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Virtual MSTC 2021 Bio - Julien Simon
As a Global AI & Machine Learning Evangelist, Julien focuses on helping developers and enterprises bring their ideas to life. Prior to joining AWS, Julien served for 10 years as CTO/VP...
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Virtual MSTC 2021 Bio - Dilek Isik Akcakaya, PHD
Dilek Isik Akcakaya is a process engineer at Rogue Valley Microdevices. She received a Ph.D. in Metallurgical Engineering from Ecole Polytechnique de Montreal in 2013. Between 2013-2016, she...
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Virtual MSTC 2021 Bio - Barry McDonogh
Barry McDonogh is General Manager at HinaLea Imaging where he is responsible for commercial development and strategy. Barry has extensive experience in product and market development...
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New Silicon Carbide Test Method Task Force Formed
New Silicon Carbide Test Method Task Force Formed
By Kevin Nguyen, SEMI
Threading screw dislocations (TSDs) are detrimental to the yield and the performance silicon carbide base devices. Thus,...
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BIM Ballot out for Voting
Building Information Modeling Document Out for Ballot
By Laura Nguyen, SEMI
Within the semiconductor industry, the diversity and complexity of manufacturing equipment creates difficult challenges...
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SEMICON Japan Standards Awards
SEMICON Japan Standards AwardsBy Hirofumi Kanno, SEMI JapanThe SEMI International Standards Program is operated in all major electronics manufacturing regions including Americas, Europe, Japan,...
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Equipment RAMP Standard Updated
Standard for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization Updated
By Michelle Sun, SEMI
SEMI E10, Specification for Definition and...
Member Company
Dell Technologies UDS
Dell EMC Unstructured Data Solutions (UDS) is the manufacturer of PowerScale/Isilon scale-out Network Attached Storage systems and ECS scale-out object storage systems that are used by many companies...
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New Japan Flexible Hybrid Electronics Technical Committee Chapter
New Japan Flexible Hybrid Electronics Technical Committee Chapter
By Mami Nakajo, SEMI Japan
On December 18, 2020, a new Japan TC Chapter of Flexible Hybrid Electronics (FHE) Global Technical...
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200 mm Silicon Carbide Wafer - An Update
200mm Silicon Carbide Wafer Specification and Marking - An Update
By Kevin Nguyen, SEMI
SEMI M55, Specification for Polished Monocrystalline Silicon Carbide Wafers, initially developed in 2004...
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New ATE Standard Passes the Test
New ATE Standard Passes the TestBy James Amano, SEMIAs with other segments of semiconductor manufacturing, semiconductor test is increasingly utilizing data for real-time analysis and real-time ATE...
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Emerging Standard Helps Address Cybersecurity
Emerging Standards Help Address Cybersecurity Maturity in the Supply Chain
By Ming-chang (Bright) Wu and Willis Towers Watson Taiwan
Fab equipment is not originally designed to serve the purposes...