European 3D Summit 2018: Heterogeneous Integration – Driving Force and Enabling Technology for 3D-SiP

Bill Bottoms, Ph.D., Chairman at 3MTS discusses 3D integration, heterogeneous integration, CMOS scaling, growth in data generation and global network traffic, OSATs, and plasmonics. Six issues are driving data growth and innovation, namely cloud computing, social media, mobile devices, Internet of Things, Internet of Everything, and AI. Heterogeneous Integration refers to the integration of separately manufactured components into a higher level assembly (SiP) that, in the aggregate, provides enhanced functionality and improved operating characteristics. Many companies’ advancements are analyized. From the European 3D Summit in January 2018 in Dresden, Germany.

Keywords: CMOS, OSAT, Packaging, IoT, Big Data, Internet of Everything, AI, SiP, 3D-SiP, Fabrication, Forecast, Scaling, Cloud, Cloud Computing, Mobile, Characteristics