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ESPOO, Finland, 2nd December 2020 – Picosun Group, the leading supplier of AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries, has launched Sprinter, a brand new, fully automated high throughput ALD production module for 300 mm wafers. Barrier, high-k and other films are deposited in Sprinter with perfect ALD for semiconductor (e.g. emerging memory, transistor, capacitor), display, and IoT component applications.

In Sprinter, single wafer film quality and uniformity are upscaled to fast batch processing with the highest reliability and repeatability(*).

Compared to vertical furnace reactors typically used for batch ALD processing, Sprinter provides higher film quality with lower thermal budget, so it is suitable also for temperature-sensitive devices.

Sprinter combines very fast process times with smaller batch sizes than in vertical furnaces, which allows greater production flexibility and minimized risk without sacrificing throughput.

The core of the Sprinter is its disruptively designed reaction chamber, where fully laminar precursor flows ensure perfect ALD deposition with no parasitic CVD growth. This minimizes the need for system maintenance.

“PICOSUN® Sprinter meets directly the challenges in high volume ALD manufacturing on 300 mm wafers. We are happy to unveil this product to our new and existing customers in 300 mm semiconductor markets, and offer them a truly disruptive, modern alternative to old technologies in batch ALD manufacturing,” says Mr. Jussi Rautee, CEO of Picosun Group.

SEMI S2/S8 certified PICOSUN® Sprinter module can be integrated to customer’s manufacturing line or cluster. It is suitable also for single wafer manufacturing lines as it does not disturb the process flow. Sprinter is run with Picosun’s new, proprietary PicoOS™ operating system and process control software.

“Together with Sprinter, we are launching also our PicoOS™ operating system. Own operating system and process control software, developed by our in-house software team, means the highest control precision and accuracy, the fastest service times, and the best reliability and quality for our customers,” continues Rautee.

Full stack PicoOS™ software allows control, operation and configuration of PICOSUN® ALD equipment – either standalone systems or full production clusters – via one unified, intuitive, and user-friendly graphical HMI and ensures smooth connection between the system and the customer’s factory automation via SECS/GEM protocol.

Sprinter is available for process demos at Picosun facilities. Sprinter module sales starts in January 2021 and full Sprinter cluster with several ALD modules, central vacuum wafer handling unit and EFEM is available later in spring 2021.

(*)PICOSUN® Sprinter ALD batch process data on 300 mm Si wafers, Al2O3 process as an example (more data available on request):

Parameter Value
Film thickness 1σ non-uniformity, within-wafer @ 200 oC About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Mr. Jussi Rautee
CEO, Picosun Group
Tel: +358 50 345 4457
Email: [email protected]
Web: www.picosun.com

ESPOO, Finland, 23rd November 2020 – Picosun Group, the leading supplier of AGILE ALD® (Atomic Layer Deposition) thin film coating solutions, partners with prominent Chinese hospitals and researchers to apply medical ALD technology for safer surgical procedures.

Picosun’s biocompatible ALD coatings will be applied on electrosurgical equipment (electrotomes) to improve their performance, safety, and service life.

“It’s great to collaborate with a company such as Picosun to develop solutions for safer and more patient-friendly surgeries. Picosun is the leader in medical ALD solutions. The company has extensive process portfolio for biocompatible ALD materials and their equipment are at use at several medical equipment manufacturers around the world. In China, Picosun is the market leader with numerous PICOSUN® ALD systems installed throughout the country. We have strong trust that this collaboration will result in disruptive new innovations and novel solutions for surgical equipment,” says Longsheng Lu, Professor of South China University of Technology.

Electrotome utilizes high temperature to cut and separate tissue, with simultaneously coagulating blood, and it’s a standard equipment replacing traditional mechanical scalpels in many operations. Tissue and blood sticking and burning on the electrotome blade is a serious problem because the crusted blade risks increased bleeding, tissue damage, tearing and scarring, thus making the patient’s healing time longer. Smoke from the burning tissue may also hinder the surgeon’s vision and increase the risk for error during delicate procedures such as cardiac or neurosurgery.

This far, there hasn’t been a working solution in the market to overcome this problem. ALD technology can potentially provide this solution and thus improve patient safety, wound quality and healing time. ALD forms ultra-thin, pinhole-free coatings with unmatched conformality over the smallest microscale details of the surface, and the ALD process can be performed at moderate temperatures so the method is suitable also for sensitive materials. Deposited over special anti-adhesive micropatterning of the electrotome blade, biocompatible ALD film prevents blood and tissue from sticking to the blade.

“We are happy to extend our PicoMEDICAL™ technology to a yet new healthcare application, and to work with top tier Chinese hospitals and scientists to qualify our solutions in everyday use. ALD is revolutionizing the medical field right now, just like it did to semiconductor industries over a decade ago. We at Picosun want to use our extensive ALD know-how to develop solutions to improve people’s health and quality of life, which is why medical ALD is one of our key markets for the future,” continues Dr. Jani Kivioja, CTO of Picosun Group.

Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, China mainland and Taiwan, Singapore, Japan and South Korea, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

The project “Design of anti-adhesive surface modified with bionic microstructures and ALD coatings and its application on surgical electrotomes” is carried out in collaboration with SCUT (South China University of Technology), PLAGH (General Hospital of the People's Liberation Army), Guangdong Provincial People's Hospital, and Guangzhou First People’s Hospital. The project will start on 1st December 2020 and continue for 3 years. The project is partially funded by Business Finland.

More information:
Dr. Jani Kivioja
CTO, Picosun Group
Tel: +358 46 922 8804
Email: [email protected]
Web: www.picosun.com

Questions about the webinar? Contact  [email protected]

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SEMI | SCIS

Semiconductor Components, Instruments, and Subsystems (SCIS) is a SEMI technology community chartered to address process-critical components challenges to meet the demands of high-volume manufacturing (HVM) at advanced process nodes. SCIS brings together all stakeholders that are driving yield improvements through the very last frontier of component and hardware defect reduction.

About The Webinar

Defect prediction and defect source mitigation is critical to enabling high-volume manufacturing at all semiconductor fabs, but especially at advanced process nodes. This program will provide perspectives on:

  • Importance of OEM part design, cleaning & refurbishment loops for advanced node high volume manufacturing and designing for zero defects
  • The standards gap between cleanliness specs, measurement methods & successful predictive maintenance (PdM) in the Fab  and how to enable AI based maintenance scheduling
  • Applicability of cleaning techniques vs OEM part designs and mitigating human variability during parts cleaning
  • The emerging considerations for parts designed to facilitate cleaning

Who Should Attend

  • IDMs, fabs, foundries; fab managers, process engineers
  • Semiconductor processing equipment OEMs
  • Critical chamber component suppliers
  • Semiconductor processing equipment parts clean vendors
  • Parts clean metrology service providers

United States

8:00 am - 8:05 am
Paul Trio
Paul Trio

Welcome Remarks & Moderation

Paul Trio, Senior Manager, Strategic Initiatives
SEMI

8:05 am - 8:40 am
Patrick Martin, Applied Materials
Patrick Martin

OEM Perspective on Parts Cleaning - Cleanliness and Hardware Connectivity

Patrick Martin, Business Development, New Markets and Alliances
Applied Materials

Speaker Bios

8:40 am - 9:15 am
dave Laube
David Laube

Parts Cleaning from Design to Scrap

David Laube, CTO,
Pentagon Technologies

Speaker Bios

Reed Rosenberg
Reed Rosenberg

Parts Cleaning from Design to Scrap

Reed Rosenberg, CTO
Cleanpart USA

Speaker Bios

9:15 am - 10:00 am
Victor Chia
Victor Chia

Cleanliness Metrology

Victor Chia, International Expert; Director, Surface Contamination Technologies
Air Liquide / Balazs NanoAnalysis

Speaker Bios

10:00 am - 10:15 am
Max van den Berg
Max van den Berg

Product Cleanliness – International Collaboration Initiatives

Max van den Berg, System Architect, Electronics and Assembly, Global Application Engineering
Festo

Speaker Bios

10:15 am - 10:30 am

Q&A and Closing Remarks

- EMG FOA MSIG SCIS Standards

This 2.5 hour webinar is offered OnDemand from the SEMI Library.

 

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This SEMI CEO Series Webinar will bring you expert analysis of the outcome of the U.S. presidential election on current geopolitical tensions and the corresponding impact on the global microelectronics supply chain. SEMI President and CEO Ajit Manocha invites you to join us for an opening presentation from Eurasia Group on the post-election world and US-China trade, focusing on implications for the semiconductor and the bigger technology sector.

A panel discussion with industry CEOs from multiple regions and segments will provide their perspectives to the analysis, addressing the role industry executives can play in easing trade tensions and providing insights on navigating the current geopolitical environment.

United States

4:30 pm
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Ajit Manocha
CEO and President
SEMI

Welcome & Opening Remarks

4:35 pm
Joe Pasetti, SEMI
Joe Pasetti
VP, Global Advocacy & Public Policy
SEMI

SEMI Global Advocacy Priorities

4:40 pm
Gerald Michael Butts
Gerald Butts
Vice Chairman
Eurasia Group

Macro Overview on the Post-Election World and US-China Trade

4:55 pm
Kevin Allison
Kevin Allison
Director, Geotechnology
Eurasia Group

Implications for Semiconductor and Overall Tech Industry

5:10 pm
James Andrew Lewis
Moderator

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James Andrew Lewis
Senior VP and Director, Strategic Technologies Program
Center for Strategic and International Studies (CSIS)
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Mitsunobu Koshiba
Chairman of the Board
JSR
Biography

Bertrand Loy
Panelist

Bertrand Loy
President and CEO
Entegris
Biography

Dr. Steve Schwartz
Panelist

Dr. Stephen Schwartz
President and CEO
Brooks Automation
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Dr. Tien Wu
Director and CEO
Advanced Semiconductor Engineering, Inc. (ASE Group) and USI
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5:45 pm

Q&A

5:58 pm

Closing Remarks

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