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In the span of a few short months earlier this year, Mentor Graphics became Siemens EDA and introduced a suite of integrated hardware-assisted verification tools, the first product launch under the new Siemens EDA brand. Jean-Marie Brunet, senior director of marketing, product management and product engineering at Siemens EDA, orchestrated the launch and connected with me for a discussion about the chip design verification space. As he pointed out, verification and validation of systems is a fast-growing and important market segment to the electronic system design ecosystem. Smith: What trends do you see in chip design? What is driving these trends? Brunet: Chip verification costs continue to grow faster than design costs because of factors such as increasing design complexity, rising computing power, surging I/O traffic activity, increasing energy consumption and the widespread use of peripherals. These dynamics are being driven by new data center networking, communications/5G, autonomous driving, artificial intelligence (AI) and machine learning (ML), and storage applications. These trends also indicate the need for more powerful verification tools and expanded verification objectives that include power and performance analysis. Hardware-assisted verification tools are perfect for meeting these demands. Smith: Chip design verification consumes the most time in a project cycle. Why is this so? Brunet: The verification of designs reaching multi-billion gates and supported by voluminous software stacks is fraught with challenges. To exhaustively check every possible state in a billion-gate design with simulation alone would require up to trillions of verification cycles. That’s why hardware-assisted verification is one of the fastest-growing technologies in EDA. Given the complexity of today’s SoC design, it’s no surprise that verification is the largest undertaking in the entire project design cycle, consuming more than 50% of it. It also has the greatest impact on quality, cost and schedule because it prevents designs from failing at first silicon. While a respin of a large design taped out at a node below 10 nanometers could cost more than $10 million, delaying delivery of a new product for a few months in a highly competitive market may cost hundreds of millions of dollars. Smith: What other challenges do engineers face trying to verify a chip design will work as intended? Brunet: Verifying an SoC design is a massive undertaking and, in parallel, verification teams are trying to streamline and optimize verification cycles. SoC design groups are tasked with completing full system-level verification prior to creating production masks by thoroughly vetting all hardware blocks, interactions between those blocks, and the software developed for the end application before the chip is built. To alleviate this enormous pressure, they are starting to adopt a shift-left methodology for early functional verification as soon as individual blocks of a SoC design become available. It helps jump-start embedded software validation before full system validation is completed to save time and allow engineers to work in parallel, not serially. While it is an effective approach, it creates the need for a complete and integrated suite of hardware-assisted verification tools to verify and validate a design’s hardware and software components. Smith: How do you define hardware-assisted verification and how does it help solve these challenges? Brunet: A typical definition of hardware-assisted verification is special purpose hardware to accelerate verification. In other words, hardware emulation and FPGA prototyping. Hardware-assisted verification is a mandatory investment as single-die or multi-die chips get larger with more complexity and more interfaces, making hardware and software code integration critical early in the design cycle. Because software performance defines a chip’s success, the need to perform software workload-based analysis is acute, not just analysis of chip functionality, but also accurate performance and power consumption in the context of real-world applications. Hardware-assisted verification is the only option when hardware and software meet. By combining emulation, desktop FPGA prototyping boards and enterprise FPGA prototyping platforms to work on the same SoC design, a verification group can assemble a complete hardware-assisted verification system for thorough and exhaustive verification and validation. Smith: Where are the big opportunities for hardware-assisted verification? Brunet: New end-user applications are coming from computing and storage, AI/ML, 5G, networking and automotive. Recently released market data from the ESD Alliance shows that in 2020, hardware-assisted verification revenues exceeded $700 million. It is reasonable to assume that revenues of $1 billion will be within reach in the next few years given the amount of chip design activity at advanced nodes below 10nm. Smith: With the design/verification and manufacturing phases of the semiconductor supply chain more closely aligning, what role does hardware-assisted verification play? Brunet: Semiconductor manufacturing and the supply chain that supports it benefits greatly from the continued innovation in verification and validation tools and methodologies. With this innovation, designs are delivered to the manufacturing flow with a much greater chance of passing first silicon with success. This reduces friction in the semiconductor supply chain since IP and chips are available when anticipated. Hardware-assisted verification is a quick-moving, highly leveraged resource that helps a design and verification team to ensure chips are manufacturable and meet the functionality, power and performance requirements for the end-product application. Jean-Marie Brunet is the senior director of product management and engineering for the Scalable Verification Solutions Division at Siemens EDA. He has served for over 20 years in application engineering, marketing, and management roles in the EDA industry, and has held IC design and design management positions at STMicroelectronics, Cadence, and Micron, among other companies. Jean-Marie holds a Master's degree in Electrical Engineering from I.S.E.N Electronic Engineering School in Lille, France. Jean-Marie Brunet can be reached at [email protected]. About Bob Smith Robert (Bob) Smith is executive director of the ESD Alliance, a SEMI Technology Community. He is responsible for the management and operations of the ESD Alliance, an international association of companies providing goods and services throughout the semiconductor design ecosystem.
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Air pollution is a serious public health issue worldwide with airborne hazardous substances such as volatile organic compounds (VOCs), particle matter (PM), and nitrogen dioxide linked to a wide range of adverse health conditions. According to the World Health Organization (WHO), “the combined effects of ambient (outdoor) and household air pollution cause about seven million premature deaths every year, largely as a result of increased mortality from stroke, heart disease, chronic obstructive pulmonary disease, lung cancer and acute respiratory infections.” There’s also an economic impact of air pollution. Related illnesses and loss of life cost billions of dollars in healthcare services globally. And while we might think that air pollutants are only present outdoors, we’re more exposed to them – and they’re more potentially dangerous – indoors, where higher concentrations of volatile organic compounds (VOCs) produced by paint and furniture are a major concern. The COVID-19 pandemic has only heightened our awareness of the air we breathe. With recent medical research showing that viruses may be transmitted by attaching themselves to airborne particles, indoor air quality (IAQ) monitoring is becoming even more important. As we turn to VOC sensors for IAQ monitoring, it’s important to note that not all VOC sensors are equal. The current crop of low-cost VOC sensors are primarily total VOC sensors. Generally based on electrochemical or metal-oxide transducers, total VOC sensors provide a “grayscale” image of IAQ, which doesn’t differentiate among different gases. This limits people’s ability to make informed decisions regarding the level of threat to their health, since not all VOCs are equally hazardous and don’t require detection at the same concentrations. In addition, total VOC sensor technologies don’t support PM detection. This forces end-device designers to either add a module of optical sensors or switch to a completely different system. While optical sensors provide excellent performance, particularly for PM detection, they’re much more expensive, as well as more complex, bulky and power-hungry. This makes them ill-suited to resource-constrained portable devices where cost, size and power are at a premium. FBAR-based IAQ sensors emerge The shortcomings of available technologies for IAQ sensors has boosted the development of alternative solutions that provide better performance – in terms of both sensitivity and selectivity – as well as greater versatility, lower cost and smaller size. Acoustic sensor technologies featuring the latest advancements in film bulk acoustic resonator (FBAR) sensors are emerging as a leading candidate. Sensitivity is important in VOC detection because certain hazardous compounds, such as formaldehyde, are dangerous at very low concentrations. As highly sensitive devices, FBARs are a MEMS equivalent of a weight scale, but instead of detecting kilograms or grams, they can sense femtograms, which are just one-quadrillionth of a gram each. FBARS work by putting a thin film piezoelectric material into a mechanical resonance through application of an AC electric signal (GHz range) to a pair of electrodes on either side of the film. This resonant frequency is sensitive to the mass attached to the electrode surface. Whenever the mass attaches to the active area of the sensor, it produces a frequency shift, and this shift is proportional to the mass attached on the surface. Another major benefit of this approach is selectivity, which allows a device to distinguish between different target molecules or species. By placing a layer of material on the sensor –which is the functionalization layer – FBAR sensors display high selectivity on targeted materials. This allows the consumer to distinguish among different VOCs instead of just measuring a mixture of VOCs that vary in toxicity. Unlike older IAQ sensing technologies, FBAR sensors support functionalization layers comprised of different materials, from metal oxides and polymers to more exotic options such as carbon nanotubes and graphene. This increased versality makes it easier to use FBARs for a variety of applications, ranging from gas sensors to medical sensors. Sorex Sensors’ FBAR sensor in a 3mm x 3mm ceramic package FBAR technology is a perfect match for IAQ. In addition to high sensitivity and selectivity, it enables the manufacture of very small arrays, and it’s low-power, all of which make it a good choice for small portable devices. Plus FBAR technology is CMOS-compatible, so FBAR sensors can be made using standard MEMS processes and combined with integrated circuits fabricated using standard CMOS processes, making them cost-effective. With its origins at the University of Cambridge in the UK, Sorex Sensors is leading the commercialization of FBAR devices for sensing applications. After releasing our first product in 2019 – a standalone FBAR sensor and a development kit that can be used for particle monitoring – we’re preparing to release an FBAR sensor array that detects five different gases later this year. By offering specific functionalization layers for different targets, our new FBAR technology will provide a level of selectivity that other silicon-based sensors can’t achieve – particularly in light of FBAR’s low power consumption and very small size (less than 5mm x 5mm). In addition, the sensor’s targeted gases will include one of the main headaches in the IAQ space, formaldehyde, which is especially carcinogenic and is widely found in the varnishes used in furniture. We’re planning for this new iteration of our FBAR technology to help our customers sense in color rather than in grayscale – providing a level of granularity that’s unmatched in IAQ sensing. Check out the latest news about Sorex Sensors on our website and on LinkedIn. About the Author Mario de Miguel Ramos, Ph.D., is the co-founder and CEO of Sorex Sensors Ltd, a spin-out of the University of Cambridge, the University of Warwick, and the Universidad Politecnica de Madrid (UPM). Founded in 2017, the company focuses on the development of highly sensitive mass sensors based on film bulk acoustic resonators (FBARs). Dr de Miguel Ramos has been working in the field of FBARs for a decade. Prior to founding Sorex Sensors, he worked as a postdoctoral research associate at the Electronic Devices and Materials (EDM) Group at the University of Cambridge. He holds a master’s in Telecommunications Engineering and a Ph.D. in Electronic Engineering Systems, both from UPM. Sorex Sensors is a member of MEMS Sensors Industry Group®(MSIG), a SEMI technology community that connects the MEMS and sensors supply network in established and emerging markets to enable members to grow and prosper. Visit us today.
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The adage “the only thing constant is change” has never been more universally applicable than this past year – across the globe, across industries, across buyers. All manner of ways in which we work and consume has changed and continues to change, driving innovation, disrupting industries, and transforming buyers’ behavior. To survive, companies must follow the old adage: to remain a constant, they must change. Overnight, we shifted to work-from-home, and, after a few days to adjust and align, we discovered surprising benefits. By working remotely, we gained time by losing our commute, and we increased exponentially the number of meetings we could hold – and the number of people we could meet with – in a typical business day. Executives, customers, and decision makers were suddenly more accessible, and we could share a ‘face-to-face’ call in far more intimate settings, allowing us to meet family and pets, which in turn deepened relationships. Beyond productivity and a healthier work-life balance, remote work obliterated any constraints of geography, enabling companies to consider employees across the country and globe, thereby expanding talent pools, creating retention opportunities, and bolstering diversity efforts. Now, despite the easing of restrictions, published studies and employee surveys (even our own annual Tell Dell survey) show that many employees want and expect to continue to work remotely at least part-time. No surprise there, but it is important to note: These changes in preference and expectation are not limited to how we work; They apply to every aspect of our lives. In 2020, with never-before-seen speed, we adopted distance learning, telehealth, online entertainment, 3D printing of PPE, online grocery/restaurant orders, and digitally-enabled deliveries and curbside pickup – and we aren’t going back. Just like employees now prefer the flexibility of work-from-home, buyers now prefer – and expect – the flexibility of shop-from-home. While these changes were in progress well before 2020, the pandemic accelerated and normalized adoption, and now buyers approach business decisions with the same preferences, expectations, and behaviors of consumers. In fact, according to Gartner, by 2025, 80% of B2B sales interactions between suppliers and buyers will occur in digital channels.[1] Buyers have already embraced online research and digital buying. They expect authentic, personal experiences and relationship-driven online interactions. Like the consumers they are at home, B2B buyers are researching online well before they engage with a person. To survive, companies must meet customers where they are and how they want to buy: online. For marketing and sales, the handoffs have changed. In marketing, our messaging and content is touching decision makers and potential customers far before they meet with a sales rep. Enabled by artificial intelligence (AI) and enhanced analytics, sales teams will need to follow the data, and be ready to respond to buyers’ needs at the exact time they realize the need. At Dell Technologies, we have not only embraced this digital transformation change, but we are also leveraging marketing automation technology to help our partners learn and activate digital marketing and selling. We are training our sales and marketing teams while also providing enablement, training and support to enable our partners to navigate the new buyer’s experience. Our teams are organized to move quickly and lead through change so, together with our partners, we can address the ever-changing needs of our customers. Are you and your team ready for this change? Do you have the digital skills needed to adapt? Are your organizations agile and open to new ways of working? Do you have the right leaders in place to lead through change? Your buyers are in the driver’s seat: They determine if, when, and how they interact with suppliers. Are you in the right place at the right time to meet your customer if, when and how they want? To remain a constant – to remain in business – you need to embrace the change in your buyer and embrace the technology available to meet your buyers where they are – online. Join me July 13 at my session Digital Leadership – Embracing the Buyer Evolution at the SEMI Innovation for a Transforming World virtual event to learn more. Senior Vice President at Dell Technologies, Cheryl Cook spearheads development and strategy for the Global Partner Marketing organization. Beyond her main global responsibilities for branding, partner program marketing, channel events, partner communications, and MDF/BDF program investments and execution, Cheryl drives long-term partner marketing strategy, together with Dell’s Global Alliances, OEM, and global and regional business teams. A vocal advocate for the partner community, Cheryl is a 20+ year partner veteran, known as an innovative, collaborative leader who creates compelling business solutions that accelerate partners’ success. [1] Gartner Press Release, Gartner Says 80% of B2B Sales Interactions Between Suppliers and Buyers Will Occur in Digital Channels by 2025, September 15 2020.
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Taking aim at advancing smart medtech innovation, the SEMI Nano-Bio Materials Consortium (NBMC), in collaboration with the U.S. Air Force Research Laboratory (AFRL), in March 2020 identified 12 organizations from industry and academia as recipients of $20.4 million in funding, leveraging $10.7 million of cost-share from award recipients. Unique to this round – the sixth in NBMC’s eight years – is a pilot program for NBMC and AFRL to collaborate more closely and share more resources. As part of that effort, AFRL is contributing additional funding to seven of the 12 projects to enable its researchers to work alongside industry on the projects in the new AFRL-Industry Co-Development Program. After being matched to a project during pre-RFP discussions – also known as the White Paper Stage – AFRL researchers were designated as NBMC Consortium Project Investigators before collaborating with industry on the second stage of proposal development. Once contract negotiations between NBMC and the proposing entity wrap up, the AFRL investigators will participate in the development of smart medtech innovations. “This is a new way for AFRL researchers to participate as project performers responsible for contributing to project milestones and deliverables, in addition to providing program management oversight that AFRL has employed for past NBMC projects,” said Dr. Jeremy Ward, past NBMC government lead and current participant in the AFRL Entrepreneurial Opportunity Program. “This program should enable technical risk-reduction for industry by leveraging AFRL competencies and U.S. Air Force aeromedical and airmen performance mission connectedness and ultimately help speed the development of dual-use smart medtech,” added Matt Dalton, AFRL Materials and Manufacturing Directorate program manager and NBMC Governing Council member. “We need efficient mechanisms to leverage research being done outside of AFRL,” said Sharma, who is also senior technical lead for Cognitive Neuroscience at AFRL's 711th Human Performance Wing. “If someone is developing a groundbreaking technology that can be helpful for our airmen, then let’s work with them so that we have an opportunity at an early stage to actively shape that research for Air Force-relevant use cases. Similarly, with this co-development initiative, external researchers will also get an opportunity to work alongside world-class researchers at AFRL and, through those interactions, get insights into the needs of the operational community.” “The AFRL-Industry Co-Development Program strengthens the work between AFRL and industry to better target the strategic needs of the Air Force for dual-use technologies while more closely aligning with commercial market requirements,” said Dr. Melissa Grupen-Shemansky, SEMI CTO and Executive Director of NBMC. “This new collaboration will enable the growth of the ecosystem critical to bringing the latest smart medtech innovations to market while making the technology’s supply chain more sustainable and resilient.” SEMI NBMC connects military, industry and academia for research and development into the practical use of nano-biomaterials. The 2020 RFP targeted nano-bio materials for wearables, flexible and alternative power sources for wearables, and open concepts for wearables for diagnostics and ambulatory monitoring. These technologies address the critical need to monitor, evaluate and mitigate stress experienced by workers in high-pressure occupations – such as aviation, emergency, critical care and aeromedical evacuation – to enhance their warfighter performance and help ensure their well-being. For more information on SEMI NBMC, our R D funding projects, and how you can help shape the direction of our funding programs, visit our website or contact me at [email protected]. Learn more about our projects at the 2021 Global Smart MedTech Symposium July 28-29 and August 4-5, 2021. For more information about the NBMC-AFRL collaboration, see the 2020 Smart MedTech Virtual Workshop agenda. This article borrows from a U.S. Air Force press release on May 27, 2021. Rene Krantz is program manager for SEMI NBMC Smart MedTech.
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When COVID-19 hit the semiconductor industry, SEMI members were confronted with new hurdles to keeping their employees safe and their operations running uninterrupted. We quickly assisted our global membership around the globe by providing a forum for collecting member insights on best practices for operating and safety procedures, supply chain issues and sentiments on business impact and recovery. That forum took the form of surveys we launched in March 2020. We shared the results with the larger SEMI member community to help them cope with the evolving impacts of the pandemic on their businesses. Following is a summary of our 4th survey, issued last month. Regional and Sector Representation Nearly 40% of our respondents represented companies headquartered in North America. Of the respondents, 10% each were from companies headquartered in Taiwan and China; 5% from Korea, 13% from Japan and 20% from European and Middle Eastern members. The largest share of respondents – 40% – develop equipment for semiconductor fabrication, assembly, and test; 21% supply materials to the microelectronics industry; 14% are device makers; 6% supply software and design services; and 3% are OSATs, EMS suppliers or ODMs. Measures Member Are Taking to Continue Operations The May survey found that almost no companies ceased production for any significant length of time. In order to continue operations, companies instituted social distancing and masking requirements, temperature checks, schedule changes, and some contact tracing, all to varying degrees, as shown in Figure 1. In addition, several companies implemented some combination of mandatory testing, bump sensors, air purification and site capacity limits and sequestered foreign workers in separate housing for required quarantines after travelling. Figure 1 All of these measures are routinely discussed during the regular SEMI EHSS COVID-19 Working Group calls. That group consists of facilities, HR managers and others tasked with ensuring safety monitoring and compliance at member companies. Company Vaccination Policies With the pace of vaccine rollouts varying widely around the world, only 5% of respondents are requiring all workers to be vaccinated before returning to the office, and 12% have not yet considered a vaccine policy. The majority of companies are encouraging but not requiring employee vaccinations, and 26% leave the decision to the individual employees. Figure 2 North American companies constituted the majority of the required and encouraged vaccination categories. In Europe, companies fall into the employee decision or encouraged categories but none require vaccinations. Japanese companies primarily leave the vaccination decision to employees, while Chinese companies are split among the required, encouraged and employee decision categories. Clearly, these guidelines are not required by law in each region, but instead fall to employers and local policymakers. Member Readiness for Digital Transformation A solid majority of members reported they have invested in the adoption of digital transformation technologies and practices, though only about 14% expect to continue their digital investments in the coming year. Many respondents have deployed virtual meeting software and have implemented or plan to put in place virtual reality tools for remote diagnostics and predictive modeling for semiconductor manufacturing. Figure 3 Location by Functional Group in Returning Employees to Sites Not surprisingly, manufacturing and distribution staff that could work from home during the pandemic are back on site, and respondents signaled that R D and engineering groups will soon end their remote work, following by finance and procurement. Sales and marketing show the highest percentage of staff working remotely, with sales having the highest number remaining remote for some time to come. Figure 4 Resilience to Further Economic Uncertainty Of the 274 companies responding, 229, or 84%, feel more resilient in the face of further economic uncertainty after their response to COVID-19, though continuing supply chain issues and raw materials shortages ranked among their top concerns, as did rising customer demands, their ability to increase capacity utilization rates, and the increasing demands on employees and facilities overall. Figure 5 Many thanks to all survey respondents over the past year! We’ll keep you up to date on results of future surveys. For more details on the SEMI EHSS COVID-19 Working Group calls, visit the SEMI COVID Response Site. To watch the recording of our most recent CEO Webinar – Surging Chip Demand, Digital Transformation, and the Pandemic – What’s Next? – click here. More than 750 people attended the June 2nd webinar sponsored by SEMI members Brooks Automation, Hitachi, JCET, KLA and TEL. Heidi Hoffman is senior director of Technology Communities marketing at SEMI.
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