Advanced packaging is in high demand. SEMICON Taiwan 2024 showcases a comprehensive lineup of the supply chain

Global attention is turning to SEMICON Taiwan 2024 set in September, where the event will spotlight the latest trends and innovations in semiconductor technology

(August 15, 2024 – Hsinchu) As demand for Artificial Intelligence (AI) and High-Performance Computing (HPC) continues to surge, the need for advanced packaging technologies is also on the rise. SEMICON Taiwan 2024, the largest and most influential semiconductor event in Taiwan, will be held from September 4-6 at the TaiNEX Halls 1 and 2. The event will showcase the most comprehensive lineup of the semiconductor supply chain and cutting-edge industry technologies. The exhibition will feature 11 diverse and forward-looking innovation themes, including "AI Chips," "Advanced Processes," "Heterogeneous Integration," "Silicon Photonics," and "Compound Semiconductors", all of which will be highlighted in various theme pavilions and programs. The international forums on "Advanced Packaging Technologies," which will be showcased during the event, are particularly seen as indicators of next year's technological trends. Key topics such as globally recognized advanced packaging technologies, including Chiplet, 3D IC, CoWoS, and FOPLP (Fan-out Panel Level Packaging), will be major focal points for the market.

Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI, said, "Over the past 50 years, Taiwan's semiconductor industry has evolved from IC design, wafer manufacturing, and packaging to integrated component manufacturing, developing a comprehensive supply chain. As the industry enters the era of 'Foundry 2.0', this advancement not only enhances and expands Taiwan's semiconductor landscape but also positions Taiwan as a potential global rule-maker, increasing its competitiveness and influence globally."

CoWoS and FOPLP advanced packaging technologies are driving the future of heterogeneous integration

This year's SEMICON Taiwan will feature over 40 CoWoS-related manufacturers and more than 40 panel-level packaging suppliers, offering a comprehensive supply chain lineup that spans equipment, materials, components, and processes. As semiconductor technology advances, the industry faces increasingly complex challenges, necessitating close collaboration and strategic growth across the supply chain. To address these challenges, TSMC and ASE will lead the inaugural 3D IC/CoWoS for AI Summit – HIGS Series Event, during SEMICON Taiwan. This initiative aims to drive technological innovation and further advance semiconductor development.

Elites converge at SEMICON Taiwan, where innovation pushes the boundaries of Moore's Law

This year's SEMICON Taiwan will also spotlight advanced processes and semiconductor packaging through a series of technical forums. The Heterogeneous Integration Global Summit 2024 series will feature the inaugural FOPLP Innovation Forum. Over four days, industry leaders and academic experts from AMD, Intel, Micron, Samsung Electronics, SK Hynix, Silicon Box, Sony Semiconductor, and TSMC will gather to provide in-depth insights into critical technologies including HBM, silicon photonics, CPO, Hybrid Bonding, and Liquid Cooling, offering a comprehensive exploration from multiple perspectives.

During SEMICON Taiwan, major global semiconductor leaders converge in Taiwan, strengthening their supply chain relationships with Taiwan’s key technologies and successfully bringing new opportunities for global supply chain collaboration. Registration for SEMICON Taiwan 2024 is now open for free. Register for the international forums for a super early-bird discount of 20%. For more information, please visit the official website.

About SEMI

Founded in 1970, SEMI operates 10 major offices globally and established the SEMI Taiwan in 1996. It connects over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. Since its inception, SEMI Taiwan has annually hosted SEMICON® Taiwan, international summits, and various major technical forums, enhancing Taiwan's international influence and competitiveness. SEMI upholds the principles of objectivity and neutrality, acting as a semiconductor industry think tank for Taiwanese member companies. It fosters deep global exchanges among industry, government, academia, and research sectors, promoting Taiwan's semiconductor industry to align with global standards, and establishing a two-way communication platform.

SEMI Taiwan currently hosts 18 technical committees to drive industry growth and innovation in design, devices, equipment, materials, services, and software. It provides comprehensive market intelligence, standardization, policy advocacy, talent cultivation, sustainability development, supply chain management, and program assistance to empower members in facing industry challenges. For more information, visit www.semi.org or join SEMI Facebook and SEMI LinkedIn.

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