Validation underscores DAS EE’s 35 years of leadership in advanced and sustainable abatement solutions
Dresden, Germany, November 28, 2025 — As the semiconductor industry intensifies its efforts to reach net-zero emissions, the recently published SEMI SCC Whitepaper “Overview of F-GHG and Nitrous Oxide Semiconductor Abatement Technologies” (2024) establishes new industry performance benchmarks for greenhouse gas abatement. The report defines a minimum Destruction and Removal Efficiency (DRE) for CF₄ of >95% and a maximum goal of >99% for process gas abatement systems.

These new reference points represent a significant step beyond the legacy assumptions used in many ESG reports and supplier requirements, which have historically relied on conservative default values for greenhouse gas abatement performance. However, even the upper range of the SEMI SCC targets does not yet represent the full potential of modern technology.

DAS Environmental Expert GmbH demonstrates with its TILIA abatement system that destruction efficiencies exceeding 99.9% for CF₄ and other F-GHGs are both technically feasible and economically advantageous. These systems outperform the benchmarks set forth by the SEMI SCC whitepaper and contribute directly to the industry's carbon reduction goals.

“Systems like TILIA prove that it is not only possible but also economically rational to exceed the current industry benchmarks,” says Stephan Raithel, Chief Operating Officer Gas Treatment at DAS Environmental Expert GmbH. “With rising carbon taxes and tightening sustainability targets, investing in high-efficiency abatement translates directly into operational and financial benefits.”

The global semiconductor industry emits thousands of tons of CF₄ annually, a gas with a Global Warming Potential (GWP) of 7,390. Even a few tons of unmitigated emissions correspond to millions of tons of CO₂ equivalents. While current industry practice aims to meet the SCC-recommended minimum DREs, only systems operating consistently above 99.9% will enable the industry to meet its net-zero commitments.

The SEMI SCC Whitepaper emphasizes that achieving these higher efficiencies is crucial for the industry’s sustainability roadmap and requires broad adoption of next-generation abatement technologies. DAS Environmental Experts’ proven TILIA platform exemplifies this transition – setting a new benchmark for “Best in Class” abatement performance in the semiconductor industry.

About the Company
DAS Environmental Experts Group (DAS Group), headquartered in Dresden, Germany, was founded in 1991 and is now a global organization with subsidiaries on three continents and more than 950 employees worldwide. Over the past three decades, DAS Group has become one of the leading technology and equipment providers for waste gas abatement solutions with a focus on semiconductor industry.
In addition, DAS Group develops advanced process and system solutions for industrial water treatment, with extensive expertise in the recycling and reuse of wastewater from the semiconductor industry.
DAS solutions are engineered to meet the stringent purity requirements of semiconductor manufacturing, helping clients comply with global environmental standards.

• Read more about Best in Class Abatement System: DAS Environmental Experts Exceeds Efficiency Benchmarks in Semiconductor Greenhouse Gas Treatment

New SECS-II library helps fabs and OEMs integrate semiconductor tools with the MES in hybrid manufacturing sites, ensuring faster time to market and limiting integration costs

MUNICH, November 18, 2025 – Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor manufacturing, today unveils Agil’SECS-II at Booth #C2518 at SEMICON Europa 2025. This new SECS-II library, featuring built-in SEMI standard communication, enables a manufacturing execution system (MES) to accelerate the integration and validation of hybrid semiconductor and traditional manufacturing tools on production lines, ensuring faster time to market, lower integration costs, and reduced deployment risks. With this connection gateway, users can send and receive any SEMI SECS-II-compliant message as host or equipment for full GEM and GEM300 equipment integration and validation. This product can prove valuable for a variety of customers:

• Pure semiconductor original equipment manufacturers (OEMs) that need a practical way to develop an MES simulator and exercise their equipment under fab-like conditions. For small production lines or multi-tool set-ups exchanging data through SECS/GEM, Agil’SECS-II allows OEMs to design, test, and validate their equipment efficiently before shipping it to fabs.

• Customized, multi-industry, or low-volume production sites that use an MES system to integrate both traditional production machines and semiconductor tools. Agil’SECS-II simplifies integration in mixed equipment environments, especially where the MES cannot use SECS/GEM because most tools rely on protocols such as OPC UA, Modbus, or MQTT, yet semiconductor equipment using SECS/GEM must be integrated within the same MES.

• Laboratories and pilot lines without a full-featured MES that require a driver to collect data from various types of manufacturing equipment, including process, inspection, and metrology tools, to ensure quality and process control as well as complete traceability.

“With Agil’SECS-II, we wanted to provide a flexible tool that can serve multiple types of customers who can benefit from a proven software foundation built on more than 15 years of deployment experience in semiconductor fabs worldwide,” explains Marc Engel, chief executive officer of Agileo Automation. “Our SECS-II driver is especially useful for validating the processes of hybrid fabs that combine semiconductor and non-semiconductor manufacturing equipment, such as silicon carbide (SiC) wafer production lines or advanced packaging lines. It enables product and process traceability with legacy MES and helps OEMs developing equipment for these lines create MES simulators to verify information flow between tools using heterogeneous communication protocols.”

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About Agileo Automation
Agileo Automation is a trusted partner for equipment manufacturers, helping them build smarter, automated, and more connected machines that integrate seamlessly into advanced semiconductor fabs. Founded in 2010 in Poitiers, France, Agileo Automation helps OEMs optimize control, communication, data acquisition, and testing across their tools through proven software frameworks, applications, and expert support. Its flagship A²ECF-SEMI framework provides a solid foundation for developing equipment controllers fully aligned with SEMI SECS/GEM, GEM300, and EDA standards. As an active member of SEMI and the OPC Foundation, Agileo Automation contributes directly to shaping the standards that drive Industry 4.0 manufacturing. For more information, please visit our website or follow us on LinkedIn.

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RENA Technologies marks a new milestone in the semiconductor industry with the launch of Vanguard, a state-of-the-art, fully automated single-wafer platform designed for wet chemical cleaning, etching, and drying of 200mm and 300mm wafers. Engineered for performance, efficiency, and scalability, Vanguard offers new possibilities for advanced semiconductor manufacturing.

Broaden the Possibilities in Wafer Wet Processing

Vanguard is purpose-built to address the rising demands of next-generation semiconductor substrates and materials. Supporting 4 to 8 independent processing chambers within a compact footprint, the system delivers high throughput without compromising cleanroom space. Its advanced chemical cleaning and double-sided processing—handling up to five distinct chemistries—minimizes contamination, substrate damage, and defects, ensuring wafers meet the stringent yield and quality requirements of cutting-edge chip manufacturing.

"With the launch of our new semiconductor wet processing platform, we are entering a new aera in precision, efficiency, and reliability for advanced chip manufacturing. This machine embodies our commitment to innovation—delivering not only superior process control but also the flexibility our customers need to stay ahead in a rapidly evolving industry. It represents a decisive step in enabling the next generation of semiconductor technologies for both high-volume manufacturing lines and R&D fabs." Emphasizes Peter Schneidewind, CEO of RENA Technologies.

Scalable, Modular Design 

Vanguard’s modular architecture grows with customer needs. Fabs can easily adjust chamber count and process configurations to match evolving requirements, from R&D to high-volume production.
The platform integrates internal chemistry preparation for precise formulation control, ensuring consistent process delivery and minimizing chemical consumption. This reduces operating costs and environmental impact—key considerations for sustainable fabs.

Serviceability is also built-in: each chamber operates independently, allowing maintenance without halting production. Combined with AI-assisted process control, and the digital service platform RENA Connect Hub, customers gain maximum uptime and efficiency.

Next-Level Automation and Compatibility

With its digital twin simulation, customers can model system integration, test interfaces, and even simulate throughput with real process data—well before installation. Training and upgrades can be conducted seamlessly during live production.

Fully GEM300 compatible, Vanguard is integration-ready from day one. Operating within a Class 1 mini environment, it guarantees ultra-clean wafer handling, while its advanced drying ensures residue-free, pristine surfaces for downstream processing.

Key Features at a Glance

• Fully automated wet processing for 200mm / 300mm wafers
• Scalable from 4 to 8 single-wafer chambers
• Double-sided cleaning with up to 5 chemicals
• Internal chemistry preparation system
• AI-assisted software with predictive maintenance
• Advanced drying technology
• Class 1 mini environment for ultra-clean operation
• Compact footprint with high-throughput capability
• GEM300 factory-integration ready
• Low chemical usage for reduced cost and environmental impact 

Availability

Vanguard is officially available as of today. Semiconductor fabs and foundries seeking to modernize their wet processing capabilities now have access to a solution that combines performance, scalability, and sustainability—delivered today for the challenges of tomorrow.

• Read more about Introducing Vanguard: The New Single-Wafer Cleaning and Etching Tool from RENA Technologies

OXFORD INSTRUMENTS PROVIDES COHERENT WITH STATE-OF-THE-ART, FULLY AUTOMATED PROCESSING EQUIPMENT, FOR 6” INP WAFER MANUFACTURING, ENABLING NEXT GENERATION AI APPLICATIONS

Oxford Instruments (OXIG), a leading provider of advanced plasma processing solutions for the compound semiconductor industry, announces the key role it is playing to support the industry’s first fully automated 6-inch indium phosphide (InP) wafer fabrication capability for photonic devices, led by Coherent Corp. (NYSE: COHR), a global leader in compound semiconductors and high-performance optical networking solutions.

Oxford Instruments’ cutting-edge plasma processing equipment is central to Coherent’s groundbreaking achievement of ramping up 6-inch InP fabs in Sherman, Texas, and Järfälla, Sweden. These fabs will play a pivotal role in driving advancements in AI datacentre, telecommunications, and sensing applications. Coherent’s transition to 6-inch wafers is set to deliver significant benefits, including a substantial increase in capacity, lower die cost and more than four times the number of devices per wafer.

Oxford Instruments has supplied fully automated, high-throughput 6-inch InP processing equipment, enabling Coherent to achieve these remarkable productivity gains. This advanced equipment is designed to support the transition from 800G to 1.6T products, a key requirement to meet the growing demands of AI interconnects and optical communications.

“We have been the leading supplier of InP plasma etch equipment to the datacom market, and Coherent, for many years. Our technology, with the quality, throughput and reliability that we have developed alongside excellent service, is ideally positioned to support the current device demand inflection we are seeing with the release of generative AI applications. We are delighted to be partnering with Coherent during this exciting period of market expansion and look forward to continuing to develop and release innovative and valuable plasma processing solutions.” Matt Kelly, Managing Director, Oxford Instruments Plasma Technology.

"Coherent’s move to 6-inch InP wafer fabrication marks a transformative milestone for the industry. Oxford Instruments’ expertise in plasma processing has been essential in enabling our Sherman and Järfälla fabs to reach world-class performance,” said Dr. Beck Mason, Executive Vice President – Semiconductor Devices at Coherent. “Together, we are advancing InP technology to support faster networks, greater efficiency, and the new applications that will define the future of connectivity."

The joint efforts of Oxford Instruments and Coherent have culminated in a manufacturing platform that sets the stage for the next generation of InP optoelectronic devices. These devices are critical enablers for applications ranging from AI datacentres and datacom transceivers to advanced sensing in consumer electronics and automotive technologies.

• Read more about Enabling AI with Fully Automated Equipment for 6” InP Wafer Processing

Glendale, AZ / Dresden, Germany, October 2025 - DAS Environmental Experts Group, a leading global provider of environmental technologies for waste gas and water treatment, has officially opened its new Innovation & Support Center (ISC) in Glendale, Arizona. Initiated and built by DAS US, the Group's American branch, the center represents a significant milestone in the company's North American growth strategy. It strengthens the organization`s proximity to U.S. customers while creating jobs and contributing to Arizona's thriving technology ecosystem.

Long-term Commitment to U.S. Semiconductor and High-tech Industries
With the new Glendale hub, DAS US customers benefit from faster spare parts supply, improved service, and direct access to the company’s latest innovations. DAS US has been active in the U.S. since 2014, serving semiconductor and high-tech customers through offices in Boise, Idaho, and Phoenix, Arizona, along with service locations in Hillsboro, Oregon; Lehi, Utah; Fort Collins, Colorado; and Austin, Texas. The Phoenix office, opened in 2022, has now been expanded into the new ISC, further underscoring the company`s long-term commitment to the region and providing a foundation for future growth and collaboration with U.S. partners. Today, DAS US employs about 40 people nationwide.

“The opening of our Glendale Innovation & Support Center is a clear signal of our commitment to the U.S. market,” said René Reichardt, CEO of DAS Environmental Experts Group. “We are investing in Arizona and the U.S. workforce to ensure we can support our customers locally with reliable service, spare parts availability, and hands-on technical expertise. The facility’s tool training and classroom space provide real-world experience with a variety of DAS technologies, taking our customer care to a new level.”

Industry Outlook: Advancing Sustainability in a Growing Market
The semiconductor and solar industries are expanding rapidly to meet global challenges in digitization and energy supply. In the U.S., major investments under the CHIPS and Science Act are fueling new chip factory projects — and with them, growing expectations for environmental stewardship. Semiconductor manufacturing is among the most resource-intensive industries, making solutions for reducing emissions and optimizing water use critical for future growth.

“With more than 30 years of international expertise and a strong U.S. customer base, we are well positioned to help the industry meet these challenges,” said CEO Reichardt. “By combining proven technologies with a growing local presence, we enable customers to cut their environmental impact while driving innovation and conserving natural resources. I am proud of our US branch`s growth over the past decade, and we will continue contributing to the sustainable development of the semiconductor and solar industry in the United States.”
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About the company
DAS Environmental Experts Group (DAS Group), headquartered in Dresden, Germany, was founded in 1991 and is now a global organization with subsidiaries on three continents and more than 950 employees worldwide. Over the past three decades, DAS Group has become one of the leading technology and equipment providers for waste gas abatement solutions. International leaders in the semiconductor, TFT, LED, and electronic industries as well as in the solar industry, nanotechnology, and MEMS rely on its expertise.

In addition, DAS Group develops advanced process and system solutions for the treatment of industrial waters. This business builds on many years of experience in the semiconductor, chemical, food and beverage, paper, cosmetics, and pharmaceutical industries, and combines technology
know-how with services such as consulting, planning, installation, and start-up, as well as maintenance, repair, optimization, and operation of treatment systems.

Contact:
DAS Environmental Expert USA Inc.
Daniela Georgi, Head of Corporate Communications
23439 N. 35th Dr.
Suite 6+7
Glendale, AZ 85310, USA
T: +1 (844) 862 1662
[email protected]

For press inquiries, please contact:
S. Smith Consulting
Susann Smith
T: +1 (805) 280 1884
[email protected]

• Read more about DAS Environmental Experts Group boosts U.S. Semiconductor Sustainability with Arizona Expansion

FOR IMMEDIATE RELEASE

Media contact: M. Guilbert, [email protected]

RECIF Technologies Adopts Agileo Automation’s Combined Speech Scenario and E84 PIO Box Solution to Test E84 and SECS/GEM SEMI Standard Compliance of Wafer Handling and Tracking Equipment

Global French manufacturer of automated handling equipment, wafer sorters, and equipment front-end modules (EFEMs) saves significant fab equipment integration time and enhances customer satisfaction

PHOENIX, October 7, 2025 – Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor manufacturing equipment, today announced at Booth #877 at SEMICON West 2025 that RECIF Technologies has adopted its combined Speech Scenario and E84 PIO Box solution to test its wafer handling and tracking equipment for E84 and SECS/GEM compliance. The global company headquartered in Toulouse Blagnac, France, which specializes in the design, manufacturing, and installation of automated equipment for semiconductor wafer handling, needed a fast and effective solution to validate the compliance of its products with SEMI’s E84 and SECS/GEM standards before they are shipped and implemented at customers’ semiconductor manufacturing sites all over the world.

Speech Scenario is a software that emulates the fab host to validate SECS/GEM tool scenarios before shipping brand-new production equipment to fabs. The E84 PIO Box is a compact and lightweight device that serves as an interface between Speech Scenario and E84 passive equipment. Used together, these products allow RECIF Technologies to generate complete test reports that can be communicated to its customers, ensure fast detection of non-compliance and errors to avoid downtime, as well as quick and reliable SEMI E84 and SECS/GEM compliance testing, especially in the management of complex cases. The company has now better control over host-sorter interactions, with customizable scenarios related to automatic carrier delivery defined in the E84 standards. With Speech Scenario, RECIF teams can more effectively replicate customer use cases when resolving anomalies.

“We were using less flexible software where automation messages were not easily modifiable and old emulation technology for validation of only the PIO part of the E84 standard, which meant that more complex cases and host-sorter interactions had to be tested and adapted in the field during machine integration at customer sites,” explains Thomas Brillouet, research and development director for RECIF Technologies SAS. “We selected Agileo’s all-in-one Speech Scenario and E84 PIO Box solution because we believe that it is the most efficient and competitive product currently on the market. The flexibility and time savings we have garnered since using Agileo’s solution has translated into enhanced overall customer satisfaction for our company.”

“Over the past 40 years, RECIF Technologies has built a solid reputation as an innovative industry leader in advanced semiconductor equipment manufacturing and as an early adopter of SEMI standards,” adds Marc Engel, CEO of Agileo Automation. “Agileo Automation, whose origins are closely tied to RECIF Technologies, benefits from a strong cultural and technical proximity with the company. We are proud to contribute to RECIF Technologies’ success, both as a technology partner and by supporting them in demonstrating quality and reliability to their customers.”

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About Agileo Automation
Since its inception in 2010 in Poitiers, France, Agileo Automation has empowered global semiconductor equipment manufacturers to optimize their production machines with control, communication, data acquisition, and testing solutions, enabling their deployment in large-scale fabs worldwide. At the heart of Industry 4.0, Agileo’s A²ECF-SEMI framework provides a robust foundation for developing equipment controller software, leveraging the SEMI SECS/GEM and GEM300 standard suites. As a member of SEMI and the OPC Foundation, Agileo Automation is a key contributor to the development and integration of industry standards such as SEMI and OPC UA. For more information, please visit our web site or follow us on LinkedIn.

About RECIF Technologies
RECIF Technologies, headquartered in Toulouse-Blagnac, France, has been providing advanced robotic solutions for semiconductor wafer handling since 1985. The company designs and manufactures reliable sorters, EFEMs, and compact handling tools that help leading semiconductor manufacturers worldwide improve productivity, ensure reliability, and reduce total cost of ownership. As a member of SEMI and the Aeneas association, RECIF Technologies actively contributes to the industry standards and collaborative projects shaping the future of the semiconductor industry. For more information, please visit our web site or follow us on LinkedIn.

• Read more about RECIF Technologies Adopts Agileo Automation’s Combined Speech Scenario and E84 PIO Box Solution to Test E84 and SECS/GEM SEMI Standard Compliance of Wafer Handling and Tracking Equipment

Rogue Valley Microdevices (RVM) and the MiQro Innovation Collaborative Centre (C2MI) have signed a Memorandum of Understanding (MOU) to strengthen collaboration in MEMS and semiconductor manufacturing. By combining complementary expertise, the organizations will accelerate innovation and expand customer access to advanced technologies.

Rogue Valley Microdevices is a MEMS foundry specializing in the design, prototyping, and manufacture of MEMS devices for a diverse global customer base. C2MI is a world-class innovation centre in manufacturing MEMS, advanced semiconductor assembly, printed electronics and quantum superconductive chips. Together, they will create a stronger value chain for organizations in the MEMS and semiconductor fields—supporting the journey from ideas to proof of concept, in order to speed up commercialization of new technologies and products.

“This partnership between Rogue Valley Microdevices and C2MI allows us to collaborate and share resources,” said Jessica Gomez, CEO and founder of Rogue Valley Microdevices. “By leveraging each other’s facilities and complementary capabilities, we can fast track the creation and deployment of next-generation MEMS platforms, including advancements in 300mm technology.”

Marie-Josée Turgeon, CEO of C2MI added, “We are delighted to join forces with Rogue Valley Microdevices. By combining our strengths and sharing access to our world-class facilities, we will be opening new opportunities for customers on both sides of the border. This collaboration exemplifies our commitment to supporting our partners’ growth and to advancing innovation in the next generation of MEMS.”

Through this MOU, the two organizations will pool expertise and infrastructure to give customers greater access to essential resources. As demand for 300mm technology grows, Rogue Valley Microdevices and C2MI will collaborate to open new pathways for innovation in advanced microelectronics and MEMS.

Update on RVM’s 300mm-capable MEMS Fab

Rogue Valley Microdevices is continuing the build-out of its new 50,000-square-foot microfabrication facility in Palm Bay, Florida—expected to become the first 300mm-capable pure-play MEMS foundry in the U.S. Since 2003, RVM has partnered with customers to take designs from lab to fab, successfully commercializing MEMS and sensor technologies from its Medford, Oregon facility. With the addition of Palm Bay, the company will offer a strategically located second source, strengthening both manufacturing excellence and supply chain resilience. As the facility nears its anticipated opening, RVM expects to begin accepting orders for dielectric and conductive films in December, followed by MEMS devices and post-CMOS processing in early 2026.

Today, MEMS and related devices are central to industries ranging from biotechnology and industrial sensing to photonics. With the migration to larger substrates, RVM’s new facility will deliver modern capabilities and scalable manufacturing to meet the evolving needs of its customers.

Update on C2MI Fab

Anchored in Canada’s semiconductor manufacturing ecosystem, C2MI nears completion of new 11,000 square feet extension, mostly made of class ISO4 cleanroom. The extension will host advanced packaging and wafer post-processing capabilities on both 200mm and 300mm wafers, while also establishing the first pure play industrial-scale facility for superconducting quantum chips.

With this extension, C2MI will continue to offer a truly unique bridge between academia and industry—combining a collaborative research environment with an innovative approach to intellectual-property management and a fully integrated industrial development chain, accelerating the creation of cutting-edge technologies and significantly reducing commercialization risks for our customers.

Visit Rogue Valley Microdevices at SEMICON West

Rogue Valley Microdevices welcomes meeting with prospective customers and partners at SEMICON West, October 7-9 in Phoenix, AZ, at booth #777. Please email [email protected] to set up a meeting or just drop by the booth. To schedule a media briefing with Jessica Gomez during SEMICON West, please reach out to Maria Doyle at [email protected].

About C2MI

The MiQro Innovation Collaborative Centre (C2MI) serves as a reference in research and development to accelerate the commercialization of components essential to digital technologies, being a transversal vector for all the economic sectors and critical to wealth creation. Backed by a world-class infrastructure in the manufacturing fields of micro-electro-mechanical systems (MEMS), advanced semiconductor packaging, quantum and printed electronics, C2MI is at the core of all industry sectors integrating components essential for the use and deployment of digital technologies. The Centre is strongly committed to being a unique model of collaboration, where synergy between industrial and academic partners is necessary, even essential, for the development of next-generation products. Visit: www.c2mi.ca

About Rogue Valley Microdevices

Rogue Valley Microdevices is a full-service precision MEMS and photonics foundry that combines state-of-the-art process modules with the engineering expertise to go seamlessly from custom design to manufacturing. RVM also maintains the broadest and most comprehensive set of wafer services commercially available—with over 50 unique dielectric and conductive thin films and all services performed in its own Class 100 cleanroom. With headquarters in Medford, Oregon, and a new 300 mm fab under construction in Palm Bay, Florida, RVM offers a flexible, customer-focused approach to manufacturing. Visit: www.roguevalleymicro.com and follow us on LinkedIn.

RVM Media Contact:
Maria Doyle
Doyle Strategic Communications
781-964-3536
[email protected]

C2MI Media Contact:
Maryse Demers
C2MI
450-534-8000 ext. 1000
[email protected]

• Read more about Rogue Valley Microdevices and C2MI Sign MOU to Offer Fast-Track MEMS Platform Creation and Deployment

SEMICON West – PHOENIX — October 8, 2025 — Global 300mm fab equipment spending is expected to reach $374 billion from 2026 to 2028, SEMI reported today in its latest 300mm Fab Outlook. This robust investment reflects fab regionalization and surging AI chip demand for data centers and edge devices, while underscoring the growing commitment to semiconductor self-sufficiency across key regions through localized industrial ecosystems and supply chain restructuring.

Worldwide 300mm fab equipment spending is expected to surpass $100 billion for the first time in 2025, growing 7% to $107 billion. The report projects investment will increase 9% to $116 billion in 2026, 4% to $120 billion in 2027, and 15% to $138 billion in 2028.

“The semiconductor industry is entering a pivotal era of transformation, driven by unprecedented demand for AI-enabled technologies and a renewed focus on regional self-sufficiency,” said Ajit Manocha, President and CEO of SEMI. “Strategic global investments and collaboration are driving robust, advanced supply chains and faster deployment of next-generation semiconductor manufacturing technologies. The global expansion of 300mm fabs will enable progress in data centers, edge devices, and the digital economy.”

Segment Growth

The Logic & Micro segment is projected to lead equipment expansion with $175 billion in total investments from 2026 to 2028. Foundries are expected to be the primary drivers of this growth, fueled by sub-2nm capacity build-outs. Key enablers include advanced technologies such as gate-all-around (GAA) architecture and backside power delivery, which are essential to enhancing chip performance and power efficiency for increasingly demanding AI workloads. More advanced 1.4nm process technology is expected to enter volume production by 2028-2029. Additionally, AI performance improvements are anticipated to drive massive growth in edge-devices including automotive electronics, IoT applications, and robotics. Beyond advanced processes, demand across all nodes and various electronics devices is expected to surge significantly, fueling mature process equipment investment.

The Memory segment is projected to rank second with $136 billion in spending over the three-year period, marking the beginning of a new growth cycle for the segment. DRAM-related equipment investment is expected to exceed $79 billion from 2026 to 2028, with 3D NAND investment reaching $56 billion over the same period. AI training and inference have driven comprehensive demand increases across various types of memory. AI training requires greater data transmission bandwidth and extremely low latency, significantly boosting high bandwidth memory (HBM) demand. Moreover, model inference generates higher quality and more diverse AI digital content, creating substantial demand for end storage capacity and driving 3D NAND Flash requirements. This robust demand has sustained elevated levels of supply chain investment in memory over the medium to long term, helping to mitigate potential downturns from traditional memory cycle fluctuations.

Analog-related segments’ anticipated investment is projected to exceed $41 billion over the next three years.

Including Compound semiconductors, the power-related segment is expected to invest $27 billion from 2026 to 2028.

Regional Growth

China is expected to continue to lead in 300mm equipment spending with $94 billion in projected investments from 2026 to 2028, sustained by national self-sufficiency policies. 

Korea is projected to rank second in global 300mm equipment spending over the three-year period with $86 billion invested, supporting industries worldwide in generative AI demand. 

Taiwan is expected to invest $75 billion in 300mm equipment over the three years, ranking third. Investment will concentrate primarily on 2nm and sub-2nm capacity to maintain dominance in advanced foundry capacity and technology leadership.

The report projects Americas to invest $60 billion from 2026 to 2028, rising to fourth position. U.S. suppliers are expanding advanced process capacity to meet surging AI application demands while catalyzing domestic industrial and investment upgrades to maintain global technology development leadership.

Japan, Europe & Middle East, and Southeast Asia are projected to invest $32 billion, $14 billion, and $12 billion, respectively, over the three-year period. Policy incentives aimed at alleviating critical semiconductor supply concerns are expected to increase equipment investment by more than 60% in these regions by 2028 compared to 2024.

Part of the SEMI Fab Forecast database, the SEMI 300mm Fab Outlook lists 391 facilities and lines globally. The report reflects 173 updates and nine new fabs/lines projects since its last publication in January 2025.

For more information on the report or to subscribe to SEMI market data, visit SEMI Market Data or contact the SEMI Market Intelligence Team (MIT) at [email protected].

About SEMI

SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

• Read more about SEMI Reports Global 300mm Fab Equipment Spending Expected to Total $374 Billion Over Next Three Years

FOR IMMEDIATE RELEASE
Busch Group Expands US Footprint with nearly 60,000 sqft. Service Center in Tempe, Arizona

Tempe, AZ – August 14, 2025 – Busch Vacuum Solutions, part of the Busch Group, a global leader in vacuum and overpressure technology, is proud to announce the development of its newest U.S. facility: almost 60,000-square-foot Arizona Service Center located in Tempe. This strategic expansion underscores Busch’s continued investment in innovation, customer service, and regional growth across North America. The state-of-the-art facility is scheduled to open in October 2025.

The new Tempe facility will serve as a key regional hub specializing in the repair, service, and overhaul of vacuum pumps, vacuum systems, and overpressure equipment including turbo molecular pumps, leak detectors, valves and accessories etc. - supporting all major brands. This expanded capability brings greater flexibility, technical expertise, and responsiveness to customers across the semiconductor, industrial, medical, and environmental sectors. Designed to meet the growing demands of the region, the Tempe Service Center will provide faster turnaround times, expert support, and more efficient service delivery tailored to the unique operational needs of customers not just in the Southwest but across the US.

"This investment represents more than just added square footage. It’s about proximity, partnership, and performance," said Turgay Ozan, President & CEO, Busch Group USA. "With the launch of our Tempe location, we’re better positioned to deliver unmatched value to customers who rely on advanced vacuum technologies in high-performance environments."

“We’re excited to welcome Busch Vacuum Solutions, a global leader in advanced manufacturing, to Tempe. Their decision to invest here speaks to the strength of Arizona’s semiconductor ecosystem, diversity of thriving industries located here, and the spirit of innovation that defines our community. The new Tempe Service Center will create skilled employment opportunities, strengthen business partnerships, and keep Tempe at the forefront of high-tech growth and excellence. We are grateful to Busch Group for selecting Tempe as the location for its Southwest service hub and look forward to supporting their continued success.” said Corey Woods, Mayor of Tempe, AZ.

With more than 8,000 employees globally and over 1,200 in the United States, Busch continues to expand its network of facilities to support mission-critical operations across a diverse range of industries. In addition to semiconductor and industrial markets, Busch's vacuum technology supports automotive, food and beverage, packaging, metallurgy, pharmaceuticals, plastics, and large-scale distribution. These capabilities enable more localized production and increase operational resilience across essential supply chains.

The new Tempe facility reinforces the Busch Group’s ongoing mission to drive industry forward through cutting-edge vacuum solutions and service excellence.

Busch Group USA’s newest facility in Tempe, Arizona – a state-of-the-art service center designed to expand capabilities, enhance customer support, and strengthen the company’s national presence.

About the Busch Group
The Busch Group is one of the world’s largest manufacturers of vacuum pumps, vacuum systems, blowers, compressors and gas abatement systems. Under its umbrella, the group houses two well-known brands: Busch Vacuum Solutions and Pfeiffer Vacuum+Fab Solutions. The gas abatement systems previously offered by centrotherm clean solutions – a former Busch Group brand – are now part of the Pfeiffer portfolio.

The extensive product and service offer includes solutions for vacuum, overpressure and abatement applications in all industries, such as food, semiconductors, analytics, chemicals, plastics, and aerospace. This also includes the design and construction of tailor-made vacuum systems and a worldwide service network.

The Busch Group is a family business that is managed by the Busch family. More than 8,000 employees in 44 countries worldwide work for the group. Busch is headquartered in Maulburg, Baden-Württemberg, in the tri-country region of Germany, France and Switzerland.

The Busch Group manufactures in its 23 own production plants in China, the Czech Republic, France, Germany, India, Romania, South Korea, Switzerland, the United Kingdom, the USA and Vietnam. The Busch Group has an annual consolidated revenue of close to 2 billion Euro.

Media Contact:
Jake Young
Marketing Business Partner
Busch Group USA
[email protected]
+1-800-872-7867
www.buschgroup.com

• Read more about Busch Group Expands US Footprint with nearly 60,000 sqft. Service Center in Tempe, Arizona

Lightium, MPI Corporation, and Axiomatic_AI Announce Strategic Partnership to Revolutionize Photonic Integrated Circuit (PIC) Device Testing with AI-Driven Solutions
Zurich, Switzerland; Hsinchu, Taiwan; and Boston, USA – January 6, 2025 – Lightium AG, MPI Corporation, and Axiomatic_AI Inc. have entered into a Memorandum of Understanding (MoU) to jointly develop the world's first Intelligent, Autonomous, and Integrated Test Solution (IAITS) for photonic devices.
This strategic collaboration aims to revolutionize the testing and qualification processes of photonic integrated circuit (PIC) devices by uniting state-of-the-art artificial intelligence, next-generation hardware, and deep domain expertise. The IAITS platform will deliver breakthrough performance in testing workflows—enabling unmatched efficiency, precision, and scalability to meet the ever-evolving demands of the photonics industry.
A Unified Vision for the Future of Photonics Testing
This partnership is driven by a shared commitment to deliver groundbreaking AI driven and self-optimizing solutions to the photonics industry. By combining Axiomatic_AI’s cutting-edge, reasoning-based, self-learning artificial intelligence with MPI Corporation’s industry-leading wafer probing systems and automation software, and leveraging Lightium AG’s advanced testing infrastructure and deep expertise in ultra-high-speed photonic device measurements, the collaboration aims to bring fully integrated, intelligent photonic integrated circuit (PIC) test solutions to market.
Together, the three companies are creating a unified AI platform that addresses the growing complexity and performance demands of characterizing photonic integrated circuits—unlocking new levels of automation, precision, and scalability for next-generation applications.
Disruptive Value Creation Across Hardware and Human Resources
The Intelligent, Autonomous, and Integrated Test Solution (IAITS) introduces a new paradigm in photonic integrated circuit (PIC) testing, delivering transformative value across both technology infrastructure and human capital.
Key Benefits of IAITS:
• Increased Throughput: By automating complex test routines, minimizing downtime, and optimizing measurement system utilization, IAITS significantly accelerates test cycles and reduces iteration times.
• Enhanced Human Efficiency: The system reduces reliance on manual operation, programming, and debugging—freeing skilled personnel to focus on high-value engineering and strategic innovation tasks.
IAITS will be commercially available as an advanced software add-on package for MPI Corporation’s wafer probing systems. Designed to support both R&D and high-volume production environments, the solution sets a new industry benchmark for efficiency, precision, and scalability—ultimately lowering the total cost of testing and accelerating time-to-market for next-generation PIC devices.
About Lightium AG
Lightium AG is a Swiss-based startup specializing in Photonic Integrated Circuit (PIC) foundry and design services, built on its proprietary, production-grade Thin-Film Lithium Niobate (TFLN) platform. Lightium accelerates customer innovation by delivering unmatched photonic performance, a streamlined and cost-efficient supply chain, and seamless scalability from prototyping to high-volume manufacturing.
As Europe’s first production-grade TFLN foundry, Lightium plays a pivotal role in enabling next-generation photonic solutions across a diverse range of industries, including telecommunications, data communications, quantum computing, artificial intelligence, and space technologies.
Further information can be found at: Lightium - Thin Film Lithium Niobate (TFLN) Photonic Foundry
About MPI Corporation
MPI Corporation, headquartered in Taiwan, is a global leader in advanced probe systems and testing solutions for the semiconductor, photonic, and photonic integrated circuit (PIC) industries. The company designs and manufactures high-performance wafer probing systems known for their exceptional precision, automation capabilities, and scalability—empowering cutting-edge testing across research, development, and high-volume production.
MPI’s innovations play a critical role in advancing next-generation technologies in wireless communication, electronics, and photonics. The company is publicly listed on the Taipei Exchange (TAIEX: 6223).
For more information, please visit: About MPI Corporation – Global Semiconductor Testing Leader
About Axiomatic_AI Inc.
Axiomatic_AI Inc., headquartered in Boston, is a pioneering startup developing physics-based reasoning artificial intelligence to accelerate innovation and reduce the cost and risk associated with deep-tech development. Its cutting-edge AI technologies are redefining how high-tech industries design, measure, and optimize complex systems—enabling faster, smarter decision-making across R&D and production environments.
Axiomatic_AI’s mission is to unlock new efficiencies and capabilities in fields where precision and complexity are paramount.
Learn more at: https://axiomatic-ai.com/mission/

• Read more about Lightium, MPI Corporation, and Axiomatic_AI Announce Strategic Partnership to Revolutionize Photonic Integrated Circuit (PIC) Device Testing with AI-Driven Solutions