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Innovation for a Transforming World 2021
Trustworthy AI: Reinventing the Core of Today Enterprise by a Human-centered AI Strategy
Seth Dobrin, PhD | Global Chief AI Officer | IBM
The biggest barrier companies face today to drive AI...
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Lauren Boteler, PhD
Dr. Lauren Boteler is currently the Technical Assistant to the Director of the U.S. Army Research Laboratory. Previous to this position, she led the thermal and packaging research programs as part of...
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Smart Manufacturing Workshop: Manuel Aybar
Manuel Aybar is an Industrial Engineering Manager at Qorvo Semiconductor Texas Operations. During his tenure at Qorvo, he has been involved in leading various industrial engineering projects,...
Member Company
MAX I.E.G. LLC
We are the leading experts on Operational Improvements, New Facility Design and Build, Management Consulting, and Information Technology Consulting. Our exposure to multi-national, multi-disciplined...
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ISS Speaker Bio - Ajit Manocha, SEMI
BIOGRAPHYAjit Manocha is the president and CEO of SEMI, the global industry association serving the semiconductor and electronics manufacturing and design supply chain. Throughout his career, Manocha...
Event
ESD Alliance Webinar: Savage on Security 2: Mar 27, 2025
The ESD Alliance, a SEMI Technology Community, is hosting a webinar series, "Savage on Security," moderated by Warren Savage, Researcher at University of Maryland, Applied Research Laboratory for...
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ISS 2025 Speaker Abstract & Bio - Greet Storms, ASML
AFFORDABLE EUV LITHOGRAPHY SUPPORTING LOGIC AND DRAM ROADMAPS INTO THE NEXT DECADEABSTRACTSemiconductor industry continues to pursue Moore`s law by printing all complex layers on a chip in the most...
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ITPC Speaker Bio - Ajit Manocha
BIOGRAPHYAjit Manocha is the president and CEO of SEMI, the global industry association serving the semiconductor and electronics manufacturing and design supply chain. Throughout his career, Manocha...
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MEMS & Sensors Technical Congress—MSTC 2024 Speaker Bio - Dr. Arne Quellmalz
Wafer-Level Integration of 2D Materials for Back-end of Line ApplicationsABSTRACTLayered materials with thicknesses on the atomic scale (2D materials) promise to revolutionize electronics and...
SEMI Press Release
Q3 2023 Global Semiconductor Equipment Billings Drop 11% Year-Over-Year, SEMI Reports
MILPITAS, Calif. – November 30, 2023 – Global semiconductor equipment billings contracted 11% year-over-year to US$25.6 billion in the third quarter of 2023, while quarter-over-quarter billings...
SEMI Press Release
Q2 2023 Global Semiconductor Equipment Billings Dips 2% Year-Over-Year, SEMI Reports
MILPITAS, Calif. – September 6, 2023 – Global semiconductor equipment billings dipped 2% year-over-year to US$25.8 billion in the second quarter of 2023, while quarter-over-quarter billings...
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Advanced Packaging Automation Seminar
Advanced Packaging Automation Seminar
By Natalie Shim, SEMI Korea
With the objective of facilitating the growth of Korea’s semiconductor back-end industry, SEMI Korea organized an exclusive...