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MEMS & Sensors Industry Group

The seemingly simple act of commanding consumer devices by voice is a choice that nearly 118 million Americans now make every day, according to a recent report from eMarketer, the digital marketing research firm.While the voice interface is convenient for users, its implementation comes at the potential loss of individual privacy. The reason? Always-on, always-connected voice-first devices such as Amazon Alexa and Google Home require a wall plug and an internet connection to powerful cloud processors, making it possible for cloud companies — however benignly — to collect data on personal habits, location and conversation that were never intended for sharing. Move processing to the edgeTo address concerns over user privacy, device designers are attempting to do more of the audio processing within the consumer device, rather than sending users’ voices into the cloud. Moving more processing to the edge is a trend across the Internet of Things (IoT) industry, and not just for voice data but for other types of sensitive or proprietary data as well.Yet designers have realized limited success because the conventional approach to always-listening edge processing is notoriously inefficient: It digitizes and processes 100% of incoming sound data even though up to 90% of the data is irrelevant noise. This digitize-first approach wastes vast amounts of system power digitizing and analyzing the audio signal as it searches for a wake word when there isn’t even speech present, making it impractical for use in small, battery-operated devices.Workarounds don’t workTackling this power issue is critical to keeping private data secure. Unfortunately, it’s also exceptionally difficult. Design engineers have tried workarounds to decrease power consumption in an always-listening system, including duty cycling and reducing the power of each individual component in the audio signal chain that handles the data. The reality is that these kinds of approaches don’t address the root cause of the problem: too much data.To truly tackle the problem, we need to change our approach to a system solution, not a component solution. By moving to a more efficient edge architecture that intelligently minimizes the amount of data that moves through the system, we can focus the system’s energy resources on analyzing voice and not on searching for a wake word in irrelevant noise. Analyze, THEN digitize It’s time to move away from the digitize-first approach that has dominated voice wake-up device architecture since the invention of voice-first applications.Inspired by the way the human brain efficiently filters incoming information, differentiating, for example, a dog bark from a baby’s cry, an ultra-low-power analog machine learning technology is changing this paradigm. For the first time, device designers can use low-power analog machine learning to detect which data are important for further processing and analysis prior to data digitization.Leveraging an analyze-first architecture, a new analog neuromorphic semiconductor platform allows the higher-power-processing components in the system to stay asleep until voice has actually been detected, and only then does it wake them to listen for a possible wake word.Delivering a post-microphone audio chain that draws as little as 25µA of current when always-listening and collecting preroll data, this analyze-first architecture allows designers to extend battery lifetime significantly. That’s the difference between smart earbuds that run for weeks instead of hours or a battery-powered smart speaker that runs for months instead of weeks.More importantly, it’s the difference between the current always-listening devices that indiscriminately record and send all sound data to the cloud, and one that has the localized intelligence to select and send only the relevant data, reducing the user’s vulnerability to the loss of private data.Balance convenience with privacyThe trade-off between making our lives easier and keeping our personal information private is a choice that we are asked to make throughout our day in a hundred different ways. Bringing more audio processing capability to the mobile device without draining the battery is the first step toward delivering more secure voice-first solutions. But to succeed in this effort, we must shift to a bio-inspired architecture that determines which data are important and requires further processing at the earliest point in the signal chain. Once we move to the analyze-first approach, only a small fraction of the tens of zettabytes of data collected by the forthcoming generation of always-on IoT devices will require further processing in the device and in the cloud.A better balance between cloud and edge processing is a better balance between convenience and privacy, and that’s a win for everyone.About the AuthorTom Doyle is CEO and founder of Aspinity. He brings over 30 years of experience in operational excellence and executive leadership in analog and mixed-signal semiconductor technology to Aspinity. Prior to Aspinity, Tom was group director of Cadence Design Systems’ analog and mixed-signal IC business unit, where he managed the deployment of the company’s technology to the world’s foremost semiconductor companies. Previously, Tom was founder and president of the analog/mixed-signal software firm, Paragon IC solutions, where he was responsible for all operational facets of the company including sales and marketing, global partners/distributors, and engineering teams in the US and Asia. Tom holds a B.S. in Electrical Engineering from West Virginia University and an MBA from California State University, Long Beach. For more information, please visit https://www.aspinity.com/Technology.Aspinity is a member of MEMS Sensors Industry Group (MSIG), a SEMI technology community, that enables the MEMS and sensor industry to address common challenges, innovate and accelerate business results.
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As the body’s largest organ, skin is responsible for the transduction of a vast amount of information. This conformable, stretchable, self-healable and biodegradable material simultaneously collects signals from external stimuli, which translates into information such as pressure, pain and temperature. The development of electronic materials, inspired by the complexity of this organ, offers a tremendous unrealized materials’ challenge. Fortunately, the advent of organic-based electronic materials may offer a solution to this longstanding problem.Zhenan Bao, K.K. Lee Professor of Chemical Engineering, Stanford University, is one of the world’s leading researchers working on the design of organic electronic materials that mimic skin functions. SEMI’s Maria Vetrano interviewed professor Bao to preview her February 25 keynote, Skin-Inspired Electronics, at FLEX|MEMS Sensors Technical Congress (MSTC) 2020, February 24-27, 2020, at the DoubleTree by Hilton in San Jose, California.Join us at FLEX|MSTC to meet Professor Bao and other industry influencers furthering innovation in flexible hybrid electronics (FHE) and MEMS sensors. Register now to connect with her at FLEX|MSTC or visit her on LinkedIn.SEMI: Your pioneering work on the use of electronic materials to construct second skin is a major step forward in human-machine interfaces. Could you please describe second skin?Bao: Second skin is a new electronic-device platform encompassing electronic devices that have skin-like properties such as stretchability, self‐healing ability, biocompatibility and biodegradability. In essence, the second skin is an electronic system of fully integrated multifunctional components operating on the surface of or inside the body to enable smart healthcare for disease prevention and treatment and to enhance the functional capabilities of natural skin. The second skin could also serve as a module to connect our human body to the Internet, thereby allowing human integration with the Internet of Things (IoT) for next‐generation wireless communications. In this way, we can view the second skin as an artificial body part that can be used to improve our everyday lives.SEMI: How might second skin operate in the human body?Bao: It has many potential uses. It could be a prosthesis for people who have lost their sense of touch. It could be used to repair damaged skin as well as to provide enhanced functionality that’s not possible with biological human skin. It could, for example, connect us with our external environment, with other people, even with our cars.I can also envision second skin as an implantable device for both neurostimulation and for early detection of disease. Schematic illustration of structure of second skin composed of functional devices: sensor, integrated circuit, display and power supply. Source: Stanford University SEMI: How did you get started in this research? Bao: Sixteen years ago when I started at Stanford, I learned of a colleague in mechanical engineering who was working on robotic cockroaches. That’s when I understood the need for sensor functions in robotics.I considered the large number of people with prosthetics who do not have a sense of touch. With this audience in mind, I started by designing a simple flexible electronic device that could take the shape of skin, even conforming to a robot hand, thereby approximating the natural sense of human touch.Once we developed the first sensor, and realized that its touch sensitivity could eclipse that of human touch, I asked myself: what can we learn from second skin – in addition to its sensing functionality?Skin is not just flexible; it is biodegradable and stretchable. So we started to dream. We began by developing electronic materials, either conductors or semiconductors. We added new functionality, such as self-healing properties, biodegradability and stretchability. That opened the way to new materials’ development.SEMI: What discoveries have you made in new materials?Bao: Over the past decade, we’ve developed skin-like materials with electronic properties that are on par with the best conducting and semiconducting polymers. Some of our skin-like semiconducting polymers can perform even better than amorphous silicon. That means with suitable processing methods, we can make stretchable ICs, initially with tens of transistors that can perform analog or digital functions, and in a later stage, stretchable displays driven by active matrix arrays.SEMI: What would it take to put these materials into production?Bao: We need to develop methods to pattern the skin-like electronic materials into fine features. We have been leveraging similar processes used for flexible circuit boards. Some research groups are developing roll-to-roll fabrication and printing methods.SEMI: Which technologies/applications are you commercializing?Bao: C3Nano is a Bao Research Group spin-off startup that is commercializing nanomaterials that are promising for bendable and foldable electronics.Another spin-off that is licensing our technology, PyrAmes, is developing a continuously non-invasive blood-pressure monitor. It’s not a cuff so the patient doesn’t have to remember to put it on.In the shorter term, we’re looking at putting artificial skin on prosthetic limbs and robotic hands. Further down the road, we could put skin on wounded regions of the body, forging connections to nerves that would support realistic sensation.To realize these applications, we’ll need to conduct further R D on materials and applications. The manufacturing of these devices still needs much more development.Fortunately, we’re part of a fertile development ecosystem at Stanford. I started the Stanford Wearable Electronics Initiative (eWEAR) to forge collaborations across Stanford campus as well as with industry.SEMI: What would you like FLEX|MSTC attendees to take away from your presentation?Bao: I’d like them to realize that the future of electronics is changing. I imagine a future in which the functions of a smartphone will disappear into what we wear, what we attach to our skin and what we implant inside our body. I believe that skin-like electronics will help to facilitate this future, allowing us to connect with each other and our surroundings in ways that feel natural, yet that also enhance our quality of life. Zhenan Bao is K.K. Lee Professor of Chemical Engineering with courtesy appointments in Chemistry and Material Science and Engineering at Stanford University. She founded the Stanford Wearable Electronics Initiate (eWEAR) and serves as the faculty director. Prior to joining Stanford in 2004, she was a Distinguished Member of Technical Staff at Bell Labs, Lucent Technologies from 1995 to 2004.Bao has over 500 refereed publications and over 65 U.S. patents with a Google Scholar H-Index 155. In her recent work, she has developed skin-inspired organic electronic materials, which have resulted in unprecedented performance or functions in medical devices, energy storage and environmental applications. She has pioneered several important design concepts for organic electronic materials. Her work has enabled flexible electronic circuits and displays.For more information on professor Bao’s research, visit Bao Research Group. FLEX|MSTC is organized MEMS Sensors Industry Group (MSIG) and FlexTech, SEMI technology communities focused on the growth of MEMS sensors and the flexible electronics supply chain, respectively. Maria Vetrano is a public relations consultant at SEMI.
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MEMS technology has changed human interaction with electronic devices. Introduced in the 1990s, the first mass-market MEMS devices were used for inkjet printheads and automotive airbag crash sensors. Today, MEMS are ubiquitous, with billions of the tiny devices adding intelligence and interactivity to smartphones, smart speakers, wearables, automobiles, biomedical devices, remote monitoring and event detection systems, and countless other applications. Integrating MEMS with Flexible Hybrid Electronics (FHE) is an important step in the evolution of this miniaturized intelligent sensing technology, paving the way for its use in new classes of flexible, conformal devices.The integration of the two technologies promises to breed new applications in small form factors but also presents challenges inherent to FHE design and fabrication processes. SEMI’s Nishita Rao caught up with Nathan Pretorius, prototyping and automation engineer, NextFlex, to discuss MEMS-FHE device integration challenges and opportunities ahead of his February 26 presentation, Integrating MEMS Devices in FHE, at FLEX|MEMS Sensors Technical Congress (MSTC) 2020, February 24-27, 2020, at the DoubleTree by Hilton in San Jose, California.Join us at FLEX|MSTC to meet Nathan and other industry influencers advancing innovation in FHE and MEMS sensors. Register now to connect with him at FLEX|MSTC or visit him on LinkedIn.SEMI: Why is integrating MEMS devices into FHE systems important? What new use cases might it enable?Pretorius: The main value proposition of integrating MEMS devices into FHE is that it allows MEMS devices to exist in a different form factor than was possible previously, giving us high-quality MEMS sensors on the flexible and conformable platform of FHE.Ease of application, flexibility, lower cost and rapid iteration on a design are just some of the benefits of FHE devices. And because there are few robust FHE sensors that overlap with MEMS’ capabilities, when you combine the two, you get a lot of compelling uses. That’s why NextFlex is working with agencies and companies to evaluate MEMS’ integration, including using bare MEMS die with microfluidics and promoting new ways of attaching and packaging MEMS die for use with FHE. SEMI: Why is FHE an ideal platform for integrating various types of sensors?Pretorius: MEMS integrated with FHE devices are ideal for rapid design and deployment of data-gathering sensor nodes — which we can iterate for specific applications. A few examples include on-body health monitoring devices for bio-fluids analysis, medical pressure sensors for monitoring blood pressure, and peel-and-stick sensors nodes for infrastructure monitoring. In terms of design and production, FHE devices support rapid prototyping, allowing for instantaneous design-iteration cycles. This speeds design-to-production over traditional rigid PCBs and copper flex because the feedback cycle time between design, manufacturing and testing is shorter, accelerating time to market. What’s exciting about FHE technology is that a variety of sensors or components, including MEMS, can be designed into the base system to easily customize it for a specific application. In addition, our experience shows that when compared to a traditional rigid PCB, an FHE board reduces manufacturing steps and device weight by two-thirds and, perhaps most importantly, converts the device to a thin, conformal shape that makes possible products in new form factors. SEMI: What are the primary challenges to integrating MEMS with FHE? What is NextFlex doing to help device manufacturers address these challenges? Pretorius: There are a few challenges, some of which are device-specific. Most recently, I’ve been focusing on inertial and timing devices, including accelerometers, gyroscopes and resonators. There are a few technical challenges involved in the process of getting the devices from the wafer to an FHE substrate. The wafer processing is very important, especially the dicing and thinning steps. After thinning and dicing, the die is placed onto the FHE substrate. The stresses caused by bonding to the substrate have to be understood and characterized. After placing the die, you then have a calibration step, which is normally performed after the device is packaged. With a MEMS die placed onto directly onto an FHE substrate, calibration then must be done.Finally, the device encapsulation is important, since on an FHE substrate the hard-to-soft material transition is very important to mitigate stresses to rigid component interfaces. We have also been looking at how to work with devices that have damping vents. Flexible encapsulants are inherently more permeable to gases and water vapor than hard encapsulants, so studying the encapsulation of MEMS devices on FHE is another area of interest. NextFlex has been working in a supporting role to evaluate best design practices and best attach and integration methods. In addition to our ongoing collaborative programs, NextFlex is developing the FHE manufacturing ecosystem to include system and component manufacturers and designers, product developers, and materials and equipment providers.SEMI: How do we facilitate closer collaboration between the FHE manufacturing ecosystem and MEMS suppliers such as MEMS device manufacturers, product developers, and materials and equipment providers?Pretorius: It’s important to include manufacturers early in the design process so we can identify challenges up front. That’s why NextFlex spearheads technology road-mapping efforts that include representatives from across the manufacturing ecosystem. We use the roadmaps to prioritize challenges that we can address effectively through collaboration, focusing the industry on solving problems through Project Calls that reveal integration challenges and results from real devices and that tell us how the materials and equipment actually perform with a real device.NextFlex keeps the information flowing, holding quarterly project update webinars to share results. As current devices are optimized for the process in which they will be used, we learn a lot from the project performers who make FHE system demonstrators — and we share that information with the member community. SEMI: Can you point to an example of a successful MEMS-FHE device integration?Pretorius: MEMS-FHE integration is still in the early stages, but we are working on several projects including a DARPA Seedling project for which we have integrated MEMS sensors into FHE systems for testing and evaluation. We plan to continue this work by integrating MEMS and FHE devices using methods that support mass production.SEMI: What would you like FLEX|MSTC attendees to take away from your presentation?Pretorius: We would like to see the FHE community work more closely with MEMS device manufacturers. For example, NextFlex often works with manufacturers to gain access to bare die, which is still a significant hurdle in making devices.The best way to speed things along is to get involved. We encourage FLEX|MSTC attendees to join NextFlex. As a prototyping and automation engineer at NextFlex, Nathan Pretorius explores new print methods for prototyping and automation using novel materials and processes. Pretorius currently focuses on how best to apply software scripting and machine learning to streamline FHE processes. Prior to joining NextFlex, he researched the strengths of roll to roll and screen printing on printed electronics designs, including capacitive touch interfaces, FHE passive component design, and antennas. Nathan holds a Bachelor of Science degree in Graphic Communications from Clemson University. FLEX|MSTC is organized MEMS Sensors Industry Group (MSIG) and FlexTech, SEMI technology communities focused on the growth of MEMS sensors and the flexible electronics supply chain, respectively.Nishita Rao is marketing manager for technology communities at SEMI.
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VTT Technical Research Centre of Finland Ltd (VTT) has its sights set high. As a leading global research and development firm , VTT is out to produce bio-interfacing and biodegradable flexible hybrid electronics (FHE) devices that help tackle some of the world’s greatest challenges including environmental degradation and food scarcity.SEMI’s Maria Vetrano interviewed Antti Vasara, president and CEO of VTT Technical Research Centre of Finland, to preview his February 25 keynote, Beyond Flexible Hybrid Electronics: Biodegradable Electronics and Interfacing Bio+Electronics, at FLEX|MEMS Sensors Technical Congress (MSTC) 2020, February 24-27 at the DoubleTree by Hilton in San Jose, California. Join us at FLEX|MSTC to meet Antti and other industry influencers driving innovation in flexible hybrid electronics (FHE) and MEMS sensors. Register now to connect with him at FLEX|MSTC or visit him on LinkedIn.SEMI: What is body-interfacing electronics and what is your vision for bio-interfacing and biodegradable electronics?Vasara: Body-interfacing electronics have existed for decades. Developed in the 1970s, the wireless heart rate monitor is a good example. While continuous heart monitoring with a compact, inexpensive wearable device is widely accessible technology, other bodily parameters, such as cholesterol levels or biomarkers, are diagnosed every time we see a doctor. Establishing a baseline using multiple measurements — before symptoms develop is actually much more effective.That’s where bio-interfacing comes in. Bio-interfacing devices will continuously measure and analyze complex biogenic substances such as sweat, breath, blood and urine. A smart patch for continuous sweat monitoring, for example, would overcome several challenges: supporting electronics functionality in liquid environments, managing the transport of harvested samples to and from the sensor, managing potential contamination, and disposing of samples after measurement.While FHE in principle delivers the right building blocks and is an ideal form factor for a wearable sweat analytics patch, flexible circuits are not ready for out-of-the box interaction with biological matrices. Hence, our mission at VTT is to anticipate and develop the upscaling process know-how required for FHE devices that either interface with biological systems — or that must themselves biodegrade.We’re also focusing on biodegradable electronics because environmentally conscious end-users and manufacturing companies want biodegradable versions of energy-autonomous, label- or sticker-like Internet of Things (IoT) sensors. Typically used for packaging, logistics, environmental monitoring and medical diagnostics applications, these sensors — which have a lifetime of a few days, weeks or months — have become very popular. Unless they are biodegradable, however, they just add to landfill.SEMI: What approaches is VTT using to develop bio-interfacing and biodegradable electronics?Vasara: In our Business Finland-funded ECOtronics project, we are working with our partners to create recyclable and compostable electronics and optics that use renewable resources. For example, devices developed using substrate materials like paper, cardboard or VTT’s in-house-developed nanocellulose films and biopolymer films for environmental monitoring or skin patches can be easily recycled or even biodegrade naturally. Where possible, we use roll-to-roll printing to generate the device circuitry, and on a component level, we have optimized our assembly process towards bare-die component bonding to reduce the overall footprint of non-biodegradable waste per device.SEMI: What use cases do you find most promising and why?Vasara: A prominent example of a single-use test that generates a large amount of waste is the digital pregnancy test. When breaking it down into components, you will find a rigid circuit board with microprocessor, a couple of coin cell batteries, a liquid crystal display, a LED light source and photodiode, and a large chunk of plastic packaging around it. The materials and battery capacity of such a device would be sufficient to run hundreds of pregnancy tests – actually technical overkill.By using printed circuits on biodegradable substrates, bare-die assembled components (ASIC, LED light sources, photo diodes, thin film batteries as power sources) and device packaging composed of biodegradable plastics, we can completely redefine the environmental footprint of single-use tests. We are currently developing a toolbox for our customers to turn their existing conventional test into an ecotronic form factor.Another exciting use case is a sweat sensor that we developed collaboratively with Ali Javey, Ph.D., professor of Electrical Engineering and Computer Sciences, UC Berkeley, and the co-director of Berkeley Sensor and Actuator Center (BSAC). Together with his team, we created a wearable electrochemical sensor for continuous sweat analysis during exercise. With the UC Berkeley group providing the chemistry to monitor N+, K+ ion and hydration levels in sweat over the duration of several hours, VTT delivered the underlying sensor platform, featuring the printed sensor electrodes and sweat harvesting microfluidic channels for fluid management and transport. It’s exciting to see what we can achieve by combining techniques from different disciplines, in this case electrochemistry, printing, packaging and microelectronics.SEMI: How can industry enable the development/manufacture of flexible FHE devices? Where does VTT fit into the ecosystem?Vasara: As many FHE devices target large-volume markets, scalability of manufacturing is key: How can I get from one device (= working prototype) to a handful of devices (= feasibility study), to thousands (= pilot manufacturing), to a million (= mass manufacturing) without compromising the quality of the system’s performance and reliability?Access to upscaling infrastructure is essential for the development of novel FHE devices and methods, but infrastructure is expensive. That’s where our establishment of a roll-to-roll pilot printing line to bridge the gap between laboratory R D and mass manufacturing has proved invaluable. We can provide a unique worldwide upscaling infrastructure for advanced FHE devices, with a strong focus on large-area roll-to-roll processes and hybrid assembly. This service removes our customers’ burden of high infrastructure investment in early development stages and it allows us to guide customers along their development path, from prototype to mass production.Watch our video: VTT pilot manufacturing for diagnostics and wearablesSEMI: Is there anything else that device manufacturers need to know in order to succeed?Vasara: In my eyes, the success of FHE devices eventually depends on several factors: It requires a high degree of automation, well-optimized processes, reliable supply chains, and perhaps most importantly, clear standards and rules for designers to guarantee flawless interoperability of all the different elements on a flexible and hybrid circuit. Let us not forget – we are trying to marry electronics with printing, biology, packaging, microfluidics, injection molding and other fields of expertise.We recently finalized the compilation of a set of design rules for publication in our state-of-the-art overview of printed and hybrid electronics manufacturing methods. You can download the overview, PrintoCent Handbook, for free.SEMI: What would you like FLEX|MSTC attendees to take away from your presentation?Vasara: The latest technologies and innovations in microelectronics, MEMS, printing, materials, and biosensors provide us a toolbox for true innovation in the FHE space. Now we need cross-disciplinary thinking and daring steps to combine different manufacturing methods and skill-sets. The ideal cross-disciplinary team might include: The printing engineer who knows how to design contact pads for a bare-die IC assembly The biologist who knows about the thermal and mechanical stress in a printing environment to design processes for bio-functionalization of surfaces The electronics engineer who knows how to optimize a circuit powered with an enzymatic biofuel cell The number of sensors deployed on (or inside) our body, in our drinking water, in our cars, on our fields, in our pets, and everyday products will surely grow. Let us make sure they leave the smallest environmental footprint possible.Antti Vasara, Ph.D. has been the president and CEO of VTT Ltd since 2015. VTT is a visionary research, development and innovation partner with over 2000 people and a turnover exceeding 250M EURO. Vasara is president of EARTO (European Association of Research and Technology Organisations) and is chairman of the board of Palta (Finnish Service Sector Employers). In addition, he is a non-executive director of Elisa Oyj (largest communications operator in Finland) and a board member at EK (Finnish Confederation of Industries).He has served on several high-profile groups on industrial and innovation policy of the European Commission, in addition to several groups in Finland on artificial intelligence and research policy. Previously, Vasara spent close to 25 years in private industry, working at Nokia, Tieto, SmartTrust and McKinsey Company. Earlier in his career, he was a researcher in optical communications with 20+ peer-reviewed articles and one international patent. Vasara holds a Doctor of Science (Technology) degree from Aalto University in Finland.For more information about VTT’s work in bio-interfacing and biodegradable FHE devices, visit VTT Research. FLEX|MSTC is organized MEMS Sensors Industry Group (MSIG) and FlexTech, SEMI technology communities focused on the growth of MEMS sensors and the flexible electronics supply chain, respectively.Maria Vetrano is a public relations consultant at SEMI.
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Today’s mobile devices are smaller, more power-efficient, and have more capability than we could have imagined just a decade ago. Offering ever-increasing levels of user functionality, mobile devices are now ubiquitous, and are rapidly becoming the primary mechanisms through which we interact with the digital world, our physical environment, and one another. An unintended side effect of our dependence on the current crop of mobile devices is that they are driving us to distraction.A major industry dynamic will shake things up for the better. Sensors are getting smaller and more efficient, and they’re offering attractive new functionality, giving us the ability to monitor our air and water quality, assess potential toxins in our food sources, and analyze personal health conditions, to name a few use cases. At the same time, the realization of flexible hybrid electronics (FHE) through new materials and production processes, better integration with other electronic components, more efficient energy production and consumption, and pervasive wireless connectivity are fueling the next generation of devices and experiences. What can we expect from tomorrow’s mobile devices — and how can we manage them, instead of having them manage us?SEMI’s Nishita Rao caught up with Mike Wiemer, Ph.D., VP of Engineering, CTO and co-founder, Mojo Vision, to preview his February 25 keynote, The Art of the Possible, at FLEX|MEMS Sensors Technical Congress (MSTC) 2020, February 24-27 at the DoubleTree by Hilton in San Jose, California.Join us at FLEX|MSTC to meet Mike and other industry influencers advancing innovation in FHE and MEMS sensors. Register now to connect with him at FLEX|MSTC or visit him on LinkedIn.SEMI: Mojo Vision has conducted its own research on human interaction with mobile devices. Why is this important?Wiemer: Our mobile devices have given us access to the information we need and want, improving many aspects of our lives. But our devices have also influenced our relationships and attention to our environment in negative ways. We believe that the next mobile computing platform must improve this situation. Instead of pulling us away from the moment, our devices need to embrace more human-centric engagement while still letting us access information that improves our quality of life. Mojo Vision has worked to understand this problem through our own studies and research so we can better develop an approach to address it. SEMI: How are key technical trends driving size, efficiency and capability advancements in mobile devices?Wiemer: Tiny low-power sensors are enabling ever-smaller feature-rich mobile devices that run longer on a battery charge. Smartwatches are a good example. Just a few years ago, smartwatches were not that much more than small screens on our wrists. Today, we have GPS, EKG/health monitoring, and cellular wireless interfaces all inside the same form factor.As this trend continues, we at Mojo Vision predict that our devices will continue to shrink and become even more personal: They’ll be more continuously worn and matched to our own needs and behaviors. This trend towards invisible personal devices is something we’re trying to accomplish with our solutions at Mojo Vision.SEMI: What is Mojo Vision’s concept of “Invisible Computing?” Wiemer: Our vision of Invisible Computing is based on the idea that our wearable devices should be invisible to those around us, encouraging more human interactions. These wearables should be invisible and unobtrusive to users themselves. Our Mojo Lens, which contains a full display and sensors housed inside a contact lens platform, exemplifies this vision. Using proprietary microelectronics and the world’s densest microdisplay to layer digital images and information seamlessly, Mojo Lens is redefining augmented reality. Our mobile devices today continue to increase the quantity and magnitude of interruptions. We think that shouldn’t happen. As a socially invisible device that delivers contextual, relevant content, the Mojo Lens lets us go about our daily lives, naturally interacting with other people while simultaneously enjoying the benefits of augmented reality. We think Invisible Computing can change our relationship with our devices, as well as seemingly give us superpowers. For more information, download the Mojo Vision report, Device Distraction: Understanding the Problem, Re-Thinking the Solution.SEMI: Can you tell us more about Mojo Lens?Wiemer: At its foundation, Mojo Lens is a nanoLED display, radio and sensor platform, integrated using flex technologies, and placed on your eye to provide important information. Mojo Lens can elevate or suppress this information to decrease reliance on your other devices.Unlike your smartwatch or smartphone, which react to you in a binary manner because they don’t have enough information to make autonomous decisions, Mojo Lens understands the context of your experience. That’s because it’s based on our Invisible Computing platform, which can understand your activity. Mojo Lens recognizes if you’re engaged in a conversation, driving or having a coffee, and it reacts with information accordingly.Mojo Lens could act like a real-time interpreter, for example. When someone speaks to me in a language I don’t understand, I should see “subtitles.” Or if I’m having a conversation with someone, Mojo Lens wouldn’t interrupt me with a notification at that moment. For the 92% of Americans who are interrupted by their devices during conversations every day, this prioritization can boost productivity. More importantly, it can improve the quality of our connections with the people around us.Mojo Vision’s microLED platform offers a world-record pixel pitch of over 14,000ppi and pixel density of over 200Mppi², making it the smallest, densest display for dynamic — or moving — content. SEMI: What would you like FLEX|MSTC attendees to take away from your presentation?Wiemer: It feels like the speed at which people are defining important problems and tackling them is increasing every year. And there are so many important problems to solve: space travel, autonomous driving, electric vehicles, alternative energy, quantum computing, lifespan extension, increased food production, brain-computer interfaces, AR/VR. All these problems seem impossible and “crazy,” until some group of people comes along to put a framework in place that can address them. Interestingly, these frameworks aren’t necessarily new. Rather, they build upon existing technologies and capabilities.MEMS sensors and FHE are good examples. From smart textiles, flexible displays and biological sensors to miniature radars, MEMS sensors and FHE technologies are essential building blocks. Many of the big problems we can imagine today will be solved by stacking today’s MEMs and FHE technologies in imaginative new ways. So what do we do next? I’d like to encourage FLEX|MSTC attendees to first define the problem to solve and then define the technology — rather than starting with the technology solution. Mike Weimer is a serial entrepreneur and proven science and technology leader in complex systems development and integration. Before co-founding Mojo Vision as CTO, Weimer co-founded and served as president at Solar Junction, a high-efficiency solar cell company (acquired) where he and his team set two world records for the highest-efficiency solar cells ever made by humans.After Solar Junction, Wiemer joined New Enterprise Associates (NEA) as an Entrepreneur in Residence where he sourced new investments and helped portfolio companies to develop their business and funding strategies. He is a board director at Stratio Corporation and an advisor at Stanford’s StartX Accelerator. He holds a B.S., M.S., and Ph.D. in Electrical Engineering from Stanford University.For more information, visit Mojo Vision.Interested in engaging with the MEMS sensors supply chain? MEMS Sensors Industry Group is a SEMI technology community that enables professionals in the MEMS and sensors industry to accelerate business results by addressing common challenges and opportunities.Nishita Rao is marketing manager for technology communities at SEMI.
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Part 2 of 2-part series on MSEC 2019 highlights. Read Part 1. Neural Networks on ChipTo be sure, low power is king when bringing machine learning to the sensor edge. Battery-powered, always-on sensing devices require it since frequent recharging is the death knell of any electronic product. That’s why semiconductor companies are offering new ways to conserve power.“MEMS sensor suppliers have made significant strides in the power, size and performance of their devices,” said Aspinity CEO Tom Doyle. “Yet these gains deliver only incremental power improvements to the system.”Doyle advocates a new architectural model that uses an analog neuromorphic processor to analyze all sensor data at the start of the signal chain instead of sending it downstream so power-hungry chips such as DSPs can digitize it before analysis.“The technology industry wants to take advantage of the many benefits of always-on sensing applications,” said Doyle. “Before we can reach mass proliferation, however, we need to resolve the power issues that are deal-breakers for some applications. We believe the answer to this challenge is architectural. All the data gathered by always-on sensing systems is analog in nature, yet as soon as it’s captured, it’s digitized immediately for analysis. Determining which data is important up front eliminates the digitization and processing of irrelevant data so that voice-first devices such as smart speakers and wearables/hearables can run for long periods of time without requiring battery recharge.”Syntiant CTO Jeremy Holleman agreed that on-device intelligence is the future.“Did you just fall? Is your heartrate a bit off? Deep learning provides a toolset that yields vastly superior decisions,” said Holleman. “The problem is that deep learning is computationally intensive. The answer is a neural network that performs on-device edge inferencing.”Holleman added that Syntiant’s neural decision processor was recently certified as Amazon Voice Service (AVS)-compliant for wake-word detection, making it easier to design voice control in battery-powered devices such as earbuds and wearables.MSEC Technology Showcase WinnerWith the groundswell of interest in intelligence at the edge, it was no surprise that Cartesiam won top honors among all competitors in the MSEC Technology Showcase for its NanoEdge AI, software that brings AI to the edge of the signal chain, making it easier for designers to create intelligent objects that can learn and understand.“Unlike other AI algorithmic technologies for sensing devices, NanoEdge enables both learning and inference at the edge, providing accurate and adaptive intelligence,” said Cartesiam Managing Director and Co-founder Marc Dupaquier, who accepted the award. “It’s also the only tool of its kind that does not require data scientists on board for implementation, which saves a tremendous amount of money. Our clients can build a machine learning library and embed it into their own code within weeks to realize the same caliber of unsupervised neural network that was once the exclusive domain of AI cloud vendors.”MSIG 2019 Hall of FameAt this year’s conference, MSIG Director Carmelo Sansone recognized two longtime contributors to the commercialization of MEMS and sensors: Peter G. Hartwell, Ph.D., chief technology officer at InvenSense, a TDK group company; and Thomas Kenny, professor and senior associate dean of engineering at Stanford University.Hartwell leads technology strategy and the InvenSense advanced technology research group. He has more than 25 years’ experience commercializing silicon MEMS products, including advanced sensors and actuators, and developing MEMS testing techniques.Kenny’s academic accomplishments include authoring or co-authoring more than 250 scientific papers and holding 50 issued patents. He has also advised more than 50 graduated Ph.D. students from Stanford.MSEC 2020Mark your calendar for next year’s MSEC, October 12-14, at Coronado Island Marriott Resort Spa in Coronado, Calif. Get updates from MSIG on MSEC and other upcoming events including MSTC 2020.Stay in Touch with MSIGMEMS Sensors Industry Group (MSIG), a SEMI Strategic Association Partner, is the industry association representing the global MEMS and sensors supply chain. To learn how MSIG enables professionals in the MEMS and sensors industry to innovate, address common challenges and accelerate business results, visit us today.Connect with MSIG on Twitter and LinkedIn. Subscribe to SEMI Blog: Technology and Trends.Maria Vetrano is a public relations consultant at SEMI.
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Part of 1 of 2-part series on MSEC 2019 highlights. Read Part 2. MEMS and sensors are proliferating across consumer, automotive, biomedical/healthcare, robotics, industrial and agriculture applications to harvest sensory data in a hyper-connected world and meet demand from consumers and organizations alike as they clamor for more intelligence in electronics.Take the ubiquitous iPhone. Shipped in 2007, Apple’s first iPhone sported five sensors. By contrast, the most feature-packed smartphones will embed up to 20 sensors by 2021, according to Yole Développement’s Jérôme Azémar. He estimates that the devices will feature four MEMS microphones, four CMOS image sensors (CIS), a RGB color sensor, a laser rangefinder, an infrared sensor, a gas sensor, a heart rate monitor and a fingerprint sensor, not to mention the MEMS inertial sensors that device users have come to know and trust.The MEMS market is expected to reach $18.5 billion in 2024 [1], up a whopping 60 percent from $11.6 billion in 2018, according to Azémar, who presented at MEMS Sensors Industry Group’s 15th annual MEMS Sensors Executive Congress (MSEC) in late October in Coronado, Calif. Add other types of sensors to the mix – CIS, environmental sensors, LiDARs, radars, ultrasonics, and fingerprint sensors – and the market will mushroom to $93 billion by 2024, said Azémar.Since MEMS Sensors Industry Group (MSIG) joined SEMI as a Strategic Association Partner three years ago, SEMI has expanded its MEMS and sensors programs to Europe and Asia while continuing to grow its U.S. conferences. “SEMI is continually investing in MEMS and sensors innovation across the supply chain,” said Dave Anderson, president of SEMI Americas and host of MSEC. “For example, MSIG is contributing to the development of the Heterogeneous Integration Roadmap, an initiative designed to drive heterogeneous integration technology development and accelerate electronics innovation. The roadmap spans device design, test and fabrication, ecosystem development, R D, equipment and materials. “At MSEC, executives and other speakers explored how AI and blockchain are remaking the food supply chain, air transportation and other sectors as MEMS and sensors improve the quality of our lives,” said Anderson.Sensing at the EdgeThe concept of artificial intelligence (AI), that a machine can harness intelligence that rivals or outperforms humans – and act without human intervention – has been a feature of the human imagination since at least the 1968 film 2001: A Space Odyssey. MEMS and sensors facilitate intelligence in a wide range of electronics such as smartphones, healthcare wearables, robots, industrial predictive maintenance systems, and cars. AI is sure to augment that functionality.MEMS and sensors are now in their third wave of evolution, a focus on edge AI, Bosch Sensortec CEO and General Manager Stefan Finkbeiner told MSEC attendees. For its part, Bosch is working to add AI to MEMS devices. The first wave integrated software with MEMS sensors, and the second, sensor fusion, enabled designers to allocate performance and power strategically to tune MEMS for resource-constrained devices. The third wave is “an active-learning phase in which MEMS facilitates real-time learning at the edge to promote greater personalization, environmental feedback, privacy of user data and improved battery life,” said Finkbeiner.Small sensor nodes with edge AI exemplify third-wave applications. Integrating low-power environmental sensors (e.g., gas, temperature, pressure, humidity and air-flow sensors), the nodes could be deployed in fire-prone forests to assess fire risk and support early detection. Access to this real-time environmental information could prove invaluable to residents and public-safety personnel alike.Google takes another tack, applying machine learning to resource-constrained devices, said Nick Kreeger, a senior software engineer at the Internet giant. The company’s Google Brain creates machine learning models that can run on inexpensive, low-power microcontrollers using Google’s TensorFlow Lite, an open-source machine learning tool that’s been deployed on a multitude of mobile devices. Inferencing is done at the device’s edge, rather than transmitted to the cloud.Meeting the power constraints of battery-powered sensing devices is another matter that starts with minimizing energy and data waste. “Deep learning is compute-bound and runs well on existing microcontrollers,” Kreeger said. “Because it’s all arithmetic, it’s low-power compared to storage access.”Already Google has worked with Plant Village, a research unit at Penn State University, and the International Institute of Tropical Agriculture (IITA) to help farmers improve food production by using machine learning and cheap sensors to spot and manage planet diseases in developing countries. And that production chain is in dire need of a boost, according to Rajendra Rao, general manager of IBM Food Trust, an enterprise-class blockchain solution.“We are on the cusp of complete failure of the food system,” Rao said. “One out of 10 people gets sick each year from foodborne illness, 420,000 die from this annually, 80 percent of companies in the food supply chain have not digitized, one-third of all fresh food in the US is thrown away, and one in five seafood samples worldwide is mislabeled.”IBM Food Trust’s work with Sucafina, which manages a global green coffee supply chain, shows how sensors can trace food from the farm to the processing plant to the consumer. With the IBM Food Trust platform, Sucafina can track the origin of the beans used in a cup of coffee – a competitive differentiator to coffee drinkers eager to support fair-trade coffee roasters.ripe.io, one of Forbes’ 25 most innovative AgTech startups, is also tackling the challenges and complexities of the food supply chain.“Our secure blockchain platform creates a digital twin of food items, transparently aggregating foods’ journey in real-time, to provide a harmonized trustworthy platform for multiple stakeholders,” said Rachel Gabato, the company’s COO. The ripe.io blockchain-based platform collects data from various sensors – temperature, pressure, light, humidity and inertial MEMS sensors. Growers, distributors and end customers including sweetgreen – a U.S. restaurant chain that depends on fresh produce – use the information to trace the origin and quality of food.MSEC 2020Mark your calendar for next year’s MSEC, October 12-14, at Coronado Island Marriott Resort Spa in Coronado, Calif. Get updates from MSIG on MSEC and other upcoming events including MSTC 2020.Stay in Touch with MSIGMEMS Sensors Industry Group (MSIG), a SEMI Strategic Association Partner, is the industry association representing the global MEMS and sensors supply chain. To learn how MSIG enables professionals in the MEMS and sensors industry to innovate, address common challenges and accelerate business results, visit us today.Connect with MSIG on Twitter and LinkedIn. Subscribe to SEMI Blog: Technology and Trends.[1] Source: Status of the MEMS Industry report, Yole Développement, 2019Maria Vetrano is a public relations consultant at SEMI.
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Most of today’s blockbuster MEMS products – from pressure sensors and resonators to accelerometers and microphones – originated from academic research, a trend that Alissa M. Fitzgerald, Founder Managing Member, A.M. Fitzgerald Associates, expects to continue. While many of these potentially game-changing new technologies will require many more years of intensive development and up to $100 million in investment to reach full commercialization, Fitzgerald sees their potential for generating new waves of activity and opportunity in the MEMS and sensors industry.SEMI’s Maria Vetrano caught up with Fitzgerald to preview her October 23 presentation, Emerging MEMS Sensors Technologies to Watch as We Enter a New Decade, at MEMS Sensors Executive Congress, October 22-24, 2019, at the Coronado Island Marriott Resort Spa in Coronado, California.Join us at MEMS Sensors Executive Congress (MSEC) to meet Alissa Fitzgerald and other industry influencers driving innovation in the MEMS and sensors industry. Register now to connect with her at MSEC or visit her on LinkedIn.SEMI: What are your top three emerging MEMS and sensors technologies with the greatest promise?Fitzgerald: Let’s start by defining emerging. In researching this topic for MSEC, I reviewed a year’s worth of academic papers to search for compelling technologies that will emerge five to 10 years from now. While these applications are not yet commercially ready, they bear a distinct presence in academic literature, and some have even reached the proof-of-concept phase. They all have the potential to advance user functionality derived from MEMS and sensors in very meaningful ways.Next-Generation MicromirrorsI’ve noticed renewed interest in micromirrors, driven by interest in LiDAR for autonomous vehicles, in fiberoptic networking, and in VR/AR glasses and headsets as well.Newer generations of micromirrors will use piezoelectric films to enhance optical performance. Piezoelectric actuation can pivot the mirror to a much larger angle than older-generation electrostatically actuated micromirrors. This is important for wider-angle scanning for LiDAR – as well as for other applications – as it enables the creation of a larger picture image.Piezoelectric films can also be used to change the shape of the mirror surface to enable a variable-focus mirror. This is useful on two fronts: It supports depth-of-field adjustments and it alleviates the need for extreme precision in packaging of optical devices, improving both cost and yield.Event-driven sensors/zero-power/ultra-low power sensorsSensors that draw no power, or that draw just small amounts, by activating only upon a triggering stimulus, are enormously exciting. Their extremely low power consumption addresses one of the most significant obstacles to creating large-area sensor networks: the problem of too-frequent battery changes.In addition, while most sensor nodes today broadcast a large stream of data back to the mother ship by radio, these event-driven or zero-power sensors consume only a small amount of power because they activate the radio only to transmit essential data.Resolving the power-consumption problem with sensors will allow deployment of large-area sensor networks in remote or inaccessible locations, highly useful for applications such as monitoring infrastructure.Bacterial sensorsSensors that can detect the presence of bacteria, as well as the type, have widespread applicability beyond medical uses. They would be particularly useful in food-safety applications as they can identify particular strains of bacteria, such as E. coli, before the beef leaves the processing plant or the spinach ships from the warehouse. This could offer dramatic improvements in food safety over the Centers for Disease Control (CDC) and U.S. Food and Drug Administration’s (FDA’s) food safety program, which only flags foodborne illness when a cluster of people are seriously ill.Researchers are also designing bacterial sensors for rapid point-of-care (POC) diagnostics to detect, for example, sepsis early, potentially saving lives.SEMI: You’ve said that some future MEMS and sensors will use alternatives to silicon. When might we see MEMS and sensors printed on paper or other flexible materials – and for which applications are they suited?Fitzgerald: We’re seeing an enormous amount of development of sensors made on paper, plastics and even textiles, materials that are readily available, inexpensive and flexible.What’s gating our progress right now is manufacturing infrastructure. At present, researchers are using inkjet printers, 3D printers, etc. to manufacture prototype sensors, but in most cases, they would need to move to roll-to-roll printing to scale up. I think that we’re looking at a decade before we see these sensor technologies reach the mass market.When they do arrive, we’ll see sensors that we can easily affix to any kind of carton, wrapper or packaging used with food or other disposable items. Traceability and status of perishable items in particular will allow consumers to track food from the farm or factory to the warehouse, store and, finally, to the home.Implementing these kinds of sensors would also help the environment. According to the Natural Resources Defense Council, in the United States alone up to 40 percent of our food is wasted annually, in part because we fear it’s gone bad. If consumers feel assured that their food is safe, they will waste less. And wasting less means that we can grow less food to feed the same number of people. We’ll also reduce the volume of food waste that goes to landfills.SEMI: What can the MEMS industry do to promote the use of more environmentally friendly materials in its products?Fitzgerald: Some of this is already underway. More companies in our industry are adopting Restriction of Hazardous Substances (RoHS) standards to get rid of heavy metals, such as lead, cadmium or other hazardous materials, in their electronics.We could also produce disposable sensors on paper or on biodegradable plastics, which would decompose within a few months, and we could use safer metals, such as gold, magnesium or zinc, to reduce hazardous metals’ contamination in landfills. While it’s not feasible to make all sensors biodegradable, the market for such sensors could be massive.As companies (and individuals), we should also work hard to design electronics that consume less power, because this ultimately translates to fewer disposable batteries in landfills.SEMI: What would you like MSEC attendees to take away from your presentation?Fitzgerald: I’d like to make two main points. First, the trend to use other non-silicon materials to make MEMS and sensors is real and inevitable. It’s a matter of when. Anyone building a gas or chemical sensor on silicon should look at how to do it on paper or plastic because there are great future applications incorporating flexible, disposable sensors in packaging of all types. That’s the low-hanging fruit.Second, to support this technology development trend, we must look seriously at manufacturing infrastructure because we will need completely different sets of equipment, environments and consumable materials to manufacture MEMS and sensors on paper or plastic. Sensor manufacturers could prepare for this future expansion by beginning to collaborate today with companies that already produce paper and plastic goods. Alissa Fitzgerald, Ph.D., founded A.M. Fitzgerald Associates, LLC (AMFitzgerald), a MEMS and sensors solutions company, in 2003. She has over 20 years of engineering experience in MEMS design, fabrication and product development.Prior to founding AMFitzgerald, Fitzgerald worked at the Jet Propulsion Laboratory, Orbital Sciences Corporation, Sigpro, and Sensant Corporation, now part of Siemens. She received her bachelor’s and master’s degrees from MIT and her doctorate from Stanford University, in Aeronautics and Astronautics. Fitzgerald has numerous journal publications and holds eight patents. She served on the Governing Council of MEMS Industry Group from 2008-2014 and was inducted into the MIG Hall of Fame in 2013. Fitzgerald serves on the Board of Directors of both Rigetti Computing and the Transducer Research Foundation.For more information, please visit AMFitzgerald.MEMS Sensors Industry Group (MSIG), the industry association representing the global MEMS and sensors supply chain, hosts the annual MEMS Sensors Executive Congress. To learn how MSIG enables professionals in the MEMS and sensors industry to innovate, address common challenges and accelerate business results, visit us today.Maria Vetrano is a PR consultant for MSIG, a SEMI Strategic Association Partner.
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Smart cities of the digital future will employ systems enabled by MEMS and sensors in wide-ranging ways. From wearable sensors that monitor personal health and wellness and environmental sensors that assess air quality to autonomous micro-transit systems that are efficient and environmentally sustainable, MEMS and sensors are critically important to living in smart societies.SEMI’s Nishita Rao spoke with Albert P. Pisano, Professor and Dean at UC San Diego Jacobs School of Engineering ahead of his October 24 closing keynote presentation, MEMS and Systems in the Digital Future, at MEMS Sensors Executive Congress, October 22-24, 2019, at Coronado Island Marriott Resort Spa in Coronado, Calif.Join us at MSEC to meet Albert Pisano and other industry influencers driving MEMS and sensors innovations. Registration is open.SEMI: What are some of the most important large-scale system needs of the digital future – and why is MEMS so important in meeting these needs?Pisano: My vision of the digital future is an optimistic one, in which technology is used to assist people in their pursuit of health and happiness. In that digital future, I expect disruption in several key industries that depend on large-scale systems enabled by MEMS – healthcare, retail, transportation and education.Driving these disruptive forces across all four industries is the demand for more relevant real-time information, collected via inconspicuous technologies. Small in size and weight and low in power consumption, what technology other than MEMS delivers these combined attributes?SEMI: How do you envision MEMS in smart cities? What applications and devices will change the human experience in cities?Pisano: Smart cities, by my definition, are cities in which the four basic industries – healthcare, retail, transportation, and education – are implemented in their disrupted form.Take healthcare, for example. The adoption of MEMS chemical sensors in a wearable format will revolutionize human health monitoring. These sensors will not only improve individual health but also mitigate the spread of disease.In transportation, the coming of semi- or fully autonomous vehicles (as well as the general upgrading of all mass-transit vehicles) will give commuters additional time to pursue their interests while en route. A coming revolution of data connectivity to all vehicles will spur the rise of work, study and entertainment options available to people in transit. MEMS in the communication channels as well as in the vehicles will play an essential role in streaming personal data to travelers.SEMI: Could you help us visualize a disruptive application in one of these industries, say healthcare? Pisano: Healthcare is a particularly compelling area because MEMS offers life-enhancing, even life-saving, functionality that will significantly improve the quality of life of some people. MEMS allows us to design consumable wearable sensors that allow individuals to unobtrusively and non-invasively obtain biochemical data, such as potassium, sodium and sugar levels in the body fluid, as well as metabolic indicators such as lactic acid. Further, MEMS-based devices can perform EKG and EEG functions as well as monitor blood pressure in deep body veins in non-medical settings. This higher level of medical-grade data (not just casual data such as an approximate number of steps taken) will allow departments of public health to identify the early onset of individual disease.SEMI: What new forms of wireless communications will affect MEMS-enabled systems in the digital future?Pisano: Most visions of a digital future include wireless communication, but as the spectrum becomes ever more crowded, and as the need for unregulated, negotiated spectrum access increases, we will experience greater pressure to consider other forms of communication, such as inductive, optical and sonic. MEMS sensors are the only technical alternative to these other forms of communication in that they provide acceptable SWAP (size, weight and power). This will spawn battery-powered solutions with significant operational time. A good example is wireless telemetry of human physiological data from the skin. Only MEMS technology can reduce sensor-consumed power to below one microwatt. At this low level, energy harvest from the skin itself is sufficient to power the sensor!SEMI: How is the UCSD campus a living laboratory for intelligent sensing devices and systems?Pisano: Progressive universities, such as the University of California San Diego, understand that they are microcosms of small cities. They have populations during the day of approximately 65,000 people, a myriad of vehicles and a concentrated group of people.Many functions on campus mirror that of a small city. Lecture halls are similar to movie theatres. Student stores and centers are similar to shopping malls. Student residence halls are similar to apartment houses. Many campuses have medical centers, with their own emergency health services and hospitals. As a microcosm of a small city, it is only natural to think of the university as a wonderful living laboratory that allows us to test out new technologies at scale.Clearly, autonomous transit and wearable sensors have potential for uptake in this community. And that’s just scratching the surface. Package delivery (dinner to a dorm room, perhaps?), parking-spot location assistance, and even location-independent data streaming for classroom lectures are just a few possible examples of applications that we can test in a university environment.SEMI: How can the MEMS and sensors industry help researchers and innovators realize the digital future?Pisano: As a MEMS practitioner for almost 30 years, I fully understand the need to focus at the device level to ensure that the MEMS design meets SWAP and other requirements. But I truly believe that MEMS designers must learn to think more about subsystem and system issues, since the future of MEMS will be won by those who cannot only design the device right, but who can design the right device. By taking a much more market- and system-oriented approach to MEMS design thinking, companies in this industry will realize greater success.Register now to connect with Albert Pisano at MSEC and visit his UCSD page for more information.Albert P. Pisano, Ph.D., began his service as Dean of the Jacobs School of Engineering in 2013. He holds the Walter J. Zable Chair in Engineering and serves on the faculty of the departments of mechanical and aerospace engineering and of electrical and computer engineering. Pisano is an elected member of the National Academy of Engineering for contributions to the design, fabrication, commercialization, and educational aspects of MEMS, and is a Fellow of the ASME.Prior to his appointment at UCSD, Pisano served on the UC Berkeley faculty for 30 years, where he held the FANUC Endowed Chair of Mechanical Systems. Pisano was the senior co-director of the Berkeley Sensor Actuator Center (an NSF Industry-University Cooperative Research Center), director of the Electronics Research Laboratory (UC Berkeley’s largest organized research unit), and faculty head of the Program Office for Operational Excellence, among other leadership positions. From 1997 to 1999, Pisano was a program manager for the MEMS Program at the Defense Advanced Research Projects Agency (DARPA). Pisano held several research positions prior to joining academia.Pisano is a co-inventor listed on more than 36 patents in MEMS and has co-authored more than 400 archival publications. Pisano also is a co-founder of 10 startup companies in the areas of transdermal drug delivery, transvascular drug delivery, sensorized catheters, MEMS manufacturing equipment, MEMS RF devices and MEMS motion sensors. Visit his faculty page to learn more about his research interests.MEMS Sensors Industry Group, a SEMI technology community representing the global MEMS and sensors supply chain, hosts the annual MEMS Sensors Executive Congress. To learn how MSIG enables professionals in the MEMS and sensors industry to innovate, address common challenges and accelerate business results, visit us today.Nishita Rao is marketing manager for technology communities at SEMI.
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Software for sensors has evolved from simply reading out and evaluating sensor data to making intelligent decisions based on that data, a transformation enabled by new software synthesis and artificial intelligence (AI) technologies. Together, they make consumer devices smarter, dramatically improving the user experience through greater interactivity and higher levels of automated personalization.SEMI’s Nishita Rao spoke with Stefan Finkbeiner, CEO and General Manager at Bosch Sensortec, who will explore the topic in his October 23 keynote, How Software Makes MEMS Sensors into Smart Systems, at MEMS Sensors Executive Congress (MSEC), October 22-24, 2019, at the Coronado Island Marriott Resort Spa in Coronado, Calif.Join us at MSEC to meet Bosch Sensortec and other industry influencers driving MEMS and sensors innovations. Registration is open.SEMI: What is the relationship between MEMS sensors suppliers and specialized software synthesis providers?Finkbeiner: Collaboration is a key driver for innovation in sensor software. There are already several fruitful collaborations between MEMS sensors suppliers and specialized software providers, which are mostly startups. Collaborations with providers of simulation and evaluation tools as well as with well-known universities in the field of AI are starting to show positive results.Domain expertise is also critical for developing smart sensor software, making it essential to future sensing solutions.SEMI: How does software synthesis relate to sensor fusion?Finkbeiner: Put simply, software synthesis refers to ways of automatically generating code based on domain knowledge and given constraints for specific product versions. Sensor fusion combines sensor data from different kinds of sources in order to improve the results.Software synthesis techniques enable a level of automation that creates new opportunities for more complex sensor fusion, which was formerly out of reach when using traditional approaches that involved, for example, big data and a large number of potential data sources.The traditional sensor fusion toolset can now be further extended by machine learning techniques that help to determine which sources are more reliable than others and how to combine data streams. This topic and others are still active areas of research. A wearable device with motion detection is a case in point. With unsupervised learning, the device could identify short versus long cyclically repeating motions and treat them differently from other types of motion. SEMI: How is the new software synthesis-AI approach different from previous approaches? To what degree will the new approach open up new applications?Finkbeiner: Traditionally, technology companies have used cloud computing for data storage and machine learning on aggregated user data. In that model, MEMS sensors generate large amounts of data that power-hungry hardware (such as digital signal processors) must process. In addition, machine learning generally requires lots of power-hungry cloud nodes with GPUs. This model, however, is not the best option for many users. Just think for a moment about all the scenarios in battery-powered devices where frequent battery charging frustrates users.Leveraging both software synthesis and AI techniques in MEMS sensors is therefore a very promising approach because it supports improved recognition and learning inside the sensor. This means that user-specific data isn’t transferred to the cloud. Instead, it remains private inside the sensor. This improves existing applications that learn all the time and opens up new opportunities for applications such as smart clothing, predicting a product’s lifespan, detecting whether a window or door is open or closed – all without server connectivity.SEMI: How will such software adapt to the individual user?Finkbeiner: Devices will offer much more personalized information to users. For example, optimizing a step counter to match the height, age or Body Mass Index (BMI) of a user – or to adapt to a user’s environment (is the person running on a beach, hiking up a mountain or strolling in a park?) – will provide more accurate information on calories burned. Not every step is created equal, and both pre-loaded personal data as well as real-world environmental data will prove that some steps consume a lot more energy than others.SEMI: What would you like MSEC attendees to take away from your presentation?Finkbeiner: I want to introduce the journey of software development by illustrating specific use case examples. I would also like to offer my outlook on the role of software and AI in MEMS sensors to help increase their adoption in current and new applications. Ultimately, I think it’s important to raise awareness in our industry on why we should embrace the use of software and AI.Connect with Stefan Finkbeiner at MSEC or via LinkedIn. Get more information on Bosch Sensortec products and solutions online.Stefan Finkbeiner, Ph.D., CEO and General Manager, Bosch Sensortec, was appointed CEO of Bosch Sensortec in 2012. He joined the Robert Bosch GmbH in 1995 and has been working in different positions related to the research, development, manufacturing, and marketing of sensors for more than 20 years. His senior positions at Bosch have included director of marketing for sensors, director of corporate research in microsystems technology, and vice president of engineering for sensors.Finkbeiner received his Diploma in Physics from the University of Karlsruhe in 1992 before studying at the Max-Planck-Institute in Stuttgart, where he earned his Ph.D. in Physics in 1995. In 2015, Finkbeiner received the prestigious lifetime achievement award from the MEMS Sensors Industry Group (MSIG), a SEMI technology community.Bosch Sensortec is a member of MEMS Sensors Industry Group, the industry association representing the global MEMS and sensors supply chain. To learn more about how MSIG enables professionals in the MEMS and sensors industry to innovate, address common challenges and accelerate business results, visit us today.Nishita Rao is marketing manager for technology communities at SEMI.
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