Test Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, proudly announces the release of the high-throughput 3D SEMI CT AXI TR7600 SIII Plus, specifically designed for high-reliability electronics manufacturing, including the Semiconductor and Advanced Packaging industries.

Equipped with a Multi – High-Resolution configuration 2 µm - 20 µm, the TR7600 SIII Plus is an optimal addition to high-reliability electronics manufacturing industries such as Automotive, Aerospace, and Medical. The TR7600 SIII Plus delivers High-Speed Inspection tailored to the throughput requirements of OSATs (Outsourced Semiconductor Assembly and Test providers) and integrates AI-Powered Inspection Algorithms, including AI-Void Detection and AI Repair Station to enhance defect detection rates.

The TR7600 SIII Plus is capable of inspecting C4 Bumps, from 70µm - 140µm, SiP and Cu Pillars. The AXI can inspect large boards of up to 800 x 350 mm in size and 12 kg in weight, ideal for advanced manufacturing environments.

The TR7600 SIII Plus integrates with Smart Factory production lines and MES, ensuring inspection traceability. The TR7600 SIII Plus supports current Smart Factory Standards, including the IPC-CFX, IPC-DPMX, and The Hermes Standard (IPC-HERMES-9852).

Please visit the following link below to learn more about the TR7600 SIII Plus:
https://www.tri.com.tw/en/product/product_detail-84-2-1825.html

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Presentation at SEMICON Taiwan 2024 demonstrates how materials impact sustainability, artificial intelligence, and high-performance computing.

Taipei, Taiwan – August 28, 2024 – Brewer Science, Inc., a global leader in developing and manufacturing innovative materials for micro- and optoelectronics, shares its expertise on the impact materials have on sustainable lithography processes. Additionally, Brewer Science presents the role innovative materials have in the critical advanced packaging markets, including artificial intelligence (AI) and high-performance computing. Brewer Science’s presentations and exhibition will be at SEMICON Taiwan, from September 4th – 6th, 2024.
Material Efforts Towards Sustainable Processes

Dr. Douglas Guerrero, Brewer Science’s Senior Technologist, presents “Material Efforts Towards Sustainable Processes” addressing the industry’s most critical questions when it comes to balancing technology innovation with environmental stewardship, including:

- How can the semiconductor industry enhance sustainability while meeting growing consumer demands for eco-friendly practices?
- What innovative solutions are available to reduce energy consumption in EUV lithography processes?
- Can transitioning from thermal baking to UV curing improve both energy efficiency and lithographic performance?
- What are the benefits of optical crosslinking in semiconductor manufacturing, and how does it optimize material design, process efficiency, and tool throughput?

With 30 years of R&D experience in patterning materials and processes, over 20 patents, and 60 publications, Dr. Guerrero combines material expertise and industry leadership to present how sustainable processes can lead to energy savings, while improving tool throughput and maintaining lithographic performance. Attend Dr. Guerrero’s presentation on September 6 at 2:20pm in 401, 4F at SEMCION Taiwan, as part of the IC Forum – Advanced Chip Technology and Manufacturing.

The Role of Cutting-edge Materials in Advanced Packaging in AI and High-Performance Computing

Mr. Alexander Smith, Brewer Science’s Executive Director of Semiconductor Materials Business Unit, presents “The Role of Cutting-edge Materials in Advanced Packaging in AI and High-Performance Computing”, providing an insightful review of the challenges and advancements in packaging materials enabling more efficient and cost-effective flows. Mr. Smith will highlight chemical properties and customizable structures that will offer the most innovative solutions to pressing industry challenges. Attend Mr. Smith’s presentation on September 6 at 12:00pm in 701GH, 7F at SEMCION Taiwan, a part of the Heterogeneous Integration Global Summit 2024 – Day 3.

Explore New Innovations in Advanced Packaging at Booth I2116

Throughout the events, Brewer Science’s experts will be stationed at booth I2116 in the SEMICON Taiwan Exhibit Hall and available for discussions on how Brewer Science’s materials assist with advanced-node patterning and wafer thinning. A list of Brewer Science’s PFAS-Free Materials is also available.
- Wednesday, September 4 : 10:00am–5:00pm
- Thursday, September 5 : 10:00am–5:00pm
- Friday, September 6 : 10:00am–4:00pm

For those unable to attend, Brewer Science extends an open invitation to explore its Packaging Solutions and Advanced Lithography webpages. You can also request datasheets or schedule expert-led consultations on Brewer Science’s website. www.brewerscience.com.

About Brewer Science

Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique quality monitoring systems for water and air applications. We are Certified Employee-Owned and a Certified B Corporation™, using our business as a force for good. Our headquarters are in Rolla, Missouri, with customer support throughout the world. Learn more at www.brewerscience.com.

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Kitchener, Ontario, August 15, 2024 – PEER Group®, the largest supplier of innovative factory automation software products for the semiconductor industry, will be showcasing its suite of powerful and flexible test products and services during SEMICON Taiwan 2024.

“Successfully passing the factory acceptance test (FAT) is a very important step for OEMs,” says Mike Barrett, PEER Group’s Vice President, Global Sales. “By using PEER Group’s test product and services, OEMs can quickly and easily validate their tool to ensure it’s ready for a seamless integration once it reaches the factory floor and avoid any costly delays or issues.”

With decades of experience integrating equipment into semiconductor factories, PEER Group provides OEMs with deep knowledge and expertise into what it takes to pass the factory acceptance test at the world’s leading semiconductor factories. “We have been doing this for a long time,” says Barrett, while noting: “Failing the FAT can really hurt a company’s reputation and jeopardize future sales. Luckily, we have the test products and services OEMs need to make sure their tool meets and complies with all the requirements factories are requesting.”

PEER Group’s test products are used by OEMs to validate SECS/GEM communications, factory requirements, and compliance with SEMI automation standards. These tests can be conducted before the tool is shipped to the factory, eliminating risk of integration delays or issues by identifying any potential problems early on.

For OEMs that require additional help passing the FAT, PEER Group OEM Services offers various options, including factory specification reviews, equipment testing, and onsite integration services, to ensure timely and successful equipment acceptance.

SEMICON Taiwan will take place September 4-6 in Taipei. The PEER Group booth, M0938, will be located on the fourth floor in Hall 1. For more information, visit: https://bit.ly/3M5ugak.

About PEER Group
PEER Group® is the largest supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. An award-winning company, PEER Group’s commitment to quality has been recognized by Intel’s EPIC Supplier Program, naming PEER Group a Distinguished Supplier in 2024. Follow PEER Group on LinkedIn.

• Read more about PEER Group showcasing factory acceptance test products and services at SEMICON Taiwan