Dr. Lauren Boteler is currently the Technical Assistant to the Director of the U.S. Army Research Laboratory. Previous to this position, she led the thermal and packaging research programs as part of the Advanced Power Electronics group at the U.S. Army Research Laboratory (ARL). She received her PhD degree in mechanical engineering from the University of Maryland. Her work at ARL, beginning in 2005, has included electronics packaging and thermal management solutions for a wide range of Army applications. Her research programs focus on design tool development and package integrated thermal solutions including 3D chip stacking, power electronics, laser diodes, double side cooling, and phase change materials. She initiated a research portfolio in Advanced Power Electronics Packaging and Thermal Management which defines the four main challenges of power electronics packaging: co-engineering/co-design, transient thermal mitigation, additive manufacturing, and high-voltage packaging. She is an adjunct professor at Johns Hopkins University and was awarded the 2018 ASME EPPD Woman Engineer of the Year award for her contributions to the electronics packaging community.