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China

Registration

China PV and PV Materials China Joint TC Chapter Fall Meeting 2021

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1st floor, 4th Building of LEED INTERNATIONAL, Yangtze River Delta Capital Service Base

No. 1158 Zhangdong Road, Shanghai


»  Venue to Shanghai Pudong International Airport 27 miles, 25 minutes’ drive.
»  Venue to Shanghai Hongqiao International Airport 40 miles, 55 minutes’ drive.
»  Venue to Shanghai Hongqiao Railway Station 40 miles, 55 minutes’ drive.
»  Venue to metro Line 2 Guanglan Road Station 3 miles, 8 minutes’ drive.

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Shanghai
China

Standards

SEMI International Standards Program
PV and PV Materials China Joint TC Chapter Fall Meeting 2021
Wednesday, November 17, 2021
13:30-17:00
Shanghai, China

13:00 – 13:30  Registration
13:30 – 13:50 Welcome
13:50 – 13:55 Review and Approval of Previous Meeting Minutes
13:55 – 14:00 SEMI Staff Report
14:00 – 14:15 Liaison Reports
14:15 – 15:00 Task Forces Reports
15:00 – 16:00 Request for Global Ballots Cycle
16:00 – 16:30 5-Year-Review SNARF
16:30 – 16:45 New Action Items Review
16:45 – 16:50  Next Meeting Date & Locale

Web Meeting link:Click here

Standards Contact information:
Isadora Jin
SEMI China
Email: [email protected]
Phone: 86.21.6027.8578

 
1:30 pm - 5:00 pm Off Add to Calendar 2021-11-17 13:30:00 2021-11-17 17:00:00 PV and PV Materials China Joint TC Chapter Fall Meeting 2021 SEMI International Standards Program PV and PV Materials China Joint TC Chapter Fall Meeting 2021 Wednesday, November 17, 2021 13:30-17:00 Shanghai, China 13:00 – 13:30  Registration 13:30 – 13:50 Welcome 13:50 – 13:55 Review and Approval of Previous Meeting Minutes 13:55 – 14:00 SEMI Staff Report 14:00 – 14:15 Liaison Reports 14:15 – 15:00 Task Forces Reports 15:00 – 16:00 Request for Global Ballots Cycle 16:00 – 16:30 5-Year-Review SNARF 16:30 – 16:45 New Action Items Review 16:45 – 16:50  Next Meeting Date & Locale Web Meeting link:Click here Standards Contact information: Isadora Jin SEMI China Email: [email protected] Phone: 86.21.6027.8578   Shanghai China SEMI.org [email protected] America/Los_Angeles public

ESPOO, Finland, 14th of October 2021 – PICOSUN® Morpher has continued to demonstrate excellent batch process results in the latest acceptance runs the company has performed for its customers in the global semiconductor industry.
Excellent uniformities (About Picosun
Picosun provides the most advanced ALD (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

Belgium China France Germany Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam https://us06web.zoom.us/webinar/register/1016333850080/WN_vp4idiRyRi-DhHfKk4pIBA Business
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Virtual, Eastern Time
United States

Off Add to Calendar 2021-10-27 00:00:00 2021-10-27 00:00:00 Joint SEMI-CAR virtual event: Chip Shortage Impact on Automotive Virtual, Eastern Time United States SEMI.org [email protected] America/Los_Angeles public

TAIPEI, TAIWAN, October 8, 2021 – Lite-On Technology Corporation (“LITEON”) has filed a patent infringement suit against Sensor Electronic Technology, Inc. (“SETi”) September 17, 2021, in the United States District Court for the Western District of Texas, asserting infringement of LITEON’s UV LED patents and demanding a judgment that SETi has infringed and seeking an injunction and an award of damages. The claims relate to the UV LED package, LED chip, and epitaxial layer growth.

LITEON is founded in 1975 and being a worldwide leading provider of optoelectronic semiconductors. LITEON Optoelectronics Product Solution SBU (LITEON OPS) has been dedicated to R&D on LED technologies and has more than forty-five years' experience in this field. Its leading role is backed by the broadest and most widely varying product offering in Optical technologies, ranging from illumination to sensing, from low power to high power, from commodity to custom-made, from LED to Laser, from visible lights to infrared & UV. LITEON possesses a strong patent portfolio in the key markets including America, China, Taiwan, Japan, Europe, and Korea.

In response to recent press releases by SETi as a subsidiary of Seoul Viosys and the media coverage that focused on the patent lawsuits related to SETi v. LITEON, LITEON hereby clarifies that:
The patent lawsuits are still in progress. LITEON disputes SETi’s claims and will vigorously defend against them. LITEON reaffirms that we, as always, respect intellectual property rights and will devote to the protection of customers’ and shareholders’ benefits and rights.

CONTACT:Ifei Lee
 Director, OPS SBG,
   LITE-ON Technology Corporation
   [email protected]

YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that it has purchased the semiconductor equipment business of Swedish heating technology provider Kanthal.

Under the terms of the agreement, which was signed on October 6, YES will take ownership of Kanthal’s semiconductor-related capital equipment portfolio, system-related upgrades, and service needs. The acquisition will add Kanthal’s high-temperature (>800°C) furnace technology as well as Low Pressure Chemical Vapor Deposition (LPCVD) processes to YES’s growing capabilities in the thermal processing area.

“We aim to be the semiconductor industry’s provider of choice for surface modification, material enhancement, and high-quality deposition,” said Rezwan Lateef, President of YES. “With this acquisition of equipment and technical expertise from a leader in industrial heating, we look forward to supporting our global customer base with new high-temperature annealing and bonding systems that leverage Kanthal heating equipment. In addition, we feel that the Kanthal LPCVD technology has potential to open exciting deposition opportunities for YES beyond our current monolayer coating systems, particularly in the areas of optical, power and microLED.”

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include vacuum cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit www.yieldengineering.com.

SANTA ROSA, Calif. – September 28, 2021 – PNI Sensor, the world’s foremost expert in precision location, motion tracking, and fusion of sensor systems into real-world applications, today announced that its proprietary magneto-inductive sensor technology is now integrated into MagCanica’s torque sensor systems for high-performance FORMULA 1 race cars. PNI’s sensor technology is used in MagCanica’s innovative driveshaft, clutch shaft, and MGUK shaft torque sensor systems to accurately measure both steady-state and transient torque levels, helping race teams optimize powertrain performance and driveability.

MagCanica designs, develops, and manufactures wireless torque sensor systems and rate-of-change-of-torque (ROC) sensor systems for high performance applications such as automotive racing powertrains, turboshaft engines and associated rotorcraft transmissions, and high speed couplings for gas compression trains and power generation trains for the energy sector.

“The team at PNI worked closely with our engineers to customize their high-performance magnetic sensors to our exacting specifications,” said Sami Bitar, President and co-founder of MagCanica. “This close collaboration supports our mission to deliver the most lightweight, compact and accurate systems for our FORMULA 1 race team customers.”

“Our team of highly experienced engineers takes a holistic approach and supports our customers’ system accuracy and long-term reliability requirements,” said Robin Stoecker, director of marketing at PNI Sensor. “We’re proud that MagCanica is using our expertise and field-tested sensor hardware and applying it to a highly specialized and demanding application like automotive racing systems.”

About PNI Sensor
With over 30 years of experience, PNI is the world’s foremost expert in precision location, motion tracking, and fusion of sensor systems into real-world applications. PNI’s sensors and algorithms serve as the cornerstone of successful IoT projects and mission-critical applications where pinpoint location, accuracy, and low power consumption are essential. Building on decades of patented sensor and algorithm development, PNI offers the industry’s highest-performance geomagnetic sensor in its class, location and motion coprocessors, high-performance modules, sensor fusion algorithms, and complete sensor systems. To learn more, please visit www.pnicorp.com.

The F1 logo, F1 FORMULA 1 logo, FORMULA 1, F1, FIA FORMULA ONE WORLD CHAMPIONSHIP, GRAND PRIX, PADDOCK CLUB and related marks are trademarks of Formula One Licensing BV, a Formula 1 company. All rights reserved. Use of the Formula 1 trademark does not imply any affiliation with, or endorsement by, FORMULA 1.

YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that Kimihiko Matsubara has joined its senior management team and will lead its sales efforts in the Japan market, supporting the rapidly evolving semiconductor and advanced organic substrate market segments in the region.

“We welcome Matsubara-san warmly to the YES senior team. His proven management and relationship-building skills, strong record of sales growth, and deep knowledge of the country’s precision machinery and semiconductor industries will be highly valuable to YES as we build our local presence in Japan,” said Rezwan Lateef, President of YES.

Kimihiko Matsubara started his career with process equipment manufacturer Hakuto, spending three decades there in positions of increasing managerial responsibility. He subsequently held business development and senior sales management roles at TASMIT (a subsidiary of Toray, specializing in semiconductor inspection and metrology) and Faro Japan, a maker of 3D metrology and visualization systems. He earned his bachelor’s degree in Mathematics from Meijo University in Nagoya, Japan.

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include vacuum cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence.

For more information, please visit www.yieldengineering.com.

China Business Executive Expositions Technical
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China

Standards Workforce Development

BIPV TASK FORCE MEETING

光伏建筑一体化(BIPV)屋顶抗风揭试验方法标准交流会

BIPV TASK FORCE MEETING

9:00 am - 5:30 pm Off Add to Calendar 2021-09-28 09:00:00 2021-09-28 17:30:00 BIPV TASK FORCE MEETING BIPV TASK FORCE MEETING 光伏建筑一体化(BIPV)屋顶抗风揭试验方法标准交流会 China SEMI.org [email protected] America/Los_Angeles public
Event format
China Business Executive Expositions Technical
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China

Standards Workforce Development

会议邀请:4H-SiC同质外延片工作组线上会议

4H-SiC Homoepitaxial Wafer Task Force Meeting 

 

Meeting:Link

Friday, September 17, 2021

10:00-11:30

10:00 am - 11:30 am Off Add to Calendar 2021-09-17 10:00:00 2021-09-17 11:30:00 4H-SiC Homoepitaxial Wafer Task Force Meeting 会议邀请:4H-SiC同质外延片工作组线上会议 4H-SiC Homoepitaxial Wafer Task Force Meeting    Meeting:Link Friday, September 17, 2021 10:00-11:30 China SEMI.org [email protected] America/Los_Angeles public
Event format

Registration

Registration is free for SEMI Members.  Use your company email when registering for the system to recognize you as a member.  

Non-Member fee = $49

Contact Paul Trio at [email protected] with any questions.

Belgium China France Germany Italy Japan Singapore South Korea Taiwan United States Register Now Business Technical

Do you sometimes feel like you are operating in the dark when dealing with the new challenges and opportunities in process and design?  These continue to emerge in parallel to ever shrinking semiconductor device geometries.

While Moore’s law and beyond are driving scale reduction, the industry is facing increased process sensitivity and complexity, and is redefining on-wafer defect tolerance in terms of size and complexity.  

To detect, identify, understand the source and eliminate yield limiter defectivity are key for total wafer environment contamination characterization and control and are essential for yield enhancement to ensure the success of the latest technology nodes. 

It is more imperative than ever that the semiconductor industry works together to enable improved defect detection, speciation/characterization metrology, and as needed, hybrid analytical technology for upcoming HVM readiness.

Join us for this session for speakers and discussion on tackling some of these industry challenges.

Virtual
United States

7:30 am - 7:35 am
Paul Trio
Paul Trio
Senior Manager, Strategic Initiatives
SEMI

Welcome

7:35 am - 7:55 am
Archita Sangupta
Archita Sengupta
Sr. Technologist
Intel

IDM Perspective of Defectivity with regard to Next-Gen Metrology and Analysis Tools

Intel logo
7:55 am - 7:58 am
Robert McIntosh
Moderator
Robert McIntosh
Consultant
Enviro-Energy Solutions

Introduction to the Presentations

7:58 am - 8:13 am
Hiroyuki_Hamada_Daikin
Hiroyuki Hamada
Senior Scientist
Daikin - Chemicals Division

Contamination Control for PFA

Ashwin_Rao_Daikin
Ashwin Rao
Semiconductor Marketing Manager
Daikin - Chemicals Division

8:13 am - 8:14 am

Introduction: Ashutosh Bhabhe

8:14 am - 8:29 am
Ashutosh_Bhabhe_Entegris
Ashutosh Bhabhe
Wet Etch & Cleans Applications Manager
Entegris

Metrology: (Ideally) Enabling the What, When, How, and Where of Unknown Contamination Detection and Control

8:29 am - 8:30 am

Introduction: Fuhe Li

8:30 am - 8:45 am
Fuhe Li - Air Liquide / Balazs
Fuhe Li
Director, Advanced Materials, Thin Films and Nanoparticles
Air Liquide - Balazs

Challenges in detecting nanoparticle, NVR, native oxide, and trace metals for 5 nm and beyond processes

8:45 am - 8:46 am

Introduction: Hugh Gotts

8:46 am - 9:01 am
Hugh_Gotts_Balazs
Hugh Gotts
International Fellow, Director R&D
Air Liquide - Balazs

HMW Organic Contaminants: What, Where, How?

9:01 am - 9:02 am

Introduction: Gary Van Schooneveld

9:02 am - 9:17 am
Gary_Van_Schooneveld_CTAssociates
Gary Van Schooneveld
President
CT Associates

Advance Metrology for Particle Sizing and Identification in Ultrapure Liquids

9:17 am - 9:18 am

Introduction: Ali O Altun

9:18 am - 9:35 am
Ali_O_Altun_Unisers
Ali O Altun
Co-Founder & CEO
Unisers

On-wafer detection and characterization of organic defects with Unisers

9:35 am - 10:00 am

Open Discussion

CAST FOA SCIS Standards

New challenges and opportunities in process and design continue to emerge in parallel to ever shrinking semiconductor device geometries. While Moore’s law and beyond are driving scale reduction, the industry is facing increased process sensitivity and complexity, and is redefining on-wafer defect tolerance in terms of size and complexity.  

Join us for this webinar-like session to discuss best-known methods from industry leaders

7:30 am - 10:00 am Off Add to Calendar Disabled America/Los_Angeles