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Approaches to Further Enhance Cut AccuracyYield improvement is a critical concern in semiconductor manufacturing and cut accuracy during bevel wet etching has a considerable influence on both yield...

Crystallographic Orientation-Dependent on Native Oxide Evolution for Advanced CMOS Surface ControlThere is a great deal of engineering interest in Si(110) wafer as substrate by its current...

Impact of Supply Chain Conditions on IPA Product QualityThe IRDS roadmap outlines technology requirements for surface contamination control, specifying that isopropyl alcohol (IPA) used in...

Silicon-Germanium Etchants with Excellent Silicon and Silicon Oxide Compatibility for Advanced Semiconductor DevicesThis presentation highlights recent advances in formulated chemistries for...

Wet Cleaning Approaches to Remove Post-Etching AlOx Residues in Al/AlOx/Al StacksWet cleaning of Al and AlOx surfaces is essential for advanced surface preparation, particularly when ultrathin AlOx...

Ab Initio Study of Confined HF Etching Mechanism on SiO2Advancements in semiconductor manufacturing has relied heavily upon increasing the density of features in integrated circuits which...

High Loading Capacity Solvent Blend for a Safe and Efficient Alternative to NMP and Amine-Based Strippers Introduction:For photolithography processes, a wide variety of photoresists (PR) are...

BIOGRAPHY  Ashutosh is the co-founder and CEO of 14Si Solutions, offering expertise in contamination control in process liquids and gases for semiconductor...

Challenges and Solution of Post Ceria CMP CleanCeria particles are widely used in STI CMP processes because they provide higher TEOS removal rate. High TEOS removal rate is due to the Ce-O-Si bond...