manufacturing investments,” said Ajit Manocha, SEMI President and CEO. “The world’s ubiquitous need for chips is boosting spending on equipment for both leading-edge technologies addressing AI applications and mature technologies driven by automotive and IoT applications.”

Regional Growth

China is projected to maintain its position as the top spending region on 300mm equipment globally until 2027, investing over US$100 billion in the next three years driven by its national self-sufficiency policies. However, spending is anticipated to gradually decrease from a peak of US$45 billion in 2024 to US$31 billion by 2027.

Korea is projected to rank second and invest US$81 billion in the next three years to further its dominance in memory segments including DRAM, high-bandwidth memory (HBM), and 3D NAND Flash. Taiwan is forecast to spend US$75 billion on 300mm equipment over the next three years, ranking third as the region’s chipmakers build some new fabs overseas. Leading-edge logic below 3nm is the primary driver of Taiwan fab investments.

The Americas is projected to invest US$63 billion from 2025 to 2027, while Japan, Europe & Mideast, and SE Asia are expected to spend US$32 billion, US$27 billion, and US$13 billion, respectively, over the three-year period. Notably, these regions are anticipated to more than double their equipment investment in 2027 compared to 2024 due to policy incentives earmarked to alleviate concerns on the supply of crucial semiconductors.

Segment Growth

Foundry equipment spending is projected to reach approximately US$230 billion between 2025 and 2027, fueled by investments in sub-3nm cutting-edge nodes as well as continued spending on mature nodes. Investment in 2nm logic processes and development of key technologies at 2nm, such as gate-all-around (GAA) transistor structure and back-side power delivery technology, is crucial to meet future high-performance and energy-efficient computing needs, particularly for AI applications. Cost-effective 22nm and 28nm processes are expected to see growth due to increasing demand for automotive electronics and IoT applications.

The Logic and Micro segment is projected to spearhead the equipment spending expansion over the next three years, with an anticipated total investment of US$173 billion. Memory comes in second, expected to contribute over US$120 billion in spending during the same period, marking the beginning of another segment growth cycle. Within Memory, investment in DRAM-related equipment is projected to surpass US$75 billion, while investment in 3D NAND is expected to reach US$45 billion.

The Power-related segment ranks third, with an expected investment of over US$30 billion over the next three years, including around US$14 billion for compound semiconductor projects. The Analog and Mixed-signal segment is projected to reach US$23 billion during the same period followed by Opto/Sensors at US$12.8 billion.

Part of the SEMI Fab Forecast database, the SEMI 300mm Fab Outlook Report to 2027 report lists 420 facilities and lines globally, including 79 high-probability facilities expected to start operation during the four years beginning in 2024. The report reflects 169 updates and nine new fabs/lines projects since its last publication in June 2024.  

For more information on the report or to subscribe to SEMI market data, visit SEMI Market Data or contact the SEMI Market Intelligence Team (MIT) at [email protected].

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

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Phone: 1.408.943.7870
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• Read more about Global Semiconductor Industry Plans to Invest $400 Billion in 300mm Fab Equipment Over Next Three Years, SEMI Reports