downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Member company iconResource item iconStore item iconGroup 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
Skip to main content
Default Banner Image

SEMICON West

2025 was a fast-paced, exciting, and impactful year for the SEMI Standards team. We developed 14 new standards on crucial topics like supply chain traceability, defect mitigation, compound semiconductor materials, and so many more. In addition, we introduced the SEMI Global Standards Summit (GSS) in North America, where we created new standardization roadmaps and continued pertinent sustainability conversations from the inaugural GSS at SEMICON Japan 2024. We’re also excited to announce that we closed out 2025 with an impactful Q4. From December 17-19, we held our SEMI International Standards Meetings during SEMICON Japan. More than 15 Task Force meetings and 5 Technical Committee meetings were held, followed by an award ceremony. The brand-new Digital Twins in Manufacturing Task Force was also established to define and standardize a digital twin framework that supports consistent and scalable implementations. We published the new SEMI T27 standard in Q4, and we celebrated several outstanding volunteers for their contributions to the SEMI Standards Program at both SEMICON West and SEMICON Europa. As we reflect on Q4, it’s apparent how important collaboration is to the success of SEMI Standards. By working together, we lay the foundation for groundbreaking innovations in microelectronics manufacturing. The SEMI Standards team would like to extend a warm and sincere thank you to everyone who donated their time and expertise to define the future of our industry. These efforts would not be possible without your commitment and support.Still, it’s never too late to join the SEMI Standards Program. Learn more about membership and how you can help influence the next phase of semiconductor manufacturing. Q4 2025 HighlightsTakeaways from the International Standards Meeting at SEMICON JapanIn Q4, the SEMI Standards team held its International Standards Meeting at SEMICON Japan, where several task forces convened to set standards for compound semiconductor materials, information and control, traceability, and more. From December 17-19 at Tokyo Big Sight, the SEMI Standards team supported these technical committees in advancing several key standards revisions, including SEMI E181, Specification for Panel FOUP for Panel Level Packaging, and SEMI E182, Specification for Panel FOUP Loadport for Panel Level Packaging. In addition, a new Maintenance Robot Communication (MRC) Task Force was established with the objective of defining communication protocols and data exchange specifications between maintenance robots and equipment.The next SEMI International Standards Meeting will take place from May 11-14 in Albany, New York, during the SEMI Advanced Semiconductor Manufacturing Conference (ASMC). Digital Twins in Manufacturing Task Force Although the terms “digital twins” and “digital twin frameworks” are becoming more prevalent in the semiconductor industry, there’s still much debate on what they cover. To develop concrete, standardized definitions for each, the SEMI Standards team established the Digital Twins in Manufacturing Task Force in Q4. After the task force defines these crucial terms, it will then create definitions for internal digital twin components outlining baseline capabilities, discovery mechanisms, prediction quality metrics, unified model interfaces, and lifecycle management. Eventually, the task force will outline a framework for Digital Twins compatible with existing guidelines like SEMI Standard E133 or ISO 23247. The SEMI Digital Twins in Manufacturing Task Force is open to industry stakeholders. To participate, join the SEMI International Standards Program or learn more. Standards Awards at SEMICON West and SEMICON Europa SEMICON West honoreesQ4 was also a time to celebrate some of the talented individuals who make a difference in the SEMI Standards Program. At SEMICON West and SEMICON Europa, we honored 25 accomplished industry leaders across the following five award categories for their commitment and participation. Merit Award winners led projects to successful completion at the task force level. SEMICON Europa honorees: Judith Wittmann, Cristina Sanna, Peter Wagner, Friedrich Passek, Frank Riedel SEMICON West honorees: Dave Dunne of Applied Materials, Kirsten Smith of UCT/ChemTrace, Tommaso Orzali of ASML, Dr. Tyler Harrison of Teledyne MEMS, and Dr. Mary Ann Maher of SoftMEMSSEMICON Europa honorees: Christian Kranert of Fraunhofer IISB, Enrica Cela of Soitec, Hans-Christian Alt of the Munich University of Applied Sciences, and Ulrich Kretzer of Freiberger Compound Materials GmbHLeadership Award winners bolstered the SEMI Standards program through member recruitment, mentoring, and training efforts. SEMICON West honorees: Michael Potts of Arcadis, David Kandiyeli of KINETICS Equipment Solutions Group, and Per Nelson of Daikin AmericaSEMICON Europa honorees: Frank Riedel and Judith Wittmann of Siltronic, Cristina Sanna of GlobalWafers, and Jochen Ruth of Pall CorporationHonor Award winners have demonstrated long-term dedication to advancing SEMI Standards.SEMICON West honorees: Steve Martell of Nordson Test Inspection Americas, Lucian Girlea of Nikon Precision, and Dave Huntley of PDF SolutionsSEMICON Europa honorees: Peter Wagner of SEMI Standards, Fritz Passek of Siltronic, Arnd Weber of SiCrystal GmbH, and Frank Petzold of trustsec IT solutions GmbHCorporate Device Member Award winners are participants from the user community who act as corporate representatives for the SEMI Standards Program from the device manufacturer side. Stefan Radloff of Intel was honored with this award at SEMICON West. Technical Editor Appreciation Award winners are adept at translating complex technical information into clear and precise language. Dr. Alissa M. Fitzgerald of A.M. Fitzgerald Associates became the award recipient in 2025. Workshops at SEMICON WestOn October 8, the SEMI Voltage Sag Immunity Task Force hosted its Enhancing Voltage Sag Immunity workshop to address fab downtime caused by voltage sags. The workshop convened more than 20 industry professionals to review the limitations of SEMI Standard F47. They found that while 20% of downtime instances can be attributed to three-phase events, SEMI Standard F47 does not require testing for such occurrences. As a result, the Voltage Sag Immunity Task Force is developing a draft revision of SEMI Standard F47, scheduled for balloting in March 2026. If you missed this workshop, you can access the recording and presentation here. October 8 also saw the exciting return of the Analytical Workshop, hosted by the SEMI Liquid Chemicals Committee after a multi-year hiatus. This year’s workshop addressed near-term challenges and advancements identified by the International Roadmap for Devices and Systems (IRDS). It covered chemical quality and consistency, trace metallic impurities and improvements in ICPMS instrumentation, automated instrumentation for online measurements, detection for particle precursors and sub-10nm particles in liquids and on-wafer, and organic particle precursors identification using FTIR-ATR, SERS and AFM-IR. If you missed this workshop, you can access the recording and presentation here. The 2026 call for abstracts will be announced soon. Lastly, the SEMI Standards and SEMI University teams worked together to host Semiconductor Device Manufacturing in a Cleanroom, a workshop meant to introduce best practices for overcoming contamination problems in the cleanroom. By reviewing different sources of contamination, reviewing analytical techniques for quality control, and performing cleanliness testing, the course aims to help cleanroom facilities improve production reliability and yield.New and Revised Standards Released in Q4October 2025November 2025December 2025Get InvolvedSEMI Standards development activities take place throughout the year in all major manufacturing regions. To participate, join the SEMI International Standards Program.SEMI Standards are available through individual download purchases or online via SEMIViews. Watch this video to learn more about how SEMIViews offers a cost-effective and streamlined way to access 1,110+ SEMI Standards. Sign up for a 30-day SEMIViews trial.For more information, please visit the Standards website and events page. For any questions regarding SEMI Standards activities, please contact your local SEMI Standards staff.Paul Trio is Director of Standards at SEMI.
Read More
Q3 2025 was packed with activity. From finalizing the Standards program for SEMICON West, to organizing the event’s corresponding Global Standards Summit (GSS), the Standards team is excited to share its most recent quarterly developments.On Tuesday, October 7, leaders from across the industry convened in Phoenix, Arizona, for the second annual GSS. This half-day summit focused on future standardization needs for supply chain traceability and environmental sustainability. In addition, the Standards team conducted two workshops at SEMICON West. The first, SEMI Liquid Chemicals Analytical Workshop, detailed recent advances in analytical methodology and instrumentation related to particle measurement, trace metals, and organics in liquid chemicals. The second, Enhancing Voltage Sag Immunity: SEMI F47 Standards Updates Insights Workshop, offered a forum for sharing improvements to SEMI Standard F47 to further enhance tool performance and reliability. Finally, Q3 saw the official introduction of SEMI Standards T26 and E195. SEMI T26-0925, Specification for Electronic Supply Chain Traceability Using Distributed Ledger Technology, will be crucial for improving security and transparency for the industry’s supply chain. Additionally, SEMI E195-0925 is now available for purchase. This standard, Test Method Using Adhesive Replacement Substrates to Assess Particulate Surface Contamination on Critical Chamber Components, offers a testing approach for measuring the ISO 14644-9 cleanliness of a critical chamber component.To participate in upcoming standard developments, learn more about becoming a member of the SEMI International Standards Program. Global Standards Summit The SEMI GSS made its North American debut at this year’s SEMICON West in Phoenix. Building on its inaugural event at SEMICON Japan 2024, GSS is a strategic forum dedicated to creating an industry-wide standardization roadmap for the next three and seven-year benchmarks. The 2025 GSS continued conversations from SEMICON Japan on environmental sustainability, while expanding its program to include supply chain traceability. As geopolitical tensions, mounting cybersecurity threats, and rising technological demands continue testing the limits of the industry’s supply chain, the need for global standardization is becoming increasingly apparent. The 2025 GSS program addressed these concerns and others across multiple sessions, offering insight on how these challenges are being addressed in the industry while highlighting critical areas still in need for standards development. Key outcomes from the GSS program include: Addressing data sharing across multiple supply chain tiers while protecting IP rights and a call for harmonization across standards. The presentation by Randy Hall from the Provenance Chain Network, offered approaches on how data owners can share information with authorized users without compromising sensitive manufacturing details. While there are standards gaps that hinder broader adoption, there is opportunity to address insufficient visibility across the industry’s supply chain amid ongoing cybersecurity threats by harmonizing across existing standards implementations. An integrated modeling framework for informing energy efficiency and carbon reduction approaches. Developed by the International Roadmap for Devices and Systems (IRDS) Environmental Sustainability for Semiconductor Facilities (ESSF) team, this effort helps address demands for maintaining rapid technological progress while still meeting the industry’s ambitious sustainability goals.Standardization opportunities for improving sustainability within manufacturing facilities. Nate Monosoff from Jacobs offered insight into the decision-making tradeoffs that balance sustainability with other facility performance areas, focusing on standard methods for calculating ESG performance. GSS concluded with a panel discussion that featured leaders from AMD, FTD Solutions, Intel, The Provenance Chain Network, Jacobs, Qualcomm, and Tokyo Electron. In this session, our thought leaders discussed the fundamental importance of standardization for our industry, standards adoption, incentivizing stakeholders, and how standards can be designed to remain flexible and adaptive as technologies and regulatory landscapes evolve. SEMI Standard T26In line with the 2025 GSS theme of supply chain traceability, the Standards team is pleased to introduce SEMI T26, Specification for Electronic Supply Chain Traceability Using Distributed Ledger Technology. This standard was published in September to define a secure and decentralized traceability system that all members of the electronics supply chain can safely share. This system is based on distributed ledger technology to improve industry-wide reliability assurance.Update on Document 7130CIn February, Document 7130C was approved during the North America Metrics Technical Committee Chapter Meeting. The document officially became SEMI E195 - Test Method Using Adhesive Replacement Substrates to Assess Particulate Surface Contamination of Critical Chamber Components in September.SEMI E195 describes a quantitative method for measuring the ISO 14644-9 surface cleanliness for particle concentration of a critical chamber component (CCC), by means of an adhesive replacement substrate. The purpose of this standard is to ensure measuring and reporting consistency across CCCs or processing equipment manufacturers. To help acquaint the industry with this standard, SEMI offered a combined, in-person course on SEMI E194 and SEMI E195 during SEMICON West. The course provided fundamental information on each standard, in addition to other process approaches for improving reliability and yield.Other SEMI Updates:SEMI Preventive Maintenance Automation White Paper SEMI Korea conducted a Global PM Automation Survey in August to better understand today’s preventive maintenance readiness issues for autonomous fabs. The results will be included in SEMI’s upcoming PM Automation Whitepaper and will ultimately guide future developments for related SEMI Standards. Standardized Semiconductor Cyber Assessment FrameworkIn Q3, the Semiconductor Manufacturing Cybersecurity Consortium (SMCC) released its Standardized Semiconductor Cyber Assessment (SSCA) framework. This document provides a detailed cybersecurity readiness plan for semiconductor companies across the supply chain. Its goals are to standardize industry-wide cybersecurity risk evaluations, establish and accelerate the adoption of best practices, and improve information sharing and collaboration. Download the SSCA framework for free.New Data Standard for Equipment Edge Governance In June, Document 6938C was approved during the Taiwan Information Control Technical Committee Chapter Meeting. The document officially became SEMI E196 - Guide for Equipment Edge Data Governance. SEMI E196 provides guidance for identifying equipment data supplied by manufacturers that can be used in equipment engineering or analysis applications.New Guide to Meet IRDS Yield Table RecommendationsAt the NA Summer Meetings, Document 6601B passed TC Chapter review with technical changes and a Ratification Ballot was issued in Cycle 7-2025. Pending final Procedural Review, Guide for Meeting IRDS Yield Table Recommendations for High Purity Polymer Materials and Components Used in Ultrapure Water, will cover areas that establish criteria for allowable contribution by critical components used for UPW treatment plant and distribution system. This document will be proactively updated to manage the risks associated with the high purity polymer materials used in the semiconductor process. The biggest challenges today are metals and particles and certain organics.Flex Standards Meeting at FLEX 2026Meet the leaders of the SEMI Standards Flexible Hybrid Electronics (FHE) Task Forces at Flex 2026, in Arizona, February 24-26, and learn about ongoing FHE standardization efforts!Standards Introduced in Q3 2025New and revised standards released in Q3. July 2025 StandardsAugust 2025 StandardsSeptember 2025 Standards Get InvolvedSEMI Standards development activities take place throughout the year in all major manufacturing regions. To participate, join the SEMI International Standards Program.SEMI Standards are available through individual download purchases or online via SEMIViews. Sign up for a 30-day SEMIViews trial.For more information, please visit the Standards website and events page. For any questions regarding SEMI Standards activities, please contact your local SEMI Standards staff. Paul Trio is Director of Standards at SEMI.
Read More
AI is proliferating rapidly, fueled by ever-larger models and data sets that are expanding AI use cases and improving its accuracy. Future computing systems are now required to simultaneously deliver high performance, process large amounts of data, and use the least possible energy. The growing energy footprint of AI and the strain it places on the power grid is an increasing concern for companies and even entire countries. This could adversely impact future growth and could slow the semiconductor industry’s march towards $1 trillion in revenue, which is largely driven by AI applications.This is a formidable challenge that cannot be addressed in silos by individual companies or even industry segments. The SEMI Smart Data-AI Initiative is exploring how to overcome this challenge with collaborative and innovative system-level solutions that connect the dots across the entire AI system stack. In March 2025, we hosted a successful workshop, bringing together industry leaders across the value chain for a day of thoughtful discussions and knowledge sharing. Building on this foundation, we developed an exciting Smart Data-AI session to be held at SEMICON West in Phoenix, Arizona on October 7 from 10:30 a.m.-4:40 p.m. The “Future of Computing: Energy-Efficient Computing for AI and Beyond” forum will bring together executives and thought leaders across the entire ecosystem – including design, fabrication, interconnects, system integration, hyperscale architectures, advanced materials, and emerging technologies such as photonics and quantum. Attendees will have a unique opportunity to get strategic perspectives from these distinguished experts and learn about exciting future trends.Why Attend?Gain insights from global leaders and learn about innovative paths towards an energy-efficient computing future.Network and build cross-industry collaborations for the next wave of AI, photonics and quantum.Promote a more sustainable path for continued growth of AI to benefit humanity and the planet.Join the SEMI Smart Data-AI initiative to develop solutions and take concrete actions to reduce AI’s growing energy footprint.Support the industry in achieving its goal of reaching $1 trillion in revenue. Speaker Highlights Include:AMD • Ciena • Hewlett Packard Enterprise • IBM • Merck KGaA, Darmstadt, Germany •Microsoft • Quantum Economic Development Consortium • Rapidus • Rigetti •Siemens AG • Stanford UniversityDr. Pushkar P. Apte is the Strategic Technology Advisor and leads the Smart Data-AI Initiative at SEMI.
Read More
Digital Twins are no longer a futuristic concept in semiconductor manufacturing—they’re fast becoming the backbone of next-generation fabs. But here’s the challenge: without a robust, scalable data platform to unify, secure, and interpret the torrent of information flowing across design, manufacturing, packaging, and test, digital twins cannot deliver their transformative potential. At SEMICON West in Phoenix, Arizona on October 6, 2025 from 1–5 p.m., join us for a high-impact technical workshop that explores how advanced data platforms are fueling the next wave of innovation—enabling smarter, faster, and more precise decisions across the semiconductor lifecycle.What You’ll Learn – Gain insights on proven reference architectures for scalable data platforms, integration patterns that support digital twin ecosystems, real-world use cases from fabs and OSATs applying AI/ML at scale, best practices in managing governance and security across complex data pipelines.Modern Data Platform Architectures – Designed for speed, scale, and semiconductor precisionBreaking Down Silos – Leveraging shared ontologies and data fabrics for seamless interoperabilityAI-Enhanced Digital Twins – Real-world deployments across fabs and OSATsFederated Learning in Action – Secure, multi-party collaboration without compromising IPData Security Governance – Proven practices for high-stakes manufacturing environments Distinguished Speakers – Hear directly from leaders advancing digital twin and federated learning initiatives at the SmartUSA Institute and across the semiconductor ecosystem. Anshu Bahadur, Senior Program Manager, Technology Communities at SEMI, will open the workshop and introduce speakers who will share how they’re building these next-generation platforms and deploying them across fabs, OSATs, and the full manufacturing flow. Following individual presentations, the session will close with a panel discussion featuring these executives. Ross Kunz, Director of Technology, SmartUSA Institute (Keynote Speaker)Dr. Adam Schafer, CEO, Athinia TechnologiesDhara Vaishnaw, Head of Solution Architecture, AWSDr. Gautham Unni, Head of Solutions and Business Development, Semiconductor, AWSJonathan Holt, Senior Director, Product Management, PDF SolutionsDr. Surya Kalidindi, CEO, Multiscale TechnologiesWho Should Attend? This workshop is designed for: Data Platform Architects building the next-gen semiconductor backboneSmart Manufacturing Engineers integrating fab and test dataAI/ML Practitioners scaling models into production workflowsInnovators shaping digital twin systems for complex, high-precision manufacturing Why Attend? Because the future isn’t waiting. Digital Twins, powered by scalable data platforms, are redefining how the semiconductor industry innovates, collaborates, and competes. Don’t just keep up with the future—build it. Anshu Bahadur is Senior Program Manager, Technology Communities at SEMI
Read More
John Kibarian, CEO and co-founder of PDF Solutions and a member of the ESD Alliance (ESDA) Governing Council, will deliver a keynote during the CEO Summit at SEMICON West in October titled, “Revolutionizing Semiconductor Collaboration: The Emergence of AI-Driven Industry Platforms.” He recently shared with me a summary of what his talk will cover and his perspective on why collaboration is the key to growing the semiconductor industry to $1 trillion and how we will get there.Smith: What is the major industry evolution or dynamic that's making collaboration essential today?Kibarian: The semiconductor industry has dramatically evolved from a simple, linear process to a complex, collaborative ecosystem. Previously, everything happened at the wafer fab. Testing occurred at wafer sort, package yields were high, final testing was straightforward, and products were shipped. Collaboration was mainly between foundries and fabless customers, intensive during early qualification and test chip stages, then evolved to routine yield monitoring once production stabilized.Today's advanced packaging puts multiple chiplets into single packages, creating an explosion of test insertion points. This has driven up both test complexity and costs significantly. Front-end fabs now house the most complex machines, while test and assembly facilities, once relatively simple, now feature sophisticated system-level testers with integrated robotics. Assembly tools have become highly complex, with die-attach processes requiring increasingly tight tolerances. Success now requires collaboration across the entire chain, from system companies to equipment vendors, both for new product launches and ongoing production maintenance.Companies are adopting AI and machine learning (ML) to manage these complex production flows, whether for testing or equipment control. This demands even broader collaboration since AI requires combining data from multiple sources across foundries, fabless companies, OSATs, equipment vendors, and more, data that no single entity controls. What was once a straightforward handoff between two parties has become an intricate web of interdependent relationships requiring continuous coordination.Smith: Chiplets and chiplet-based architecture is in the news and seems to be a key solution or practical solution in response to the slowing down of Moore's Law. This demands incredible levels of collaboration and coordination across the whole value chain. Is this doable at scale where it starts to move into the mainstream?Kibarian: The semiconductor industry will need unprecedented collaboration to make chiplet manufacturing work at scale. But this can be done! Consider EUV lithography: Initially expected during the 65nm generation, it took years longer than anticipated despite being an incredibly complex technology. Extraordinary engineering was needed but it also required extensive collaboration between ASML, suppliers, customers, and the broader fabless community.If the industry achieved this level of coordination for EUV, it can do the same for chiplets. However, chiplet manufacturing will require even greater collaboration as more companies will build systems using chiplets from multiple suppliers.Today's chiplet-based systems typically source all components from one manufacturer, making standards like UCIe less critical since companies control their entire supply chain. This will change as companies increasingly use third-party components for cost-effectiveness.More and more, we will see systems using components from multiple players to get to market more cost-effectively. Consequently, future production flows will be significantly more complex, requiring coordination of substrates and base dies, third-party dies and interposers, OSAT and specialized testers with specific configurations.This orchestration must work not just for initial bring-up but for the ongoing production as well, and when reconfiguring chiplet combinations for different products, all requiring rapid, automated responses.All of that must be automated for quick reaction. Considering the complexity of the manufacturing flow, people will want to apply AI/ML to anticipate what is going on in each individual product built.Manual oversight of every chip and package during manufacturing isn't feasible at scale. Automated AI agents must handle this monitoring and quality control. Expanding this automation will require close collaboration between the manufacturing entity and engineering teams at the product companies.This will also require a different level of alignment and orchestration across all the software packages managing this complex multi-company process. The financial enterprise resource planning (ERP) systems know where material is going, what the demand is, and what the forecasts are. While separately, the manufacturing execution systems needs to know which tools are going to be available when. Most often, these manufacturing systems operate in factories the product company doesn't own. The product company’s PLM systems control the bill of materials and test flows, but these tests will be conducted at the OSAT requiring complex coordination between the software systems of multiple companies controlling different process domains. This orchestration spans organizational boundaries and must be able to take data from upstream test results and make decisions on what tests to run downstream. This is required to get the right chiplets put together into a package in an efficient manner within a short cycle time and not require a Formula 1 pit team to keep everything running.Smith: The volume of data is staggering, especially now with design data. What will it take to enable this vision, at scale, where everything's connected? Kibarian: It’s a marriage of the human establishing the bounding box within which the systems operate that employ agents to do a lot of the work on a day-to-day or hour-by-hour basis. A good example is how manufacturing execution systems (MES) connect to ERP systems to share data. When a company sets up an orchestration, it creates rules that govern how information flows between systems. These rules tell the ERP system: "To calculate costs for each process step, here's the recipe information you should use."Once these rules are in place, they work like guidelines that control daily operations. An AI agent automatically creates insights based on actual data collected from the MES and moves data between systems according to these rules. The ERP AI agent will use this data to spot when costs are rising and send alerts, to notice when production yields drop, to calculate what lower yields mean for costs, and will take action to fix problems.This same process happens between equipment suppliers and manufacturing facilities. They share data automatically based on pre-set rules, and AI helps identify issues and take corrective action. Fabs determine who can access which machines and when, what types of data can be transmitted and through which channels, and how frequently these transmissions occur. When new software or AI models are introduced to run equipment, the systems specify what virus scanning and security checks must be completed before installation.Human operators primarily configure these control systems by determining the most effective collaboration protocols. However, the day-to-day execution is handled by automated agents due to the enormous scale involved, both in terms of data volume and the sheer number of transactions that occur continuously throughout operations.A human will not go through and review that data. I'll give two examples of this. One outside of our industry and one in our industry. At our 2019 user conference, board member Marco Iansiti, a Harvard Business School professor, shared insights from his book on AI in business. He compared traditional banks with Ant Bank, Alibaba's banking arm, which was experiencing explosive growth before Chinese government intervention.Ant's AI wasn't particularly sophisticated, but its process was revolutionary. While traditional banks require customers to fill out loan applications that then go to human loan officers for review, Ant's system would automatically scrape the internet and social media to verify applicant information. Within seconds, an algorithm would approve or deny the loan.The crucial difference is that Ant could scale exponentially because its only constraint was computing power. Traditional banks need to hire more loan officers to double their business, a human bottleneck that limits growth.I invited him to speak because I believed in this principle six years ago, and I'm even more convinced now.For the semiconductor industry, to build a trillion-dollar industry with complex, integrated systems, we need to minimize human intervention in data intensive processes. Despite the trust issues between stakeholders in our sector, collaboration remains essential. The solution requires establishing systematic principles that allow AI agents to operate autonomously. This is a way forward to achieving exponential growth.The Ant Bank example perfectly illustrates what our industry needs. At PDF, we believe this approach is crucial for industry advancement. Consider this: We manage petabytes of data, yet humans only examine 5-10% of it. This shows AI's potential to handle the vast majority of operations without human oversight.The reality is that our customers build millions of chips a week, billions a year. They cannot look at every dataset. Algorithms can, AI can. We launched a product called Guided Analytics last year. An engineer spoke about it during our user group last year. Her company has a couple of thousand products. Her group could not keep track of them every day, but Guided Analytics could. When her group came in the morning, the daily report noted 90% of the chips were fine or alerts pointed to where issues are. It's a simple AI bot crawling over data and identifying where the root cause seems to be.Our industry will require more agents to scale. Those agents will span the industry, and yet we as humans need to set up the governing principles under which they can operate. That's how we're going to deal with the massive amounts of design and manufacturing data to get the velocity the industry will need, and to benefit from the AI that we create for our businesses.Notes: Kibarian’s keynote, “Revolutionizing Semiconductor Collaboration: The Emergence of AI-Driven Industry Platforms” is scheduled for Wednesday, October 8, at 10:20 a.m.SEMICON West adds design to its program with “The Convergence of Semiconductor Manufacturing and Design” to highlight the collaboration between semiconductor manufacturers and chip design teams to bring advanced systems to market. The three-hour session will be held Tuesday, October 7, from 1 p.m. until 4 p.m. Learn more about the design program in our latest blog. SEMICON West 2025 will be held in Phoenix, Arizona from October 7-at the Phoenix Convention Center. SEMICON West’s homepage has links to the full program, including more details about “The Convergence of Semiconductor Manufacturing and Design,” special features, sponsor and exhibits. Registration is open. About John KibarianJohn K. Kibarian is President, Chief Executive Officer and Co-Founder of PDF Solutions. He has served as President since 1991 and CEO since 2000. Dr. Kibarian received a Bachelor of Science degree in Electrical Engineering, a Master of Science and PhD degrees in Engineering Computer Science from Carnegie Mellon University.Robert (Bob) Smith is executive director of the ESD Alliance, a SEMI Technology Community. 
Read More
This year’s SEMICON West has new dates, a new location in a new city and a new addition to the program—design! “The Convergence of Semiconductor Manufacturing and Design” will highlight the collaboration between semiconductor manufacturers and chip design teams to bring advanced systems to market. The three-hour session during SEMICON West will be held Tuesday, October 7, from 1-4 p.m. at the Phoenix Convention Center in Phoenix, Arizona.Five 20-minute presentations will describe successful collaborations and address challenges and opportunities about design and manufacturing security, long-term reliability, system performance issues, and modeling and verification that encompass the entire system. Attendees can expect to learn about the key drivers behind the need for collaboration that range from heterogeneous integration to advanced packaging technologies and applications such as automotive and medical.Session moderators are Ming Zhang, PhD, Vice President of Fabless Solutions of PDF Solutions, and me. “As design and manufacturing complexity continues to grow, driven by applications like AI, it is becoming increasingly difficult to account for every manufacturing variation during design and at sign-off or to fully anticipate the entire design space at chip and system levels during manufacturing technology development,” said Zhang. “Achieving tighter integration between design and manufacturing through broader and deeper data and methodology collaboration will be critical to improving predictability, accelerating time to market and enabling the next generation of semiconductor innovation.”It’s within this context that we selected the presenters who include:“Revolutionizing Silicon to Systems Design: Unlocking the Future with 2.5D and 3D Multi-Die Innovations” by Sutirtha Kabir of Synopsys.“Manufacturing to Development to Manufacturing for Circular Collaboration Leveraging AI and Other EDA Advances” with David Kelf from Breker Verification Systems.“Bridging the Silicon Divide: Converging Chip Design and Manufacturing in the Era of High Integration” from Lu Dai at Qualcomm Technologies.“3D and Chiplets Driving Moore’s Law into the Future” with Joe Kwan of Siemens EDA.“Multiphysics Multiscale Challenges and Solutions for 3D Heterogenous Integration” by Sudarshan Mallu from Ansys, part of Synopsys.The program concludes with a panel moderated by Zhang titled “The Convergence of Semiconductor Manufacturing and Design” and features the session presenters.Join us to learn how the semiconductor manufacturing and design communities are collaborating to deliver advanced systems based on chiplets and rapidly emerging packaging technologies including 2.5D and 3D ICs and MCMs. Audience participation will be encouraged.Also of interest to attendees is a SEMICON West keynote from John Kibarian, CEO, President and Co-Founder of PDF Solutions who is also co-chair of SEMI’s ESD Alliance Governing Council. Kibarian will address “Revolutionizing Semiconductor Collaboration: The Emergence of AI-Driven Industry Platforms” during the CEO Summit keynotes on Wednesday, October 8 at 10:20 a.m.SEMICON West 2025 makes its debut in Phoenix, October 7-9 at the Phoenix Convention Center. This milestone event gathers global leaders across the microelectronics supply chain to explore transformative technologies, develop the future workforce and drive strategic collaboration. Moving SEMICON West to Phoenix highlights Arizona as a key hub for innovation and industry growth. Visit the SEMICON West homepage for more details on full program, including “The Convergence of Semiconductor Manufacturing and Design” session, special features, sponsors and exhibits. Registration is open. Robert (Bob) Smith is executive director of the ESD Alliance, a SEMI Technology Community. 
Read More
In Q2, the SEMI International Standards Program made progress on several emerging initiatives. Together, we reached a critical milestone for one of our data standards initiatives with Document 6938C recently passing Technical Committee review in mid-June 2025. Ballot 6938C, which provides guidance on how to identify manufacturing equipment data provided by the equipment supplier that can be used in equipment engineering or analysis applications, is slated to join SEMI E190 and E190.1 in providing industry-enabling data standardization.In addition, we began major revisions to SEMI Standards S2, S8, and S10. These standards govern environmental, health, and safety (EHS) considerations, equipment user fatigue and injury reduction, and equipment risk assessment and evaluation, respectively. In our recently concluded North America Standards Summer 2025 Meetings, the NA EHS Technical Committee Chapter approved a revision ballot to SEMI S10. The ballot (7169) proposed several major revisions to the SEMI S10 Safety Guideline on risk assessment which included changes to references to equipment to objects under consideration. Other changes also included the relocation of the assessment of the risk of harm to property other than the OUC to a Related Information section. Additional details are provided below.We’re eagerly preparing for this year’s SEMICON West event, taking place for the first time ever in Phoenix, Arizona. We are also pleased to announce the return of the SEMI Global Standards Summit taking place Tuesday afternoon, October 7 at SEMICON West. Our inaugural Summit was held last year at SEMICON Japan 2024 last December. The Summit aims to identify standards-critical areas and work towards an industry standardization strategy for the next 3- and 7-year time horizons. This year's Global Standards Summit will feature sessions on Supply Chain Traceability as well as Environmental Sustainability. Similarly, as cybersecurity considerations become more complex, SEMICON West will host a dedicated Cybersecurity Forum from October 7-9 to address today’s most pertinent challenges. More detailed program information will be available soon. Finally, we’re looking forward to our SEMI Standards + Award Ceremony Networking Event at SEMICON West. Following the International Standards Meeting and Standards Summit on Tuesday, October 7, join us for appetizers, drinks, and great conversation from 6-7:30 p.m. In the meantime, learn more about becoming a member of the SEMI International Standards Program.Balloting for Document 6938Document 6938C introduces a new potential standard – Guide for Equipment Edge Data Governance. Under development by the Equipment Edge Data Governance (EEDG) Task Force since 2021, Document 6938C was balloted in Cycle 3-2025 and approved during the Information Control Taiwan Technical Committee (TC) Chapter meeting held on June 12, 2025. It has since received approval by the International Standards Committee Audits and Reviews Subcommittee and is now undergoing final processing for publication by SEMI. As manufacturing equipment offers more accessible data than ever, poor communication, inconsistent expectations, and data security concerns continue to halt or slow factory integration efforts. If passed, this new standard will help organize the information that supports smart manufacturing efforts at the edge. In addition, the EEDG Guide will provide a comprehensive set of best practices to both users and suppliers to increase the value of existing equipment data. Update on Revisions to SEMI S2, S8, and S10 Safety GuidelinesOur 2025 Q1 Standards Watch newsletter announced a significant overhaul for SEMI Standards S2, S8, and S10.S2, SEMI’s standard for performance-based environmental, health, and safety (EHS) considerations for semiconductor manufacturing equipment, is undergoing discussions on redefining safety interlock systems. The S2 task force will issue an informal ballot to the general audience for feedback. The results then will be used to develop a formal letter ballot.First developed in 1995, SEMI Standard S8 works to reduce fatigue and injury by matching equipment to the user’s size, strength, and range of motion. Although this safety standard has been periodically updated since its inception, its last substantial revision was in 2018. The ballot to revise S8 ultimately failed the EH S TC Chapter review at this year’s Winter Meeting. With 214 comments and negatives to consider, the task force is revising the ballot and plans to reissue in Cycle 7 of August 2025.Finally, SEMI Standard S10 is moving through ballot 7169. This standard defines a consistent means of risk estimation that other SEMI Safety Guidelines can invoke. Ballot 7169 will separate facility and building risk assessment to a non-normative portion of the document, ensure EHS risks are separately calculated from commercial object risks, and clarify risk assessment of observed events from risk assessment of foreseen events. Ballot 7169 results were reviewed on June 5 during the North America Standards Summer meetings. The document was approved and is being processed for publication by SEMI.Cybersecurity Forum at SEMICON West 2025This year’s SEMICON West will feature a dedicated Cybersecurity Forum to address the semiconductor industry’s rapidly-changing cybersecurity landscape. The SEMI Cybersecurity Forum will gather industry experts to share knowledge and experience on the following topics. The goal is to develop actionable strategies and a deeper understanding of current and future cybersecurity risks. Cybersecurity in Legacy Semiconductor ToolsEmerging and Existing Cybersecurity Legislation and ComplianceCybersecurity in Maintenance and ManufacturingImpact of Cybersecurity Events on Semiconductor Manufacturing OperationsSupply Chain SecurityThreat Landscape in Semiconductor ManufacturingThe 2025 call for abstracts is now closed. Speakers will be announced in Q3.SEMI E187 Compliance Guidance White PaperThe SEMI Semiconductor Manufacturing Cybersecurity Consortium (SMCC), in collaboration with industry experts, is pleased to announce the release of the SEMI E187 Compliance Guidance Whitepaper. This comprehensive resource is designed to support semiconductor equipment suppliers and device manufacturers as they work to meet the requirements of the SEMI E187 0122 Standard - The Specification of Cybersecurity of Fab Equipment.Professionals involved in tool development, manufacturing, operations, and security will find the guidance particularly relevant and actionable. It provides guidance to address all twelve SEMI E187 requirements and focuses on new to fab equipment.Download the Whitepaper for freeSEMI Standards North America Summer MeetingsThis year’s SEMI Standards North America Summer Meetings were held from June 2-5 at SEMI’s headquarters in Milpitas, California. The meetings convened 11 committees and 40 task forces to discuss topics ranging from EHS to facilities, 3D packaging, MEMS, and more. In addition to the results of ballot 7169, technical changes to ballot 6601B, New Standard: Guide for Meeting IRDS Yield Table Recommendations for High Purity Polymer Materials and Components Used in Ultrapure Water, was also approved by the Liquid Chemicals North America TC Chapter, since the activity began in 2019. A Ratification Ballot will be issued in Cycle 7-2025 to verify the changes. In total, over 15 activities, ranging from Auxiliary Information, Reapprovals, and Line-Item ballots, also recently passed Procedural Review by the International Standards Committee (ISC) Audits Reviews Subcommittee and will be forwarded to Publications for final processing. The next SEMI International Standards Meeting will be held at SEMICON West from October 7-9 at the Phoenix Convention Center. Some technical committees and task forces may meet virtually outside of this meeting set, so be sure to check the SEMI Standards calendar of events for updates. Standards Introduced in Q2 2025New and revised standards released in Q2. April 2025 standards: https://store-us.semi.org/collections/standards/stdpbc-0425May 2025 standards: https://store-us.semi.org/collections/standards/stdpbc-0525June 2025 standards: https://store-us.semi.org/collections/standards/stdpbc-0625Get InvolvedSEMI Standards development activities take place throughout the year in all major manufacturing regions. To participate, join the SEMI International Standards Program.SEMI Standards are available through individual download purchases or online via SEMIViews. Sign up for a 30-day SEMIViews trial.For more information, please visit the Standards website and events page. For any questions regarding SEMI Standards activities, please contact your local SEMI Standards staff. Paul Trio is Director of Standards at SEMI.
Read More