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Member Company
OBSIDIA Semiconductors, Inc.
Semiconductor authentication and integrity verification for the elimination of counterfeit and tampered devices within the supply chain.
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Arizona Chapter Breakfast Forum Speaker Bio - Richard Simoncic
BIOGRAPHYRichard "Rich" Simoncic currently serves as the Chief Operating Officer of Microchip Technology, a leading provider of microcontroller, mixed-signal analog, and Flash-IP solutions. With a...
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Pacific Northwest Chapter Breakfast Forum 26 Speaker Bio - Tina Guldberg
BIOGRAPHYTina Guldberg joined the University of Oregon in September 2018 and serves as associate vice president for economic development and strategic relations. In this leadership role, she advances...
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Pacific Northwest Chapter Breakfast Forum 26 Speaker Bio - Robert Sanger
BIOGRAPHYRob Sanger joined the SEMI Foundation in January 2024 as Program Manager for Workforce & Training in California, where he leads efforts to strengthen the semiconductor and...
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Pacific Northwest Chapter Breakfast Forum 26 Speaker Bio - Kyle Ritchey-Noll
BIOGRAPHYKyle Ritchey-Noll is the director of education and workforce policy at the Oregon Business Council (OBC) and co-director of the FAST Workforce Committee. OBC, a business roundtable focused...
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Pacific Northwest Chapter Breakfast Forum 26 Speaker Bio - Christie Dudenhoefer
BIOGRAPHYChristie Dudenhoefer is the Executive Director of Semiconductor Economic Development and the Corvallis Microfluidics (CorMic) Tech Hub Regional Innovation Officer at Oregon State...
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SEMI Texas Spring Breakfast Forum Speaker Bio - Da Yang
BIOGRAPHY Dr. Da Yang is Senior Director of Product at NVIDIA, where he leads the AI product development for Semiconductor and EDA applications. Before joining NVIDIA, Da was Vice President of...
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SPCC 2026 Bio Joe Stockunas
BIOGRAPHY As President of SEMI Americas, Joe Stockunas leads efforts to increase the value SEMI Americas delivers to members, directs North America sales and services, and drives events and...
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SPCC 2026 Bio Ji Chul Yang, PhD
Advanced Topography Correction Planarization Technology for Yield EnhancementABSTRACTThe evolution of advanced semiconductor processes, such as Backside Power Delivery Networks (BSPDN) and wafer...
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SPCC 2026 Bio Mona Moukrati
Controlled Cracking-Induced Delamination for Polymer-Based CleaningABSTRACTThe continuous miniaturization of microelectronic devices imposes increasingly strin gent requirements on surface...
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SPCC 2026 Bio Koji Nakata
Improvement of Hybrid Bonding By Controlling Surface with Copper Pads Using Functional WaterABSTRACTThe strong demand for higher device integration density in advanced semiconductor manufacturing has...