Serena Brischetto

SEMI spoke with Kate Wilson, president of the semiconductor division at Edwards Vacuum, about how her personal dedication to sustainability and Edwards Vacuum’s commitment to green practices such as contributing to the semiconductor manufacturing industry’s reduction of carbon emissions.

Antoine Amade, VP of sales for the Microcontamination Control division at Entegris, discusses innovation opportunities for semiconductor technologies entering the automotive domain, views on design and process engineering, and collaboration between the semiconductor and automotive industries.

Atomic Layer Deposition (ALD) players are poised to seize a new growth opportunity after the chip shortage pushed manufacturers to announce fab capacity expansions worldwide. Driven by the wafer production volume increase, ALD solutions are now expected to grow and enter the MtM devices market.

The Pact for Skills aims to support upskilling and reskilling and generate European, national and regional funding to attract new talent. Launched by commissioners Breton and Schmit, the Pact makes it a priority to create a well-skilled workforce in microelectronics R&D, design, and manufacturing.

Jens Fabrowsky, executive VP of Automotive Electronics at Robert Bosch GmbH, spoke about changes in the European electronics industry necessary for the region to become more resilient, sharing his views during the panel discussion at SEMI ISS Europe on May 30 2022 in Brussels, Belgium.

Guido D’hert, High Tech and Semiconductor Industry Europe Lead at Accenture, spoke about challenges semiconductor companies face in meeting sustainability goals and how to apply analytics, new green technologies and circular design, sharing during his presentation at ISS Europe in Brussels, Belgium.

Luc Van den hove, president and CEO at imec, spoke on semiconductor sustainability, healthcare trends and deep tech, and their implications for the semiconductor industry, sharing his views ahead of his keynote presentation at SEMI ISS Europe on May 30, 2022, in Brussels, Belgium.

As monolithic scaling slows down, the semiconductor industry is increasingly relying on advanced packaging technologies to extend Moore’s law through heterogeneous integration. Higher on-package bandwidth, improved yield resiliency and the need to integrate diverse IP from multiple foundries are driving demand for advanced packaging technologies that address these issues but introduce challenges of their own such as efficient power delivery to all the different domains in a heterogeneous system. SEMI spoke with Kaladhar Radhakrishnan, Intel Fellow at Intel, about heterogeneous system integration trends and new developments in the semiconductor industry. Radhakrishnan shared his views ahead of his keynote at the SEMI Connecting Heterogeneous Systems Summit, 1-3 September 2021, an online event. Join the summit to meet experts from Intel and other key industry influencers. Registration is open. SEMI: What is driving the adoption of electronics and semiconductor devices nowadays and why is the development of new and innovative technologies important? Radhakrishnan: We are living in an increasingly data-driven world where devices have become an integral part of our lives. A recent study estimated that in the United States alone, 13.6 connected devices per capita consume an average of 300 gigabytes worth of data every month. In the workplace, COVID-19 has driven fundamental business changes that has sped up the adoption of digital technologies such as virtual conferencing, remote work, and e-commerce. Organizations are realizing that a high-quality video conference can be an adequate substitute for many in-person meetings. As a result, businesses are accelerating the digital transformation in order to adapt and thrive in this new environment. Five decades of sustained exponential growth in semiconductor performance has conditioned the average digital consumer to expect more from their devices. However, there are some headwinds ahead as traditional scaling slows down and power density rises. Because consumers and businesses are now generating data at a faster rate than they can consume it, technologists need to scale compute, storage, and bandwidth even faster to keep pace. Without investments in research and development of new and innovative technologies to address these challenges, the full potential of this data will go unrealized. SEMI: What forces are heightening the importance of heterogeneous system integration? What are the implications for increased on-package bandwidth, improved yield resiliency and the need to integrate diverse IP from multiple foundries? Radhakrishnan: The semiconductor industry increased transistor density and scaled performance through classical Dennard scaling until the turn of the century. By then, the gate oxide thickness had scaled down to atomic dimensions and the exponential increase in sub-threshold leakage signaled the end of scaling through traditional methods. Since that time, the chip industry has been relying on innovations in transistor materials and structures such as high-k metal gate, strained silicon, and FinFETs to keep pace with Moore’s law. However, this alone will not be sufficient to continue scaling and the industry needs to explore other vectors to augment improvements in transistor technology. Heterogeneous integration through advanced packaging is one key technology that can help drive these gains. Technologies like Foveros can enable device density scaling by creating a 3D stack of multiple die using high-density interconnects. Heterogeneous integration enables chipmakers to move from a monolithic system designed on a single large chip to a heterogeneous system comprised of a number of smaller chiplets. The main benefit of using smaller chiplets is that they improve yield and enable application based customization of the foundry processes. However, if the disaggregation to smaller chiplets is not accompanied by an increase in on-package bandwidth, the power and performance penalties associated with chiplet-to-chiplet communication will hobble system performance. This is why advanced packaging technologies that improve die-to-die communication are key enablers for heterogeneous integration. SEMI: What are some of the key technology challenges in developing heterogeneous systems? Radhakrishnan: The obvious challenge that most people focus on is the need for improved on-package bandwidth. However, as we rely on 3D stacking to continue device scaling at the package level, it is important to comprehend power delivery and thermal challenges as well. Power to the top die has to be delivered through TSVs on the bottom die, which not only adds resistance but also reduces the useful area available on the bottom die. This problem is further exacerbated when we stack more than two die. Excessive noise on the power delivery network can cause timing issues that limit the maximum operating frequency of the transistor. Similarly, when we stack multiple die, we must take into account associated thermal challenges. For example, each interface of the multi-die stack adds thermal resistance, which makes it harder to cool the chips at the bottom. SEMI: What are some of the key global market trends that driving demand for heterogeneous and system-level integration? Radhakrishnan: The number of artificial intelligence (AI) and machine learning applications have grown dramatically due to their ability to solve highly complex problems across a wide range of segments. AI and machine learning models require more memory bandwidth and compute capabilities that are difficult to achieve without some form of heterogeneous integration. Another market trend driving demand for heterogeneous integration is the increasing reliance on custom hardware accelerators. To combat the slowdown in frequency scaling and single-core performance, we have moved to multi-core architectures by tackling the inherent parallelism in our workloads. However, Amdahl’s law tells us that such an approach will hit a bottleneck when we reach the limits of the serial portion of the workload. As these constraints slow the performance of general-purpose processors, the reliance on custom hardware accelerators to boost performance for specific workloads is growing. Heterogeneous integration at the system level with a combination of CPUs, GPUs, FPGAs and other accelerators can optimize system power and performance. SEMI: What solutions is Intel developing to address these market needs? Radhakrishnan: Intel is actively involved in the development of the industry ecosystem for heterogeneous integration. We have developed a number of innovative advanced packaging solutions such as the EMIB and Foveros that are used in products today. Intel is also developing the next generation of advanced packaging technologies, Foveros Omni and Foveros Direct, which will dramatically scale the IO density by using direct Cu-Cu bonding technology. Foveros Omni is a crucial building block technology to enable high-voltage power conversion on the package for efficient power delivery. Intel is uniquely positioned to predict the design needs for future systems and deploy its resources to develop the technology building blocks needed to continue performance scaling. Our IDM 2.0 strategy enables us to leverage our leadership in packaging technologies to design the best products and use the best IP to deliver leading products across a broad range of categories. SEMI: What do you expect from your participation at SEMI Connecting Heterogeneous Systems Summit? Radhakrishnan: I’m hoping to shed some light on some of the new technologies we have been developing at Intel to enable heterogeneous system integration. I also want to bring awareness to the power-related challenges we are facing with heterogeneous systems. I also look forward to listening to what other industry leaders have to say on the topic. Kaladhar Radhakrishnan is an Intel Fellow and a Power Delivery Architect with the Technology Development group at Intel. He plays a significant role in shaping and driving power delivery technologies for Intel microprocessors. His areas of expertise include integrated voltage regulators, advanced packaging and passives technologies. Kaladhar is a two-time recipient of the Intel Achievement Award, the highest Intel honor an individual or small team can receive. He has authored four book chapters, over 40 technical papers in peer-reviewed journals, and has been awarded 35 U.S. patents. He has also served as an adjunct professor at Arizona State University. Kaladhar joined Intel in 2000 soon after receiving his Ph.D. in Electrical Engineering from the University of Illinois at Urbana-Champaign. Serena Brischetto is senior manager of marketing and communications at SEMI Europe.

MEMS actuators transform electronic signals into something that can be sensed or touched by the end user of an electronics device. A case in point: MEMS actuators such as print heads in inkjet printers transform electronic files into text or beautiful images. In 3D printers, actuators can produce real objects. Inside smart glasses, tiny MEMS mirrors can create virtual objects. Little surprise, then, that integrating these powerful devices into the end products is a multidisciplinary enterprise. STMicroelectronics has been successfully leading the deployment of dedicated MEMS actuator solutions with customer products in various market segments. SEMI spoke with Anton Hofmeister, group vice president and general manager of the MEMS Actuator Division at STMicroelectronics, about MEMS actuator trends. Hofmeister shared his views at the SEMI MEMS Imaging Sensors Forum as part of the virtual SEMI Technology Unites Global Summit. Watch the STMicroelectronics’ presentation on-demand until March 26, 2021. Registration is open. SEMI: What is the difference between MEMS devices that sense and MEMS devices that actuate? Hofmeister: MEMS sensors gather data from the world around us including motion, pressure and air temperature and transform them into an electrical signal. Actuators work the other way round. They receive an electrical signal and transform it into some well-controlled actuation such as ejecting a fluid, moving a membrane or deflecting a laser beam. SEMI: How can MEMS actuators’ integration be simplified to be embedded in new applications so they appeal to consumers? Hofmeister: The challenge of integrating MEMS sensors into devices has been simplified by demo kits and evaluation boards, which customers use to embed the sensor into a system. MEMS actuators are more difficult to integrate. They often power the core function of a system and therefore require deep system understanding. Reference designs are a big step forward in simplifying integration. My presentation at the SEMI MEMS Imaging Sensors Forum showcased some examples. MEMS micro-mirror projection for augmented reality (AR) glasses is an example of a complex system that requires multiple types of components to function. Together with several partners, STMicroelectronics recently announced the LaSAR Alliance, which will develop reference designs to enable the AR glasses market. SEMI: MEMS sensors and actuators are considered the backbone of many consumer products. Are MEMS actuators also mostly used in automotive? Hofmeister: The widest use of MEMS actuators has so far been in print heads for inkjet printers. In recent years, we have seen actuators adopted in emerging applications ranging from piezo heads for 3D printers to MEMS mirrors for laser beam scanning systems or 3D sensing solutions for consumer applications. The first high-volume application in automotive will likely be MEMS mirrors for LIDAR systems. SEMI: What market growth trends do you see for MEMS sensors and actuators? Hofmeister: The sensorization trend, which aims to collect data from homes, cities, factories, cars and personal devices, continues to drive the adoption of sensors and actuators for a wide variety of applications. While the last wave of MEMS growth was triggered by one end product – the smartphone – the next wave will be driven by multiple applications and use cases in industrial, medical, automotive and personal electronics. SEMI: How can technology unite us? Hofmeister: In recent months, we have all experienced vividly how vital technology has become. MEMS, and semiconductors in general, are an integral part of many products and services that make our lives easier. Communications technologies have been particularly important during this pandemic, whether using the personal devices as our interface to the digital world or the complex infrastructure that they operate through. I hope that my participation at the summit helped increase awareness of the new possibilities and opportunities that technologies like MEMS actuators have to offer to create products and services that further improve people’s lives. Anton Hofmeister is group vice president at STMicroelectronics, general manager of the company’s MEMS Actuator Division and managing director of its German subsidiaries. Hofmeister has been with STMicroelectronics for more than 30 years, working in Germany, France, the U.S. and Italy. He has held managerial positions in key account management, product and strategic marketing, advanced R D and general management. For the past 10 years, he has managed various product divisions in the MEMS sector. Hofmeister has also served as a board member of the Singapore-based molecular diagnostics company Veredus Laboratories. Serena Brischetto is senior manager of Marketing and Digital Engagement at SEMI Europe.

With each transition to a new technology node, fab requirements for metal and particle contamination become more stringent, posing challenges for existing coating methods such as anodization or plasma spray that may not provide complete protection against contamination especially on critical chamber components with complex geometry. SEMI spoke with Beneq business executive Sami Sneck about common metal and particle contamination issues with critical chamber components, coating methods to protect against corrosion, and properties to look for when selecting the optimal protective coating solution. Sneck discussed the unique benefits of atomic layer deposition (ALD)anti-corrosion coatings with Aluminiumoxide (Al2O3) and Yttrium Oxide (Y2O3) and offered recommendations on how to work with original equipment manufacturer (OEM) partners to design, test and implement an ALD coating solution for semiconductor equipment. To learn more, visit Beneq at its digital booth at SEMI Technology Unites Global Summit, available on-demand until March 26, 2021. Registration is open. SEMI: How does ALD compare with other coating methods such as anodization and plasma spray? Sneck: ALD enables conformal dense and pinhole-free coatings on complex shapes. We can deposit various ALD coating materials on parts made of various materials. All other coating techniques have limitations. For instance, anodization is conformal, but porous and is suitable for Al2O3 used for aluminum parts. Plasma Spray is a line-of-sight method and not conformal on complex shapes, such as holes in showerhead parts. SEMI: Which substrate materials work for ALD coatings? Sneck: In general, parts made of common metal materials, such as aluminum, stainless steel or titanium, all work well with ALD coatings. Commonly used ceramic materials work well with ALD too. Plastic materials need to be coated generally at a lower temperature, which limits the coating material selection, but materials such as Al2O3 can be applied as well. SEMI: What is the maximum coating thickness you can reach with ALD? Does this depend on the material? Sneck: Yes, indeed. The maximum coating thickness does depend on the material of the part that we are coating. Polymer materials for example, have a very large coefficient of thermal expansion, which limits the practical coating thickness to the 100-nanometer level. On metal and ceramic parts, coatings of several micrometers are possible too. Typically, ALD coating thickness on chamber components range from a few hundred nanometers to one micrometer. SEMI: Which aspect ratio can you coat with ALD? Sneck: Basically, ALD can coat aspect ratios of 1000:1, but this would be extremely slow. In practice, some of the most complex parts are showerhead parts with small holes. Typically, these have an aspect ratio of around 100:1, which is perfectly commercially feasible for ALD. An extreme example would be gas lines: In this case, the aspect ratio may be also around 100:1, but the physical distance from one end to the middle may be half a meter. In this respect, it is not practical to wait for gas diffusion to reach such a depth level. Instead, the gas lines can be coated by forcing the ALD precursor gas flow into the gas line parts. This works well but needs part-specific manifolds to guide the gases. SEMI: What is the lifetime of ALD coating compared to other coatings? Sneck: ALD coatings differ from other coatings a couple of ways. First of all, ALD coatings generate less particle contamination since they are non-porous. Secondly, and most importantly, ALD coatings can cover areas that other coatings cannot. What is considered the lifetime of a certain part depends on various factors. Ultimately, the lifetime needs to be confirmed by testing parts in actual process chambers by running a lot of wafers through the chamber and monitoring critical parameters such as particle level and yield. SEMI: If you have multiple shelves with parts in the reaction chamber, how does the shelf position affect the coating uniformity? Is center shelf better than top and bottom shelf? Sneck: Uniformity depends on many parameters, including the part geometry, part holder geometry, batch size and coating material. When the shelves supporting the parts are optimally designed and the gas flow is well-distributed to all shelves, all shelves from top to bottom show similar uniformity. SEMI: Is there any risk of cross-contamination? Sneck: Cross-contamination could potentially be caused by the parts themselves or by different coating materials. The batch setup is fixed in production use, which means the parts are the same in every batch. The only variation is that the batch may not be full in some cases, but then we do not fill the empty part of the batch with other parts that could cause contamination in order to prevent contamination from one part type to another. Cross-contamination from one coating material to another is not a usual concern but can be prevented by using dedicated reaction chambers for different coating materials. This is very easy to do with Beneq P800. Sami Sneck manages Beneq’s semiconductor part coating business. He joined Beneq in 2005 and since then has held various professional and management positions including product manager, application manager, director of ALD group, head of sales, and head of Asia. He earned his MSc degree in Chemical Engineering in 2001 from Helsinki University of Technology. Sneck has special expertise in Atomic Layer Deposition technology and business development. He has played a vital role in introducing various ALD production concepts and solutions to several industries ranging from jewelry to photovoltaics, electronics and semiconductors. Access the free webinar recording and discover the latest anti-corrosion coating solutions and the unique benefits of ALD (atomic layer deposition). This webinar is particularly helpful for process engineers, equipment engineers and others responsible for contamination control and equipment yield. Serena Brischetto is senior manager of Marketing and Digital Engagement at SEMI Europe.