At IMAPS 2020 MRSI Systems will introduce a new 5 micrometer die bonder product, MRSI-705 high-volume configuration. The MRSI-705 was first introduced in 2012 and has enjoyed a dominant position in the die bonding industry offering customers multiple application solutions in one machine. This new configuration offers an innovative horizontal turret feature to significantly increase the speed and throughput from the machine without sacrificing its renowned flexibility, accuracy, or reliability.

The new MRSI proprietary design delivers an “on-the-fly” tool change with up to 12 tools with zero tool changeover downtime, which has been an integral part of MRSI’s popular high-speed product lines MRSI-HVM and MRSI-H. This leads to increased machine efficiency, higher production output, and lower manufacturing costs.

This flexible 5 micrometer die bonder retains its comprehensive appeal across a wide range of applications including photonic packaging, microwave modules, RF power amplifiers, and infrared sensors.

“The addition of this new high-speed 5 micrometer die bonder re-enforces MRSI’s industry-leading position in the field of manufacturing automation for advanced microelectronic and optoelectronic devices. We look forward to working with customers to help them to scale their production,” said Dr. Yi Qian, VP & GM MRSI Systems, Mycronic.

To schedule an appointment and discuss a prototype demonstration, please contact us at [email protected].

For additional information, please contact:
Dr. Limin Zhou
Senior Director, Strategic Marketing, MRSI Systems
Tel: +86 135 0289 9401, e-mail: [email protected]
Time Zone: CST – China Standard Time

About MRSI Systems
MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high- volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. www.mrsisystems.com

About Mycronic
Mycronic AB is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Singapore, South Korea, the Netherlands, United Kingdom and the United States. Mycronic AB (publ) is listed on NASDAQ Stockholm. www.mycronic.com

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• Read more about MRSI launches MRSI-705 high-volume configuration

ESPOO, Finland, 24th September 2020 – Picosun Group, the leading supplier of AGILE ALD® (Atomic Layer Deposition) thin film coating technology, reports excellent results in UVC (ultraviolet-C) LED performance, achieved with the company’s ALD solutions.

Excellent reliability and lifetime improvements of UVC LEDs have been obtained at Picosun’s customer and collaboration partner site, National Chiao Tung University (NCTU), Taiwan, using passivation and barrier films deposited with PICOSUN® ALD equipment(*). ALD passivation layer could potentially replace the expensive hermetic seal package of the LEDs and thus lower the costs of the final device.

“We have used Picosun’s ALD technology already for years with great success. Our PICOSUN® ALD equipment yields superior quality films which has helped us to achieve several breakthroughs in our LED research. Picosun has local presence in Taiwan and we appreciate the prompt response of their customer support if we ever have any issues. At the phase when R&D results are to be ramped up to industrial-level production, the scalability of Picosun’s ALD technology is a huge benefit,” comments Professor Hao-Chung Kuo from NCTU.

In order to reach maximum light output and long operating lifetime, LED chips require surface passivation to eliminate parasitic currents caused by traps and defects. Also barrier coating is typically needed as LED materials are sensitive to moisture. ALD is an ideal technique to manufacture both the passivation and barrier films – and when the LED size diminishes to micrometer dimensions, the only coating method capable of producing high enough quality films on the required minuscule scale. Ultra-thin, pinhole-free ALD films do not suppress the LED light intensity and they provide reliable protection against ambient conditions, whereas their superior conformality ensures no thickness variations between the facets of the LED chip. Thickness variations, typical side effect of other coating methods, can potentially lead to uneven distribution of film stress or thermal expansion behavior and risk physical damage of the chip.

Short-wavelength UVC radiation destroys bacteria and viruses so UVC LED technology is particularly topical now during the still ongoing COVID-19 pandemic. Small, lightweight LEDs enable versatile design of portable, compact disinfecting equipment, they consume less power than other UVC sources, they are durable, and they pose no risk of hazardous material leaks such as e.g. mercury lamps.

“We are happy of the achievements of Professor Kuo’s group at NCTU, and how Picosun’s ALD technology has helped them to achieve their goals in UVC LED development. Our long-term collaboration and networking with both the academia and prominent industries in this field gives us the perfect synergy advantage to facilitate implementation of these solutions in industrial manufacturing,” says Mr. Edwin Wu, CEO of Picosun Asia Pte. Ltd.

(*) UVC LED with 50 nm ALD Al2O3 passivation and normal LED packaging (no hermetic seal) maintained 80% of its original efficiency even after 500 hours environmental test at 85% humidity and 85 oC temperature.

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Taiwan, China, Korea and Japan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Mr. Edwin Wu
CEO, Picosun Asia Pte. Ltd.
Tel: +358 40 480 3449
Email: [email protected]
Web: www.picosun.com

• Read more about Picosun’s ALD technology boosts UVC LED performance

Kalispell, MT – Semiconductor equipment manufacturer ClassOne Technology announced the sale of its Solstice® LT electroplating system to Jenoptik for manufacturing semiconductor material for high-power diode lasers at its semiconductor production facility in Berlin-Adlershof, Germany. High-power diode lasers play an important role in optical pumping of solid-state lasers as well as in direct use applications such as material processing, sensing as well as in healthcare & life science. The dual-chambered Solstice LT is specially configured for high-performance gold processing. The announcement was made jointly by ClassOne CEO, Byron Exarcos, and Dr. Juergen Sebastian, plant manager of the Jenoptik facility in Berlin.

"The new Solstice LT will replace a manual plating wet bench," explained Dr. Sebastian. “This will significantly improve process stability, plating quality as well as reduce our metallization step costs. That’s important because at Jenoptik, we build all the semiconductors that go into our diode lasers in-house. The new Solstice LT electroplating system thus ensures very high quality, performance and service life of our end products. Moreover, the new system also promotes Jenoptik’s policy of sustainability thanks to the new electrolyte technology.”

“The Solstice LT for Jenoptik is specially configured with our GoldPro™ processing chamber,” said Exarcos. “GoldPro can deliver unprecedented levels of repeatability – wafer-to-wafer, die-to-die, within-die, and within-feature. The bottom line is exceptional uniformity and reproducibility, along with reduced cost of ownership.”

With the new electroplating system, Jenoptik is now able to process different GaAs wafers sizes to accommodate different customer requirements. Another reason for selecting Solstice was the flexibility of its design, which readily allows the handling of multiple wafer sizes on the same tool.

“We’re proud to be on the Jenoptik team because their semiconductor lasers are industry leaders,” said Exarcos. “Their quality is based on advanced manufacturing, with strict quality controls and state-of-the-art process technologies. It's an environment in which Solstice can play an integral role, and we're looking forward to the next generations of Jenoptik diode lasers!”

ClassOne Solstice systems provide high-performance electroplating specifically for ≤200mm wafer processing. The Solstice series includes fully-automated 8-chamber and 4-chamber systems with up to 75-wph throughput as well as a 2-chamber semiautomated configuration that can be used both for process development and production. In addition to electroplating, the unique Plating-Plus™ capabilities of the Solstice platform enable it to handle many other important functions, such as wafer cleaning, high-pressure metal lift-off, resist strip, UBM etch, and more. Solstice’s class-leading performance and flexibility consistently make it the tool of choice for ≤200mm plating.

• Read more about ClassOne’s Solstice LT Plating System Selected by Jenoptik for Producing High-Power Diode Lasers

MRSI launches submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging

At CIOE 2020 MRSI Systems will introduce a new product, MRSI-S-HVM high-speed, flexible 0.5 micrometer die bonder for silicon photonics, co-packaging electronic and photonic chips, and wafer-level packaging.

This advanced die bonder is based upon MRSI’s field proven high-speed HVM die bonder platform for high-volume manufacturing of integrated photonics that requires ultimate accuracy at the submicron level. It has inherited the speed using multiple levels of parallel processing from the HVM platform. It also has the HVM’s high level of flexibility for multiple die applications using auto-tool changing and multiple process applications with eutectic, epoxy stamping and dispensing in one machine.

The MRSI-S-HVM flexibility is elevated to another level with the capability to switch automatically between two modes of accuracies - 0.5 micrometer and 1.5 micrometer. The 0.5 micrometer mode uses a real-time alignment mechanism facilitated by the on-axis z-force bonding for the best possible co-planarity and final accuracy. For flip-chip bonding, it aligns the features on the bonding surfaces of the die and the carrier. This eliminates the expensive step for the customer to make alignment fiducials on both top and bottom sides of a chip during wafer fabrication, and it also eliminates the subsequent die bonder alignment step in order to calibrate the top and bottom surface of the chip. All these advantages are essential for volume manufacturing capability for those emerging applications.

The MRSI-S-HVM die bonder is capable of chip-on-wafer (CoW) process with dies from III-V wafer being picked, placed, and bonded onto a silicon wafer (12 inches) including fine lateral motions. It can also be applied to chip-on-interposer (CoI) and chip-on-substrate (CoS). Three heating options are available including high-density top heating eutectic bonding, bottom thermal heating, and MRSI’s proprietary bottom laser soldering solution, avoiding secondary reflow of adjacent chips, and improving UPH.

“The addition of this new submicron die bonder product family re-enforces MRSI’s industry-leading position in the field of manufacturing automation for advanced optoelectronics devices. We look forward to working with customers to help them to scale at this improved level of accuracy without compromising speed or flexibility,” said Dr. Yi Qian, VP & GM MRSI Systems, Mycronic.

To schedule an appointment and discuss a prototype demonstration, please contact us at [email protected].

For additional information, please contact:
Dr. Limin Zhou
Senior Director, Strategic Marketing, MRSI Systems
Tel: +86 135 0289 9401, e-mail: [email protected]
Time Zone: CST – China Standard Time

About MRSI Systems
MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high- volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com

About Mycronic
Mycronic AB is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Singapore, South Korea, the Netherlands, United Kingdom and the United States. Mycronic AB (publ) is listed on NASDAQ Stockholm. www.mycronic.com

• Read more about MRSI launches submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging

ESPOO, Finland, 31st August 2020 – Picosun Group’s growth strategy is based on strong expansion into industrial ALD markets. To support this strategy, special emphasis has been placed on strengthening the Group’s global service organization. The investment has paid itself back in the form of high level of customer satisfaction, despite the challenges caused by the global covid-19 pandemic especially in traveling and logistics.

“Due to the reinforced localization of our service and support units, our service engineers’ utilization level has been more than 85% in the past six months, and with the latest remote service and support tools we have gained advantage to manage our customers’ PICOSUN® ALD system commissionings online and in time. ALD tool maintenances, process development, spare parts and other critical deliveries are also provided locally with maximum safety precautions in place, to ensure customers continuous operation of their PICOSUN® ALD equipment,” states Mr. Timo Malinen, Customer Experience Director of Picosun Group.

During the last months, Picosun Group has hired and trained several new service engineers and sales and support personnel to provide local support at the Group’s US, Asian, and European locations. Remote diagnostics, control, and data logging features for remote troubleshooting and process optimization of customers’ PICOSUN® ALD tools are a routine approach in the Group’s ALD solution deliveries. Augmented and/or virtual reality solutions for even more efficient service operations and remote learning/e-training possibilities are also under development and will be introduced in all Picosun’s operations later on.

“Our principle of ‘AGILE ALD’ and our position as the technological forerunner in our field obligate us to provide the best possible services and solutions to our customers. As a globally operating company, pandemic risk scenarios are an integral part of our continuous risk planning. Against the backdrop of the current covid-19 outbreak, our service operations are continuously being adapted to mitigate potential impacts. Picosun Group follows a holistic management process that enables constant development of our customer service unit to ensure the best possible response even in an emergency situation,” continues Malinen.

For Picosun, the health of employees and customers is the highest priority. In order to closely monitor and manage the covid-19 situation, Picosun follows all the safety regulations provided by WHO, CDC, ECDC, and Finnish Institute for Health and Welfare, and provides the necessary information timely to all employees, customers, and other stakeholders.

Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Taiwan, China, Korea and Japan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Mr. Timo Malinen
Customer Experience Director, Picosun Group
Tel. +358 40 5011 860
Email: [email protected]
Web: www.picosun.com

• Read more about High customer satisfaction with Picosun’s new service and support model