Frontier Semiconductor

FSM provides wafer metrology systems including FSM 413AA for thickness, TTV, TSV, roughness, step height, and bump height. FSM 128, 500, and 900 Series measure film stress from room temperature up to 900°C, with 900 Series supporting vacuum and TDS/CTE analysis. FSM 125RAFT provides nanoscale topography, roughness, and local stress variation. FSM R/SE measures film thickness using reflectometry/ellipsometry for transparent and multi-layer films. Adhesion testers include AquaFlex (quantitative 4 Point Bend) and Laminar (qualitative). FSM 900TC-VAC supports vacuum-based material characterization and 4 Point Probe integration. Electrical testers include FSM Eddy Current (non-contact Rs) and FSM 4 Point Probe (contact Rs mapping). Systems support wafer sizes up to 450mm and bonded substrates. AI and inline inspection options available per system.