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About 70% of the U.S. Gross Domestic Product (GDP) is driven by consumer demand. What consumers are looking for is influenced by, for example, fashion trends, product innovations, environmental forces, and personal interests. Regarding personal interests: Sales of electronic components at Fry’s are poor. Radio Shack stores even vanished completely. Today’s consumers do not like to tinker; they want to buy software-enabled, user-friendly systems with over-the-air updating that serves their current and future requirements well – e.g. smartphones. System vendors followed the same transition, and so did semiconductor vendors. Instead of offering (low margin) components, they develop and manufacture big portions of, if not complete, (high value) hardware and software solutions for electronic systems, targeted at specific markets.Mid-August, two SEMI webinars outlined the Smart Mobility market and what it expects from system and semiconductor vendors.SEMI's Smart Initiative“None of us knows as much as all of us,” “Connect – Collaborate – Innovate,” and other strategic considerations have motivated SEMI to become the gateway for the $2 Trillion (= 2,000 Billion) global electronic design and manufacturing supply chain. Figure 1 shows how many companies and organizations have joined this large industry organization, to work together efficiently and serve customer demands cost-effectively. Especially in four high-growth markets/application areas – Smart Data, Smart Mobility, Smart MedTech, and Smart Manufacturing – SEMI enables highly rewarding cooperation. Figure 1: Overview of SEMI members, technology communities, and areas of focus. (Courtesy: SEMI) MEMS and Sensors for Smart Mobility Tim Brosnihan, executive director of MEMS Sensor Industry Group (MSIG), moderated the webinar on MEMS and sensors for Smart Mobility. Bettina Weiss, Chief of Staff and Global Smart Mobility Lead at SEMI, presented the overview. In addition to Figure 1 above, she showed how many companies are now supporting SEMI’s Smart Mobility efforts and have joined the Global Automotive Advisory Council (GAAC). The European GAAC was founded in 2018, based on requests from VW and Audi. Regional chapters have also been formed in the U.S., China, Taiwan, and Japan. Figure 2 shows the current members of the American GAAC – new members are welcomed in all five regions. Figure 2: Current GAAC members in the Americas. (Courtesy: SEMI) Market Trends and Technology Innovations in MEMS Sensors Andreas Breiter, Partner at McKinsey Company, addressed markets, and Armen Mkrtchyan, Associate Partner at McKinsey Company, spoke about technology. Breiter addressed both vehicle and infrastructure changes required, as well as many ongoing and planned activities to enable Smart Mobility. He outlined autonomy, connectivity, electrification, and shared mobility of vehicles as the major opportunities for MEMS sensors. Mkrtchyan showed which technologies enable Smart Mobility and which regions will invest how much in software, hardware, and services by 2030, to capture data and process it in partially/fully autonomous vehicles’ Domain Control Units (DCUs) – see Figure 3. Figure 3: Pre-COVID market estimates. (Courtesy: McKinsey Company) MEMS-based sensors are used in vehicles to monitor pressures and perform as accelerometers or gyroscopes. Non-MEMS-based sensors capture light (e.g. for time-of-flight distance measurements) or magnetic fields (e.g. for RPM measurements). Regarding the many infrastructure upgrades needed for enabling autonomous vehicles on the roads, in Figure 4, Breiter gives road planners a lot of food for thought and planning work. City planners face much more complex challenges. That’s why electronic systems will also be needed to make these large infrastructure investments earn returns. Figure 4: Smart roads are essential for autonomous driving. (Courtesy: McKinsey Company) EDA and Smart Mobility The second Smart Mobility webinar focused on how Electronic Design Automation (EDA) tool vendors, Intellectual Property (IP, System Building Blocks) vendors, and system/IC Design Services can contribute to the success of Smart Mobility. Bob Smith, executive director of Electronic System Design Alliance (ESDA), moderated the webinar, highlighting where the relatively small but essential ESDA and its members fit in the semiconductor ecosystem – see Figure 5. Figure 5: EDA, IP, and design services enable the entire electronics ecosystem. (Courtesy: ESDA) Bettina Weiss explained how SEMI and the Smart Mobility Team are working to bring together stakeholders in the semiconductor ecosystem in general and the Smart Mobility segment specifically, to jointly address topics of common interest, work on solutions and agree upon standards where and when needed. Market Trends and Technology Innovations in EDA, IP and Design Services Andreas Breiter and Armen Mkrtchyan presented McKinsey’s perspectives regarding these topics. In addition to the above-mentioned market data, Breiter emphasized that DCUs are playing an increasingly important role in capturing the data provided by smart sensors, are processing it, and initiating appropriate actions. Together with application-specific software, these DCUs perform tasks like sensor fusion, manage creature comfort, assure safe operation of the vehicle, and secure communication with the outside world (Figure 6). Figure 6: High growth for DCU; likely shift in business models. (Courtesy: McKinsey Company) Mkrtchyan addressed EDA, IP, and services for Smart Mobility from 10 different technical perspectives. Here are the highlights. Component failures can and will have severe consequences in Smart Mobility. Therefore screening, testing, and exhaustive verification are extremely important. Software content is likely to increase at 10% CAGR during this decade. To increase the productivity of software and middleware developers, he emphasized that standards need to be agreed upon. Over-the-air (OTA) updating capabilities are needed. That’s why cybersecurity is important to keep vehicles current and safe. Power train electronics need to function at up to 150°C. New materials will be needed to increase reliability, reduce cooling efforts, and lower unit costs. Last, but not least, Mkrtchyan emphasized that every city needs to design its own infrastructure, not only to enable Smart Mobility but also to monetize the large investments needed; EDA, IP and design support will help to achieve both. In summary, he stated that Design and IP as well as packaging and test will be the most impacted areas in the transition to Smart Mobility. Personal Comments After having attended several MSIG events, I am impressed by how MEMS, NEMS (Nano…), and sensors can lend machines in many ways sight, smell, taste, touch, and hearing. They can replicate these human senses, often better than found in us. If you, like me, celebrated when your first modem enabled your PC to communicate with the entire world, you’ll appreciate the value MEMS and sensors can and will add to machines’ “communication skills.” Also, I can assure you that innovative engineers in this field will find many new ways to capture data in the physical, chemical, and biological domains and enable machines to keep humans safe. (I look forward to a handheld Covid-19 sensor that provides results within a few seconds!) Having worked for a small, then a large EDA vendor, many years ago, and for the ESD Alliance several years ago, I know how difficult it is to motivate innovative software developers to work together or agree upon standards. I am glad that the ESD Alliance is now working closely with SEMI. Most SEMI member companies, and their innovative employees, have learned over the years how important standards are to reduce development cost, processing, and test time, as well as time to profit. I wish Bob Smith and the ESDA members all the best for cooperating closely to define design standards, bi-directional hand-off points up and down the entire supply chain, primarily at the interface between design and manufacturing. I want to encourage EDA and IP experts to work closely with the experienced and knowledgeable people in materials, equipment, manufacturing, and test. 5G mm-wave communication, artificial intelligence/machine learning (AI/ML), reliable solutions for Smart Mobility, and development/characterization of new materials offer great opportunities and challenges for design AND manufacturing. Together, these two big camps can monetize required solutions much better and faster, than on their own. Your contact at SEMI can tell you how and where you can watch the webinar recordings and/or download all the slides. P.S.: Having two eCars and one eBike in our garage encourages me to appreciate SEMI’s efforts in advance Smart Mobility! Republished with permission from 3D InCites.
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Inertial sensors have continued to underpin the success of wearables in increasingly important ways. Propelled by evolutionary advancements in inertial sensors, wearables have strayed from their humble beginnings in simple activity and wellness, which defined the user experience over the past decade. What started with the simple act of telling people their daily step count has morphed to provide deeper insights into swim stroke and run cadence, all the way to mapping out a person’s off-piste ski route. Layered on top of this foundation of inertial sensors, we’ve fused optical, temperature and other sensor technology to provide clinical-grade healthcare snapshots available previously only by visiting the doctor’s office.Inertial sensors today are again leading the way in improving health and wellness. Instead of humans, however, this time the patients are machines. In fact, the health of critical assets – whether factory-based equipment, windmills, train bogies or aircraft – has been assessed through sophisticated analysis of their vibration signatures for many years. The sensors used for these applications have depended on piezoelectric technology because their vibration amplitude signals are very small and difficult to detect and because of the importance of understanding their spectral content over a wide bandwidth. When it comes to noise and bandwidth, bulk piezoceramics have had a major advantage over electrostatic MEMS technology – until recently.Using bulky expensive piezoelectric sensors for condition-based monitoring has been akin to going to the doctor’s office to have an MRI. The equipment required (sensors, receivers) is expensive and requires highly trained specialists to operate the machine and to interpret the information. For this reason, only mission-critical assets are instrumented. For nearly all other equipment, we tend to use inefficient schedule-based maintenance approaches to cover the gap of not having continuous data. Condition-based monitoring leverages real-time sensing of critical machine parameters to reduce system downtime and improve efficiency. Evolving machine healthMEMS started to democratize machine health several years ago, when suppliers began switching from piezoelectrics to capacitive MEMS. While the performance was still not on par with piezoelectric sensors, MEMS technology could already capture a wide array of faults. One example, the ADXL001, started making its way into Integrated Electronics Piezo-Electric (IEPE) and 4-20 mA sensors, which form the backbone of the vibration monitoring market. Although the bandwidth and noise of the sensor did not allow for very early detection and prescriptive monitoring, it did allow the tracking of faults as they progressed and became more imminent.Other digital accelerometers started finding their way into new wireless prototype systems with the goal to simplify and increase deployment to a greater population of assets. The thinking was that self-contained digital wireless sensor nodes could be deployed more economically and quickly, and that these digital sensors would bring the power of computing to the edge node.Unfortunately, even the lowest-noise MEMS products did not have the bandwidth needed to diagnose and predict faults early enough to influence how and when machines are maintained most economically. Instead, such devices were used to detect imminent failure to prevent irreparable harm. As we all know, however, the earlier the doctor spots a problem, the better the probable outcome. That’s because early detection increases the likelihood that the doctor will have access to the full spectrum of treatment options available to fix the problem.Inertial MEMS is blazing a new frontier with the introduction of next-generation capacitive MEMS such as the ADXL100x portfolio. Offering ultra-low noise density and high-frequency response, these newer capacitive MEMS devices fit the bill. With 3dB bandwidths up to 25 kHz and flat response curves within 0.4dB all the way to 10kHz, these accelerometers demonstrate compelling enabling characteristics such as better DC performance, improved robustness, lifetime stability, linearity, and of course, cost, making capacitive MEMS a better choice than piezoelectrics.With high-bandwidth capacitive MEMS much easier to use and deploy – as well as more affordable – the market is starting to respond. Condition monitoring equipment and instrumentation is becoming more accessible to a larger base of manufacturers. In turn, a wealth of data is being created and mined to develop better and timelier predictive and prescriptive maintenance approaches that rely heavily on machine learning and artificial intelligence (AI).It’s worth paying attention to the sizable condition-based monitoring market. Estimated at $3.5 billion and growing, condition-based monitoring reduces downtime and increases equipment utilization in quantifiable ways. And it’s not just manufacturers who stand to benefit. More sustainable and efficient industrial processes, safer trains that crisscross continents at ever increasing speeds, autonomous cars and trucks that know what’s happening under the hood as well as on the road, and modern infrastructure to support our evolving lives show us that condition-based monitoring has something for everyone.Learn more about Analog Devices’ condition-based monitoring signal-chain options that help customers on the journey from sensor to solution. View ADI’s whole portfolio of condition-based monitoring solutions online or download Next-Generation Condition-Based Monitoring brochure.Tzeno Galchev is product marketing manager in the Inertial Sensor Technology Group at Analog Devices Inc. He oversees the strategic marketing and product definition of the inertial sensor component portfolio. He received B.S. degrees in both Electrical and Computer Engineering in 2004, and M.S. and Ph.D. degrees in Electrical Engineering in 2006 and 2010 respectively from the University of Michigan, Ann Arbor. He has over 30 publications in the area of MEMS, holds multiple patents, and is a frequent lecturer and speaker on topics related to MEMS, energy harvesting and sensors.Analog Devices is a longtime member of MEMS Sensors Industry Group (MSIG), a SEMI technology community that enables the MEMS and sensor industry to address common challenges, innovate and accelerate business results.
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MEMS and image sensors are shining stars in the chip industry as technology companies worldwide accelerate innovation in the fight against COVID-19. The tiny devices are behind advances in areas of electronics ranging from thermal imaging and faster point-of-care testing to microfluidics-based polymerase chain reaction (PCR) tools and techniques to detect SARS-CoV-2.SEMI recently spoke with Yole Développement analysts Dimitrios Damianos and Chenmeijing Liang about MEMS and imaging sensors market trends and how microelectronics-enhanced technologies are supporting the worldwide push to contain the spread of COVID-19.For additional insights on the technologies, join the SEMI MEMS Imaging Sensors Summit, held for the first time at SEMICON Europa, 12-13 November 2020 in Munich, Germany. Registration is open.SEMI: Despite the global pandemic, the MEMS and sensors market is still growing and is one of the healthiest industries, not only in Europe, but globally. What is driving this growth?Damianos: MEMS have been continuously evolving from the first sensors that were measuring pressure and acceleration to rotation sensing and visible light management followed by light sensing beyond visible and the expansion to ultrasound and multi-spectral. Now we are heading towards an era where we want to sense every aspect of our environment, with more processing and eventually analytics bringing more quality to the data.COVID-19 has impacted various global markets in very different ways. While automotive, mobility and civil aviation have suffered, the impact on telecommunications and medical has been positive. The effects on the consumer, mobile and industrial markets have been moderate. Moreover, COVID-19 is changing the perception of the current global supply chain in manufacturing, potentially leading to more localized value chains and further regionalization in order to minimize similar risks posed by the pandemic and the first lockdown.SEMI: Who are the main MEMS players based on your research? Damianos: For MEMS players, the picture in 2019 was not the same as 10 years ago, when Texas Instruments (TI) and Hewlett-Packard (HP) were leading the scene, with Bosch and ST Microelectronics following, all at comparable revenue levels. Now, Broadcom and Bosch lead with almost $1.4 billion in revenue each, and the rest of the MEMS key stakeholders compete in the $400 million to $600 million league. Microphone players profited from the voice interface adoption trend, while players active in MEMS for mobility and smartphones suffered slightly due to weak end-system demand.SEMI: What scenarios can we expect for each market with regard to the impact of COVID-19 on MEMS for 2020? Damianos: For 2020, at Yole Développement we expect the consumer market to contract slightly by 2.6%, with the automotive market to dip by 27.5%, and defense and aerospace by 20.5%. For the defense market, no major effect is expected, as all major programs still run for the year. The market may experience some slight delays in deliveries due to supply chain and logistics problems. However, sensors integrated in commercial/civil aerospace applications will suffer due to the general paralysis of the air travel industry. On the positive side, telecommunications could increase by 4.7%, medical applications by 10.6%, and industrial by 11.5%.Due to the global pandemic, some types of MEMS have spiked in demand this year. For example, demand for thermopiles and microbolometers used in temperature guns and thermal cameras has increased because of the need for contactless monitoring of people’s temperatures. Moreover, microfluidics for DNA sequencing and real-time polymerase chain reaction (PCR) diagnostic tests for detecting COVID-19 are gaining market relevance, with the latter serving as a premier method of detecting a bacteria or virus on the molecular level with high degrees of accuracy. Furthermore, pressure and flowmeters in ventilators will grow because of huge demand by hospital intensive care units (ICUs).SEMI: What growth trends do you predict for the long haul?Damianos: In the longer term, we expect global MEMS volumes to almost double, from 24.4 billion units in 2019 to 50.8 billion units in 2025, with a 13% CAGR during the same period. The global MEMS market could reach $17.7 billion in revenue by 2025.We see a trend to more wearable devices integrating a lot of sensors but also a move to a more consumer-oriented healthcare. Moreover, everything related to voice interfaces and voice/virtual-personal assistants (VPAs) will continue to see strong growth, increasing demand for MEMS mics with better quality and high-fidelity voice capture. MEMS devices are shifting to higher accuracy, ultra-low power, embedded intelligence and possibly some bio-compatibility for medical applications.MEMS players will try to escape the commoditization cycle and deliver more value by increasing the value of the data, either grouping many sensors to create sensor hubs or by adding processing, algorithms and software. Industry players are employing strategies such as adding extra processing close to the sensor (e.g. Knowles) or ameliorating the use cases of their applications of their clients (e.g. Bosch or ST). AI on the edge seems very alluring for extra value acquisition, with many startups already working on it. Some examples include always-on-sensing (Aspinity in collaboration with Infineon, Syntiant), echolocation (IMERAI) and predictive maintenance using inertial sensors (Cartesiam). This will be the next pit stop for MEMS technology for sure. SEMI: The CMOS Image Sensor (CIS) is a cornerstone technology in the development of devices powered by machine sensing and artificial intelligence (AI) for applications such as advanced driver assistance system (ADAS). CIS powers many of the ongoing revolutions in new technical products and use cases. What is the status of the image sensors industry? Liang: Last year was exceptional with a combination of high demand and high prices due to capacity limitations. Q4 2019 went way above the forecast, and, in the end, the CIS industry reached $19.3 billion for the full year. This year, we think it will return to normal, and, despite the pandemic impact, we expect significant growth in the range of 7% to 12%. Last year’s 25% year-over-year (YOY) growth was the highest we’ve seen over the past decade. Mobile still dominates the marketplace for CIS with 69% market share. Two markets, computing (8%) and consumer (5%), are adjacent to the mobile market but progressively losing ground due to the smartphone disruption.Security, at 6% market share, will probably be the second largest CIS market in the future. Although this is an area of excellence for the emerging Chinese players, unfortunately, they could be hit by the current trade war. The automotive market did very well from 2018 to 2019 because of the numerous applications recently developed for ADAS, viewing, and in-cabin applications. Lastly, the industrial camera applications benefited from large investments in automation, especially in the semiconductor and automotive industries, but here again many uncertainties remain as these markets will reshuffle in the post COVID-19 world. SEMI: Which CIS markets are most susceptible to seasonality and the impact of COVID-19?Liang: According to our quarterly CIS monitor, automotive and security were both negatively impacted by the pandemic beyond what we expected in terms of seasonality. For computing, the situation improved just prior the lockdown. Q1 got a positive impact with high sales results for laptops and tablets, but no significant impact was seen for security equipment. For automotive, the demand for cameras was very high in Q1, which is seasonally normal, despite the decrease of car shipments that followed later. The automotive CIS market in 2020 should remain relatively flat compared to 2019 due to the higher attachment rates of cameras despite the lower number of cars produced. Consumer and industrial segments dropped in Q1, which is typical early in the year.The next five years might be a bit slow, and although we forecast growth for the next year, in the future the market share will be lower in mobile. In fact, mobile CIS growth will fall below the CIS growth average, but we will see an increase of market share for the security, automotive and industrial segments. The CIS market could reach $28 billion in 2025.At first, COVID-19 had a limited impact on the production side, as factories in China are usually closed for the New Year holiday, when the pandemic started. While supply is currently recovering, we still consider the limited impact on demand. Smartphone production for 2020 will be down 6%, but camera shipments for mobile should increase about 10% this year. Another positive trend for the mobile market is optical fingerprint implementation. Currently, high-end Android phones use this kind of technology. For 2023, we estimate optical fingerprint technology revenue to be over $1 billion.The roadmap for the automotive market is driven by camera proliferation. We’ll see 10 cameras per car and more for some high-end vehicles. Increasing demand for safety and convenience will mean more cameras per car in the future. With a strong attachment rate, the market average in automotive is around 2.0 cameras per car nowadays, and we expect the market average to reach 3.5 cameras per car in 2025. In security, Charge Coupled Device (CCD)-based cameras are nearly out of the market, as CMOS-based IP cameras are most important now.SEMI: What are current key technology trends?Liang: 3D semiconductor technology is the hot topic. CIS wafer staking technology is indeed at the center of the CIS technology race. Future applications could be AI analytics or recently developed applications on new types of CIS. So far, we have seen the introduction of variants of the CIS pixel. Global shutter (GS) and indirect Time of Flight (iToF) were recently introduced, and now direct time-of-flight (dTOF) pixels are being used in high volume. 3D semiconductor technology is a bonanza for the industry, as it allows to pack more value in a single chip. While the surface of silicon is still increasing, additional silicon is added through stacking.With COVID-19 still a problem, the endpoint for smartphones in 2020 remains uncertain. The short-term impact for CIS will be slower growth with respect to the 25% YoY of last year. The downturn in car production will be mitigated by an increased attachment rate for automotive cameras. The security market will also help maintain CIS growth.For more insights, see the following reports: Status of the MEMS Industry 2020 3D Imaging and Sensing 2020 CIS Market Monitor Q2 2020 Dimitrios Damianos is a technology and market analysts at Yole Développement covering MEMS, Sensors, Photonics and Imaging. Chenmeijing Liang is a technology and market analysts at Yole Développement covering Imaging. Serena Brischetto is senior manager of Marketing and Communications at SEMI Europe.
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Humanity has survived almost unimaginable challenges over the past 5,000 years of documented human history. From war, famine and natural disasters to the first global pandemic in the last 100 years, more often than not, people have relied on one another to survive and thrive again. As the industry association representing the global microelectronics industry, SEMI has similarly made collaboration and community integral to the fabric of its organization. From helping members to succeed through the COVID-19 pandemic to facilitating member-driven industry standards around environmental health and safety, materials, and manufacturing capabilities, this approach shows members that standing together is better than standing alone.On the eve of the 50th annual SEMICON West (July 20-23, 2020) — the first virtual edition in SEMI’s history — I spoke with SEMI’s vice president of technology communities, Michael Ciesinski, about the role of SEMI in tackling big challenges through an active member community intent on solving problems through collaboration.SEMI: How long have you worked with SEMI and in what capacity?Ciesinski: In January 2016, I started my second tour at SEMI when FlexTech, the industry consortium I’d been leading, became SEMI’s first strategic partner. Nearly two years into that role, SEMI President CEO Ajit Manocha asked me to form Technology Communities to engage members with common interests. After FlexTech, we brought on the Fab Owners Alliance, then MEMS Sensors Industry Group (MSIG), and later the Electronic System Design Alliance (ESD Alliance).SEMI now has more than 20 communities in all, including Smart MedTech, Smart Data AI, Smart Manufacturing, Electronic Materials, and Integrated Packaging, Assembly and Test.SEMI: What is your role with Technology Communities — and how do members stand to benefit?Ciesinski: The leadership of Technology Communities ensures that SEMI’s benefits and services align to our members’ interests so we can provide member benefits that matter most. This spans forming communities where people hold common interests (e.g., advanced packaging) to facilitating standards that will promote intelligence in manufacturing (e.g., data standards for AI and machine learning) as well as providing R D funding.I’m especially proud that over the past three years, SEMI has brought more than $40 million in R D funding to our members, with most grants in the $500,000-$1 million range. We’ve been especially successful in securing funding in flexible hybrid electronics (FHE) through U.S. Army Research Laboratories (ARL), a model we first developed through FlexTech.Two recent recipients of FHE funding, GE Research and ITN Energy Systems, show how the grants are spawning partnership opportunities among commercial enterprises, R D organizations and universities. In developing lightweight, non-invasive wearables, including a human-performance sweat-monitoring patch that remotely analyzes sweat to detect hydration levels and other vital signs, GE Research is using key components such as sensors and lightweight batteries in its designs.ITN Energy Systems designed a flexible all-solid-state lithium battery that’s printed on light, flexible substrates to power small and incredibly thin applications.Universities are also benefiting by plugging into the SEMI ecosystem. In fact, 40-50 percent of funded projects are seeding commercialization by universities. This is another validation that SEMI’s collaborative, community approach to microelectronics is working.SEMI: Position, Timing and Navigation (PNT) is another hot area where SEMI has secured ARL funding. What makes this funding different and why is it important?Ciesinski: The PNT grant makes ARL funding available to the MEMS Sensors Industry Group (MSIG) members through SEMI for the first time. If you’ve ever lost GPS signal while coming out of a tunnel, you know how frustrating that is. For us, that’s an inconvenience, but for a healthcare worker in a remote location who’s waiting for a delivery of medication by drone, it could be life-critical. While that’s just one example of why we need PNT to operate when GPS isn’t available, I can imagine dozens of other important dual-use cases, including autonomous driving.SEMI: How else do Technology Communities benefit under SEMI?Ciesinski: Technology Communities need access to diverse resources to spur continuous innovation. Electronic Materials Group participants, for example, need to stay informed on regulations coming out of Asia, the U.S. and Europe that may affect their businesses. Where else other than SEMI can like-minded stakeholders congregate with people up and down the supply chain to determine whether industry-wide action is needed on regulation?SEMI: What is the importance of SEMI’s global footprint?Ciesinski: I’ve worked with many associations and managed major industry consortia. The clear advantage of SEMI is our global footprint. And that’s vital because microelectronics is a global industry involving a multitude of stakeholders that play essential roles in the supply chain.Let’s say you want to discuss EU regulations on hazardous chemicals. Rather than decipher these complexities alone, you can pick up the phone to speak with someone on SEMI’s European team to learn what’s critical.What if you’d like more information on the 20-plus new fabs that are going up in China? You can explore that question with our SEMI China or SEMI Industry Research and Statistics teams.SEMI: How has SEMI evolved over the years?Ciesinski: SEMI has a long history of providing what the industry cares about. We started in trade shows and pivoted to industry standards. We began with small silicon wafers and wafer carriers, and now within the span of 50 years we’re working on data-format standards that will support the application of AI and machine learning (ML) in the semiconductor industry.While highly varied today, data-format standards will help component manufacturers refine processes to create more efficient solutions. This ARL-funded program, which pairs SEMI members with the grant recipient, Cornell University, may offer dramatic gains in the productivity of semiconductor manufacturing.SEMI: How does SEMI’s approach to COVID-19 reflect core values of collaboration and community?Ciesinski: Together with Ajit Manocha, CMO Terry Tsao and other team members at SEMI, we pulled together a task force to help SEMI members navigate the pandemic.We tapped two existing groups, Environment, Health and Safety (EHS) and Information Technology Leadership (ITL) from the start, documenting their strategic and tactical approaches to help all members through the COVID-19 resource section of our website. The EHS section provides tips on facilities and meetings, employee policies, business travel and communications, while the ITL section lists insights on computing hardware for staff, licensing, networks, security and employee policies.Our EHS leadership team, which includes Entegris, Axcelis, Versum, and Intel, immediately started sharing best practices for sanitizing facilities. As a result of team meetings, SEMI EHS shared best practices on keeping the workforce remote and guidelines for returning people to work safely. From securing PPE and safeguarding employees and visitors by performing thermal scanning to outlining communications around potential employee exposures, EHS has provided meaningful resources for the benefit of all members.SEMI also took immediate steps in the area of advocacy. Our advocacy team in Washington, D.C., together with regional SEMI presidents around the world, have ensured that semiconductor facilities were and still are considered essential businesses in the U.S., Europe and Asia. That’s because microelectronics are foundational to fighting the pandemic.Microfluidics are critical to the Reverse Transcription (RT) Polymerase Chain Reaction (PCR) tests most commonly used for COVID-19. Sensors are embedded in the pulse oximeters that allow patients and healthcare professionals to monitor a vital rubric: oxygen saturation level. If oxygen saturation level drops into the low 90 percentiles or below, it may be time to go to the hospital for treatment.Microcontroller units are essential components in a wide range of hospital equipment, including the ventilators that may make the difference between life and death in the most seriously ill patients.SEMI: How can the ingenuity realized through microelectronics continue to help us tackle other big problems? Ciesinski: We have MEMS and sensors to thank for distributed intelligence, giving us the ability to put sensors anywhere, locally based in the field or in the packaging house.Food production is a prime example. Leveraging miniaturized wirelessly connected sensors, we can trace food through the entire production lifecycle, from the seed in the ground to the food in the warehouse and, ultimately, to the product that lands on the table.From larger enterprise such as IBM Food Trust to small startups, we’re using MEMS and sensors to improve crop yields so we can feed a human population that’s growing each year.There’s a sustainability piece as well. We’re using MEMS and sensors to reduce the amount of fertilizer or other nutrients or chemicals in the soil. That’s good for the environment and for the agricultural workers who labor in the fields.MEMS and sensors can also condense the time it takes to perform a specific task, conserving human resources.SEMI: Where do you think SEMI will go in the next decade?Ciesinski: Ten years from now, I believe we will still have our global footprint in place. I expect it will expand, particularly in Asia.We may also expand into new areas such as Latin America and Central America, which would provide at least two major benefits: People working in microelectronics would, I hope, have access to better quality of life. And diversifying the supply chain would allow nations and regions to have more control over the products they need, from PPE to medications, which may help us to better manage through the next pandemic.I am also hopeful that SEMI will be on the leading edge of helping our members communicate in much different fashion from what we have today. We’re already expanding beyond the paradigm of in-person meetings for standards meetings and conferences. As we move forward, I think we’ll see a hybrid solution to doing business, combining in-person meetings with virtual conferences and digital content that’s available 24/7.Whatever changes we see in SEMI, I’m confident that we will continue to see a global footprint in an industry association that prioritizes connections among members.Engage in the SEMI experience at upcoming SEMICON WestRegister today to hear from keynote speakers such as environmental advocate and former U.S. Vice President Al Gore, futurist and author Steve Brown, and IBM Research senior vice president and director Dr. John E. Kelly III, and Lea Gabrielle, special envoy of the Global Engagement Center for the U.S. State Department, at SEMICON West , July 20-23, 2020. Content will be live streamed and available on-demand. Michael Ciesinski is vice president of Technology Communities for SEMI, the global microelectronics industry association, appointed in August 2018. At SEMI, he directs activity for more than 20 industry groups, oversees the association’s R D funding program, and develops new technology initiatives to serve SEMI’s 2,400 members. Prior to re-joining SEMI, Ciesinski was president/CEO of FlexTech Alliance, an industry consortium focused on new methods of creating electronics. From 1995-2008, Ciesinski served in a similar role at the U.S. Display Consortium (USDC), a private/public partnership chartered with building the infrastructure for electronic display and flexible electronics manufacturing. Both FlexTech and USDC annually sponsor multimillion dollar technology development programs and provide industry technical, financial and market services. Ciesinski is a graduate of the University of Albany, NY, and a former member of the Dean’s Advisory Committee at California Polytechnic State University.Maria Vetrano is a PR consultant at SEMI.
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Since 2015, FlexTech has funded three projects with ITN Energy Systems, based in Littleton, Colorado. The projects all draw on a unique concept of using thin, flexible ceramic sheets as both a substrate for functional devices and as an integral part of the hermetic packaging to support paper-thin FHE products. Each program was increasingly sophisticated, enabling a larger variety of functions to be integrated into a common package. Independent functions such as energy storage, energy harvesting, or printed microelectronic circuits are deposited on their own ceramic substrate and the layers vertically stacked and interconnected into a monolithic structure that combines several functions in the smallest possible package volume.The ITN projects provide excellent examples of the power of collaborative research and development to help de-risk investments in next-generation electronics. All the projects were conducted with technical contributions from small and large businesses as well as university partners. The programs were funded by the U.S. Army Research Laboratories (ARL), directed by industry leaders and managed by SEMI FlexTech with the focus on utilizing the advantages of flexible hybrid and printed electronics (FHE) to create lighter-weight, lower-power, more conformable electronics than available commercially today. Markets ready to take advantage of FHE developments include healthcare, aerospace, mobility, consumer electronics, industrial electronics.ITN was founded in 1995 to focus on researching and developing technologies related to aerospace, energy and the environment for defense and commercial marketplaces. Its business model employs collaborative R D projects to explore, develop and validate promising next-generation clean energy technologies with an emphasis on tackling the manufacturing challenges that enable low-cost, high-volume production of thin-film devices on flexible substrates. Those technologies that meet the technical and business requirements of the market are commercialized via focused, spin-out companies with five such spin-outs formed so far. The work on ultra-thin batteries needed by the SEMI FlexTech community readily slid into their portfolio of projects.Project 1 – New Solid-State Lithium BatteryThe first project kicked off in 2016, with ENrG, and successfully supported the development and validation of novel Solid-State Lithium Battery (SSLB) products with total packaged thickness ranging from 50-250 microns. The SSLB proved to have substantial advantages in form factor and performance when compared with both commercial-off-the-shelf batteries and emerging technologies. For example, the SSLB provided more than double the operating time in a substantially smaller package in powering an audio device supplied by SEMI FlexTech partner companies.By avoiding the use of liquid electrolytes, the ITN SSLB also eliminates flammability issues while still allowing the benefits of lithium-based battery chemistry. The SSLB boasted many attributes attractive to the FlexTech community, including: Ultra-thin form factor, i.e. 250 microns thick, mAh class packaged batteries High volumetric energy density, i.e. baseline products with ~500 Wh/l and a roadmap to 1,000Wh/l The ability to support high current pulsing, i.e. current pulses at 4-10C rates, in support of demanding FHE duty cycles High temperature compatibility with solder reflow and other FHE integration schemes Rechargeability with high capacity retention at 1,000 cycles This new SSLB has formed the foundation of subsequent projects and commercialization efforts.Project 2 – Adding Energy Harvesting Based Recharging Capability The second SEMI FlexTech-funded project proposed a novel self-recharging battery with the addition of Lucintech’s cadmium telluride (CdTe) photovoltaics (PV), which was also deposited on thin yttria stabilized zirconia (YSZ) substrates. Because the CdTe supports a superstrate configuration, the SSLB can function as the back sheet for the PV package, thereby dramatically decreasing overall package thickness. The resulting flexible integrated power pack provided up to 0.25 Wh of energy storage and ~0.2 W of PV generating capacity in a total package less than 250 microns.As part of that effort, the ITN Team identified an effective power-management circuit that was ultimately compatible with die thinning and form factors very attractive to FHE. Consequently, the PV and SSLB were interconnected into a common power bus that enabled FHE to be operated with either the PV, SSLB or some combination of the two.ITN is seeing great interest in this product and both developing a version with substantially higher capacities than the project entertained for a UAV platform while ramping to low volume with support from NextFlex, a member of the Manufacturing USA network, and formed in 2015 through a cooperative agreement between the U.S. Department of Defense (DoD) and FlexTech Alliance.Monolithic integration of function layers atop of SSLB for high performance microelectronics device Project 3 – Integration with Processing and Sensor SystemsThe third FlexTech-funded project builds further on that foundation. In this project, the ITN Team is maturing the technologies to create a battery with an integrated processing and sensor system, nicknamed BiPASS. In addition to SSLB layers, the BiPASS package integrates printed circuits on YSZ employing high-performance, silicon- based bare die micro-electronics and/or thin film sensors into the common packaging. Mock-up of the charge control circuit on SSLB The initial demonstration integrates a commercial lithium battery charge control circuit within the SSLB packaging to create a monolithically integrated power module. There have also been promising developments of the University of Rhode Island’s metal oxide (MOx)-based thin film gas sensors that have dramatically increased sensitivity when deposited on thin YSZ. The resultant sensor achieves ppb detection of trace explosives gases that can be powered by SSLB. Along the way, ITN’s partners Molex and SunRay Scientific matured several aspects of FHE circuit printing and integration on both PET and YSZ, including new materials and processes for conductive traces, and bare die attachment with fine features. The project is in its final stages and the ITN Team now has a promising roadmap to integrate power, microelectronics, and thin film sensors/sensor systems into a single paper-thin package.Commercial Scale-Up StrategySince the initial demonstrations were completed, ITN has been actively maturing a commercial scale-up strategy based on significant market-pull and interest from several companies. A new venture to commercialize this next generation SSLB is in process. As part of those discussions, ITN is in active discussions with potential strategic partners to support the transition to high-volume production to access additional markets, many of which are cost-sensitive and need a higher degree of production maturity.In the meantime, ITN’s limited volume SSLB production line is already supporting medical device customers. In addition, a baseline SSLB (~2.5 mAh capacity) has been developed and tested in several new applications, including wearables, sensors and smart labels.“Based on the acceptance of these project in the market, I believe all three projects have provided significant value to the SEMI FlexTech community,” noted Brian Berland, Chief Technology Officer at ITN. “In addition, the connections and visibility we have gained within the industry by partnering with SEMI FlexTech have been invaluable. We are excited to continue this journey with new and additional projects. In the meantime, we are hopeful that our ongoing discussions with investment partners will support our commercializing of these components.”For more information visit www.flextech.org. SEMI FlexTech is currently (from 6/10/2020 – 7/17/2020) accepting white papers for new technology development projects. Read more at www.flextech.org.About the AuthorDr. Gity Samadi is the SEMI FlexTech Program Manager. Gity is responsible for the flexible hybrid electronics R D consortium activities including project awards and management, Technical Advisory Council management, and webinar/industry event planning for the building and fostering of this dynamic innovative community.
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On Saturday, March, 21, 2020 the U.S. Food and Drug Administration (FDA) gave emergency authorization to Cepheid, a California company, to sell a new test for rapid detection of the pandemic coronavirus SARS-CoV-2, which causes COVID-19. Cepheid’s Xpert® Xpress SARS-CoV-2 test gives healthcare workers results in just 45 minutes, with less than a minute of hands-on time for sample preparation.Cepheid, founded by Kurt Petersen, M. Allen Northrup and five others in 1996, is well known in the MEMS community for commercializing microfluidic chip-based polymerase chain reaction (PCR) analysis machines. This is not the first time Cepheid has responded quickly to a biological threat; after the 2001 terrorist attacks in the USA, Cepheid was the first to provide rapid anthrax detection capabilities to the U.S. Postal Service, and it still does today.At the heart of all COVID-19 test protocols (see the WHO protocol and U.S. CDC protocol) is the real-time reverse transcription polymerase chain reaction (RT-PCR) analysis technique. In a very simplified description, PCR uses thermal cycling to amplify the DNA present in a patient’s swab sample, and then using fluorescence optical detection, searches for the virus’s specific DNA. The test requires knowing the virus’s genome in the first place; the crucial work to sequence the full genome of SARS-CoV-2 was first published by Chinese scientists for public use on January 10, 2020.While traditional PCR machines take many hours to thermal cycle and reach a result, MEMS-based PCR systems can work much faster. Featuring scale heaters and reaction chambers that have a tiny thermal mass, they create a significantly faster heat-cool cycle, enabling a rapid result in minutes.The first MEMS silicon PCR chip, developed by Northrup et. al. at Lawrence Livermore National Laboratory and licensed to Cepheid (left) and the Cepheid test cartridge today (right). (Source: Northrup MA, Ching MT, White RM, Watson RT, “DNA amplification in a microfabricated reaction chamber,” Transducers 1993, Yokohama, Japan. pp. 924–926.) Research on MEMS-based PCR systems has continued steadily since the early 1990s. Today, researchers have been focusing on developing highly integrated, low-cost systems specifically for point-of-care use. One example of recent research: a team at Korea’s ETRI and Genesystem have developed a prototype low-cost, handheld PCR system having a polyimide chamber and microheater and an integrated CMOS detector for optical readout of results (figure below). Cross-section schematic of the chamber, heating module and integrated optical detector in a portable PCR prototype (left) and integrated test cartridge (right). (Source: DS Lee, OR Choi, and YJ Seo, “A Handheld and Battery-Powered Realtime Microfluidic PCR Amplification Device,” Transducers 2019, Berlin, Germany pp. 1063-1065.) Korea’s quick recruitment of its biotech companies and creation of novel drive-through testing sites helped it to successfully pinpoint its COVID-19 outbreak and to implement control measures. Let’s hope the Cepheid test can be similarly effective.Based on successive epidemics of SARS, MERS and now COVID-19, rapid PCR test machines, enabled by MEMS technology, are becoming essential medical tools in the fight against viral outbreaks. As continued development lowers the cost of such critical equipment, let’s hope we may soon have a PCR machine in every doctor’s office.Alissa M. Fitzgerald, Ph.D., founded A.M. Fitzgerald Associates, LLC (“AMFitzgerald”), a MEMS and sensors solutions company based in Burlingame, CA, in 2003. She has over 25 years of engineering experience in MEMS design, fabrication and product development.Prior to founding AMFitzgerald, Fitzgerald worked at the Jet Propulsion Laboratory, Orbital Sciences Corporation, Sigpro, and Sensant Corporation, now part of Siemens. She received her bachelor’s and master’s degrees from MIT and her doctorate from Stanford University, in Aeronautics and Astronautics. Fitzgerald has numerous journal publications and holds eight patents. She served on the Governing Council of MEMS Industry Group from 2008-2014 and was inducted into the MIG Hall of Fame in 2013. Fitzgerald serves on the Board of Directors of both Rigetti Computing and the Transducer Research Foundation.AMFitzgerald is a longtime member of MEMS Sensors Industry Group (MSIG), a SEMI Strategic Association Partner. For more information on AMFitzgerald, please visit: https://www.amfitzgerald.com.Interested in learning more about this topic? Read Alissa M. Fitzgerald and Farzad Khademolhosseini’s article in EE Times, MEMS in the Fight Against Covid-19.
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As the body’s largest organ, skin is responsible for the transduction of a vast amount of information. This conformable, stretchable, self-healable and biodegradable material simultaneously collects signals from external stimuli, which translates into information such as pressure, pain and temperature. The development of electronic materials, inspired by the complexity of this organ, offers a tremendous unrealized materials’ challenge. Fortunately, the advent of organic-based electronic materials may offer a solution to this longstanding problem.Zhenan Bao, K.K. Lee Professor of Chemical Engineering, Stanford University, is one of the world’s leading researchers working on the design of organic electronic materials that mimic skin functions. SEMI’s Maria Vetrano interviewed professor Bao to preview her February 25 keynote, Skin-Inspired Electronics, at FLEX|MEMS Sensors Technical Congress (MSTC) 2020, February 24-27, 2020, at the DoubleTree by Hilton in San Jose, California.Join us at FLEX|MSTC to meet Professor Bao and other industry influencers furthering innovation in flexible hybrid electronics (FHE) and MEMS sensors. Register now to connect with her at FLEX|MSTC or visit her on LinkedIn.SEMI: Your pioneering work on the use of electronic materials to construct second skin is a major step forward in human-machine interfaces. Could you please describe second skin?Bao: Second skin is a new electronic-device platform encompassing electronic devices that have skin-like properties such as stretchability, self‐healing ability, biocompatibility and biodegradability. In essence, the second skin is an electronic system of fully integrated multifunctional components operating on the surface of or inside the body to enable smart healthcare for disease prevention and treatment and to enhance the functional capabilities of natural skin. The second skin could also serve as a module to connect our human body to the Internet, thereby allowing human integration with the Internet of Things (IoT) for next‐generation wireless communications. In this way, we can view the second skin as an artificial body part that can be used to improve our everyday lives.SEMI: How might second skin operate in the human body?Bao: It has many potential uses. It could be a prosthesis for people who have lost their sense of touch. It could be used to repair damaged skin as well as to provide enhanced functionality that’s not possible with biological human skin. It could, for example, connect us with our external environment, with other people, even with our cars.I can also envision second skin as an implantable device for both neurostimulation and for early detection of disease. Schematic illustration of structure of second skin composed of functional devices: sensor, integrated circuit, display and power supply. Source: Stanford University SEMI: How did you get started in this research? Bao: Sixteen years ago when I started at Stanford, I learned of a colleague in mechanical engineering who was working on robotic cockroaches. That’s when I understood the need for sensor functions in robotics.I considered the large number of people with prosthetics who do not have a sense of touch. With this audience in mind, I started by designing a simple flexible electronic device that could take the shape of skin, even conforming to a robot hand, thereby approximating the natural sense of human touch.Once we developed the first sensor, and realized that its touch sensitivity could eclipse that of human touch, I asked myself: what can we learn from second skin – in addition to its sensing functionality?Skin is not just flexible; it is biodegradable and stretchable. So we started to dream. We began by developing electronic materials, either conductors or semiconductors. We added new functionality, such as self-healing properties, biodegradability and stretchability. That opened the way to new materials’ development.SEMI: What discoveries have you made in new materials?Bao: Over the past decade, we’ve developed skin-like materials with electronic properties that are on par with the best conducting and semiconducting polymers. Some of our skin-like semiconducting polymers can perform even better than amorphous silicon. That means with suitable processing methods, we can make stretchable ICs, initially with tens of transistors that can perform analog or digital functions, and in a later stage, stretchable displays driven by active matrix arrays.SEMI: What would it take to put these materials into production?Bao: We need to develop methods to pattern the skin-like electronic materials into fine features. We have been leveraging similar processes used for flexible circuit boards. Some research groups are developing roll-to-roll fabrication and printing methods.SEMI: Which technologies/applications are you commercializing?Bao: C3Nano is a Bao Research Group spin-off startup that is commercializing nanomaterials that are promising for bendable and foldable electronics.Another spin-off that is licensing our technology, PyrAmes, is developing a continuously non-invasive blood-pressure monitor. It’s not a cuff so the patient doesn’t have to remember to put it on.In the shorter term, we’re looking at putting artificial skin on prosthetic limbs and robotic hands. Further down the road, we could put skin on wounded regions of the body, forging connections to nerves that would support realistic sensation.To realize these applications, we’ll need to conduct further R D on materials and applications. The manufacturing of these devices still needs much more development.Fortunately, we’re part of a fertile development ecosystem at Stanford. I started the Stanford Wearable Electronics Initiative (eWEAR) to forge collaborations across Stanford campus as well as with industry.SEMI: What would you like FLEX|MSTC attendees to take away from your presentation?Bao: I’d like them to realize that the future of electronics is changing. I imagine a future in which the functions of a smartphone will disappear into what we wear, what we attach to our skin and what we implant inside our body. I believe that skin-like electronics will help to facilitate this future, allowing us to connect with each other and our surroundings in ways that feel natural, yet that also enhance our quality of life. Zhenan Bao is K.K. Lee Professor of Chemical Engineering with courtesy appointments in Chemistry and Material Science and Engineering at Stanford University. She founded the Stanford Wearable Electronics Initiate (eWEAR) and serves as the faculty director. Prior to joining Stanford in 2004, she was a Distinguished Member of Technical Staff at Bell Labs, Lucent Technologies from 1995 to 2004.Bao has over 500 refereed publications and over 65 U.S. patents with a Google Scholar H-Index 155. In her recent work, she has developed skin-inspired organic electronic materials, which have resulted in unprecedented performance or functions in medical devices, energy storage and environmental applications. She has pioneered several important design concepts for organic electronic materials. Her work has enabled flexible electronic circuits and displays.For more information on professor Bao’s research, visit Bao Research Group. FLEX|MSTC is organized MEMS Sensors Industry Group (MSIG) and FlexTech, SEMI technology communities focused on the growth of MEMS sensors and the flexible electronics supply chain, respectively. Maria Vetrano is a public relations consultant at SEMI.
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MEMS technology has changed human interaction with electronic devices. Introduced in the 1990s, the first mass-market MEMS devices were used for inkjet printheads and automotive airbag crash sensors. Today, MEMS are ubiquitous, with billions of the tiny devices adding intelligence and interactivity to smartphones, smart speakers, wearables, automobiles, biomedical devices, remote monitoring and event detection systems, and countless other applications. Integrating MEMS with Flexible Hybrid Electronics (FHE) is an important step in the evolution of this miniaturized intelligent sensing technology, paving the way for its use in new classes of flexible, conformal devices.The integration of the two technologies promises to breed new applications in small form factors but also presents challenges inherent to FHE design and fabrication processes. SEMI’s Nishita Rao caught up with Nathan Pretorius, prototyping and automation engineer, NextFlex, to discuss MEMS-FHE device integration challenges and opportunities ahead of his February 26 presentation, Integrating MEMS Devices in FHE, at FLEX|MEMS Sensors Technical Congress (MSTC) 2020, February 24-27, 2020, at the DoubleTree by Hilton in San Jose, California.Join us at FLEX|MSTC to meet Nathan and other industry influencers advancing innovation in FHE and MEMS sensors. Register now to connect with him at FLEX|MSTC or visit him on LinkedIn.SEMI: Why is integrating MEMS devices into FHE systems important? What new use cases might it enable?Pretorius: The main value proposition of integrating MEMS devices into FHE is that it allows MEMS devices to exist in a different form factor than was possible previously, giving us high-quality MEMS sensors on the flexible and conformable platform of FHE.Ease of application, flexibility, lower cost and rapid iteration on a design are just some of the benefits of FHE devices. And because there are few robust FHE sensors that overlap with MEMS’ capabilities, when you combine the two, you get a lot of compelling uses. That’s why NextFlex is working with agencies and companies to evaluate MEMS’ integration, including using bare MEMS die with microfluidics and promoting new ways of attaching and packaging MEMS die for use with FHE. SEMI: Why is FHE an ideal platform for integrating various types of sensors?Pretorius: MEMS integrated with FHE devices are ideal for rapid design and deployment of data-gathering sensor nodes — which we can iterate for specific applications. A few examples include on-body health monitoring devices for bio-fluids analysis, medical pressure sensors for monitoring blood pressure, and peel-and-stick sensors nodes for infrastructure monitoring. In terms of design and production, FHE devices support rapid prototyping, allowing for instantaneous design-iteration cycles. This speeds design-to-production over traditional rigid PCBs and copper flex because the feedback cycle time between design, manufacturing and testing is shorter, accelerating time to market. What’s exciting about FHE technology is that a variety of sensors or components, including MEMS, can be designed into the base system to easily customize it for a specific application. In addition, our experience shows that when compared to a traditional rigid PCB, an FHE board reduces manufacturing steps and device weight by two-thirds and, perhaps most importantly, converts the device to a thin, conformal shape that makes possible products in new form factors. SEMI: What are the primary challenges to integrating MEMS with FHE? What is NextFlex doing to help device manufacturers address these challenges? Pretorius: There are a few challenges, some of which are device-specific. Most recently, I’ve been focusing on inertial and timing devices, including accelerometers, gyroscopes and resonators. There are a few technical challenges involved in the process of getting the devices from the wafer to an FHE substrate. The wafer processing is very important, especially the dicing and thinning steps. After thinning and dicing, the die is placed onto the FHE substrate. The stresses caused by bonding to the substrate have to be understood and characterized. After placing the die, you then have a calibration step, which is normally performed after the device is packaged. With a MEMS die placed onto directly onto an FHE substrate, calibration then must be done.Finally, the device encapsulation is important, since on an FHE substrate the hard-to-soft material transition is very important to mitigate stresses to rigid component interfaces. We have also been looking at how to work with devices that have damping vents. Flexible encapsulants are inherently more permeable to gases and water vapor than hard encapsulants, so studying the encapsulation of MEMS devices on FHE is another area of interest. NextFlex has been working in a supporting role to evaluate best design practices and best attach and integration methods. In addition to our ongoing collaborative programs, NextFlex is developing the FHE manufacturing ecosystem to include system and component manufacturers and designers, product developers, and materials and equipment providers.SEMI: How do we facilitate closer collaboration between the FHE manufacturing ecosystem and MEMS suppliers such as MEMS device manufacturers, product developers, and materials and equipment providers?Pretorius: It’s important to include manufacturers early in the design process so we can identify challenges up front. That’s why NextFlex spearheads technology road-mapping efforts that include representatives from across the manufacturing ecosystem. We use the roadmaps to prioritize challenges that we can address effectively through collaboration, focusing the industry on solving problems through Project Calls that reveal integration challenges and results from real devices and that tell us how the materials and equipment actually perform with a real device.NextFlex keeps the information flowing, holding quarterly project update webinars to share results. As current devices are optimized for the process in which they will be used, we learn a lot from the project performers who make FHE system demonstrators — and we share that information with the member community. SEMI: Can you point to an example of a successful MEMS-FHE device integration?Pretorius: MEMS-FHE integration is still in the early stages, but we are working on several projects including a DARPA Seedling project for which we have integrated MEMS sensors into FHE systems for testing and evaluation. We plan to continue this work by integrating MEMS and FHE devices using methods that support mass production.SEMI: What would you like FLEX|MSTC attendees to take away from your presentation?Pretorius: We would like to see the FHE community work more closely with MEMS device manufacturers. For example, NextFlex often works with manufacturers to gain access to bare die, which is still a significant hurdle in making devices.The best way to speed things along is to get involved. We encourage FLEX|MSTC attendees to join NextFlex. As a prototyping and automation engineer at NextFlex, Nathan Pretorius explores new print methods for prototyping and automation using novel materials and processes. Pretorius currently focuses on how best to apply software scripting and machine learning to streamline FHE processes. Prior to joining NextFlex, he researched the strengths of roll to roll and screen printing on printed electronics designs, including capacitive touch interfaces, FHE passive component design, and antennas. Nathan holds a Bachelor of Science degree in Graphic Communications from Clemson University. FLEX|MSTC is organized MEMS Sensors Industry Group (MSIG) and FlexTech, SEMI technology communities focused on the growth of MEMS sensors and the flexible electronics supply chain, respectively.Nishita Rao is marketing manager for technology communities at SEMI.
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VTT Technical Research Centre of Finland Ltd (VTT) has its sights set high. As a leading global research and development firm , VTT is out to produce bio-interfacing and biodegradable flexible hybrid electronics (FHE) devices that help tackle some of the world’s greatest challenges including environmental degradation and food scarcity.SEMI’s Maria Vetrano interviewed Antti Vasara, president and CEO of VTT Technical Research Centre of Finland, to preview his February 25 keynote, Beyond Flexible Hybrid Electronics: Biodegradable Electronics and Interfacing Bio+Electronics, at FLEX|MEMS Sensors Technical Congress (MSTC) 2020, February 24-27 at the DoubleTree by Hilton in San Jose, California. Join us at FLEX|MSTC to meet Antti and other industry influencers driving innovation in flexible hybrid electronics (FHE) and MEMS sensors. Register now to connect with him at FLEX|MSTC or visit him on LinkedIn.SEMI: What is body-interfacing electronics and what is your vision for bio-interfacing and biodegradable electronics?Vasara: Body-interfacing electronics have existed for decades. Developed in the 1970s, the wireless heart rate monitor is a good example. While continuous heart monitoring with a compact, inexpensive wearable device is widely accessible technology, other bodily parameters, such as cholesterol levels or biomarkers, are diagnosed every time we see a doctor. Establishing a baseline using multiple measurements — before symptoms develop is actually much more effective.That’s where bio-interfacing comes in. Bio-interfacing devices will continuously measure and analyze complex biogenic substances such as sweat, breath, blood and urine. A smart patch for continuous sweat monitoring, for example, would overcome several challenges: supporting electronics functionality in liquid environments, managing the transport of harvested samples to and from the sensor, managing potential contamination, and disposing of samples after measurement.While FHE in principle delivers the right building blocks and is an ideal form factor for a wearable sweat analytics patch, flexible circuits are not ready for out-of-the box interaction with biological matrices. Hence, our mission at VTT is to anticipate and develop the upscaling process know-how required for FHE devices that either interface with biological systems — or that must themselves biodegrade.We’re also focusing on biodegradable electronics because environmentally conscious end-users and manufacturing companies want biodegradable versions of energy-autonomous, label- or sticker-like Internet of Things (IoT) sensors. Typically used for packaging, logistics, environmental monitoring and medical diagnostics applications, these sensors — which have a lifetime of a few days, weeks or months — have become very popular. Unless they are biodegradable, however, they just add to landfill.SEMI: What approaches is VTT using to develop bio-interfacing and biodegradable electronics?Vasara: In our Business Finland-funded ECOtronics project, we are working with our partners to create recyclable and compostable electronics and optics that use renewable resources. For example, devices developed using substrate materials like paper, cardboard or VTT’s in-house-developed nanocellulose films and biopolymer films for environmental monitoring or skin patches can be easily recycled or even biodegrade naturally. Where possible, we use roll-to-roll printing to generate the device circuitry, and on a component level, we have optimized our assembly process towards bare-die component bonding to reduce the overall footprint of non-biodegradable waste per device.SEMI: What use cases do you find most promising and why?Vasara: A prominent example of a single-use test that generates a large amount of waste is the digital pregnancy test. When breaking it down into components, you will find a rigid circuit board with microprocessor, a couple of coin cell batteries, a liquid crystal display, a LED light source and photodiode, and a large chunk of plastic packaging around it. The materials and battery capacity of such a device would be sufficient to run hundreds of pregnancy tests – actually technical overkill.By using printed circuits on biodegradable substrates, bare-die assembled components (ASIC, LED light sources, photo diodes, thin film batteries as power sources) and device packaging composed of biodegradable plastics, we can completely redefine the environmental footprint of single-use tests. We are currently developing a toolbox for our customers to turn their existing conventional test into an ecotronic form factor.Another exciting use case is a sweat sensor that we developed collaboratively with Ali Javey, Ph.D., professor of Electrical Engineering and Computer Sciences, UC Berkeley, and the co-director of Berkeley Sensor and Actuator Center (BSAC). Together with his team, we created a wearable electrochemical sensor for continuous sweat analysis during exercise. With the UC Berkeley group providing the chemistry to monitor N+, K+ ion and hydration levels in sweat over the duration of several hours, VTT delivered the underlying sensor platform, featuring the printed sensor electrodes and sweat harvesting microfluidic channels for fluid management and transport. It’s exciting to see what we can achieve by combining techniques from different disciplines, in this case electrochemistry, printing, packaging and microelectronics.SEMI: How can industry enable the development/manufacture of flexible FHE devices? Where does VTT fit into the ecosystem?Vasara: As many FHE devices target large-volume markets, scalability of manufacturing is key: How can I get from one device (= working prototype) to a handful of devices (= feasibility study), to thousands (= pilot manufacturing), to a million (= mass manufacturing) without compromising the quality of the system’s performance and reliability?Access to upscaling infrastructure is essential for the development of novel FHE devices and methods, but infrastructure is expensive. That’s where our establishment of a roll-to-roll pilot printing line to bridge the gap between laboratory R D and mass manufacturing has proved invaluable. We can provide a unique worldwide upscaling infrastructure for advanced FHE devices, with a strong focus on large-area roll-to-roll processes and hybrid assembly. This service removes our customers’ burden of high infrastructure investment in early development stages and it allows us to guide customers along their development path, from prototype to mass production.Watch our video: VTT pilot manufacturing for diagnostics and wearablesSEMI: Is there anything else that device manufacturers need to know in order to succeed?Vasara: In my eyes, the success of FHE devices eventually depends on several factors: It requires a high degree of automation, well-optimized processes, reliable supply chains, and perhaps most importantly, clear standards and rules for designers to guarantee flawless interoperability of all the different elements on a flexible and hybrid circuit. Let us not forget – we are trying to marry electronics with printing, biology, packaging, microfluidics, injection molding and other fields of expertise.We recently finalized the compilation of a set of design rules for publication in our state-of-the-art overview of printed and hybrid electronics manufacturing methods. You can download the overview, PrintoCent Handbook, for free.SEMI: What would you like FLEX|MSTC attendees to take away from your presentation?Vasara: The latest technologies and innovations in microelectronics, MEMS, printing, materials, and biosensors provide us a toolbox for true innovation in the FHE space. Now we need cross-disciplinary thinking and daring steps to combine different manufacturing methods and skill-sets. The ideal cross-disciplinary team might include: The printing engineer who knows how to design contact pads for a bare-die IC assembly The biologist who knows about the thermal and mechanical stress in a printing environment to design processes for bio-functionalization of surfaces The electronics engineer who knows how to optimize a circuit powered with an enzymatic biofuel cell The number of sensors deployed on (or inside) our body, in our drinking water, in our cars, on our fields, in our pets, and everyday products will surely grow. Let us make sure they leave the smallest environmental footprint possible.Antti Vasara, Ph.D. has been the president and CEO of VTT Ltd since 2015. VTT is a visionary research, development and innovation partner with over 2000 people and a turnover exceeding 250M EURO. Vasara is president of EARTO (European Association of Research and Technology Organisations) and is chairman of the board of Palta (Finnish Service Sector Employers). In addition, he is a non-executive director of Elisa Oyj (largest communications operator in Finland) and a board member at EK (Finnish Confederation of Industries).He has served on several high-profile groups on industrial and innovation policy of the European Commission, in addition to several groups in Finland on artificial intelligence and research policy. Previously, Vasara spent close to 25 years in private industry, working at Nokia, Tieto, SmartTrust and McKinsey Company. Earlier in his career, he was a researcher in optical communications with 20+ peer-reviewed articles and one international patent. Vasara holds a Doctor of Science (Technology) degree from Aalto University in Finland.For more information about VTT’s work in bio-interfacing and biodegradable FHE devices, visit VTT Research. FLEX|MSTC is organized MEMS Sensors Industry Group (MSIG) and FlexTech, SEMI technology communities focused on the growth of MEMS sensors and the flexible electronics supply chain, respectively.Maria Vetrano is a public relations consultant at SEMI.
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The march of innovation in semiconductor microfabrication technology over the past 60 years has produced electronic devices and information systems that have transformed industries and lives around the world. And while advances in chip technology continue to make it possible to collect, transmit, store and process more data for a rapidly growing universe of applications, the pace of innovation is now facing strong headwinds. Powered by chip innovation, data centers have become massive centers of information processing but, on the downside, enormous consumers of electricity. Today, the power-hungry hubs account for five percent of the world's electricity usage, a proportion that is growing every year, raising important questions about sustainability. Compounding the challenge, the pace of Moore's Law, for decades the engine of electronic device and information system innovation, has slowed. While the research and development of state-of-the-art semiconductor fine processing technology remains robust, developing the advanced manufacturing technology for mass-producing more sophisticated electronics devices is becoming harder, as is ensuring business profitability."It has become difficult for semiconductor technology to continue to evolve as it has in the past," said Akira Minamikawa, Research Director of Technology Research at IHS Markit, who moderated the Semiconductor Executive Forum – View by Top Two in the Era of Digitalization on opening day of SEMICON Japan 2019 at Tokyo Big Sight. Held at the SuperTHEATER, the forum featured Terushi Shimizu, representative director and president at Sony Semiconductor Solutions, and Atsuyoshi Koike, president at Western Digital Japan, two industry powerhouses that could figure heavily in the future of digital technology. SuperTHEATER, the main stage at SEMICON Japan 2019 Image sensors evolve to become eyes of AIImage sensors are becoming eyes of artificial intelligence (AI) and intelligent systems that monitor people and events worldwide, collecting data that one day could help puzzle out growing social challenges such as energy conservation and traffic congestion. With 51 percent market share on the strength of its industry-leading technology, Sony Semiconductor Solutions dominates the image sensor market. Despite last year’s global semiconductor industry slump, the company’s “business continues to enjoy strong growth and we are very busy,” said Shimizu, who attributed the company’s robust performance to the rising importance of the social role of image sensors and the expanding number of applications they support.The success of the company’s image sensors can also be traced to its division of the image sensor market into two application categories: "Imaging" focuses on capturing beautiful image data, while "sensing" aims to collect data that accurately describes the state of a subject and its surroundings."In 2019, sales of imaging products for smartphones grew rapidly,” Shimizu said in his market overview. “This is due to the average annual 15 percent growth rate of multi-camera smartphones, with some phones today featuring seven cameras, and an average annual growth rate of 20 percent in sensor size to produce higher image quality."But Shimizu cautioned that Sony Semiconductor Solutions doesn’t expect the smartphone sensor market to maintain that fast growth rate."The imaging market is expected to grow until 2022, but after that, the sensing market will drive market growth,” he said, adding that the company’s “capital investment plan is based on this scenario."AI will be key in catalyzing growth of the sensor market as integrations of AI processing engines and sensing images grow in sophistication to capture images undetectable by the human eye, Shimizu said. AI will extract insight from captured image data. For its part, Sony will apply its layer stacking technology to sensing products."By stacking an AI processing engine, we want a significant portion of the recognition processing done within the sensor chip," Shimizu said.One sensor the company already offers collects in-depth information for indirect time-of-flight (ITOF) 3D ranging for new user interfaces relying on autonomous or gesture control for robotics. The sensor “was first used in smartphones in 2018 and saw widespread adoption in 2019," Shimizu said.Sony Semiconductor Solutions plans to focus on developing new sensors for integration with their ultrasonic cousins. Aided by optical deflection technology, the sensors will be used for product quality inspections during manufacturing.With the company’s growing strengths in sensor technology, it hopes “to increase sales of sensors from a few percent of the company’s total sales in 2018 to 30 percent in 2025,” Shimizu said, pointing to its goal "to capture 60 percent share of the image sensor market by 2025."Data as one way to spread happinessAt the heart of consumer devices such as smartphones and computers and also cloud servers, NAND flash has made it possible to process vast troves of data anytime, anywhere. In recent years, the technology has enjoyed stronger adoption for use as the storage medium of choice for edge computing, stationed between end devices and the cloud to help streamline data utilization. But the technology isn’t merely about making smarter use of bits and bytes."We would like to promote the technology development that can support the use of data to bring happiness to people around the world," Koike of Western Digital Japan said. The company calls data that contributes to individual happiness and helps solve social issues "data for good" and, like the Sony Semiconductor Solutions bifurcated classification of the image sensor market, categorizes information into “big data” and “fast data.”For example, big data can leverage AI to drive dramatic improvements in the interpretation of test data and, ultimately, the diagnostic accuracy of mammography for breast cancer screening, aiding in early detection to help save lives, Koike said. Fast data can be harnessed to analyze data collected from a manufacturing equipment line in real time to improve production efficiency. The company’s plant in Yokkaichi, Mie Prefecture, which the company operates in cooperation with Japanese memory manufacturer Kioxia, already uses fast data to bolster production.More NAND flash innovation and greater supply capacity are critical to developing "data for good," Koike said. "It is difficult to expand clean rooms at the same pace as data usage grows. In order to continue to advance technology and enhance supply capacity, we need to adopt new ideas for building production lines. We need a smaller equipment footprint, shorter cycle time and higher throughput."Semiconductor market shows signs of recoveryIn their discussion of the short-term outlook for the semiconductor market, Shimizu and Koike pointed to the importance of strengthening the talent pool of Japan’s semiconductor industry as global competition heats up with China’s pursuit of semiconductor independence and the industry pulls out of the 2019 slowdown fueled by weak memory prices. While Sony’s business has been buoyed by strong image sensor demand for smartphones, the devices “did very well, but other applications didn't," Shimizu said. Even the image sensor market stagnated.Despite the 2019 slump, market conditions and capital investments by semiconductor manufacturers have been on the upswing."In the second half of 2019, the Chinese market showed signs of recovery triggered by 5G,” Shimizu said. “In 2020, this movement is going to be in full swing around the world and we will be busier than last year."Koike agreed: "The semiconductor market for data centers will recover with 5G. The hard disk shortage is already an indication of a recovery, a turnaround that will undoubtedly extend to solid state drives (SSDs). In addition, advances in autonomous driving technology will ensure continued growth of the automotive semiconductor industry.”Japan should embrace international competition, not fear China's pursuit of chip independenceIt's no secret that China is investing heavily in its semiconductor development capabilities to move up the microprocessor value chain. Minamikawa posed the question: How should Japanese chip companies navigate the shifting regional balance of power? "It is natural for China to strive to establish domestic procurement of semiconductors that are fundamental technologies for various industries,” Koike said, “I think the efforts of Chinese companies are outstanding in that they are not pursuing short-term results, such as improving yields in the near future, but are making efforts with an eye to achieving results in 10 years. Japan has a variety of options including working with China to create joint ventures and competing head-on. Regardless of which choice we make, however, it is imperative for the survival of domestic companies that Japan maintains its technological competitiveness to remain ahead of China."Shimizu said that Sony’s “Chinese customers are quick to take action and study extremely hard. We often have opportunities to share our roadmap with them and explore innovation opportunities together. Before, they were passive and relied on us for insights into new technologies, but now they are more assertive and I sense that they will start to drive innovation.”Koike added that "although Japanese companies often talk about business globalization, neither Chinese nor American companies say much about it. While global expansion is a major requirement for business, I think Japanese companies need to focus more on the Japanese market overall, not just when they think about the growing competitiveness of Chinese companies." L-R: Akira Minamikawa, Research Director of Technology Research at IHS Markit; Atsuyoshi Koike, president at Western Digital Japan; Terushi Shimizu, representative director and president at Sony Semiconductor Solutions Talent key to bolstering competitiveness of Japan’s semiconductor industryMinamikawa of IHS Markit didn’t mince words in describing the talent shortage in the Japanese semiconductor industry as “grave,” saying that “the workforce challenge is not endemic to the electronics industry as evidence grows that the number of people obtaining doctorates in Japan is falling and the educational level of the Japanese population as a whole is in decline.”Three years ago, Shimizu interviewed professors on Kyushu island for insights into Japan’s talent shortfall. He came away feeling that “Japanese semiconductor companies were not sufficiently communicating the industry's talent and innovation needs to professors. To help professors and students better grasp the appeal and potential of the industry, we have started to send frontline engineers to universities to educate students and instructors about their work and careers. Expecting corporate HR departments to alone solve the talent shortage won’t work.”"In Japan, if you advance to a doctoral course, you will have a hard time getting a job, which is a strange situation,” Koike said. “Companies and universities need to work together more closely to better understand how to attract and hire doctoral graduates."Minamikawa said companies must have strong leaders with clear missions to attract the right talent, but Koike pointed to the drawbacks: "The image of a company with a strong leader seems to be cool, but it also has a downside because engineers stop thinking for themselves and wait for instructions from the top. I believe it is important for company leaders to have ongoing discussions at all organizational levels and lead the way in times of confusion."Shimizu agreed, citing his own company as an example."Thankfully, our company is very busy right now,” he said. “However, some employees are starting to request more time to think about how to improve the quality of their work. To maintain and strengthen our competitiveness and continue business growth, I believe it is important to cultivate an environment that encourages each employee to take more time to think for themselves."Motoaki Ito is the CEO of Enlight, Inc. and a reporter for SEMI. Mayumi Amagai is a marketing manager at SEMI Japan.
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