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Member Press Release
New Patented Recycling Systems for Slurry and Ultrapure Water for the Semiconductor Market
As first company worldwide the HighQ-Factory GmbH, a company of the Faeth Group, launched a new patented recycling system for the semiconductor market. The recycling system helps for example...
SEMI Press Release
Scaling and Innovation Highlight SEMI Strategic Materials Conference Korea (SMC Korea)
SEOUL, Korea – April 16, 2018 – The 3rd SEMI Strategic Materials Conference Korea (SMC Korea), May 17 at the Coex Convention & Exhibition Center in Seoul, will bring together industry leaders for...
SEMI Press Release
SEMI Announces ESD Alliance to Join as Strategic Association Partner
Milpitas, CA – April 16, 2018 – SEMI today announced that it has signed a memorandum of understanding to integrate the ESD (Electronic System Design) Alliance as a SEMI Strategic Association Partner...
SEMI Press Release
SEMI Postpones SEMICON Southeast Asia 2018 to Avoid Malaysian Election Conflict
KUALA LUMPUR – 13 April 2018 – SEMI, the industry association representing the global manufacturing supply chain, today announced postponement of SEMICON Southeast Asia from 8-10 May 2018 to 22-24...
Blog
SEMI, 106 Other Associations Urge Caution by Congress, Trump Administration in Trade Tariffs Against China
SEMI and 106 other associations today joined forces to express deep concern to congressional leaders about the Trump Administration’s decision to use tariffs to address China’s unfair trade...
Blog
GF Simplifies RF-SOI and FD-SOI Design for 5G with New Partnership Program
GlobalFoundries' new ecosystem partner program, called RFwave™, aims to simplify RF design and help customers reduce time-to-market for a new era of wireless devices and networks (read the full press...
Blog
No Sweat! New Sensor Patch Helps Prevent Dehydration
Worried that you’re underhydrated after a heart-pounding run or bike ride? SEMI’s Nano-Bio Manufacturing Consortium (NBMC) has you covered – with a patch. A few years after the group undertook the...
Event Presentation
European 3D Summit 2018: Heterogeneous Integration – Driving Force and Enabling Technology for 3D-SiP
Bill Bottoms, Ph.D., Chairman at 3MTS discusses 3D integration, heterogeneous integration, CMOS scaling, growth in data generation and global network traffic, OSATs, and plasmonics. Six issues are...
Event Presentation
European 3D Summit 2018: Opportunities and Challenges in 3D Stacked Components
Bob Sankman, Fellow of Assembly Test Technology Development at Intel Corporation, gives a background on 3D packaging, TSV’s advantages, key technology elements required for 3D packaging (in...
Event Presentation
European 3D Summit 2018: Photonic Interconnects for High-Performance Computing and Data Center Applications
Ashkan Seyedi, Photonics Research Scientist at Hewlett Packard Labs, discusses memory-driven compute architecture, network topology, VCSEL photonics, silicon photonics interconnects, LSIP technical...
Event Presentation
European 3D Summit 2018: 3D SoCEnablement Through Hybrid Wafer Bonding – A Foundry Perspective
Luke England, 3D Package Development Manager and Tanya Atanasova, Technology Development Engineer at GlobalFoundries discuss 3D Wafer Bonding Applications, Hybrid Bond Process Flow Scenarios, and...
Event Presentation
SEMICON Korea 2017: The Future of Mobility
Klaus Meder, President of Bosch Corporation Japan, share sales figures from 2016 within mobility, industrial tech, energy/building tech, and consumer goods. Specifically a breakdown of total...