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Member Company
Awesomenics
AWESOMENICS INC. is the TEST PIN and TEST SOCKET
manufacturer which offers a wide range of testing solutions
for mobile APs, CPUs, GPUs and automotive chip.
Creating the great products starts with...
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GSMC 2022 Speaker Bio - Bright Wu
BIOGRAPHY
Bright Wu works for Hon Hai Research Institute as cyber governance and cyber risk professional. He is one of founding members for Cybersecurity Committee (2021) and Fab & Equipment...
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MSTC 2022 Bio - Lauren Otto, PhD
BioMEMS for Cell Engineering—The Path to Enabling the Discovery, Development, and Manufacturing of Edited Cells for Affordable Therapeutics for All
BIOGRAPHY
Dr. Lauren Otto is Mekonos's Director...
Member Company
Tohoku-MicroTec Co., Ltd
T-Micro is the unique and advanced 3D/2.5D IC process and MEMS process-oriented company, originated in Tohoku university. As an exclusive techinical representative of GINTI "Global Integration...
Event Presentation
The Future Is Flexible – By Laser
Rainer Pätzel, Coherent Inc, discusses the role of lasers in advanced display technology.
SEMICON China 2019 - Shanghai, China
Presentation
Photomask Brief
A photomask, also called a reticle, is a transparent glass or quartz plate with an array of patterns or images. This document includes a technology overview and market summary of photomasks.
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SPCC 2026 Bio Koji Nakata
Improvement of Hybrid Bonding By Controlling Surface with Copper Pads Using Functional WaterABSTRACTThe strong demand for higher device integration density in advanced semiconductor manufacturing has...
SEMI Press Release
SEMICON Taiwan 2025 to Spearhead Opportunities for Global Semiconductor Collaboration and Innovation
Registration is Open, Industry Professionals Can Apply for Complimentary Passes Through August 31MILPITAS, Calif. – July 8, 2025 – SEMI today announced its 30th annual SEMICON Taiwan event...
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ASMC 2020 — Call for Abstracts
Back to ASMC 2020 Home Page
Call for Abstracts is now closed
SEMI and IEEE has closed this year's call for abstracts. Authors who missed the last deadline are invited to contact...
SEMI Press Release
SEMI 3D & Systems Summit to Advance Heterogeneous Systems Integration with Focus on AI, Hybrid Bonding, and Europe's Chiplet Ecosystem
DRESDEN, Germany — May 6, 2026 — Global experts in advanced semiconductor packaging and 3D integration will convene at the annual SEMI 3D & Systems Summit, June 17–19, 2026, in Dresden,...