SEMICON Taiwan 2026 Debuts First Full-Day CEO Forum and Ecosystem Executive Summit
Ten Global Tech Leaders Headline Back-to-Back; Five Electronic Supply Chain Titans Unite to Respond to Global AI Demand
HSINCHU, Taiwan — August 14, 2026 — The semiconductor industry’s AI-era transformation is shifting from isolated breakthroughs to global ecosystem collaboration. Reflecting this shift, the SEMICON Taiwan 2026 CEO Summit and Ecosystem Executive Summit will expand to a full-day program spanning cloud and accelerated computing, memory, interconnects, power management and system co-design, as well as advanced packaging, process equipment and critical materials, covering the technologies needed to take AI from innovation to deployment at scale. The closing fireside chat will, for the first time, unite leaders from Taiwan’s five key electronics supply chain sectors: IC design, wafer fabrication, packaging, substrates, and electronics manufacturing, to examine its evolving partnership with the global semiconductor industry, from past collaboration and today’s AI demand to future strategies, helping define the next model of global collaboration. The Summit will take place on September 2 at TaiNEX Hall 2.
▲SEMICON Taiwan 2026 CEO Summit and Ecosystem Executive Summit expands to a full-day program spanning the AI value chain.
Cloud and AI Chip Architect Makes Asia Premiere; Agenda Spans the Full AI Value Chain
SEMICON Taiwan 2026 opening keynote speaker Amin Vahdat, Senior Vice President and Chief Technologist for AI and Infrastructure at Google, plays a pivotal role in driving the future of compute and AI systems. As part of Google’s executive leadership team, Vahdat will deliver his first public keynote in Asia. Drawing on an integrated perspective across custom silicon, data centers, and high-speed networking, he will share his vision for the future of AI infrastructure and the evolution of the semiconductor ecosystem.
For the first time, the summit will feature dedicated morning and afternoon sessions spanning the technologies needed to scale AI, from Google and Microsoft’s cloud infrastructure, NVIDIA accelerated computing, Broadcom’s networking and optical interconnects, Micron’s global manufacturing footprint and innovative memory and storage solutions, Infineon’s power solutions, to Meta’s AI hyperscale system co-design, extending to materials, equipment, and process control technologies. Together, the program maps the full AI stack from manufacturing to system deployment.
From Angstrom Nodes to AI Factories: Tech Leaders Map AI at Scale
The morning Ecosystem Executive Summit will examine how strategic partnerships, manufacturing innovation, and ecosystem collaboration can accelerate the next wave of semiconductor technologies. Speakers, in order of appearance, include:
Jon Kemp, CEO, Qnity Electronics — Making his Taiwan speaking debut, Kemp will share insights on “Shrink and Stack,” exploring how advanced packaging and materials innovation are redefining creation in the Angstrom era.
Ahmad Khan, President, Semiconductor Products and Customers, KLA Corporation — Speaking in Taiwan for the first time, Khan will share how process control and yield-management technologies are enabling high-volume manufacturing.
Benjamin Hein, Member of the Executive Board and CEO Electronics, Merck — Making his Taiwan speaking debut, Hein will discuss how combining materials science and integrated workflow solutions can address advanced packaging complexity and accelerate semiconductor innovation.
The afternoon CEO Summit will shift the focus from manufacturing foundations to the core technologies enabling AI at hyperscale. Speakers, in order of appearance, include:
Rani Borkar, President, Azure Hardware Systems and Infrastructure, Microsoft — Borkar will explore how innovation across the infrastructure stack will shape the reach and impact of AI, drawing on Microsoft’s experience designing and operating purpose-built silicon and systems at the frontier of cloud and AI.
Manish Bhatia, Executive Vice President, Global Operations, Micron Technology — Bhatia will discuss how global manufacturing, ecosystem collaboration and innovative memory and storage solutions are driving the next leap in AI performance.
Asad Khamisy, Senior Vice President and General Manager, Broadcom — Khamisy will examine how networking, silicon, optics, and packaging are shaping the future of AI infrastructure.
Alexander Gorski, Chief Operations Officer, Infineon Technologies — Making his first public speaking appearance in Taiwan, Gorski will explore how strong partnerships and scalable operations can support rapidly growing AI demand.
Dr. CQ (Chunqiang) Tang, Vice President, AI and Compute Foundation, Meta — Tang will discuss how co-designing AI clusters across data centers, silicon, software, and ML models enables AI innovation at scale.
Michael Kagan, Chief Technology Officer, NVIDIA — As the CEO Summit’s closing speaker, he will highlight innovations across chips, accelerated computing, open models, networking, systems, software, power, and cooling, showing how full-stack co-design is shaping the future of AI factories and infrastructure.
Beyond Single Breakthroughs — Taiwan’s Full Ecosystem Collaborates to Meet Global AI Demand
As AI systems continue to scale in size, computational intensity, and integration complexity, no single company or part of the technology can advance alone. From IC design and fab to packaging, substrates and electronics manufacturing, the entire supply chain must align on technology development, capacity planning, quality validation, and delivery to meet global demand for AI performance, scale, reliability, and supply resilience. This year’s closing fireside chat is designed as a direct response to this industry shift.
The fireside chat will, for the first time, bring together five titans of Taiwan's electronics supply chain on one stage. The session will be co-moderated by Tien Wu, CEO of ASE and Chair of the SEMI Global Board, and Cliff Hou, Chairman of the Taiwan Semiconductor Industry Association (TSIA). The discussion will also feature Rick Tsai, Vice Chairman and CEO of MediaTek; Young Liu, Chairman of TEEMA and Chairman of Hon Hai Technology Group (Foxconn); and Shan-Chieh Chien, Chairman and CSO of Unimicron. Together, they will look across past, present, and future to shape the next era of global collaboration, and answer the AI industry's urgent call for coordination, trust, and delivery at scale.
SEMICON Taiwan 2026 will kick off with a series of pre-show forums beginning August 31, followed by the exhibition, which will take place from September 2 to 4 at TaiNEX. Registration for exhibition visits and forums is now open. For more details and registration information, please visit the official website.
▲SEMICON 2026 fireside chat unites five supply chain titans for the first time to address global AI demand.
About SEMI
SEMI® is the global industry association connecting more than 4,000 member companies and 1.5 million professionals across the semiconductor and electronics design and manufacturing supply chain. SEMI helps members address critical industry challenges through advocacy, workforce development, sustainability, supply chain management and other programs. SEMICON® Taiwan events, technology communities, standards and market intelligence support business growth and innovation across design, devices, equipment, materials, services and software - advancing smarter, faster and safer electronics. Learn more at www.semi.org or follow SEMI on Facebook, LinkedIn and LINE.
