MEMS & Sensors Industry Group

The air we breathe is precious yet neglected as anthropogenic pollutants continue to pour into the earth’s atmosphere. Still, there’s hope that greenhouse gas emissions – and the human behavior behind them – can be brought under control for the good of the planet with the help of gas sensors that gauge pollutant levels.Of the many air pollutants, some are more detrimental to our health than others. Figure 1 lists the top seven pollutants, their chief sources and health effects. The Air Quality Index is calculated by combining values from particles and four gases (carbon monoxide, ozone, sulfur dioxide, nitrogen dioxide). The good news is that gas sensors are available in the market that can monitor each of those pollutants.Figure 1 – Top seven pollutants and their health effects. Source: EPA Air Sensor Guidebook The challenge is that many gas sensor end users today have little understanding of how to compare the performance characteristics of sensors offered by various vendors. SEMI is working to help end users clear that hurdle. SEMI-MSIG this year created a group within its Device Working Group focused on developing gas sensor standards aimed at growing the market and defining guidelines affecting areas including testing methods, reliability requirements, packaging and communication interfaces. Importantly, the standards will also make it easier for end users to make a clear choice among rival products.The SEMI-MSIG Device Working Group comprises devoted experts from leading gas sensor companies as well as OEMs. We welcome companies involved in deploying gas sensors to join this fast-growing group to improve air quality standards in sectors including residential construction, factory automation, automotive, consumer electronics and healthcare. One potential market is consumer electronics such as smart phones since concerns about air quality is growing among device users.The MEMS Sensors Industry Group (MSIG) Device Working group was formed in early 2019. Its mission is to develop a series of technical specifications, industry standards and best practices for MEMS and Sensor devices and platforms. The goal is to advance the use and expansion of MEMS and sensors worldwide.Table 1 – Top seven pollutants and their health effects. Source: EPA Air Sensor Guidebook In the past, we focused on inertial sensors (See IEEE2700 standard for inertial sensors as an example of an output of this team). In 2020, our focus shifted to gas sensors and we plan to expand our work to include other types of sensors in the near feature. Industry leaders such as Bosch, TDK Invensense, Renesas, Infineon, Analog devices, STMicroelectronics, GE and Intel meet every month to strategize on a series of initiatives.If you’re interested in joining the SEMI-MSIG Device Working Group, please contact Carmelo Sansone, Director of MEMS Sensors Industry Group.The MEMS Sensors Industry Group (MSIG) is a SEMI technology community that enables the MEMS and sensor industry to address common challenges, innovate and accelerate business results.Carmelo Sansone is director of the SEMI-MSIG. He has focused his career on building products and system solutions that have large impact in the marketplace. Sansone launched several sensor processor platforms for low-power applications, including the first microcontrollers with DSP capabilities, the core of today’s portable devices intelligence. Sansone has led the successful integration of the MSIG organization into SEMI by expanding its services and global reach. Carmelo holds a master’s degree in Electronic Engineering with a specialization in Biomedical from the University of Pisa and an MBA from Golden Gate University, San Francisco.

COVID-19 has had an impact on the entire healthcare market. During the peak of the first wave, companies from the industrial and automotive sectors worked on repurposing their sensors and production lines to provide pressure sensors for respirators and temperature sensors for thermometers. At the same time, companies making sensors for wearables and other mobile devices used for remote monitoring of patients experienced saw increased demand, caused in part by the surge in telemedicine worldwide. In addition, strong demand for COVID-19 tests pushed diagnostic players to repurpose existing systems to detect the SARS-CoV-2 virus or associated antibodies. Over the past six months in particular, numerous microfluidic technologies have enabled either rapid point-of-care tests or high-throughput solutions for central labs. The demand for these tests is incredibly high (millions of tests per month are needed), which has contributed to boosting the revenue of many companies in the respiratory-testing area.These respiratory-testing companies have placed many testing machines at existing and new customer sites, and have sold an impressive number of test kits resulting in an initial revenue spike in Q1 2020, and even higher spikes in Q2 and Q3. This growth seems on track to last into early 2021 and beyond as the pandemic continues, the flu season arrives, and health organizations test increasingly higher numbers of people than they were several months ago. The winners in respiratory testing include Abbott, bioMérieux, Cepheid, GenMark and Luminex, among many others. In this context, Yole expects the point-of-care segment of the microfluidic product market to enjoy an impressive jump from US$4.5 billion in 2019 to US$6.3 billion in 2020, growing at 15.1% CAGR between 2019 and 2025 to reach $10.4 billion in 2025. This represents 40% of the total microfluidic product market in 2019.In its research on microfluidics, Yole tracks a wide range of COVID-19 tests from different companies. The tests are used to meet different needs. Evolution of COVID-19 TestingNo doubt this increased production of tests will be especially useful for the upcoming flu season. But what will happen next year, if (we hope) reliable COVID-19 vaccines are validated and marketed, and the new coronavirus eventually disappears? Will diagnostic companies’ sales fall to pre-pandemic levels, and all these investments in production lines be wasted? Don’t worry. This is not a one-shot deal: Once the pandemic is over, most testing machines will remain in place, and customers will use them to run other tests the companies offer – usually for other kind of infectious diseases – driving sales of single-use disposables in coming years. The pandemic has shown us that more efficient diagnostic tools are required. Rapid, inexpensive, widely accessible testing for infectious diseases is crucial if we are to face such challenging situations. The real struggle for diagnostic companies, especially in the field of microfluidics where recent platforms have a small assay menu, is placing instruments (i.e., the test machines that run the disposable cartridges and read the results) at customers’ locations, from hospital settings and urgent care to field testing sites, and this has now been achieved. This will drive consumables sales in the future, even beyond the pandemic, and take the microfluidic-based point-of-care testing market to the next level. Rapid point-of-care testing is driving growth in microfluidics and will continue to do so for years to come. In the meantime, new significant opportunities are opening for point-of-care diagnostic test-makers, and rapid, miniaturized microfluidic technologies may be the winners here. Rapid passenger screening in airports, and rapid employee or visitor screening at the workplace will become essential for preventing the virus’ spread. In total, this could represent billions of rapid tests needed per year. COVID-19 has slowed down business growth in many areas but has really helped microfluidic-based point-of-care diagnostics take it to the next level, and this is only the beginning.For more information on Yole’s microfluidics activities, please view Yole’s reports, Point of Need 2020 – Including PCR-Based Testing or Status of Microfluidics Industry 2020 or visit i-Micronews.comYole Développement is a member of SEMI and the MEMS Sensors Industry Group (MSIG), a SEMI technology community that connects the MEMS and sensors supply network in established and emerging markets enabling members to grow and prosper. Visit us today. Sébastien Clerc is a technology and market analyst in Microfluidics, Sensing Actuating at Yole Développement (Yole). As part of the Photonics Sensing team, Clerc has authored a collection of market and technology reports dedicated to microfluidics and other micro-devices for major market segments: medical (including diagnostics, pharmaceutical, biotechnology, drug delivery, medical devices) and industrial (including environment, agro-food). At the same time, he is involved in custom projects such as strategic marketing, technology scouting, and technology evaluation to help academic and industrial players in their innovation processes. Thanks to his technology and market expertise, Clerc has spoken in more than 20 industry conferences worldwide over the last four years. Clerc holds a master’s degree in Biomedical Technologies and a master’s degree in Innovation and Technology Management, both from Grenoble Institute of Technology (Grenoble INP - Grenoble, France).

PNI Sensor, a member of the SEMI-MSIG Positioning, Navigation and Timing (PNT) Technical Advisory Council, is developing advanced tracking systems that promise to increase industrial worker safety.The availability of low-cost GPS jamming and spoofing technologies renders GPS-only solutions for location and navigation an increasingly dangerous and ineffective choice for the dismounted soldier in a battlefield environment. This threat to armed forces has spurred development of new self-contained location and navigation technologies for defense applications — an innovation that offers significant advantages for commercial applications.Though not as complex and mission-critical as in defense, self-contained location technology is also essential in commercially available industrial applications. That’s particularly true for workers in industrial sectors such as utilities, mining, and construction, and in environments with lone or remote workers, such as first responders. While jamming and spoofing are not a threat in the industrial sector, determining the precise location of workers in GPS-denied environments is fundamental to ensuring their safety. This makes it a priority to adapt any self-contained, non-infrastructure-based location technology — which was first developed for the modern dismounted soldier — to industrial applications.Bodies in MotionInertial solutions are very difficult to implement properly, even without the challenges uniquely created by human motion dynamics. On a construction site, for example, workers tend to cover a wide range of disciplines: supervisors, electricians, iron workers and equipment operators, among others. While performing their jobs, construction workers change locations, both indoors and outdoors, and perform dynamic motion such as crawling, ducking and climbing. These are all motions that are very difficult to model using traditional adaptive filtering techniques, which are typically applied in vehicular inertial navigation platforms, such as aircraft, ships and tanks. Even if existing inertial navigation systems could be made size, weight, power and cost (SWaP-C)-compatible to be body-worn, their performance accuracy would still need to satisfy the application’s requirements. To properly determine a worker’s precise location to ensure safety on job sites and in remote locations, we must tackle the combined challenges of SWaP-c and human dynamic motion. That’s the most effective approach for creating a complementary positioning technology that augments GPS or other infrastructure-based location systems.To address these challenges, we need to build a high-performance inertial measurement solution using commercially available MEMS inertial sensors. The issues of bias drift error and low sensitivity have traditionally made such sensors practically useless for any meaningful inertial tracking. Fortunately, this is no longer the case. We now have sensors that already conform to the necessary SWaP-C requirements for the application, and have the additional advantage of high dynamic range of measurements without saturation errors, which helps to reduce high-force and rapid movement-induced errors, promoting greater accuracy.Thus, a path forward is emerging. The current generation of high-performance MEMS gyros can now inertially track workers’ locations to step-level resolution very well for up to 30 minutes — without significant location errors due to bias or scale errors. That’s an order of magnitude better than previous generations. With the new MEMS gyros, errors typically remain less than 2% of distance travelled over that time period. Strategically applying algorithm improvements with higher levels of magnetic corrections has the potential to bring that accuracy down even lower, to less than 0.5% of distance traveled for durations of one hour or more. What’s more, the improved gyro and accelerometer bias, gain, and signal-to-noise (SNR) performance allows for better magnetic anomaly rejection. This enables finer and more sustained gyro bias corrections in the fused solution, which creates a system greater than the sum of its parts. We believe that these newer systems will promote greater worker safety at a truly affordable price.PNI Sensor, a member of the SEMI-MSIG PNT Technical Advisory Council (TAC), is developing a tracking system that combines the best elements of the newest-generation MEMS devices with an electronic compass that uses advanced magnetic anomaly detection and rejection algorithms. Based on PNI’s latest attitude and heading reference system (AHRS), the novel PNT system employs a unique Kalman algorithm that intelligently fuses its reference magnetic sensors with gyros and accelerometers. In conjunction with this work, PNI Sensor has developed advanced pedometry functionality for use in its tracking system for very high dead-reckoning tracking performance used in defense industry applications. PNI is initially designing that system to track dismounted soldiers and special forces operating in GPS-denied or contested environments.For more information about PNI Sensor’s advanced location and navigation technology, please visit PNI Sensor. To learn more about the SEMI-MSIG PNT TAC, please contact Carmelo Sansone, director, MEMS Sensors Industry Group.George Hsu is a founder and CTO of PNI Sensor. He has focused his career on the sensor industry, having invented several magnetic sensor breakthroughs, including the magneto-inductive technology, the core of today’s electronic compassing in the automotive, consumer, scientific and military markets. Hsu is a graduate of Stanford University School of Engineering, holds several patents, and is a much-published author of technical articles on sensor theory, design and applications. He is an active member of the MEMS Sensors Industry Group PNT TAC.About the SEMI-MSIG Positioning, Navigation and Timing ProjectMEMS Sensors Industry Group (MSIG) created a member-based PNT TAC to identify and pursue PNT system innovations for GPS-denied environments. To that end, MSIG solicited proposals from its membership for the SEMI-MSIG PNT Project, a U.S. Army Research Laboratory-funded R D project. PNT committee members that have secured funding are pursuing R D platforms that improve accuracy and performance. Platforms may include software, hardware, and advanced packaging requirements of optical and MEMS-based positioning and timing systems.

Semiconductor process development is no easy task, with each generation of devices more difficult and expensive to create. Traditional cycles of build-and-test development are becoming obsolete, since they are too expensive and time-consuming for the most advanced processes.The High Cost of Process DevelopmentMost chip designers developing new products rely on existing manufacturing processes, but someone had to create those processes to make the designs possible. The goal of process development is to create new semiconductor manufacturing processes that provide high yield while achieving the required device performance. In contrast to new chip design, however, it requires an entirely different set of engineers and skills.The traditional approach to process development involves building multiple test wafers to determine the ideal process for a given device. After one set of wafers is fabricated and analyzed, insights from the previous round help to refine process steps for another round of fabrication. Due to smaller feature sizes, each new process generation is more sensitive to variation. This adds even more complexity because smaller feature sizes and parasitic effects require more measurements and testing as well as additional fabrication. The cycle is repeated many times before the entire process flow can be finalized, making it time- and cost-intensive, especially for the most advanced technology nodes.Testing Virtual Wafers Instead of Real WafersToday, there is an alternative to this slow, expensive way of doing things. Virtual fabrication lets computers simulate all of the processing that occurs when real wafers are built. These virtual models allow semiconductor process engineers to test manufacturing equipment settings with far greater variation than is possible in a physical fab. Designers can simulate the entire process flow, running the equivalent of thousands of wafers in days instead of months. Designers can quickly see graphical animations to visualize process steps, modify process recipes and device geometries, and measure how these changes affect electrical behavior.Improving Yield Using Statistics in Virtual Wafer FabricationBecause of the high volume of data generated, designers are turning to statistical analysis to provide greater confidence in their choice of process settings. Defects and random variations can be modeled in a virtual fab in a way that’s not possible in a real fab, letting developers test the sensitivity of the device structures against the unpredictable aspects of processing.There’s more than one approach to optimizing the process settings used in a new memory or logic fabrication sequence. The simplest one involves taking a single variable and exploring its effects. Critical dimensions (CDs), for example, establish those feature sizes of a device that ensure desired electrical performance. A particular dimension can be swept from low to high values – developers can then measure the effects of that range on device behaviors such as threshold voltage. This allows developers to ensure that the electrical behavior of their device design addresses the range of expected feature sizes and variability. The interactions with intersecting process steps can also be tested for further validation, since these interactions can lead to unanticipated device performance.But, in reality, this approach isn’t sufficient for studying the complex web of interactions between process steps and the resulting structures.A second approach leverages Monte Carlo analysis, randomly varying a wide range of process and device parameters and calculating the resulting device geometry and performance. This data can be used to automatically identify the process and design settings needed to achieve yield and performance goals. It’s an area where simulation shines, providing a useful way to test the interactions between many different processes.Statistical experiments using virtual fabrication illustrate step-by-step methodology to optimize process and design settingsVirtual Fabrication PlatformSEMulator3D is a virtual fabrication platform created by Coventor, a Lam Research company. It allows the definition of all process steps, the modeling of devices, the collection of metrics, electrical and device analysis, the statistical analysis of results, and the visualization of process steps through graphical animation. Today, semiconductor companies use it for both optimizing and scaling leading process nodes and for developing advanced new technologies like GAA (Gate-All-Around) transistors.The ability to do this work virtually is the future of semiconductor process development. Virtual fabrication accelerates new process time-to-market by months, opening up market opportunities worth hundreds of millions of dollars for semiconductor companies.Visualization of process steps of a Gate-All-Around transistor shows 3D construction in SEMulator3D. To learn more about virtual fabrication and how it’s changing the future of semiconductor technology development, download our whitepaper Speeding Up Process Optimization with Virtual Fabrication.Lam Research is a longtime member of MEMS Sensors Industry Group®, (MSIG), a SEMI technology community that connects the MEMS and sensors supply network in established and emerging markets, enabling members to grow and prosper. Visit us today.David M. Fried, Ph.D., is vice president of Computational Products at Lam Research, where he is responsible for the company’s strategic direction and implementation of virtual process solutions, including the Coventor SEMulator3D virtual fabrication 3D process modeling solution. Fried leads the execution of technology strategy for technology platforms, partnerships, and external relationships. His expertise touches upon such areas as Silicon-on-Insulator (SOI), FinFETs, memory scaling, strained silicon, and process variability.Fried is a well-respected technologist in the semiconductor industry, with 60 patents to his credit and a notable 14-year career with IBM, where he was involved in successive process generations from 65-nanometer and lower. His most recent position was 22nm chief technologist for IBM’s Systems and Technology Group. He holds bachelor’s, master’s and doctoral degrees in Electrical Engineering from Cornell University.Republished with permission from Lam Research.

Call it a wild guess, but I suspect I am not the only follower of the automotive industry who is tired of reading articles that lament the impact of Covid-19 and speculate, to varying degrees of accuracy, what kind of recovery is in store for major automotive markets around the world.I’m much more interested in what solutions and creative approaches people, companies, and countries have come up with to make cars smarter and safer despite the pandemic or even because of it.A friend of mine who works at a major European vehicle OEM told me that “innovation cannot, must not stop – despite current difficulties.” This sentiment echoes through the automotive supply chain, particularly in the resilience of the semiconductor industry during these challenging times.The recent publication of the AspenCore Guide to Sensors in Automotive – Making Cars See and Think Ahead is a refreshingly positive and inspiring collection of articles, interviews, technology deep dives and business news, all carefully curated and edited by AspenCore Global Editor-in-Chief Junko Yoshida.One article I particularly enjoyed was her “6 Trends on ‘Perception’ for ADAS/AV.” The insights she was able to gather from experts attending the AutoSens show in Brussels are fascinating, even if consensus on what, exactly, will be the winning “robust perception” solution appears to be far off. This is only fitting with so many companies elbowing for that prime spot!Another feature article that stood out was Nitin Dahad’s “Level 5 AVs Unlikely Before 2035” article. It wasn’t so much the longer ramp to full autonomy that caught my eye but the daunting challenge the automotive industry and AVs have to tackle: “…all possible unusual driving situations under all driving conditions and in all environments.” This is truly a mind-boggling undertaking. The author argues that the road to Level 5 “is likely to be paved gradually, as more advanced driver-assistance features come to market.” Sounds reasonable.Both these articles point to the need for collaboration across the automotive electronics supply chain in order to not only sustain the pace of innovation, but accelerate it, as we face our current challenges. This made me think about the SEMI Smart Mobility initiative and how the great minds supporting it might be able to help. The initiative is designed to bring together automotive OEMs, Tier 1s, device makers, design houses, equipment and materials companies as well as R D institutes to address shared challenges and opportunities.SEMI used to stand for Semiconductor Equipment and Materials International, but over the past several years – and driven by the advent of IoT, AI, and everything “smart” – we now represent the entire electronics manufacturing and design ecosystem, with more than 2,400 member companies on our global roster. We created the Smart Mobility initiative in late 2017 with the initial goal of connecting a substantial number of members to new business opportunities involving rapidly rising silicon content in automotive. IHS Markit projects automotive semiconductor revenue to continue to grow at a 6% CAGR to 2026.Over the past 2 ½ years, the initiative has quickly evolved into a global platform connecting the semiconductor, sensor and automotive electronics ecosystem under one roof – the Global Automotive Advisory Council or GAAC. While “silicon content” is still the operative word for many of our core members, the Council’s mission is to address opportunities and challenges that impact more than one segment of the value chain. For example, the challenge of getting to zero defects involves just about every stakeholder – from contamination control in wafer carriers to ensuring device reliability and robustness to packaging and, ultimately, system integration in the car.SEMI also encompasses a number of Technology Communities that provide deep technical expertise in support of the GAAC’s mission. Member companies in our MEMS Sensors Industry Group (MSIG) are directly engaged in and contributing to the GAAC work. GAAC Europe Chapter - Participating Companies“Sensorizing” – making things smarter through the application of sensors – has created solutions for the automotive and mobility space that bring innovation, safety, security and comfort to driver and passenger and that benefit the environment around the car.This makes the AspenCore Guide to Sensors in Automotive a great resource for our members and SEMI staff as we collaborate to accelerate the drive toward Level 5 autonomy.If you are interested in learning more about SEMI’s Smart Mobility and the GAAC, please contact Bettina Weiss, Chief of Staff and Global Smart Mobility Lead at [email protected] with permission from EE Times.

Connectivity. Electrification. Shared Mobility. Autonomous Driving. McKinsey Company cites these four disruptive trends behind future mobility — dynamics that could help to transform quality of life for hundreds of millions of people.McKinsey Company predicts that by 2030, mobility innovation could dynamically alter everything from safety in human locomotion to air quality, public spaces and power systems. Much the same way that tiny plankton in our oceans sustain aquatic animals, MEMS and sensors, while small, are crucial building blocks of integrated mobility.As partner at McKinsey Company, Andreas Breiter will explore this connection during his MSEC 2020 presentation, Future Mobility Enabled by Sensorization. SEMI recently caught up with Breiter to preview his October 7 talk at SEMI’s first virtual MEMS Sensors Executive Congress, October 6-8 and 13-15, 2020.Register now for MSEC 2020 and explore this topic with Breiter during the live Q A portion of his presentation.SEMI: You play a dual role at McKinsey Company, advising clients in advanced industries on capital investments and serving on the leadership team of the McKinsey Center for Future Mobility (MCFM). What is the relationship between them?Breiter: Mobility has become so much more than the auto sector. Today when we say future mobility, we’re talking about the convergence of many exciting developments influencing the ways that people and goods move around. Cars have become computers, and we now have to contemplate new frontiers, such as air taxis and electric vehicle infrastructure.Mobility is changing so quickly that it’s inspiring decision-makers from other market sectors to explore what implications it will have for them. We’re helping mining companies think about their haulers, retailers think about their footprints, and insurance companies plan for autonomous vehicles. The MCFM exists as a global think tank to focus on these frontier topics, helping to ensure we are ready for the future. During my MSEC presentation, I’ll explore how those future topics are influencing automotive mobility in the short- and long-term. The MCFM is even more forward-looking, so we’re just starting to build scenarios for what might come in 2040 and beyond.SEMI: How are changes in the mobility ecosystem affecting the automotive value chain?Breiter: In the past, the automotive value chain was clearly structured. We had sensor companies selling to Tier 1 suppliers, who would in turn sell to OEMs, who would sell directly to end customers.The value chain has grown more complex, however. In the future, we might see fleets of robotaxis, which will be owned by companies instead of by individual consumers. Already today, rideshare companies are game-changers because consumers can travel by car without owning one.Plus we see companies offer parts of the user experience such as user interfaces for automotive infotainment. In the past, everything in the car was branded by the OEM, but now we have third-party platforms that let us control some of our automotive infotainment options.SEMI: How are MEMS and sensors suppliers participating in this new value chain?Breiter: The pervasive use of sensors in cars has driven automotive OEMs and Tier 1 suppliers to work directly with suppliers, whose close involvement eases the complexity of integration. Just think about the sensors used in autonomous driving. Getting that right is safety-critical.We’re also seeing suppliers go beyond the individual component level to provide complete systems-level solutions. Advanced driver-assistance systems (ADAS) are a good example.SEMI: Automotive applications tends to have some of the longest design-to-delivery cycles in industry. Will this ever change?Breiter: The automotive product lifecycle was typically five-plus years, with a few years of development before that and continued service after the end of the lifecycle. That gives MEMS and sensors suppliers a 10+ year timeline on one model.With so much innovation taking place, this slow cycle won’t work forever. Over-the-air (OTA) updates, for example, enable new features when they become ready for deployment. I expect we’ll see OTA updates from many end manufacturers in coming years. SEMI: What changes do you foresee in ADAS and autonomous driving?Breiter: ADAS and autonomous features will become much more common. We’ve already witnessed this progression, with introductions first in premier models and later rolling out in more affordable vehicles. Lane-change assist and rear camera followed this path and are now pretty standard. Collision avoidance, as a safety-critical feature, is likely next in line for more widespread adoption.As for fully autonomous driving, consumers will accept that only when it becomes safer than a human driving a car.SEMI: Where is the greatest opportunity in the next five years?Breiter: Electrification of vehicles is number one. When it comes to engines, we’re moving from internal combustion to hybrid and then to electric. Since OEMs are adding sensors for the battery system, for battery management, and for electric motors, this progression represents growth opportunity for sensors suppliers – in particular for hybrid vehicles that contain both powertrain technologies.But that’s not all when it comes to sensors. Outside of powertrains, new sensors are added to enable a variety of functions, including, for example, ADAS and autonomy, as well as increased interior content, such as mood lighting.SEMI: Is there anything surprising coming, sensor-wise, in mobility?Breiter: To enable intelligent traffic systems, you need to make infrastructure smarter — which brings us to sensors. We’re going to see roads and other assets in infrastructure sense the state of traffic, sense what traffic participants are doing, and support connectivity between, for example, the infrastructure, vehicles on the ground, pedestrians on walkways and drones in the air.SEMI: What would you like MSEC attendees to take away from your presentation?Breiter: We’re living in a transformative era for the mobility industry. During the last 100 years of mobility, the ecosystem barely changed. In recent years, however, we’ve seen massive technological gains, largely enabled by semiconductors, MEMS and sensors. Instead of serving as just one of many suppliers, I’d encourage MSEC attendees to anticipate future mobility challenges so they can offer solutions to OEMs and Tier 1 suppliers accordingly.For more information, visit McKinsey Center for Future Mobility. MEMS Sensors Industry Group® (MSIG), a SEMI technology community that connects the MEMS and sensors supply network in established and emerging markets, enables members to grow and prosper. Visit us today.Andreas Breiter leads McKinsey’s capital-investment work for advanced industries in North America as well as its Center for Future Mobility on the West Coast. In his advisory work, Breiter serves a broad range of companies in the automotive sector, including car and truck manufacturers and their suppliers, as well as companies in the utilities and renewables space. He helps executives make strategic choices around product development and helps companies stay ahead of emerging trends, such as autonomous driving, connectivity, electric vehicles, and shared mobility.Andreas holds a Ph.D. in Operations Management and studied in Germany, France, the U.S. and Canada.Nishita Rao is product marketing manager at SEMI.

At the 1964 New York World’s Fair, Walt Disney and his team of Imagineers debuted Audio-Animatronics® in four attractions, Great Moments with Mr. Lincoln, General Electric Carousel of Progress, Ford Magic Skyway, and it’s a small world. As “a new type of animation” that Walt said was “so lifelike that you might find it hard to believe,” Audio-Animatronics captivated audiences, setting the stage for the technological innovation that would transform theme-park attractions for decades to come. While the Audio-Animatronics in classic Disney® attractions such as Enchanted Tiki Room and Pirates of the Caribbean® continue to delight park-goers, more modern attractions take full advantage of the miniaturized, sensitive enabling hardware components, software algorithms, and connectivity technologies that are available to today’s engineers.When Michael Tschanz, director of engineering technology and analysis, a segment within Disney Parks, Experiences and Products’ Global Engineering and Technology department, gives the opening keynote at MSEC 2020, SEMI’s first virtual MEMS Sensors Executive Congress (October 6-8 and 13-15, 2020), attendees will get a rare look inside the magic of select Walt Disney World attractions. Join MEMS Sensors Industry Group and SEMI on October 6 for Tschanz’s keynote presentation, Model-Based Design and Scientific Data Analytics of Disney Attractions — and experience video footage that you won’t see anywhere else. Register now for MSEC 2020.MEMS Sensors Industry Group® (MSIG), a SEMI technology community that connects the MEMS and sensors supply network in established and emerging markets, enables members to grow and prosper. Visit us today.In his role at Disney, Michael Tschanz leads a multidiscipline team which develops detailed mathematical and physics models for transportation, ride and animatronic systems, custom software and network applications, and robotics. The responsibilities for this team also include the development of optimization algorithms, servo controllers, interactive/immersive experiences, data analytics, and material process solutions. Michael’s rich and diverse background includes designs of numerous attractions at various Disney theme parks including: Test Track® Attraction; Mission: SPACE® Attraction; Toy Story Mania!® Attraction and the Expedition Everest® Attraction. Michael also designed all the velocity profiles at the worldwide locations of The Twilight Zone Tower of Terror™.Nishita Rao is product marketing manager at SEMI.

MEMS sensors have come a long way over the past few decades. The late 1990’s brought us the mass production of both MEMS accelerometers for automotive air bag crash sensors and MEMS gyros for rollover detection and anti-locking braking systems (ABS). In the early 2000’s, MEMS sensors made the jump from automotive to mobile and consumer electronics, first with a MEMS microphone in the wildly successful Motorola RAZR phone and then with a MEMS accelerometer in the first Nintendo Wii remote.Following this initial period of MEMS’ commercialization, the timetable for the mass proliferation of both MEMS and non-MEMS sensors accelerated dramatically. Just take Apple iPhone. Released in 2007, the first iPhone had one MEMS accelerometer and one proximity sensor. Released 10 years later, iPhone X included four MEMS microphones, a barometer, three-axis gyro, MEMS accelerometer and proximity sensor, an ambient light sensor and an infrared (IR) sensor, a magnetometer, and multiple image sensors. For perspective’s sake, well over two billion iPhones have been sold since 2007, making iPhone a major growth-driver in MEMS. According to Yole Développement[i] (Yole), MEMS will generate $10.9 billion in revenue in 2020 alone (non-MEMS sensor revenue will be even higher), spanning automotive, consumer and mobile, Internet of Things (IoT), medical and healthcare, aerospace, industrial and other markets.With so much growth behind us, what’s ahead? Jens Fabrowsky, executive vice president of Automotive Electronics at Robert Bosch GmbH, will share his insights on the future of MEMS during his MSEC 2020 keynote, The Next 10 Years of MEMS: An Outlook on Opportunities and Challenges. I recently spoke with Fabrowsky to preview his October 15 presentation at SEMI’s first virtual MEMS Sensors Executive Congress, October 6-8 and 13-15, 2020. Register now for MSEC 2020 and explore this topic with Fabrowsky by participating in the Q A segment of his presentation.SEMI: What are some of the primary challenges facing the MEMS industry?Fabrowsky: Development costs for new generations of MEMS sensors are increasing, leading to several major shifts. To compensate for rising development costs and reduce risk, MEMS sensors suppliers are pursuing wider, diverse markets instead of just targeting high-volume applications. At the same time, end-device manufacturers are demanding greater product differentiation, but they don’t want to pay a premium for it or wait for new hardware iterations. To stay competitive, sensor suppliers are providing software solutions that support new features and functionality. That approach is more cost-effective and speeds design-to-production cycles. SEMI: What factors are increasing development costs for new MEMS sensors, and what can companies do to mitigate their R D risk? Fabrowsky: As with most electronic components, MEMS’ costs are driven by development and capital expenditures. The increasing complexity of the content, especially in interface ASICs and software, makes MEMS development a multidisciplinary feat, requiring several competencies across multiple design centers to meet ever-demanding timelines.Manufacturing also plays a role. We often see dedicated manufacturing lines built for new MEMS products, which stresses both investments and capacity planning. Working together as an industry, we can reduce risk and costs by applying the same manufacturing process to more than one generation of product, which will speed time to market, increase volumes and improve ROI. SEMI: To what degree will the COVID-19 pandemic continue to affect sensors suppliers?Fabrowsky: MEMS manufacturing flows have been affected by disruptions in the supply chain. While the benefits of multiple sourcing and more direct ownership of the flow itself (on-shoring, vertical integration) have helped us, no one in the industry can claim they are out of danger, especially if a new wave of contagion occurs. Our industry relies heavily on just-in-time manufacturing and logistics, and we are all watching for influences that could alter flow. The pandemic has reminded us all that an important competitive advantage is a predictable, secure supply — which also comes at a cost that the end customer must value. SEMI: Why and how are traditional hardware companies like Robert Bosch differentiating their platforms for end-device manufacturers? Fabrowsky: On-shoring was already a trend before the pandemic. We’ve always believed in and are still investing in our own manufacturing facilities. That includes the 12-inch ASIC fab in Dresden, Germany, where we expect to manufacture future generations of power and control electronics to satisfy the growing appetite for silicon that vehicle electrification demands.We think that one of our biggest differentiators is that our portfolio includes more than just components: Close collaboration with our internal partner divisions gives us comprehensive system know-how across the automotive supply chain. On the consumer-electronics side, we have extensive partnerships with makers of application processors, wireless systems, and sensor processing software. With this expertise behind us, we can provide flexible system-integration options to our end customers — who also benefit from a mature supply chain that supports high volumes and field-tested quality.SEMI: What does customer demand for software solutions mean for sensor suppliers and how will suppliers evolve to meet this need? Fabrowsky: In some silicon product business units, the R D effort to develop software is higher than the effort to design the hardware! Software is not only what’s needed on the application layer. It also runs the interface to the processors – the drivers. In addition, increasingly complex testing software ensures high yield and minimizes defects. On the application layer, we are increasingly using and promoting open-source platforms to encourage better collaboration throughout the ecosystem. In contrast, companies that charge fees to access their own proprietary software environments are missing the opportunity to remain competitive in the long run. SEMI: Why are end-device manufacturers looking for plug-and-play solutions instead of standalone devices? Fabrowsky: Consumers of electronic devices always want products with more features and lower prices. Their requirements produce a trickle-down effect that reaches all the way to component suppliers such as ourselves. This requires us to manage a healthy innovation pipeline, and to choose products and technologies that promise growth and high volumes. This isn’t always simple, however, and many times the component itself is not enough. Think of our Light Drive projector for Bosch Smartglasses. The only way we can hope to win designs in this market is by realizing a fully integrated module, with our own scanning mirrors and driver chips, as well as our integration of laser modules and the display system. This lets us offer an individually tested and calibrated end product ready for assembly.SEMI: What would you like MSEC 2020 attendees to take away from your presentation?Fabrowsky: We’ll be looking at what’s driving the next decade of MEMS applications. For example, the embedded computing inside the sensors, together with enhancements in integration, materials and packaging, will increase the pervasiveness of MEMS sensors and actuators as touchpoints between electronics and the physical world. This will create a new form of intimacy between us and the machines, which we call Artificial Empathy.To learn more about Bosch Smartglasses Light Drive and other MEMS advancements, register now for MSEC 2020.Robert Bosch GmbH is a longtime member of MEMS Sensors Industry Group® (MSIG), a SEMI technology community that connects the MEMS and sensors supply network in established and emerging markets, enabling members to grow and prosper. Visit us today.Jens Fabrowsky began his more than 20-year career at Bosch Group as department head responsible for hydraulic units in the Blaichach plant, Germany Chassis Systems division, in 1999. He soon moved onto technical plant manager and later to plant manager within the company’s Germany Gasoline systems division. He has held the role of executive vice president, Automotive Electronics at Robert Bosch GmbH, since April 2012. Fabrowsky studied mechanical engineering and industrial engineering at the University of Stuttgart (Germany) and the Technical University of Munich (Germany). [i] Status of the MEMS Industry report, Yole Développement, 2020.Nishita Rao is product marketing manager at SEMI.

Jack McCauley understands the interplay between video game hardware and human interaction like few others in the industry. He designed the guitar and drums for Red Octane’s (later Activision’s) Guitar Hero video game series. As co-founder and chief engineer of Oculus VR, he designed the Oculus DK1 and DK2 virtual reality (VR) headsets and helped guide the company through its acquisition by Facebook in 2014. Now active in automotive technology, he builds cars at Black Lab, his private R D facility and hardware incubator in Livermore, California. And, in no small feat, he thinks he’s solved the head-tracking problems in augmented reality (AR)/VR headsets – which he’ll demonstrate during his keynote presentation, MEMS Applications in Augmented Reality, October 6 at MSEC 2020. SEMI’s first virtual MEMS Sensors Executive Congress. The event is October 6-8 and 13-15, 2020, and registration is open. I interviewed McCauley to preview his presentation. Register now for MSEC 2020.SEMI: What inspired you to become the first person to use a MEMS sensor in a gaming device?McCauley: When I started designing the Guitar Hero peripherals, I had intermittent problems with the motion tracking. I switched to a Freescale single-axis accelerometer, developed some IP around it, and that fixed the problem. That’s how I became an early customer of MEMS. SEMI: When you pioneered immersive VR gaming experiences at Oculus VR, tech industry analysts predicted widespread adoption of VR for gaming. What do you think happened?McCauley: There are a lot of reasons why VR hasn’t become the standard bearer for gaming. Gaming used to be a solitary activity, but as companies like Microsoft and Sony got behind multiplayer gaming, we realized many gamers found the social aspect more important than the visual aspect. Many gamers are content to play on a 2D screen or on multiple monitors because they’re playing against many people. The proliferation of internet connections worldwide has also promoted the kinship and social aspect of gaming.SEMI: Do you think VR has a place in other applications?McCauley: I think it has a lot of potential in real estate, VR movies, and engineering and design, among other areas. The automotive designer Henrik Fisker, for example, created whole vehicles in a game-engine model. If you wanted to buy one of his cars, let’s say, you could change the color and upholstery, for example, and then view it in a VR environment. SEMI: One of the biggest obstacles to VR adoption is the motion sickness some people experience during game play. What would you do to fix that?McCauley: The vestibular system in the brain, which uses the inner ear, is crucial to helping you balance. If there’s a mismatch between what your eyes see and your brain is perceiving, you’re likely to feel dizzy. I’ve built a VR headset that uses a MEMS pico projector with micromirrors and a small laser for position tracking as well as for facial tracking and modeling. But the platform’s not for sale.Still, many of the technical advances that we’ve made in VR are helping us with AR development. The increasing power of mobile chipsets and GPUs, the decreasing geometry for individual transistors and the way specific chips are processed, screen interfaces that will drive a 4K panel at a high frame rate, plus MEMS devices inside the eyewear for rotations and tracking are all helpful innovations.SEMI: When designing cars in your own lab, you’re doing a lot of work with AR. What do you think of AR’s commercial viability?McCauley: I know there are well-funded AR programs in place at major companies. That’s because mobile-device companies want an omnipresent phone in front of your face. I thought Google Glass, for example, was brilliant, but it was way too early for that product, and there was too much hype behind it.McCauley's latest R D project is a vehicle that incorporates augmented features and a computerized display. The vehicle is a custom built, environmentally friendly super-car with enhanced driver safety and high vehicle performance. AR is appealing because it lets people see through a screen – and have objects appear on that screen – while they are moving through space. My son actually came up with one of the ideas I’m implementing in a car I’m designing. We were driving in Spain, and he suggested that instead of using Google Maps to show me driving directions – which would force me to look down at an infotainment display – a sign could appear on AR glasses that would instruct me how to drive to Italy. That’s just an example of how we’ll use AR. SEMI: After you sold Oculus VR to Facebook, you began investing time and resources into engineering education. Why did you make that choice?McCauley: I’m originally from a blue-collar family, and then I got an education at Berkeley. That made a major difference in my life. When I sold Oculus, I donated to education-focused charities primarily, because an education can lift an entire family out of poverty. Let’s say your family are farm workers, but you get a degree in engineering and land a job at Apple. That could produce a ripple effect. As other members of your family and people in your community see the benefits of your education, they’re more likely to get an education, too. SEMI: What would you like MSEC attendees to take away from your presentation?McCauley: I appreciate what the MEMS industry has done for VR because if Oculus didn’t have a nine degrees of freedom (9DoF) IMU, no one would have bought our company. A new application will come along sooner or later that will require a different type of MEMS technology, and I have total confidence that the MEMS industry will deliver what’s needed. For more information on McCauley’s R D projects or on his position as Innovator in Residence at UC Berkeley’s Jacobs Institute for Design Innovation, visit his website. MEMS Sensors Industry Group® (MSIG), a SEMI technology community that connects the MEMS and sensors supply network in established and emerging markets, enables members to grow and prosper. Visit us today.Jack McCauley is an Innovator in Residence at the Jacobs Institute for Design Innovation, where he mentors students, lectures in courses focused on product design and design for manufacturing, and leads research and development projects focused on applications of augmented, virtual, and mixed reality for design professionals and students.McCauley graduated from Berkeley Engineering with a B.S. in Electrical Engineering and Computer Science in 1986, and credits the time he spent at Berkeley as an undergraduate with helping to ignite his career. Maria Vetrano is a public relations consultant at SEMI.

Earlier this year when the novel coronavirus, SARS-CoV-2, began sprinting around the world, public health officials told us that social distancing was the most effective way to slow its spread. We’re now many months into the pandemic, and social distancing, combined with mask-wearing, is still the best way to prevent new cases of the disease.On March 20, 2020, governors on opposite coasts, Gavin Newsom in California and Andrew Cuomo in New York, shut down their states, and other states soon followed. Only essential businesses, such as select retailers – grocery and hardware stores as well as pharmacies, for example – were allowed to remain open. Depending on location, however, it was days or weeks before strict social distancing measures were in place. Tape stuck six feet apart on store floors has helped shoppers keep their distance. But shouldn’t there be a more exact and reliable way to gauge social distances in retail stores, gyms, workplaces and other settings?David Horsley, founder and CTO of Chirp Microsystems, a TDK Group company, believes so, and the company is developing technology that does just that. Horsley will share the details in his keynote A Wearable Social Distancing Solution Based on Ultrasonic Time-of-Flight Sensors October 14 at MSEC 2020, SEMI’s first virtual MEMS Sensors Executive. The event is October 6-8 and 13-15, 2020. Register now for MSEC 2020.I spoke with Horsley to learn more about the sensors.SEMI: What was the inspiration for providing Chirp’s ultrasonic Time-of-Flight (ToF) sensors for social distancing?Horsley: Companies actually started contacting Chirp about six months ago to inquire about social distance tags to measure distance between people. They already knew about us because we’ve been supplying MEMS ultrasonic ToF sensors for virtual reality and robotics for several years, so they knew we could provide the same kind of low-power range-finding accuracy for resource-constrained devices. SEMI: How are your customers using Chirp-based social distance tags?Horsley: They’re designing Chirp’s ultrasonic ToF sensors into wearable tags worn by workers in distribution centers, in factories, and in oil and gas production, to name a few areas. The tags alert workers when they’re closer than two meters from another worker to ensure social distancing. Chirp’s ToF sensors also support contact tracing without recording any personal information, which is a major advantage over contact-tracing applications from companies like Google and Apple. Because those apps use Bluetooth Low Energy (BLE), which is already in your smartphone, the user has to enable location services. This records your GPS location, a privacy concern.BLE is problematic on some other levels as well. It only provides one-meter accuracy while Chirp’s ToF solution for social distancing delivers one-centimeter accuracy. Because BLE is only accurate within one meter, it can’t alert you in real-time that you’ve crossed that two-meter boundary to another person. Imagine you’re in the checkout line at the supermarket. BLE can tell you that other people are in your general vicinity, but it doesn’t have enough resolution to tell you whether the next shopper is two meters away from you or only one-and-a-half meters away. And because it doesn’t use the air as a medium, it registers a lot of false positives. If, for example, you’re separated from a person by a partition or a wall, and you’re within two or three meters of each other, your phone’s social-distance app will register a false positive.SEMI: Are you talking with customers in other environments, such as college campuses and theme parks?Horsley: There’s great deal of potential in those markets. For example, Professor Prabal Dutta’s group at UC Berkeley is working on a system that uses our sensors. His work also made us aware of some of the privacy concerns around contact tracing because universities are much more uneasy about student privacy than some private-sector companies are today. SEMI: What would you like MSEC attendees to take away from your presentation?Horsley: From the beginning, we believed that MEMS ultrasound was very versatile. We expected it to find a home in different types of applications because of its low power, small size and ease of use, particularly since we provide the enabling software that makes it all work. With design wins in four to five vertical markets, we’re experiencing significant marketplace validation. We’re all hoping that COVID-19 will wind down in the first half of 2021. As the focus on social distancing begins to fade, we’re looking forward to building out our customer base in the markets we’re in today as well as gearing up to explore new markets.Chirp Microsystems and TDK InvenSense are longtime members of MEMS Sensors Industry Group® (MSIG), a SEMI technology community that connects the MEMS and sensors supply network in established and emerging markets, enabling members to grow and prosper. Visit us today to learn how MSIG membership can make a difference in your business.David A. Horsley, Ph.D., is co-founder and CTO of Chirp Microsystems Inc., a TDK Group company. Horsley is also a professor of Mechanical and Aerospace Engineering at the University of California, Davis, and is adjunct professor of Mechanical Engineering at the University of California, Berkeley. Since 2004, he has been co-director of the Berkeley Sensor and Actuator Center (BSAC), the National Science Foundation’s Industrial/University Collaborative Research Center (I/UCRC) focused on MEMS research. Horsley is also a recipient of the National Science Foundation’s CAREER Award, and has authored or co-authored over 150 scientific papers and holds over 20 patents.Maria Vetrano is a public relations consultant for MSIG, a SEMI technology community.