Oxford Instruments, a leading provider of advanced plasma processing solutions, today announced a plasma equipment supply agreement with Applied Optoelectronics Inc. (AOI) (Nasdaq: AAOI), a leading provider of advanced optical and hybrid fibre-coaxial networking products that power the internet, for several etch and deposition cluster systems at their facility in Sugar Land, Texas.

The agreement will support AOI’s transformative expansion and technological advancements in indium phosphide (InP) for optoelectronic device manufacturing, as the company rapidly scales to increase production capacity within the U.S.

As AOI undergoes a significant growth phase, the company is upgrading its production capabilities to meet increasing demand for high-performance InP optoelectronic devices. Oxford Instruments’ advanced plasma etch and deposition processing systems will play a key role in this transformation by supporting AOI with fully automated 3-4-6-inch capable production systems for InP processes.

“AOI is expanding its U.S. manufacturing capacity in Texas to support demand for our optical transceivers in AI datacentres, and key suppliers like Oxford Instruments will help us continue to upgrade our fully automated production line,” said Fred Chang, Senior Vice President and North American General Manager at AOI. “With our combined technology, we can speed the processing of multiple wafer sizes, ranging from 3 to 6 inches, while improving overall quality and reducing costs.”

“AOI has been a valued long-term partner, and we are thrilled to have earned their trust as the chosen supplier for their production expansion and technology upgrades. Our unique high-temperature Electrostatic Chuck (ESC) design, which enables advanced processing capabilities, was a key factor in their decision. AOI also conducted an extensive vendor qualification process, including a visit to our brand-new purpose-built manufacturing facility in Bristol, UK, where we received high praise for our technology and production capabilities,” said Emiel Thijssen, Vice President of Sales and Business Development USA, Oxford Instruments Plasma Technology. “We are also investing significantly to ensure we continue to deliver world-class service capability in the Texas region, focusing on the availability of spares and expanding our field service and process engineering teams, to support the rapid expansion of leading manufacturers in the region such as AOI.”

###

 
For media enquiries, please contact:
Grant Baldwin, Head of Marketing
Oxford Instruments Plasma Technology
E: [email protected]
About Oxford Instruments plc
Oxford Instruments provides academic and commercial organisations worldwide with market-leading scientific technology and expertise across its key market segments: Materials Analysis, Healthcare & Life Science and Semiconductors. Innovation is the driving force behind Oxford Instruments' growth and success, supporting its core purpose to accelerate the breakthroughs that create a brighter future for our world. The vigorous search for new ways to make our world greener, healthier and more productive is driving unprecedented levels of R&D investment in new materials and techniques to support productivity and decarbonisation worldwide, creating a significant opportunity for Oxford Instruments to grow.

Oxford Instruments holds a unique position to anticipate global drivers and connect academic researchers with commercial applications engineers, acting as a catalyst that powers real world progress. Founded in 1959 as the first technology business to be spun out from Oxford University, Oxford Instruments is now a global company listed on the FTSE250 index of the London Stock Exchange (OXIG).

For more information, visit www.oxinst.com

About AOI 
Applied Optoelectronics, Inc. (AOI) is a leading developer and manufacturer of advanced optical and HFC networking products that are the building blocks for AI datacentres, CATV and broadband fibre access networks around the world. AOI supplies this critical infrastructure to tier-one customers across cloud computing, CATV broadband, telecom, and FTTH markets. The company has R&D facilities in Atlanta, GA, and engineering and manufacturing facilities at its corporate headquarters in Sugar Land, TX, as well as in Taipei, Taiwan and Ningbo, China. For additional information, visit www.ao-inc.com. 

• Read more about OXFORD INSTRUMENTS TEAMS WITH AOI TO BOOST ITS OPTOELECTRONIC DEVICE MANUFACTURING WITH NEXT-GEN INDIUM PHOSPHIDE

Advancing Thermal Scanning Probe Lithography

Zurich, Switzerland — Following the successful introduction of the modular NanoFrazor nanolithography system in 2024, Heidelberg Instruments is proud to announce the installation of the newest NanoFrazor. The system is equipped with the recent modules, enabling parallelized thermal scanning probe lithography (t-SPL). The beta site is hosted by the research partner EPFL, the Swiss Federal Institute of Technology in Lausanne, Switzerland. The installation marks a significant step forward in joint efforts to bring next-generation nanofabrication technologies into practice, promising advances in nanoscale research and applications.

Designed for high-resolution lithography down to 20 nm, with application flexibility and increased throughput, the system features parallelized t-SPL with ten heated tips writing simultaneously, Direct Laser Sublimation (DLS), and advanced automation. “Parallelizing t-SPL was the logical next step in advancing thermal nanolithography. The implementation, however, was far from trivial.” states Dr. Emine Cagin, CTO of Heidelberg Instruments Nano AG. “Parallelization required a decade of development, culminating in a new and scalable framework for electronics and software that now powers the new NanoFrazor.”

The new module, named the Decapede, increases the throughput up to tenfold, without compromising on high-resolution capabilities. “With improved throughput, we are considering upscaling grayscale nano surfaces that enable deterministic and localized strain engineering of 2D materials from chip-level to wafer-scale for potential industrial integration”, says Berke Erbas, Postdoctoral Researcher in the Microsystems Laboratory at EPFL. “We also aim to upscale grayscale nanoimprint lithography stamps fabricated through t-SPL and dry-etching approaches.”

EPFL — A Hub for Innovation
EPFL’s expertise in t-SPL and broad nanofabrication capabilities make it an ideal beta site and mark the continuation of a long-standing, trusted partnership with Heidelberg Instruments. The consortium of research groups involved brings together a combination of deep knowledge in t-SPL and diverse nanofabrication techniques, along with fresh ideas and challenging applications. The generous commitment to providing continuous feedback will help Heidelberg Instruments further validate the system performance and refine user interfaces.

From Nanoelectronics to Quantum Devices, a Look Ahead
The EPFL beta site is not only a testing and validation site for the system’s capabilities but first and foremost a catalyst for innovation in nanolithography. Applications at the EPFL beta site span nanoelectronics, plasmonics, quantum devices, and bio-nano-sensors. Jürgen Brugger, Professor in Microengineering and Materials Science at EPFL, highlights: “t-SPL has proven to be an excellent tool for educating junior researchers due to its capabilities for fast prototyping with a low threshold to create nano-patterns in short time scales. We are excited to expand towards parallel writing capabilities.” For example, the Laboratory of Nanoscience for Energy Technologies (LNET), Professor Giulia Tagliabue, is exploring the use of its gray-scale functionalities for realizing advanced metasurfaces that can strongly confine light at nanoscale dimensions for energy conversion and probing of interfacial processes.

We are looking forward to seeing how the beta site will accelerate discoveries and enable new possibilities in nanoscale science, both in research and educational use of the NanoFrazor system.

Further information: https://heidelberg-instruments.com/product/nanofrazor/

• Read more about Heidelberg Instruments — Beta Site Installation of NanoFrazor with Parallelization Capabilities at EPFL

Gütenbach, Germany – December 16, 2025 – RENA Technologies is proud to be a key industrial partner in a new 1.3 million Euro Government-funded project led by the National Physical Laboratory (NPL) and supported by the Department for Science, Innovation and Technology (DSIT). The initiative will establish critical new metrology capabilities to strengthen the UK’s semiconductor innovation infrastructure and accelerate the development and adoption of next-generation semiconductor materials and processes.

This strategic investment underlines the UK’s commitment to maintaining global competitiveness in semiconductors, helping to attract private investment, strengthen supply chains, and support long-term economic growth. As advanced semiconductor materials become central to technologies such as electric vehicles, renewable energy, 5G communications and advanced electronics, robust measurement, verification and standards are increasingly essential.

The project brings together a broad consortium spanning industry and academia. Together, the partners cover the full innovation landscape, from materials research and process development to device fabrication and performance verification.

“At RENA, we develop advanced wet processing and surface treatment solutions that are critical in manufacturing of compound semiconductors and emerging materials. Through this collaboration, RENA will contribute industrial insight and process expertise to ensure that new measurement and testing capabilities are closely aligned with real manufacturing challenges.” States Peter Schneidewind, CEO of RENA Technologies.

While silicon remains the foundation of much of today’s semiconductor industry, many high-growth applications increasingly depend on advanced materials such as gallium arsenide (GaAs), gallium nitride (GaN), silicon carbide (SiC), and indium phosphide (InP). These materials offer superior performance in high-power, high-frequency and optoelectronic applications, but they also introduce new complexities in processing, characterization and quality assurance. Reliable standards and independent measurement methods are therefore essential to derisk innovation and support scale-up.

Through this project, consortium partners will work with NPL to:
• Develop new UK measurement and test capabilities for advanced semiconductor materials by combining academic research excellence with world-leading metrology expertise.
• Apply these capabilities to critical industry challenges, including assessing material integrity, verifying RF performance, and testing device reliability under demanding operating conditions.
• Share the resulting capabilities openly with industry, helping to build national consensus and strengthen the UK’s influence in international standards development for novel semiconductor technologies.

Following extensive consultation the consortium has identified three priority application areas where the UK can have the greatest global impact: power electronics, RF-communications, and optoelectronics. These areas align closely with RENA’s customer base and technology roadmap, particularly in power and compound semiconductor manufacturing.
By participating in this program, RENA reinforces its commitment to supporting the UK semiconductor ecosystem with industrially relevant innovation, enabling customers to adopt advanced materials with confidence, and helping position the UK as a global leader in next-generation semiconductor technologies.

About NPL
The National Physical Laboratory (NPL) is the UK's National Metrology Institute (NMI), developing and maintaining the national primary measurement standards, as well as collaborating with other NMIs to maintain the international system of measurement. As a public sector research establishment, it delivers extraordinary impact by providing the measurement capability that underpins the UK's prosperity and quality of life. NPL develops the metrology required to ensure the timely and successful deployment of new technologies and work with organizations as they develop and test new products and processes.

About RENA Technologies GmbH
RENA Technologies is a leading global supplier of production machines for wet chemical surface preparation. RENA products are used in path-breaking application fields such as semiconductors, MedTech, renewable energies, and the glass industry. RENA equipment is used to treat or modify surfaces of, for example, semiconductor wafers, solar cells, glass, optical substrates or other high-tech products using wet chemical processes. RENA offers proven standard machines as well as customer-specific solutions and process support.

• Read more about RENA joins UK Government-funded consortium to strengthen national semiconductor metrology capabilities

Kitchener, Ontario, December 15, 2025 – PEER Group®, the largest supplier of innovative factory automation software products for the semiconductor industry, has appointed IBM Japan Ltd. as its exclusive distributor in Japan.

Under this agreement, IBM Japan manages sales and provides frontline support for PEER Group’s full suite of automation, connectivity, and test products, as well as its comprehensive Professional Services offerings, for all customers based in Japan. Previously, Mizuho Research & Technologies, Ltd. acted as PEER Group’s exclusive Japanese distributor.

“We are honored to partner with IBM Japan to serve our current and future customers in the Japanese market,” says Mike Kropp, Co-founder, President, and CEO of PEER Group. “IBM Japan’s leadership in semiconductor manufacturing technology and highly respected engineering and sales capabilities make them the ideal representative of PEER Group’s products and services,” says Kropp, while adding: “We also extend our thanks to Mizuho for their support over the past 18 years.”

Founded in 1992, PEER Group supplies high-quality, high-performance, and cybersecure solutions for both semiconductor OEMs and fabs. Its software portfolio includes flagship automation and connectivity products PEER® Tool Orchestrator (PTO®), PEER FACTORY® Station Controller (PFSC™), EIB® OEM, as well as a host of other communications and test applications, such as GWGEM®Plus, ConX300™, and SECSIM Pro®+. As an active contributor to SEMI Standards development, PEER Group helps customers achieve compliance with the latest automation, connectivity, and emerging cybersecurity standards.

“This marks the beginning of a long-standing partnership between two industry leaders that will greatly benefit OEMs and factories in Japan,” says Mike Barrett, Vice President, Global Sales at PEER Group. “PEER Group’s best-in-class products and expertise in SEMI Standards compliance are a natural fit with IBM’s proven capabilities and deep knowledge in factory automation and MES software.”

PEER Group and IBM Japan will kick off the partnership at SEMICON Japan. Attendees are encouraged to visit booth E6527 and connect with representatives to discuss factory or equipment automation and connectivity projects. For more information, visit: https://www.peergroup.com/news-events/events/semicon-japan-2025.

About PEER Group
PEER Group® is the leading global supplier of innovative factory and tool automation and connectivity software for the semiconductor industry. Since our founding in 1992, we have been committed to developing best-in-class solutions that help OEMs and factories reduce their time to market, risk, and costs by solving their most challenging automation, connectivity, and SEMI Standards compliance problems. Follow PEER Group on. Follow PEER Group on LinkedIn.

• Read more about PEER Group appoints IBM Japan Ltd. as its exclusive distributor in Japan

Validation underscores DAS EE’s 35 years of leadership in advanced and sustainable abatement solutions
Dresden, Germany, November 28, 2025 — As the semiconductor industry intensifies its efforts to reach net-zero emissions, the recently published SEMI SCC Whitepaper “Overview of F-GHG and Nitrous Oxide Semiconductor Abatement Technologies” (2024) establishes new industry performance benchmarks for greenhouse gas abatement. The report defines a minimum Destruction and Removal Efficiency (DRE) for CF₄ of >95% and a maximum goal of >99% for process gas abatement systems.

These new reference points represent a significant step beyond the legacy assumptions used in many ESG reports and supplier requirements, which have historically relied on conservative default values for greenhouse gas abatement performance. However, even the upper range of the SEMI SCC targets does not yet represent the full potential of modern technology.

DAS Environmental Expert GmbH demonstrates with its TILIA abatement system that destruction efficiencies exceeding 99.9% for CF₄ and other F-GHGs are both technically feasible and economically advantageous. These systems outperform the benchmarks set forth by the SEMI SCC whitepaper and contribute directly to the industry's carbon reduction goals.

“Systems like TILIA prove that it is not only possible but also economically rational to exceed the current industry benchmarks,” says Stephan Raithel, Chief Operating Officer Gas Treatment at DAS Environmental Expert GmbH. “With rising carbon taxes and tightening sustainability targets, investing in high-efficiency abatement translates directly into operational and financial benefits.”

The global semiconductor industry emits thousands of tons of CF₄ annually, a gas with a Global Warming Potential (GWP) of 7,390. Even a few tons of unmitigated emissions correspond to millions of tons of CO₂ equivalents. While current industry practice aims to meet the SCC-recommended minimum DREs, only systems operating consistently above 99.9% will enable the industry to meet its net-zero commitments.

The SEMI SCC Whitepaper emphasizes that achieving these higher efficiencies is crucial for the industry’s sustainability roadmap and requires broad adoption of next-generation abatement technologies. DAS Environmental Experts’ proven TILIA platform exemplifies this transition – setting a new benchmark for “Best in Class” abatement performance in the semiconductor industry.

About the Company
DAS Environmental Experts Group (DAS Group), headquartered in Dresden, Germany, was founded in 1991 and is now a global organization with subsidiaries on three continents and more than 950 employees worldwide. Over the past three decades, DAS Group has become one of the leading technology and equipment providers for waste gas abatement solutions with a focus on semiconductor industry.
In addition, DAS Group develops advanced process and system solutions for industrial water treatment, with extensive expertise in the recycling and reuse of wastewater from the semiconductor industry.
DAS solutions are engineered to meet the stringent purity requirements of semiconductor manufacturing, helping clients comply with global environmental standards.

• Read more about Best in Class Abatement System: DAS Environmental Experts Exceeds Efficiency Benchmarks in Semiconductor Greenhouse Gas Treatment

New SECS-II library helps fabs and OEMs integrate semiconductor tools with the MES in hybrid manufacturing sites, ensuring faster time to market and limiting integration costs

MUNICH, November 18, 2025 – Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor manufacturing, today unveils Agil’SECS-II at Booth #C2518 at SEMICON Europa 2025. This new SECS-II library, featuring built-in SEMI standard communication, enables a manufacturing execution system (MES) to accelerate the integration and validation of hybrid semiconductor and traditional manufacturing tools on production lines, ensuring faster time to market, lower integration costs, and reduced deployment risks. With this connection gateway, users can send and receive any SEMI SECS-II-compliant message as host or equipment for full GEM and GEM300 equipment integration and validation. This product can prove valuable for a variety of customers:

• Pure semiconductor original equipment manufacturers (OEMs) that need a practical way to develop an MES simulator and exercise their equipment under fab-like conditions. For small production lines or multi-tool set-ups exchanging data through SECS/GEM, Agil’SECS-II allows OEMs to design, test, and validate their equipment efficiently before shipping it to fabs.

• Customized, multi-industry, or low-volume production sites that use an MES system to integrate both traditional production machines and semiconductor tools. Agil’SECS-II simplifies integration in mixed equipment environments, especially where the MES cannot use SECS/GEM because most tools rely on protocols such as OPC UA, Modbus, or MQTT, yet semiconductor equipment using SECS/GEM must be integrated within the same MES.

• Laboratories and pilot lines without a full-featured MES that require a driver to collect data from various types of manufacturing equipment, including process, inspection, and metrology tools, to ensure quality and process control as well as complete traceability.

“With Agil’SECS-II, we wanted to provide a flexible tool that can serve multiple types of customers who can benefit from a proven software foundation built on more than 15 years of deployment experience in semiconductor fabs worldwide,” explains Marc Engel, chief executive officer of Agileo Automation. “Our SECS-II driver is especially useful for validating the processes of hybrid fabs that combine semiconductor and non-semiconductor manufacturing equipment, such as silicon carbide (SiC) wafer production lines or advanced packaging lines. It enables product and process traceability with legacy MES and helps OEMs developing equipment for these lines create MES simulators to verify information flow between tools using heterogeneous communication protocols.”

- ends -

About Agileo Automation
Agileo Automation is a trusted partner for equipment manufacturers, helping them build smarter, automated, and more connected machines that integrate seamlessly into advanced semiconductor fabs. Founded in 2010 in Poitiers, France, Agileo Automation helps OEMs optimize control, communication, data acquisition, and testing across their tools through proven software frameworks, applications, and expert support. Its flagship A²ECF-SEMI framework provides a solid foundation for developing equipment controllers fully aligned with SEMI SECS/GEM, GEM300, and EDA standards. As an active member of SEMI and the OPC Foundation, Agileo Automation contributes directly to shaping the standards that drive Industry 4.0 manufacturing. For more information, please visit our website or follow us on LinkedIn.

• Read more about Agileo Automation Launches Agil’SECS-II to Enable Semiconductor OEMs, Multi-Industry Fabs, and Labs to Accelerate Equipment Integration on Production Lines

RENA Technologies marks a new milestone in the semiconductor industry with the launch of Vanguard, a state-of-the-art, fully automated single-wafer platform designed for wet chemical cleaning, etching, and drying of 200mm and 300mm wafers. Engineered for performance, efficiency, and scalability, Vanguard offers new possibilities for advanced semiconductor manufacturing.

Broaden the Possibilities in Wafer Wet Processing

Vanguard is purpose-built to address the rising demands of next-generation semiconductor substrates and materials. Supporting 4 to 8 independent processing chambers within a compact footprint, the system delivers high throughput without compromising cleanroom space. Its advanced chemical cleaning and double-sided processing—handling up to five distinct chemistries—minimizes contamination, substrate damage, and defects, ensuring wafers meet the stringent yield and quality requirements of cutting-edge chip manufacturing.

"With the launch of our new semiconductor wet processing platform, we are entering a new aera in precision, efficiency, and reliability for advanced chip manufacturing. This machine embodies our commitment to innovation—delivering not only superior process control but also the flexibility our customers need to stay ahead in a rapidly evolving industry. It represents a decisive step in enabling the next generation of semiconductor technologies for both high-volume manufacturing lines and R&D fabs." Emphasizes Peter Schneidewind, CEO of RENA Technologies.

Scalable, Modular Design 

Vanguard’s modular architecture grows with customer needs. Fabs can easily adjust chamber count and process configurations to match evolving requirements, from R&D to high-volume production.
The platform integrates internal chemistry preparation for precise formulation control, ensuring consistent process delivery and minimizing chemical consumption. This reduces operating costs and environmental impact—key considerations for sustainable fabs.

Serviceability is also built-in: each chamber operates independently, allowing maintenance without halting production. Combined with AI-assisted process control, and the digital service platform RENA Connect Hub, customers gain maximum uptime and efficiency.

Next-Level Automation and Compatibility

With its digital twin simulation, customers can model system integration, test interfaces, and even simulate throughput with real process data—well before installation. Training and upgrades can be conducted seamlessly during live production.

Fully GEM300 compatible, Vanguard is integration-ready from day one. Operating within a Class 1 mini environment, it guarantees ultra-clean wafer handling, while its advanced drying ensures residue-free, pristine surfaces for downstream processing.

Key Features at a Glance

• Fully automated wet processing for 200mm / 300mm wafers
• Scalable from 4 to 8 single-wafer chambers
• Double-sided cleaning with up to 5 chemicals
• Internal chemistry preparation system
• AI-assisted software with predictive maintenance
• Advanced drying technology
• Class 1 mini environment for ultra-clean operation
• Compact footprint with high-throughput capability
• GEM300 factory-integration ready
• Low chemical usage for reduced cost and environmental impact 

Availability

Vanguard is officially available as of today. Semiconductor fabs and foundries seeking to modernize their wet processing capabilities now have access to a solution that combines performance, scalability, and sustainability—delivered today for the challenges of tomorrow.

• Read more about Introducing Vanguard: The New Single-Wafer Cleaning and Etching Tool from RENA Technologies

OXFORD INSTRUMENTS PROVIDES COHERENT WITH STATE-OF-THE-ART, FULLY AUTOMATED PROCESSING EQUIPMENT, FOR 6” INP WAFER MANUFACTURING, ENABLING NEXT GENERATION AI APPLICATIONS

Oxford Instruments (OXIG), a leading provider of advanced plasma processing solutions for the compound semiconductor industry, announces the key role it is playing to support the industry’s first fully automated 6-inch indium phosphide (InP) wafer fabrication capability for photonic devices, led by Coherent Corp. (NYSE: COHR), a global leader in compound semiconductors and high-performance optical networking solutions.

Oxford Instruments’ cutting-edge plasma processing equipment is central to Coherent’s groundbreaking achievement of ramping up 6-inch InP fabs in Sherman, Texas, and Järfälla, Sweden. These fabs will play a pivotal role in driving advancements in AI datacentre, telecommunications, and sensing applications. Coherent’s transition to 6-inch wafers is set to deliver significant benefits, including a substantial increase in capacity, lower die cost and more than four times the number of devices per wafer.

Oxford Instruments has supplied fully automated, high-throughput 6-inch InP processing equipment, enabling Coherent to achieve these remarkable productivity gains. This advanced equipment is designed to support the transition from 800G to 1.6T products, a key requirement to meet the growing demands of AI interconnects and optical communications.

“We have been the leading supplier of InP plasma etch equipment to the datacom market, and Coherent, for many years. Our technology, with the quality, throughput and reliability that we have developed alongside excellent service, is ideally positioned to support the current device demand inflection we are seeing with the release of generative AI applications. We are delighted to be partnering with Coherent during this exciting period of market expansion and look forward to continuing to develop and release innovative and valuable plasma processing solutions.” Matt Kelly, Managing Director, Oxford Instruments Plasma Technology.

"Coherent’s move to 6-inch InP wafer fabrication marks a transformative milestone for the industry. Oxford Instruments’ expertise in plasma processing has been essential in enabling our Sherman and Järfälla fabs to reach world-class performance,” said Dr. Beck Mason, Executive Vice President – Semiconductor Devices at Coherent. “Together, we are advancing InP technology to support faster networks, greater efficiency, and the new applications that will define the future of connectivity."

The joint efforts of Oxford Instruments and Coherent have culminated in a manufacturing platform that sets the stage for the next generation of InP optoelectronic devices. These devices are critical enablers for applications ranging from AI datacentres and datacom transceivers to advanced sensing in consumer electronics and automotive technologies.

• Read more about Enabling AI with Fully Automated Equipment for 6” InP Wafer Processing

Glendale, AZ / Dresden, Germany, October 2025 - DAS Environmental Experts Group, a leading global provider of environmental technologies for waste gas and water treatment, has officially opened its new Innovation & Support Center (ISC) in Glendale, Arizona. Initiated and built by DAS US, the Group's American branch, the center represents a significant milestone in the company's North American growth strategy. It strengthens the organization`s proximity to U.S. customers while creating jobs and contributing to Arizona's thriving technology ecosystem.

Long-term Commitment to U.S. Semiconductor and High-tech Industries
With the new Glendale hub, DAS US customers benefit from faster spare parts supply, improved service, and direct access to the company’s latest innovations. DAS US has been active in the U.S. since 2014, serving semiconductor and high-tech customers through offices in Boise, Idaho, and Phoenix, Arizona, along with service locations in Hillsboro, Oregon; Lehi, Utah; Fort Collins, Colorado; and Austin, Texas. The Phoenix office, opened in 2022, has now been expanded into the new ISC, further underscoring the company`s long-term commitment to the region and providing a foundation for future growth and collaboration with U.S. partners. Today, DAS US employs about 40 people nationwide.

“The opening of our Glendale Innovation & Support Center is a clear signal of our commitment to the U.S. market,” said René Reichardt, CEO of DAS Environmental Experts Group. “We are investing in Arizona and the U.S. workforce to ensure we can support our customers locally with reliable service, spare parts availability, and hands-on technical expertise. The facility’s tool training and classroom space provide real-world experience with a variety of DAS technologies, taking our customer care to a new level.”

Industry Outlook: Advancing Sustainability in a Growing Market
The semiconductor and solar industries are expanding rapidly to meet global challenges in digitization and energy supply. In the U.S., major investments under the CHIPS and Science Act are fueling new chip factory projects — and with them, growing expectations for environmental stewardship. Semiconductor manufacturing is among the most resource-intensive industries, making solutions for reducing emissions and optimizing water use critical for future growth.

“With more than 30 years of international expertise and a strong U.S. customer base, we are well positioned to help the industry meet these challenges,” said CEO Reichardt. “By combining proven technologies with a growing local presence, we enable customers to cut their environmental impact while driving innovation and conserving natural resources. I am proud of our US branch`s growth over the past decade, and we will continue contributing to the sustainable development of the semiconductor and solar industry in the United States.”
- ENDS -

About the company
DAS Environmental Experts Group (DAS Group), headquartered in Dresden, Germany, was founded in 1991 and is now a global organization with subsidiaries on three continents and more than 950 employees worldwide. Over the past three decades, DAS Group has become one of the leading technology and equipment providers for waste gas abatement solutions. International leaders in the semiconductor, TFT, LED, and electronic industries as well as in the solar industry, nanotechnology, and MEMS rely on its expertise.

In addition, DAS Group develops advanced process and system solutions for the treatment of industrial waters. This business builds on many years of experience in the semiconductor, chemical, food and beverage, paper, cosmetics, and pharmaceutical industries, and combines technology
know-how with services such as consulting, planning, installation, and start-up, as well as maintenance, repair, optimization, and operation of treatment systems.

Contact:
DAS Environmental Expert USA Inc.
Daniela Georgi, Head of Corporate Communications
23439 N. 35th Dr.
Suite 6+7
Glendale, AZ 85310, USA
T: +1 (844) 862 1662
[email protected]

For press inquiries, please contact:
S. Smith Consulting
Susann Smith
T: +1 (805) 280 1884
[email protected]

• Read more about DAS Environmental Experts Group boosts U.S. Semiconductor Sustainability with Arizona Expansion

FOR IMMEDIATE RELEASE

Media contact: M. Guilbert, [email protected]

RECIF Technologies Adopts Agileo Automation’s Combined Speech Scenario and E84 PIO Box Solution to Test E84 and SECS/GEM SEMI Standard Compliance of Wafer Handling and Tracking Equipment

Global French manufacturer of automated handling equipment, wafer sorters, and equipment front-end modules (EFEMs) saves significant fab equipment integration time and enhances customer satisfaction

PHOENIX, October 7, 2025 – Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor manufacturing equipment, today announced at Booth #877 at SEMICON West 2025 that RECIF Technologies has adopted its combined Speech Scenario and E84 PIO Box solution to test its wafer handling and tracking equipment for E84 and SECS/GEM compliance. The global company headquartered in Toulouse Blagnac, France, which specializes in the design, manufacturing, and installation of automated equipment for semiconductor wafer handling, needed a fast and effective solution to validate the compliance of its products with SEMI’s E84 and SECS/GEM standards before they are shipped and implemented at customers’ semiconductor manufacturing sites all over the world.

Speech Scenario is a software that emulates the fab host to validate SECS/GEM tool scenarios before shipping brand-new production equipment to fabs. The E84 PIO Box is a compact and lightweight device that serves as an interface between Speech Scenario and E84 passive equipment. Used together, these products allow RECIF Technologies to generate complete test reports that can be communicated to its customers, ensure fast detection of non-compliance and errors to avoid downtime, as well as quick and reliable SEMI E84 and SECS/GEM compliance testing, especially in the management of complex cases. The company has now better control over host-sorter interactions, with customizable scenarios related to automatic carrier delivery defined in the E84 standards. With Speech Scenario, RECIF teams can more effectively replicate customer use cases when resolving anomalies.

“We were using less flexible software where automation messages were not easily modifiable and old emulation technology for validation of only the PIO part of the E84 standard, which meant that more complex cases and host-sorter interactions had to be tested and adapted in the field during machine integration at customer sites,” explains Thomas Brillouet, research and development director for RECIF Technologies SAS. “We selected Agileo’s all-in-one Speech Scenario and E84 PIO Box solution because we believe that it is the most efficient and competitive product currently on the market. The flexibility and time savings we have garnered since using Agileo’s solution has translated into enhanced overall customer satisfaction for our company.”

“Over the past 40 years, RECIF Technologies has built a solid reputation as an innovative industry leader in advanced semiconductor equipment manufacturing and as an early adopter of SEMI standards,” adds Marc Engel, CEO of Agileo Automation. “Agileo Automation, whose origins are closely tied to RECIF Technologies, benefits from a strong cultural and technical proximity with the company. We are proud to contribute to RECIF Technologies’ success, both as a technology partner and by supporting them in demonstrating quality and reliability to their customers.”

- ends -

About Agileo Automation
Since its inception in 2010 in Poitiers, France, Agileo Automation has empowered global semiconductor equipment manufacturers to optimize their production machines with control, communication, data acquisition, and testing solutions, enabling their deployment in large-scale fabs worldwide. At the heart of Industry 4.0, Agileo’s A²ECF-SEMI framework provides a robust foundation for developing equipment controller software, leveraging the SEMI SECS/GEM and GEM300 standard suites. As a member of SEMI and the OPC Foundation, Agileo Automation is a key contributor to the development and integration of industry standards such as SEMI and OPC UA. For more information, please visit our web site or follow us on LinkedIn.

About RECIF Technologies
RECIF Technologies, headquartered in Toulouse-Blagnac, France, has been providing advanced robotic solutions for semiconductor wafer handling since 1985. The company designs and manufactures reliable sorters, EFEMs, and compact handling tools that help leading semiconductor manufacturers worldwide improve productivity, ensure reliability, and reduce total cost of ownership. As a member of SEMI and the Aeneas association, RECIF Technologies actively contributes to the industry standards and collaborative projects shaping the future of the semiconductor industry. For more information, please visit our web site or follow us on LinkedIn.

• Read more about RECIF Technologies Adopts Agileo Automation’s Combined Speech Scenario and E84 PIO Box Solution to Test E84 and SECS/GEM SEMI Standard Compliance of Wafer Handling and Tracking Equipment