semiconductor manufacturing

Skills are the key to the future. It is thanks to its skilled workforce that Europe will reap the benefits of the green and digital transitions and remain competitive. At the same time, upskilling and reskilling is a clear social policy because it ensures that workers can more easily navigate from one job to another.Microelectronics is at the crossroads of many sectors, such as the automotive industry, manufacturing, health, and energy. The European electronics industry is facing an acute shortage of skills in all tiers of its value chain, particularly in electronics design, both digital and analog, and in system and software engineering. A sustainable provision of qualified personnel is key to maintain competitiveness and innovation leadership. Yet, companies in this area suffer from a critical shortage of engineers with competence in microelectronics technology and design. The rapid evolution of the electronics industry calls for a continuous update of skills and knowhow.Vocational education and training has an important role to master these challenges. Modern, inclusive and dynamic vocational education and training programmes are a pre-requisite to remain competitive in the digital age. We must support agile partnerships to develop skills for smart industrial specialisation and the green and digital transitions. Everybody must be on board to shape the workforce transformation in Europe: industry, social partners, education and training organisations, as well as policymakers. The Blueprint for sectoral cooperation on skills launched in 2016 is an excellent model for strategic collaboration and will be extended.The Commission has recently proposed an update of our successful Skills Agenda for Europe. One key element is the new Pact for Skills, in order for all stakeholders to generate new concrete commitments to invest in upskilling and reskilling. It will help us to respond to the extent and speed of change in the economy and society. I warmly invite the microelectronics industry to participate in the Pact.I welcome the fact that SEMI and its 19 partners from 14 countries launched METIS – MicroElectronics Training, Industry and Skills Erasmus+ Project – in November 2019. METIS will receive 4 million EUR EU funding to implement a comprehensive strategy with a view to identify and fill skills shortages, to tackle skills mismatches, and to support upskilling and reskilling in order to address the challenges of the future of work and digitalisation.Nicolas Schmit is European Commissioner Jobs and Social Rights.

For the past several months, U.S. Department of Commerce officials have been developing proposals to amend the foreign direct product rule to require a license for the use of U.S.-origin semiconductor manufacturing equipment or technology in producing semiconductor devices for Huawei and its affiliates. Commerce has also advanced proposals to amend the de minimis rule to expand license requirements for shipments to Huawei and its affiliates of semiconductors produced outside the U.S. and incorporating minimal amounts of non-sensitive U.S. content.The expansion of both rules is among the many Huawei-related actions the administration is pursuing that include a government procurement ban, replacing Huawei equipment in rural U.S. networks, and prohibiting imports of technology and services from unspecified foreign adversary nations. The de minimis proposal was under final interagency review, and the direct product rule next in line for further action, when on February 18 President Trump issued a tweet saying that “The United States cannot, will not, become such a difficult place to deal with in terms of foreign countries buying our product, including for the always used National Security excuse, that our companies will be forced to leave in order to remain competitive.”Speaking to reporters later that day, the president, referring to chipmakers and Huawei, said “I think people were getting carried away with it… Things are put on my desk that have nothing to do with national security.”This week, SEMI President and CEO Ajit Manocha sent President Trump a thank-you letter for his comments and warned that the proposals could severely impact the U.S. and global semiconductor and electronics industries, create confusion and uncertainty in manufacturing supply chains, reduce investment in new capacity, and lead to the design-out of U.S. technology and U.S. components. SEMI also stressed that unilateral controls on U.S.-origin semiconductor devices, equipment, materials and technology could significantly and disproportionately harm U.S. companies, serve as a disincentive for further investments and innovation in the U.S., and impact non-U.S. companies as well. SEMI continues to work with policymakers to build awareness of the damaging and far-reaching effects of these proposals. The 2020 sales forecast for the global semiconductor manufacturing equipment market, excluding the U.S. (since the proposals only directly affect non-U.S. fabs), is approximately $53 billion. With U.S. producers accounting for roughly 40 percent market share, over $21 billion in U.S. equipment sales to non-U.S. fabs could be affected. Non-U.S. companies whose equipment incorporates U.S.-origin components and technology could also be impacted, and every fab worldwide using U.S.-origin manufacturing equipment or technology to produce items destined for Huawei would need to stop their use immediately and file for a license and/or remove U.S.-origin equipment and technology from production lines used for Huawei and its affiliates. The president’s remarks, along with the resignation of two key officials supporting the proposals, have created uncertainty around the next steps. SEMI is holding regular conference calls to keep members up to date and developing strong messages for members to use in their communications with government officials. SEMI Advocacy in Washington remains actively engaged with executive and congressional officials to ensure that U.S. export controls are narrowly tailored to specific national security concerns and applied at the multilateral level with major trading partners.Joe Pasetti is Vice President of Global Public Policy and Advocacy at SEMI.

The recent World Economic Forum event in Davos ranked the unfolding climate crisis among the top three risks companies and governments must address in order to prevent irreversible environmental damage. With the stakes that high, it is becoming critical for organizations of all sizes to take into account climate change risks and opportunities as they develop their strategic and business continuity plans.Two fundamentally different schools of thought have emerged on how to address climate change. On one side, NGOs and climate activists such as Greta Thunberg are pressuring governments to abruptly divert away from fossil fuels, a shift that experts say would exact a deep economic impact. On the other side is the camp that believes capitalism will run its course and ultimately guide public and private entities to find climate change solutions.For their part, organizations are responding to rising pressure from shareholders and stakeholders to disclose their emissions mitigation strategies. The accuracy and completeness of environmental disclosures ranges widely. Some businesses adopt a conservative approach and limit the volume of information made public, while others announce aggressive targets for reducing emissions from their operations and supply chains.Formed 18 years ago, the Carbon Disclosure Project (CDP) has motivated companies (and now cities) to disclose their greenhouse gas (GHG) emissions. In 2019, more than 525 institutional investors representing $96 trillion in assets backed the CDP, whose annual CDP questionnaire is often recognized as the most “comprehensive collection of self-reported environmental data in the world.”As the list of signatory investors supporting the CDP has grown over the years, so has the number of companies responding to the annual CDP questionnaire – from 228 companies in 2003 to over 8,400 in 2019. Company scores are based on 14 disclosure areas such as C-suite level sign-off on the questionnaire content, producing GHG emission data verified by a third party, or publicizing their completed questionnaire on the CDP website. Among all respondents, 179 companies (2%) scored the highest in leadership by demonstrating the strongest commitments to reducing greenhouse gases emissions from their operations and supply chain.Among these 179 companies – referred to as the A-list companies – 10 are SEMI members headquartered in Japan, Taiwan, Korea and France. SEMI applauds these members for ranking among the most progressive companies in disclosing greenhouse gas emissions, an achievement that requires considerable work but puts them in a position of strength in conveying to customers, investors and other stakeholders their commitment to climate resiliency.Olivier Corvez is senior manager of Environment, Health, Safety and Sustainability at SEMI.

The march of innovation in semiconductor microfabrication technology over the past 60 years has produced electronic devices and information systems that have transformed industries and lives around the world. And while advances in chip technology continue to make it possible to collect, transmit, store and process more data for a rapidly growing universe of applications, the pace of innovation is now facing strong headwinds. Powered by chip innovation, data centers have become massive centers of information processing but, on the downside, enormous consumers of electricity. Today, the power-hungry hubs account for five percent of the world's electricity usage, a proportion that is growing every year, raising important questions about sustainability. Compounding the challenge, the pace of Moore's Law, for decades the engine of electronic device and information system innovation, has slowed. While the research and development of state-of-the-art semiconductor fine processing technology remains robust, developing the advanced manufacturing technology for mass-producing more sophisticated electronics devices is becoming harder, as is ensuring business profitability."It has become difficult for semiconductor technology to continue to evolve as it has in the past," said Akira Minamikawa, Research Director of Technology Research at IHS Markit, who moderated the Semiconductor Executive Forum – View by Top Two in the Era of Digitalization on opening day of SEMICON Japan 2019 at Tokyo Big Sight. Held at the SuperTHEATER, the forum featured Terushi Shimizu, representative director and president at Sony Semiconductor Solutions, and Atsuyoshi Koike, president at Western Digital Japan, two industry powerhouses that could figure heavily in the future of digital technology. SuperTHEATER, the main stage at SEMICON Japan 2019 Image sensors evolve to become eyes of AIImage sensors are becoming eyes of artificial intelligence (AI) and intelligent systems that monitor people and events worldwide, collecting data that one day could help puzzle out growing social challenges such as energy conservation and traffic congestion. With 51 percent market share on the strength of its industry-leading technology, Sony Semiconductor Solutions dominates the image sensor market. Despite last year’s global semiconductor industry slump, the company’s “business continues to enjoy strong growth and we are very busy,” said Shimizu, who attributed the company’s robust performance to the rising importance of the social role of image sensors and the expanding number of applications they support.The success of the company’s image sensors can also be traced to its division of the image sensor market into two application categories: "Imaging" focuses on capturing beautiful image data, while "sensing" aims to collect data that accurately describes the state of a subject and its surroundings."In 2019, sales of imaging products for smartphones grew rapidly,” Shimizu said in his market overview. “This is due to the average annual 15 percent growth rate of multi-camera smartphones, with some phones today featuring seven cameras, and an average annual growth rate of 20 percent in sensor size to produce higher image quality."But Shimizu cautioned that Sony Semiconductor Solutions doesn’t expect the smartphone sensor market to maintain that fast growth rate."The imaging market is expected to grow until 2022, but after that, the sensing market will drive market growth,” he said, adding that the company’s “capital investment plan is based on this scenario."AI will be key in catalyzing growth of the sensor market as integrations of AI processing engines and sensing images grow in sophistication to capture images undetectable by the human eye, Shimizu said. AI will extract insight from captured image data. For its part, Sony will apply its layer stacking technology to sensing products."By stacking an AI processing engine, we want a significant portion of the recognition processing done within the sensor chip," Shimizu said.One sensor the company already offers collects in-depth information for indirect time-of-flight (ITOF) 3D ranging for new user interfaces relying on autonomous or gesture control for robotics. The sensor “was first used in smartphones in 2018 and saw widespread adoption in 2019," Shimizu said.Sony Semiconductor Solutions plans to focus on developing new sensors for integration with their ultrasonic cousins. Aided by optical deflection technology, the sensors will be used for product quality inspections during manufacturing.With the company’s growing strengths in sensor technology, it hopes “to increase sales of sensors from a few percent of the company’s total sales in 2018 to 30 percent in 2025,” Shimizu said, pointing to its goal "to capture 60 percent share of the image sensor market by 2025."Data as one way to spread happinessAt the heart of consumer devices such as smartphones and computers and also cloud servers, NAND flash has made it possible to process vast troves of data anytime, anywhere. In recent years, the technology has enjoyed stronger adoption for use as the storage medium of choice for edge computing, stationed between end devices and the cloud to help streamline data utilization. But the technology isn’t merely about making smarter use of bits and bytes."We would like to promote the technology development that can support the use of data to bring happiness to people around the world," Koike of Western Digital Japan said. The company calls data that contributes to individual happiness and helps solve social issues "data for good" and, like the Sony Semiconductor Solutions bifurcated classification of the image sensor market, categorizes information into “big data” and “fast data.”For example, big data can leverage AI to drive dramatic improvements in the interpretation of test data and, ultimately, the diagnostic accuracy of mammography for breast cancer screening, aiding in early detection to help save lives, Koike said. Fast data can be harnessed to analyze data collected from a manufacturing equipment line in real time to improve production efficiency. The company’s plant in Yokkaichi, Mie Prefecture, which the company operates in cooperation with Japanese memory manufacturer Kioxia, already uses fast data to bolster production.More NAND flash innovation and greater supply capacity are critical to developing "data for good," Koike said. "It is difficult to expand clean rooms at the same pace as data usage grows. In order to continue to advance technology and enhance supply capacity, we need to adopt new ideas for building production lines. We need a smaller equipment footprint, shorter cycle time and higher throughput."Semiconductor market shows signs of recoveryIn their discussion of the short-term outlook for the semiconductor market, Shimizu and Koike pointed to the importance of strengthening the talent pool of Japan’s semiconductor industry as global competition heats up with China’s pursuit of semiconductor independence and the industry pulls out of the 2019 slowdown fueled by weak memory prices. While Sony’s business has been buoyed by strong image sensor demand for smartphones, the devices “did very well, but other applications didn't," Shimizu said. Even the image sensor market stagnated.Despite the 2019 slump, market conditions and capital investments by semiconductor manufacturers have been on the upswing."In the second half of 2019, the Chinese market showed signs of recovery triggered by 5G,” Shimizu said. “In 2020, this movement is going to be in full swing around the world and we will be busier than last year."Koike agreed: "The semiconductor market for data centers will recover with 5G. The hard disk shortage is already an indication of a recovery, a turnaround that will undoubtedly extend to solid state drives (SSDs). In addition, advances in autonomous driving technology will ensure continued growth of the automotive semiconductor industry.”Japan should embrace international competition, not fear China's pursuit of chip independenceIt's no secret that China is investing heavily in its semiconductor development capabilities to move up the microprocessor value chain. Minamikawa posed the question: How should Japanese chip companies navigate the shifting regional balance of power? "It is natural for China to strive to establish domestic procurement of semiconductors that are fundamental technologies for various industries,” Koike said, “I think the efforts of Chinese companies are outstanding in that they are not pursuing short-term results, such as improving yields in the near future, but are making efforts with an eye to achieving results in 10 years. Japan has a variety of options including working with China to create joint ventures and competing head-on. Regardless of which choice we make, however, it is imperative for the survival of domestic companies that Japan maintains its technological competitiveness to remain ahead of China."Shimizu said that Sony’s “Chinese customers are quick to take action and study extremely hard. We often have opportunities to share our roadmap with them and explore innovation opportunities together. Before, they were passive and relied on us for insights into new technologies, but now they are more assertive and I sense that they will start to drive innovation.”Koike added that "although Japanese companies often talk about business globalization, neither Chinese nor American companies say much about it. While global expansion is a major requirement for business, I think Japanese companies need to focus more on the Japanese market overall, not just when they think about the growing competitiveness of Chinese companies." L-R: Akira Minamikawa, Research Director of Technology Research at IHS Markit; Atsuyoshi Koike, president at Western Digital Japan; Terushi Shimizu, representative director and president at Sony Semiconductor Solutions Talent key to bolstering competitiveness of Japan’s semiconductor industryMinamikawa of IHS Markit didn’t mince words in describing the talent shortage in the Japanese semiconductor industry as “grave,” saying that “the workforce challenge is not endemic to the electronics industry as evidence grows that the number of people obtaining doctorates in Japan is falling and the educational level of the Japanese population as a whole is in decline.”Three years ago, Shimizu interviewed professors on Kyushu island for insights into Japan’s talent shortfall. He came away feeling that “Japanese semiconductor companies were not sufficiently communicating the industry's talent and innovation needs to professors. To help professors and students better grasp the appeal and potential of the industry, we have started to send frontline engineers to universities to educate students and instructors about their work and careers. Expecting corporate HR departments to alone solve the talent shortage won’t work.”"In Japan, if you advance to a doctoral course, you will have a hard time getting a job, which is a strange situation,” Koike said. “Companies and universities need to work together more closely to better understand how to attract and hire doctoral graduates."Minamikawa said companies must have strong leaders with clear missions to attract the right talent, but Koike pointed to the drawbacks: "The image of a company with a strong leader seems to be cool, but it also has a downside because engineers stop thinking for themselves and wait for instructions from the top. I believe it is important for company leaders to have ongoing discussions at all organizational levels and lead the way in times of confusion."Shimizu agreed, citing his own company as an example."Thankfully, our company is very busy right now,” he said. “However, some employees are starting to request more time to think about how to improve the quality of their work. To maintain and strengthen our competitiveness and continue business growth, I believe it is important to cultivate an environment that encourages each employee to take more time to think for themselves."Motoaki Ito is the CEO of Enlight, Inc. and a reporter for SEMI. Mayumi Amagai is a marketing manager at SEMI Japan.

Augmented reality (AR) tyrannosauruses towered on-screen as I interacted with the creatures in a mix of prehistoric and cutting edge. Or, rather, my AR double was doing the playacting. Minutes later, virtual doppelgangers of a small lineup of chip industry executives cut the ceremonial ribbon. Seemingly sweeping away the winter chill, the opening of SEMICON Japan 2019 dazzled with smart technology and the promise of lives, cities and workplaces transformed, with uber-intelligent applications in full display at Tokyo Big Sight. But what resources does the industry need to harness to drive the next era of innovation? The semiconductor industry’s unwavering passion and young talent are key, said Hiroshi Imano, Chairperson of the SEMICON Japan Initiatives Committee, in his opening keynote. And hardly any region of the world is in a better position to help realize that future than Japan, Imano said. The region supplies one third of the equipment and more than half of all materials to the global semiconductor manufacturing industry.Talent was also top of mind for SEMICON Japan 2019 keynote speaker Makiko Eda, Japan's Chief Representative Officer at the World Economic Forum (WEF). Serving as a platform for public-private partnerships, the organization's mandate is to tackle global issues such as climate change and geopolitical strife in making world more resilient to risk and, by extension, more sustainable.Spanning ecology, economy, technology, society, geopolitics and industry, that mission includes reskilling and upskilling a billion people over the next decade, a high priority for WEF, which hosts a conference every January in Davos, Switzerland. The theme of this month's conference – Stakeholders for a Cohesive and Sustainable World – reflects the vital importance of building the international partnerships and global consensus necessary to achieving WEF's goals.One key to that sustainability will be technology and Arm, a global chip design company, will play a key role, with the company’s chips touching over 70 percent of the world’s population, Arm president Yuzuru Utsumi said in his keynote. Today, Arm is driving toward an ambitious goal: Ship 100 billion chips from 2017 to 2021 – the same number produced over the previous quarter century – by powering advances in mobile computing, server and networking infrastructures, and automotive applications.Arm’s innovation ecosystem of more than 1,000 partners will deliver these chips as they continue to work together to develop differentiated technology. Arm plans to increase investments not only in its primary processor business to accelerate market share gains but in the company’s new IoT business to create new revenue streams. The goal: Deliver long-term sustainable growth, Utsumi said. SEMICON Japan 2019 showcases SMART manufacturing and transportation Billed as a showcase of smart technologies, SEMICON Japan 2019 delivered with an array of eye-grabbing exhibitions in the popular SMART Applications Zone. In the SMART Transportation area, the automatic operation pavilion featured a car equipped with open-source software for autonomous driving. The exhibitor, Tier IV, aims to help lead the early commercialization of self-driving vehicles through the adoption of its software, Autoware, which makes it easier to develop self-driving vehicle prototypes using low-power platforms.Sony Semiconductor Solutions demonstrated a vision sensing processor designed to guide autonomous drones. Using two cameras, the processor measured the changing distance between visitors moving about the exhibit and stationary objects in real time, indicating proximity in hues of red (nearby) and blue (at a distance). Many visitors were wowed, describing the multichromatic display as futuristic.Others rode a simple wooden swing hanging by two ropes, but from dizzying heights thanks to Solidray’s Duo-Sight, a virtual reality (VR) system that projects 3D images stretching from wall to floor for immersive experiences. One visitor thrilled at how riding the swing, suspended only a few feet from the floor, felt like soaring on a flying trapeze. Target applications for the technology include virtual rides at amusement parks and presenting interior design options to homeowners.In the SMART Manufacturing area, one highlight was the demonstration by the National Institute of Advanced Industrial Science and Technology (AIST) of a remote-controlled Minimal Fab System designed for low-volume, high-mix chip production with little staffing. Designed to increase production efficiency, the system allows a circuit designer to manufacture a semiconductor by singlehandedly operating equipment up and down the production line. Controlling nearly 50 pieces of equipment, the Minimal Fab System on display manufactured chips that were verified for functional operation and exhibited afterwards.On the SMART Applications stage, exhibitors DENSO and Toyota Motor Corporation announced a new joint venture to conduct research and advanced development of the next-generation in-vehicle semiconductors critical to electric and autonomous vehicle innovation. The venture, operating as MIRISE Technologies, will combine Toyota’s mobility expertise with DENSO’s in-vehicle component prowess. The goal is to build a rapid, competitive development system by 2030, said Yoshifumi Kato, executive director of the DENSO Research and Development Center, and president and representative director of the venture. On track to begin work this year, MIRISE will span three fields of technology development: power electronics, sensing and SoC (System-on-a-Chip). The name MIRISE combines word the Japanese word "mirai" (future) with "rise."Business Continuity PlanningNatural disasters and other emergencies are an ongoing threat to uninterrupted business operations across the semiconductor manufacturing supply chain and particularly in earthquake-prone Japan. To better prepare for business disruptions and restore normal operations as soon as possible after disaster strikes, more companies are teaming on Business Continuity Planning (BCP).THK's Seismic Isolation Experience Car demonstrated one technology designed to help – a seismic isolation device. The car shakes like an earthquake to give people inside a taste of how a building heaves and sways during a quake with and without the device deployed. Visitors were struck by how much the isolator dampens tremors to prevent or minimize damage. In the BCP seminar, representatives from Sony Semiconductor Manufacturing, THK, DISCO and Team Engineering Consulting shared lessons learned from actual disasters and discussed the critical importance of daily disaster drills. Yukihide Keigo, Executive Engineer in charge of Products and Development at Sony Semiconductor Manufacturing, recounted how the company’s Kumamoto Prefecture plant struggled for 96 days to restore full operations after the facility sustained heavy damage in the 2016 earthquake. Keigo said the plant lacked the structural reinforcements necessary to withstand the impact and fell prey to poor planning and accountability. The Kumamoto plant has since implemented measures – structural and procedural improvements – that more accurately account for seismic risks to ensure full recovery within 56 days. The plant’s new procedures include emergency drills for staff including night-shift workers.Innovation abounds at six SuperTHEATER forumsSEMICON Japan 2019 was held in the West and South Halls of Tokyo Big Sight as organizers of the Tokyo Olympics occupied the East Hall, the exhibition's usual home at the venue, to prepare for the 2020 games. For the first time, the main stage, SuperTHEATER, was set up in the cavernous arena near the main entrance. The SuperTHEATER featured six forums over three days. Semiconductor Executive Forum – View by Top Two in the Era of Digitalization with thought leaders from IHS Markit and Sony Semiconductor Solutions SMART Connectivity Forum – Infinite World Brought by 5G Innovation with experts from Softbank and Nokia Solutions Networks SMART Transportation Forum I – Front-line of Automated Driving featuring speakers from Intel and DENSO SMART Transportation Forum II – Revolution of Sky Transportation, supported by the U.S. Commercial Service in Japan, with presenters from Ministry of Economy, Trade and Industry (METI), Subaru and Bell Helicopter Manufacturing Innovation Summit – Issues and Innovation: What will Drive Growth to 2030 featuring thought leaders from VLSI Research, Applied Materials, KLA, Nikon and Tokyo Electron Mirai Vision Forum – Future Relation of Technology and Body 2.0 with speakers from Leave a Nest, Ory Lab and Autonomous Control Systems Laboratory The Mirai Vision Forum highlighted advanced technologies that could lead to societal improvements. One presenter, Kentaro Yoshifuji, CEO at Ory Lab, recalled how, as a child, he once stayed home from school while recovering from an illness. His imagination in full flight, the youngster imagined having a clone that could attend school and be with his classmates. The experience eventually inspired him to develop OriHime, a robot that gives socially isolated people a way to communicate with friends or colleagues remotely. Originally developed for physically impaired people, OriHime today is used to help the able-bodied. The robot is situated with the companion and the user operates OriHime remotely. A camera and monitor in OriHime’s face provide the visual and audio connection and the user controls the device with a smartphone or tablet or, for those who are paralyzed, through eye movement. One potential application: With OriHime stationed at a business office, working mothers could use OriHime to telecommute to better balance their careers with their parenting responsibilities at home. The robot would be a mother’s go-between, enabling her to communicate directly with colleagues.The next generation of innovators also took the stage as five teams presented innovative business ideas in friendly competition. The top prize in The TECH CAMP Hackathon went to the group that hatched an ingenious plan to develop a jacket that trains users to move their bodies in preprogrammed ways. For example, legendary Japanese professional baseball player Shigeo Nagashima could wear the gear while batting to program the device, then give the jacket to someone who’s never swung a baseball bat. The jacket would help the user replicate Nagashima’s swing. Now comes the real work of any innovator – executing on the vision.And then came two soccer-playing artificial intelligence (AI) robots that squared off and ... Scored! The demonstration by the Toyota National College of Technology started as a research project by Toyota National College students in 2002. The young innovators designed and developed all the robotic hardware and software from scratch. Looking ahead to SEMICON Japan 2020!SEMICON Japan 2019 not only gathered leading Japanese semiconductor materials and manufacturing equipment providers to demonstrate their latest innovations. The premiere regional event also provided insights on key trends critical to the entire electronics manufacturing supply chain. This year’s event drew more than 51,000 visitors and 695 exhibitors from 15 regions filling more than 1,700 booths.SEMICON Japan 2020 returns to East Hall at Tokyo Big Sight in December 2020. I look forward to seeing you there!Jim Hamajima is president of SEMI Japan.

We live in the New Industrial Age. Manufacturing is undergoing a profound transformation, driven not only by technological (e.g. Artificial Intelligence, robotics, IoT) but also societal, market and regulatory developments that have fundamental implications for the workforce competency requirements. How can education and training systems keep pace with this unprecedented change? How does a future-proof curriculum look like?This topic has been extensively addressed by the Curriculum Guidelines for Key Enabling Technologies (KETs) and Advanced Manufacturing Technologies (AMT) initiative (2017-2019) of the Executive Agency for SMEs (EASME) and DG GROW of the European Commission. Carried out by PwC, the initiative focuses on the promising ways of organising learning experiences of individuals and groups in the New Industrial Age. The initiative produced the Curriculum Guidelines 4.0 that aim to equip all key stakeholder groups with the knowledge base needed to transform the existing curricula.The guidelines were developed based on the extensive state-of-play analysis and active stakeholder contribution by means of expert workshops, pan-European online surveys, in-depth interviews and individual expert consultations. All key stakeholder groups were involved in the preparation of the guidelines, including the representatives of education and training providers, industry, policymakers and supporting structures (e.g. industry associations, cluster organisations and trade unions), as well as learners themselves. SEMI was among the key contributors. The guidelines were presented to the public at the EU Conference on Skills for Industry: Curriculum Guidelines 4.0 in Brussels on 26 November, 2019.The guidelines aim to be applicable for both designing fundamentally new educational offers and/or advancing the existing curricula, depending on the level of required change. They address non-tertiary vocational education and training, higher education and on-the-job training for the manufacturing-related domains.The guidelines follow a holistic approach covering a broad spectrum of dimensions relevant to curriculum design and implementation, namely: Strategy: defining core values, commitments, opportunities, resources and capabilities of an educational/training institution Collaboration: promoting practices that move beyond the typical institutional collaboration patterns and engaging individuals and communities Content: defining the nature of educational content, including specific principles related to the actual content of the curricula Learning environment: creating specific environment during the program, e.g. stimulating multidisciplinary orientation, design thinking, team spirit, collective problem-solving, risk-taking behaviour, experimental approaches Delivery mechanisms: establishing means by which learners experience and access education/training; paying special attention to technology-enabled learning Assessment: identifying most appropriate forms of assessment, including advantages and disadvantages Recognition: exploring appropriate formal and informal ways of recognition Quality: identifying the determinants of education training quality: what makes learners’ and employers’ perception different? Based on the results of the pan-European survey, the four key elements that require the most substantial change are Strategy, Collaboration, Learning Environment and Content.The guidelines will be tested in practice in the context of METIS (Microelectronics Training, Industry and Skills), a project recently launched by SEMI and 19 partners from 14 countries. Aligned with the Curriculum Guidelines 4.0, METIS will establish a Microelectronics Observatory and Skills Council consisting of representatives from industry, academia, NGOs, think tanks and government. The consortium will develop a New Skills Strategy for the microelectronics industry in Europe with a focus on raising occupational profiles and skills critical to the future of the sector.METIS will enable a new industry-driven curriculum with 43 modules integrating online education and work-based learning in microelectronics design and manufacturing. Training will focus on chip design, system design, basic of manufacturing and key competencies. METIS is a Sector Skills Alliance co-funded by the Erasmus+ Program, receiving 4 million EUR funding from the EU.Preparing students for lifelong learning, offering Big Picture education, creating effective learning ecosystems, applying problem-based and student-centric approaches, shifting from human-robot interactions towards human-machine collaboration – these are just some examples of the curriculum guidelines principles highlighted in the guidelines.The guidelines aim to offer key highlights, indicate a variety of possibilities and identify sources for more detailed information and inspiration. The guidelines by no means aim to serve as a standardised detailed recipe for organising education and training processes, as there is no one best way to approach it. The diversity of learners’ needs and contexts per definition implies a need for multitude of approaches, which could also be combined in their own unique/customised education and training solutions.The Curriculum Guidelines 4.0 will be publicly released in January 2020, and will be available on the EU Publications. More information about this and related initiatives can be found at https://skills4industry.eu/. Dr. Kristina Dervojeda leads the PwC Innovation Research Centre in the Netherlands.

Like all other SEMICON expositions, SEMICON West last month gathered thousands of people to make business connections and learn about the industry and its opportunities. But the events are also great venues for SEMI’s Global Industry Advocacy team to meet with industry leaders from around the world as well as regional SEMI presidents to discuss policy issues we face in each region and best practices for how to address them. The time was also ripe for us to meet with various advisory groups and advocacy committees to examine current issues.Top on our list at SEMICON West was a discussion with SEMI’s International Board of Directors about the then newly announced actions by Japan’s Ministry of Economy, Trade and Industry (METI) to tighten export controls in trade with Korea. SEMI depends heavily on and is grateful for insights from its International Board, Board of Industry Leaders and various Regional Advisory Boards. They are crucial to our ability to develop and execute industry advocacy strategies that take into account regional idiosyncrasies, geopolitical sensitivities and global supply chain complexities. SEMI is unique in its ability to bring a global perspective to engaging governments around the world in real time. In the case of the trade dispute between Japan and South Korea, we engaged SEMI members in Japan and Korea as we developed our strategy.On the SEMI America’s front, the North American Advisory Board and its Public Policy Committee met at SEMICON West for a spirited discussion on how to best manage our lobbying activities and how regional and U.S. companies should be involved. The committee’s perspectives and guidance will be invaluable as we chart a path forward in these challenging times in global trade.Our Global Industry Advocacy team also continues to build out SEMI Works, SEMI’s comprehensive initiative to develop a talent pipeline and overcome the industry’s longstanding shortage of skilled workers. SEMI Works focuses on stimulating greater interest in STEM careers, aligning STEM course curriculum and industry needs, and connecting students with relevant courses and careers. We are in the process of launching three regional pilot programs that will enable us to develop the SEMI Works business model that we’ll use to scale the program and ensure the initiative is robust and sustainable. At SEMICON West the Global Advocacy team convened regional stakeholders involved in these pilots to share information on opportunities and challenges and to discuss various implementation strategies.At SEMICON West we also facilitated meetings with U.S. government representatives aimed at improving cybersecurity in manufacturing and developing a commercial security model that will strengthen security throughout the supply chain in areas vital to industry growth such as traceability.After nearly 50 years, SEMI still excels in enabling the industry collaborations key to growth and innovation. Collaboration is also a driving force within SEMI Global Industry Advocacy as we continue to work with SEMI members, our various boards and governments around the world to advance the interests of the semiconductor industry.Mike Russo is vice president of Global Industry Advocacy at SEMI.

In testimony today before a U.S. government interagency panel considering tariffs on $300 billion worth of Chinese goods, SEMI called for the removal of about 30 tariff lines, which cover items central to the semiconductor manufacturing process.Mike Russo, vice president of global industry advocacy at SEMI, explained in his testimony that while SEMI strongly supports efforts to better protect valuable intellectual property (IP), tariffs will not help address Chinese trade practices, and will ultimately have significant and unintended consequences.SEMI asserts that these tariffs will harm not only companies operating in the U.S., but other companies as well in the semiconductor supply chain by increasing costs, introducing uncertainty, and most problematically, stifling innovation. Collectively, SEMI estimates that this round of tariffs will cost its 430 U.S. members millions annually in additional duties. All told, SEMI estimates that all U.S. and Chinese retaliatory tariffs will cost members nearly $800 million in annual duties.SEMI’s full written comments note that these tariffs, on top of those already in force and the retaliatory tariffs, will hamstring the industry. The tariffs seem to target firms for simply operating in China. Given that tools, materials, and related products are extremely complex, precise, and difficult to manufacture, it is unreasonable to believe that a constituent component can simply be replaced with a part or tool from another source. Further, this U.S. government approach does not take into account that many items subject to these tariffs are not available, at sufficient quality and cost, from domestic sources, or even non-Chinese sources.Over the past year, SEMI has submitted written comments and offered testimony on the three previous rounds of tariffs, which covered about $250 billion worth of Chinese goods, or about half of all imports from China. The tariffs hit various components in the electronics manufacturing supply chain critical to the semiconductor industry, including materials and equipment used to manufacture wafers, boules, and chips as well as test, inspection and sensing equipment. We urge SEMI members to review the $300 billion U.S. tariff list to determine the level, if any, of impact. We also strongly encourage members to review Chinese retaliatory lists as well. Any SEMI members with questions should contact Jay Chittooran, Global Public Policy Manager at SEMI, at [email protected].

SEMI, with 660 other companies and associations, urged the Trump Administration in a letter today not to escalate its trade dispute with China by imposing new tariffs and to negotiate a resolution. The letter comes as the Office of the United States Trade Representative prepares for hearings next week in considering 25 percent tariffs on $300 billion worth of Chinese goods, including a number of products used in semiconductor manufacturing.With intellectual property (IP) the crown jewel of the semiconductor industry, SEMI vigorously supports the stronger IP protections direly needed in international trade. However, we worry that the proposed and recently implemented tariffs will hurt companies in the semiconductor supply chain by introducing significant uncertainty, increasing costs and subjecting companies to retaliatory tariffs while ultimately doing nothing to address our concerns regarding China’s trade practices. We strongly encourage the administration to return to the negotiating table while working with our allies to develop global, enforceable trade solutions. There are no winners in a trade war. Senior industry executives and SEMI staff raised this and other issues with policymakers last month as part of SEMI’s Spring Washington Forum. SEMI will continue to engage the Trump Administration as trade tensions continue.Jay Chittooran is public policy manager at SEMI. He can by reached at [email protected].

Technologies promising huge growth such as Artificial intelligence (AI), 5G, machine learning, high-performance computing, and telematics are ratcheting up pressure on semiconductor manufacturers in the race among product makers to accelerate time to market and capture share. To support rapidly evolving end markets for these and other technologies that are key drivers of industry growth, chipmakers are boosting semiconductor performance, producing more wafer sizes and improving manufacturing efficiency.At the same time, chip manufacturers must enable unprecedented end-product reliability for exploding markets such as automotive and healthcare markets where, with lives at stake, products can’t afford even the slightest lapse in reliability. In response, chip suppliers are retooling their manufacturing processes to support 3D stacking, package-level integration and miniaturization. But they must do more. Bringing high efficiency to all phases of manufacturing including design and materials is the new imperative. The key to quality management is not in the traditional post-production testing and damage control but in prevention. Delivering the highest quality and reliability must start in the earliest stages of production with manufacturing and testing design – an approach that reduces not only the cost of downstream testing but minimizes product defects that can damage a supplier’s credibility and lead to lost business.To that end, SEMI has launched its Quality Assurance Special Interest Group (SIG) consisting of representatives from industry leaders such as Infineon, NXP, TSMC, UMC, ASE, Unimicron, and GCE. The group's goal is to establish quality requirements spanning the supply chain to meet new, higher reliability standards and help safeguard Taiwan’s competitive edge in the global microelectronics industry. Meeting for the first time earlier this month, the companies exchanged ideas for improving quality management in semiconductor manufacturing and ultimately deliver the reliability the market needs.The company representatives unanimously agreed that the first step is to ensure a QA-friendly environment with quality requirements for various stages of chipmaking ranging from design, manufacturing, packaging and testing to even PCB and CCL production. The SEMI Quality Assurance SIG this year plans to build on its current membership by enlisting companies from various fields to address critical areas of reliability including statistical process control, surface-mount-technology-based board level reliability control, and 0 dppm quality control for automotive chips. SEMI Quality Assurance Special Interest Group consists of leading companies in the industry, including Infineon, NXP, TSMC, UMC, ASE, Unimicron, and GCE. “SEMI’s comprehensive platform of exhibitions, programs, forums, trade meetings and matchmaking events is instrumental in bringing together key industry players to enhance quality management practices and meet the growing reliability requirements of the end markets we serve,” said Terry Tsao, chief marketing officer at SEMI and president of SEMI Taiwan. “The Quality Assurance Special Interest Group is a shining example of how SEMI continues to support the crucial role of Taiwan’s semiconductor industry in the international community.”For more information about the SEMI Quality Assurance Special Interest Group or to become a member, please contact Emmy Yi at [email protected] Yi is a marketing specialist at SEMI Taiwan.