European 3D Summit 2018: Opportunities and Challenges in 3D Stacked Components

Bob Sankman, Fellow of Assembly Test Technology Development at Intel Corporation, gives a background on 3D packaging, TSV’s advantages, key technology elements required for 3D packaging (in processing, architecture, design, and testing), key business elements for 3D packaging (investment, fab assembly, yield, and pricing), and other challenges and considerations for 3D packaging related to mechanics and electrical. From the European 3D Summit in January 2018 in Grenoble, France.

Keywords: Packaging, 3D Packaging, TSV, Fabrication, Capacity, Investment, Assembly, Yield