Search

h2.name{ text-transform: inherit; } .bio{ padding: 130px 0 30px; margin-top: -100px; ...

BIOGRAPHYLee Short serves as the General Manager of the Service Technology Centers (STC) within Edwards’ Semiconductor Service Division, overseeing operations throughout the Americas. In this role,...

Impact of Wet Bevel Etching on WDC Films and Advanced Interconnect Structures As BEOL scaling continues, the introduction of new interconnect materials such as tungsten-doped carbon (WDC)...

Verifying PFAS Abatement in Fab-Relevant Waste Matrices Using Complementary Analytical Characterization TechniquesPer- and polyfluoroalkyl substances (PFAS) are integral components in...

WSDL: AI-Enabled Wafer Surface Defect Localization for Cleaning Process OptimizationIn advanced semiconductor manufacturing, wafer surface integrity is strongly influenced by cleaning efficiency,...

Selective Surface Modification Using Amine Chemistry for Enhanced Semiconductor Cleaning PerformanceHuntsman is one of the world’s largest producers of amine chemistry with over 20 years of...

ABSTRACTNew Surface Preparation System; Batch-Single Hybrid EquipmentTEL has developed the ZEXSTA(TM), a Batch-Single hybrid system that completes the Batch wet etching process and Single drying...

Eco-Conscious, High Etch Rate, and Metal/Non-Metal Compatibility Stripper for Advanced Packaging Photo Resist and SOGWe report the development of an eco-friendly stripper tailored for advanced...

Molecular Dynamics Simulation of Megasonic Cavitation in Ammonia Peroxide Solution and its Impact on Silicon SurfaceMegasonic cavitation is of importance in the semiconductor industry due to its...