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MILPITAS, Calif. — April 13, 2026 — Electronic System Design (ESD) industry revenue increased 10.3% to $5,466.3 million in the fourth quarter of 2025 from the $4,955.2 million registered in the fourth quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average rose 10.1%, based on a comparison of the most recent four quarters to the prior four.

“The electronic design automation (EDA) industry continues to report strong year-over-year revenue growth in Q4 2025,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. “Product categories CAE, PCB and MCM, Semiconductor IP (SIP), and Services all reported gains. Geographic regions including Americas, EMEA, and APAC reported growth in Q4, with a double digit increase in Americas and APAC.”

The companies tracked in the EDMD report employed 71,517 people globally in Q4 2025, a 13.8% increase over the Q4 2024 headcount of 62,833 but down 2.3% compared to Q3 2025. 

The quarterly EDMD report contains detailed revenue information within the following category and geographic breakdowns. 

Revenue by Product and Application Category – Year-Over-Year Change

  • Computer-Aided Engineering (CAE) revenue increased 9.4% to $1,887.4 million. The four-quarter CAE moving average increased 10.8%. 
  • IC Physical Design and Verification revenue decreased 2.6% to $777.2 million. The four-quarter moving average for the category decreased 5.1%. 
  • Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue rose 1.8% to $484.6 million. The four-quarter moving average for PCB and MCM rose 4.5%.
  • Semiconductor Intellectual Property (SIP) revenue increased 18.3% to $2,083.2 million. The four-quarter SIP moving average rose 17.4%.
  • Services revenue increased 19.6% to $233.9 million. The four-quarter Services moving average rose 15.9%.

Revenue by Region – Year-Over-Year Change

  • The Americas, the largest reporting region by revenue, procured $2,473.5 million of electronic system design products and services in Q4 2025, a 13.9% increase. The four-quarter moving average for the Americas rose 10.6%. 
  • Europe, Middle East, and Africa(EMEA) procured $683.4 million of electronic system design products and services in Q4 2025, a 9.8% increase. The four-quarter moving average for EMEA grew 9.4%. 
  • Japan’s procurement of electronic system design products and services decreased 18.8% to $258.5 million in Q4 2025. The four-quarter moving average for Japan decreased 7.4%. 
  • Asia Pacific (APAC) procured $2,050.8 million of electronic system design products and services in Q4 2025, an 11.3% increase. The four-quarter moving average for APAC grew 12.6%. 

About the EDMD Report

The ESD Alliance Electronic Design Market Data (formerly the Market Statistics Service) report presents Electronic Design Automation (EDA), SIP and Services industry revenue data quarterly. Both public and private companies contribute data to the report available from SEMI. Each quarterly report is published approximately three months after quarter close. EDMD report data is segmented as follows: 

  • Revenue by product category (CAE, IC Physical Design and Verification, SIP, PCB and MCM Layout, and Services) including numerous detailed sub-categories
  • Revenue by geographic region (Americas, EMEA, Japan and APAC)
  • Total employment at participating companies

For information about SEMI market research reports, visit the SEMI Market Research Reports and Databases Catalog.

About the Electronic System Design Alliance

The Electronic System Design (ESD) Alliance, a SEMI Technology Community, is the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. As an international association of companies providing goods and services throughout the semiconductor design ecosystem, it is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. For more information about the ESD Alliance, visit http://esd-alliance.org.

Follow the ESD Alliance

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

The information supplied by the ESD Alliance is believed to be accurate and reliable, but the ESD Alliance assumes no responsibility for any errors that may appear in this document. All trademarks and registered trademarks are the property of their respective owners.

MILPITAS, Calif. – April 7, 2026 – Worldwide sales of semiconductor manufacturing equipment increased 15% to $135.1 billion in 2025 from $117.1 billion in 2024, driven by continued investment in advanced logic, memory, and AI-related capacity expansion, SEMI, the industry association representing the global electronics design and manufacturing supply chain, reported today. The data is available in the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report. 

SEMIIn 2025, the global front-end semiconductor equipment market posted solid growth, with wafer processing equipment sales increasing 12% and other front-end segments rising 13%. The expansion was driven primarily by continued investment in leading-edge logic and memory capacity, supported by AI-related demand and ongoing node and technology migrations.

The back-end equipment segment also recorded strong growth in 2025. Test equipment billings surged 55% year-over-year as AI devices and high-bandwidth memory (HBM) increased performance requirements and test intensity, while assembly and packaging equipment sales rose 21% as adoption of advanced packaging technologies continued to expand.

"Record semiconductor equipment billings of $135 billion in 2025 underscore the scale and urgency of the industry's buildout as AI accelerates demand for leading-edge logic, advanced memory and high-bandwidth architectures," said Ajit Manocha, SEMI President and CEO. "From wafer fab investments to the rapid rise of advanced packaging and test, the global ecosystem is expanding capacity and capability to support the next wave of innovation."

Regionally, semiconductor equipment spending remained concentrated in Asia in 2025, with China, Taiwan, and Korea together accounting for 79% of the global market, compared with 74% in 2024.

In 2025, spending in China remained near record levels at $49.3 billion, down just 0.5% from the prior year, as domestic chipmakers continued to invest in mature nodes and select advanced capacity. Equipment spending in Taiwan rose 90% year-over-year to a record $31.5 billion, reflecting AI- and HPC-driven capacity expansion. Korea increased 26% to $25.8 billion as investment in HBM and DRAM remained strong. 

In 2025, spending in China remained near record levels at $49.3 billion, down just 0.5% from the prior year, as domestic chipmakers continued to invest in mature nodes and select advanced capacity. Equipment spending in Taiwan rose 90% year-over-year to a record $31.5 billion, reflecting AI- and HPC-driven capacity expansion. Korea increased 26% to $25.8 billion as investment in HBM and DRAM remained strong. 

Japan recorded 22% growth to $9.5 billion, supported by continued investment in domestic advanced-node manufacturing. Europe declined 41% to $2.9 billion, marking a second consecutive year of contraction amid ongoing weakness in automotive and industrial demand. North America fell 20% to $10.9 billion as spending moderated following earlier capacity expansion. The rest of the world increased 25% to $5.2 billion, reflecting expanding activity in emerging semiconductor production markets.

Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the WWSEMS report is a summary of the monthly billings figures for the global semiconductor equipment industry.

About SEMI Market Data

The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports: 

  • Monthly SEMI North American Billings Report, an early perspective of equipment market trends
  • Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and more than 22 market segments
  • Bi-annual Total Semiconductor Equipment Forecast – OEM Perspective, an outlook for the semiconductor equipment market

Download a sample EMDS report.

For more information or to subscribe, please contact SEMI Market Intelligence at [email protected]. Details on SEMI market data are available at SEMI Market Data.   

Follow SEMI Market Intelligence

Follow SEMI 

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members' business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

 

MILPITAS, Calif. – April 1, 2026 – Worldwide 300mm fab equipment spending is expected to increase 18% to $133 billion in 2026 and 14% to $151 billion in 2027, SEMI reported today in its latest 300mm Fab Outlook. This strong growth reflects surging AI chip demand for data centers and edge devices, as well as the growing commitment to semiconductor self-sufficiency across key regions through localized industrial ecosystems and supply chain restructuring.

Looking further out, the report projects investment will continue to increase 3% to $155 billion in 2028 and another 11% to $172 billion in 2029, respectively.

“AI is resetting the scale of semiconductor manufacturing investment,” said Ajit Manocha, President and CEO of SEMI. “With global 300mm fab equipment spending projected to exceed $150 billion in 2027 for the first time, the industry is making historic, sustained commitments to the advanced capacity and resilient supply chains needed to power the AI era.”

 

Segment Growth

The Logic & Micro segment is expected to spearhead equipment expansion with $228 billion in total investments from 2027 to 2029 mainly due to strong foundry sector demand, driven by sub-2nm cutting-edge capacity investments. Advanced node technology is essential to enhance chip performance and power efficiency to meet rigorous chip design requirements for various AI applications. More advanced node technology is expected to enter volume production from 2027 to 2029. Additionally, AI performance improvements are anticipated to drive massive growth in various edge AI devices. Beyond advanced nodes, demand across all nodes and various electronics devices is anticipated to grow moderately, supporting investment in mature nodes as well.

The memory segment is projected to rank second in equipment spending, totaling $175 billion from 2027 to 2029. This period marks the start of a new growth cycle for the segment. Within the memory category, DRAM equipment spending is expected to reach $111 billion cumulatively from 2027 to 2029, while 3D NAND equipment spending is estimated to be $62 billion during the same time frame. 

The demand for memory has significantly increased due to AI training and inference. AI training has notably driven up the demand for High Bandwidth Memory (HBM), while model inference has created substantial demand for storage capacity, thus boosting the growth of NAND Flash applications in data centers. This strong demand has led to sustained high levels of investment in the memory supply chain over the near and long term, helping to cushion potential downturns from traditional memory cycle fluctuations.

Regional Investment Trends

Global 300mm fab equipment investment is expected to remain broadly distributed across the major semiconductor manufacturing regions from 2027 to 2029, reflecting a mix of advanced-node expansion, memory capacity additions, and policy-supported supply chain localization. China, Taiwan, Korea, and the Americas are each expected to see substantial levels of spending during the period, while Japan, Europe & Middle East, and Southeast Asia also continue to expand investment from a smaller base. 

In China, investment is expected to remain supported by ongoing domestic capacity expansion and national initiatives aimed at strengthening semiconductor manufacturing capabilities. In the Taiwan region, spending is projected to be driven primarily by continued expansion of leading-edge foundry capacity, including 2nm and sub-2nm technologies. Korea’s investment outlook remains closely tied to the memory sector, where AI-related demand is supporting another cycle of capacity and technology upgrades. In the Americas, spending is expected to be underpinned by advanced process expansion and broader efforts to strengthen domestic manufacturing ecosystems. 

Japan, Europe & Middle East, and Southeast Asia are also expected to post meaningful growth through 2029. In these regions, equipment investment is supported by a combination of government incentives, supply chain resilience strategies, and targeted efforts to expand semiconductor manufacturing capacity.

Part of the SEMI Fab Forecast database, the SEMI 300mm Fab Outlook lists 404 facilities and lines globally. The report reflects 198 updates and 9 new fabs/lines projects since its last publication in December 2025. 

For more information on the report or to subscribe, please contact the SEMI Market Intelligence Team at [email protected]. Details on SEMI market data are available at SEMI Market Intelligence.  

Follow SEMI 

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more

MILPITAS, Calif. — February 10, 2026 — Worldwide silicon wafer shipments in 2025 increased 5.8% to 12,973 million square inches (MSI) while wafer revenue slipped 1.2% to $11.4 billion over the same period, the SEMI Silicon Manufacturers Group (SMG) reported in its year-end analysis of the silicon wafer industry. 

SEMI Logo2025 marks an inflection year for wafer shipments, with silicon MSI resuming growth supported by strong demand for advanced epitaxial wafers in logic and polished wafers for high-bandwidth memory (HBM), driven by AI applications. Softness in wafer revenue is mostly attributed to the slow momentum in traditional semiconductor applications where the demand and pricing environment are yet to improve.

“The 2025–2026 wafer market is shaped by diverging trends across technology nodes,” said Ginji Yada, Chairman of SEMI SMG and Executive Office Deputy General Manager, Sales and Marketing Division at SUMCO Corporation. “Demand for 300mm wafers remains strong in advanced applications, particularly in AI-driven logic and high-bandwidth memory (HBM), supported by the ongoing adoption of sub-3nm processes. These technology transitions are driving increased requirements for wafer quality and consistency, reinforcing the need for advanced material solutions. Investments in data centers and generative AI continue to underpin demand in leading-edge segments, where performance and reliability are critical. 

“In contrast, the legacy semiconductor segment shows gradual signs of stabilization. Wafer and chip inventory levels in mature-node applications—such as automotive, industrial, and consumer electronics—have begun to normalize after extended inventory adjustments. While supply-demand conditions are improving sequentially, the pace of recovery remains moderate, with demand recovery still sensitive to macroeconomic factors and end-market dynamics. As a result, the overall market outlook reflects a two-track trajectory: sustained demand and technical advancement in advanced nodes, alongside a cautious and incremental rebound for demand in mature technology segments.”

MSI

Silicon wafers are the fundamental building material for the majority of semiconductors, which are vital components of all electronic devices. The highly engineered thin disks are produced in diameters of up to 300 mm and serve as the substrate material on which most semiconductors are fabricated.

The SMG is a sub-committee of the SEMI Electronic Materials Group (EMG) and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epitaxial). The SMG facilitates collective efforts on issues related to the silicon industry, including the development of statistics about the silicon industry.

For more information, visit SEMI Worldwide Silicon Wafer Shipment Statistics or contact the SEMI Market Intelligence Team at [email protected]. Additional details on SEMI market data are available at SEMI Market Intelligence.

Follow SEMI

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

 

MILPITAS, Calif. — January 12, 2026 — Electronic System Design (ESD) industry revenue increased 8.8% to $5,566.4 million in the third quarter of 2025 from the $5,114.5 million registered in the third quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average rose 10.4%, based on a comparison of the most recent four quarters to the prior four.

“The electronic design automation (EDA) industry continues to report strong year-over-year revenue growth in Q3 2025,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. “All product categories reported increases, with Semiconductor IP (SIP) and Services showing double digit gains. Geographic regions including Americas, EMEA, and APAC reported growth in Q3, with a double digit increase in APAC.”

The companies tracked in the EDMD report employed 73,185 people globally in Q3 2025, a 17.3% increase over the Q3 2024 headcount of 62,417 and up 0.9% compared to Q2 2025.

The quarterly EDMD report contains detailed revenue information within the following category and geographic breakdowns. 

Revenue by Product and Application Category – Year-Over-Year Change

  • Computer-Aided Engineering (CAE) revenue increased 9.1% to $2,097.8 million. The four-quarter CAE moving average increased 11.6%.
  • IC Physical Design and Verification revenue increased 1.3% to $865.4 million. The four-quarter moving average for the category decreased 1.2%.
  • Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue rose 3.4% to $466.2 million. The four-quarter moving average for PCB and MCM rose 8.1%.
  • Semiconductor Intellectual Property (SIP) revenue increased 13.6% to $1,915.7 million. The four-quarter SIP moving average rose 14.8%.
  • Services revenue increased 10.2% to $221.4 million. The four-quarter Services moving average rose 13.7%.

Revenue by Region – Year-Over-Year Change

  • The Americas, the largest reporting region by revenue, procured $2,402.2 million of electronic system design products and services in Q3 2025, a 3.4% increase. The four-quarter moving average for the Americas rose 10.3%.
  • Europe, Middle East, and Africa (EMEA) procured $675.1 million of electronic system design products and services in Q3 2025, a 4.6% increase. The four-quarter moving average for EMEA grew 7.6%.
  • Japan’s procurement of electronic system design products and services decreased 11.5% to $264.0 million in Q3 2025. The four-quarter moving average for Japan increased 2.4%.
  • Asia Pacific (APAC) procured $2,223.0 million of electronic system design products and services in Q3 2025, a 20.5% increase. The four-quarter moving average for APAC grew 12.8%. 

About the EDMD Report

The ESD Alliance Electronic Design Market Data (formerly the Market Statistics Service) report presents Electronic Design Automation (EDA), SIP and Services industry revenue data quarterly. Both public and private companies contribute data to the report available from SEMI. Each quarterly report is published approximately three months after quarter close. EDMD report data is segmented as follows: 

  • Revenue by product category (CAE, IC Physical Design and Verification, SIP, PCB/MCM Layout, and Services) including numerous detailed sub-categories
  • Revenue by geographic region (Americas, EMEA, Japan and APAC)
  • Total employment at participating companies

For information about SEMI market research reports, visit the SEMI Market Research Reports and Databases Catalog.

About the Electronic System Design Alliance

The Electronic System Design (ESD) Alliance, a SEMI Technology Community, is the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. As an international association of companies providing goods and services throughout the semiconductor design ecosystem, it is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. For more information about the ESD Alliance, visit http://esd-alliance.org.

Follow the ESD Alliance

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

The information supplied by the ESD Alliance is believed to be accurate and reliable, but the ESD Alliance assumes no responsibility for any errors that may appear in this document. All trademarks and registered trademarks are the property of their respective owners.

Gütenbach, Germany – December 16, 2025 – RENA Technologies is proud to be a key industrial partner in a new 1.3 million Euro Government-funded project led by the National Physical Laboratory (NPL) and supported by the Department for Science, Innovation and Technology (DSIT). The initiative will establish critical new metrology capabilities to strengthen the UK’s semiconductor innovation infrastructure and accelerate the development and adoption of next-generation semiconductor materials and processes.

This strategic investment underlines the UK’s commitment to maintaining global competitiveness in semiconductors, helping to attract private investment, strengthen supply chains, and support long-term economic growth. As advanced semiconductor materials become central to technologies such as electric vehicles, renewable energy, 5G communications and advanced electronics, robust measurement, verification and standards are increasingly essential.

The project brings together a broad consortium spanning industry and academia. Together, the partners cover the full innovation landscape, from materials research and process development to device fabrication and performance verification.

“At RENA, we develop advanced wet processing and surface treatment solutions that are critical in manufacturing of compound semiconductors and emerging materials. Through this collaboration, RENA will contribute industrial insight and process expertise to ensure that new measurement and testing capabilities are closely aligned with real manufacturing challenges.” States Peter Schneidewind, CEO of RENA Technologies.

While silicon remains the foundation of much of today’s semiconductor industry, many high-growth applications increasingly depend on advanced materials such as gallium arsenide (GaAs), gallium nitride (GaN), silicon carbide (SiC), and indium phosphide (InP). These materials offer superior performance in high-power, high-frequency and optoelectronic applications, but they also introduce new complexities in processing, characterization and quality assurance. Reliable standards and independent measurement methods are therefore essential to derisk innovation and support scale-up.

Through this project, consortium partners will work with NPL to:
• Develop new UK measurement and test capabilities for advanced semiconductor materials by combining academic research excellence with world-leading metrology expertise.
• Apply these capabilities to critical industry challenges, including assessing material integrity, verifying RF performance, and testing device reliability under demanding operating conditions.
• Share the resulting capabilities openly with industry, helping to build national consensus and strengthen the UK’s influence in international standards development for novel semiconductor technologies.

Following extensive consultation the consortium has identified three priority application areas where the UK can have the greatest global impact: power electronics, RF-communications, and optoelectronics. These areas align closely with RENA’s customer base and technology roadmap, particularly in power and compound semiconductor manufacturing.
By participating in this program, RENA reinforces its commitment to supporting the UK semiconductor ecosystem with industrially relevant innovation, enabling customers to adopt advanced materials with confidence, and helping position the UK as a global leader in next-generation semiconductor technologies.

About NPL
The National Physical Laboratory (NPL) is the UK's National Metrology Institute (NMI), developing and maintaining the national primary measurement standards, as well as collaborating with other NMIs to maintain the international system of measurement. As a public sector research establishment, it delivers extraordinary impact by providing the measurement capability that underpins the UK's prosperity and quality of life. NPL develops the metrology required to ensure the timely and successful deployment of new technologies and work with organizations as they develop and test new products and processes.

About RENA Technologies GmbH
RENA Technologies is a leading global supplier of production machines for wet chemical surface preparation. RENA products are used in path-breaking application fields such as semiconductors, MedTech, renewable energies, and the glass industry. RENA equipment is used to treat or modify surfaces of, for example, semiconductor wafers, solar cells, glass, optical substrates or other high-tech products using wet chemical processes. RENA offers proven standard machines as well as customer-specific solutions and process support.

TOKYO — December 16, 2025 — Global sales of total semiconductor manufacturing equipment by original equipment manufacturers (OEMs) are forecast to reach a record high of $133 billion in 2025, growing 13.7% year-on-year, SEMI announced today in its Year-End Total Semiconductor Equipment Forecast – OEM Perspective at SEMICON Japan 2025. Growth in semiconductor manufacturing equipment sales is expected to continue in the two following years of the forecast period, with projections of $145 billion in 2026 and $156 billion in 2027. This growth will be driven primarily by investments related to AI, particularly in leading-edge logic, memory, and the adoption of advanced packaging technologies. 

“Global semiconductor equipment sales show robust momentum, with both the front-end and back-end segments projected to see three consecutive years of growth, culminating in total sales surpassing $150 billion for the first time in 2027,” said Ajit Manocha, SEMI president and CEO. “Investments to support AI demand have been stronger than anticipated since our midyear forecast, leading us to boost the outlook for all segments.”

Semiconductor Equipment Sales by Segment

After registering a record $104 billion in sales last year, the wafer fab equipment (WFE) segment, which includes wafer processing, mask/reticle, and fab facilities equipment, is projected to grow 11.0% to $115.7 billion in 2025. This represents an upward revision from the previously forecast $110.8 billion in the SEMI 2025 Mid-Year Equipment Forecast, reflecting stronger than expected investments in DRAM and high-bandwidth memory (HBM) to support AI computing. Continued capacity build-out in China is also contributing meaningfully to WFE demand. Looking ahead, WFE segment sales are projected to expand 9.0% in 2026 and 7.3% in 2027, reaching $135.2 billion as device makers increase spending on advanced logic and memory technologies.

The back-end equipment segment is anticipated to continue its strong recovery that began in 2024. Sales of semiconductor test equipment are projected to surge 48.1% to $11.2 billion in 2025, while assembly and packaging (A&P) equipment sales are projected to rise 19.6% to $6.0 billion. Back-end growth is expected to continue, with test equipment sales growing 12.0% in 2026 and 7.1% in 2027, and A&P sales are forecast to grow 9.2% in 2026 and 6.9% in 2027. This expansion is underpinned by the growing complexity of device architectures, accelerated adoption of advanced and heterogeneous packaging, and stringent performance requirements for AI and HBM semiconductors. These drivers are partly offset by ongoing softness in consumer, automotive and industrial demand, which continues to weigh on some mainstream test and packaging segments. 

Wafer Fab Equipment Sales by Application

WFE sales for foundry and logic applications are expected to show robust 9.8% year-over-year growth to $66.6 billion in 2025, supported by resilient spending for advanced nodes. The segment is forecast to see 5.5% growth in 2026 and 6.9% increase to $75.2 billion in 2027 as chipmakers add capacity for AI accelerators, high-performance computing and premium mobile processors. Investments will increasingly target leading-edge technologies as the industry moves toward high-volume manufacturing at the 2nm gate-all-around (GAA) node. 

Memory-related capital expenditures are projected to see significant expansion through 2027 powered by increasing demand for HBM to support AI deployment and ongoing technology migration. The NAND equipment market is expected to see growth of 45.4% to $14.0 billion in 2025 and further increase 12.7% to $15.7 billion in 2026 and 7.3% to $16.9 billion in 2027, driven by advancements in 3D NAND stacking and capacity expansion at both leading and mainstream layers. DRAM equipment sales are projected to rise 15.4% to $22.5 billion in 2025, followed by 15.1% and 7.8% year-on-year growth in 2026 and 2027, respectively, as memory suppliers ramp HBM and upgrade to more advanced process nodes to meet AI and data center requirements. 

 

Semiconductor Equipment Sales by Region

China, Taiwan and Korea are expected to remain the top three destinations for equipment spending through 2027. China is projected to maintain the leading position over the forecast period as domestic chipmakers continue to invest in both mature and select advanced nodes, even as growth moderates and sales gradually decline from 2026. In Taiwan, robust 2025 spending reflects large-scale leading-edge capacity builds for AI and high-performance computing, while Korea’s equipment outlays are supported by substantial investments in advanced memory technologies, including HBM. All other regions tracked are expected to see equipment spending increase in 2026 and 2027, supported by government incentives, regionalization efforts and targeted specialty capacity expansions.

The SEMI forecast is based on collective input from top equipment suppliers, the SEMI Worldwide Semiconductor Equipment Market Statistics (WWSEMS) data collection program and the industry-recognized SEMI World Fab Forecast database. 

About SEMI Market Data

The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports: 

  • Monthly SEMI North American Billings Report, an early perspective of equipment market trends
  • Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and more than 22 market segments
  • Bi-annual Total Semiconductor Equipment Forecast – OEM Perspective, an outlook for the semiconductor equipment market

For more information on the report or to subscribe, please contact the SEMI Market Intelligence Team at [email protected]. Details on SEMI market data are available at SEMI Market Data.  

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

MILPITAS, Calif. – December 2, 2025 – SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, today announced in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report that global semiconductor equipment billings increased 11% year-over-year to US$33.66 billion in the third quarter of 2025. Third quarter 2025 billings registered a 2% quarter-over-quarter growth.

The growth in billings was driven by robust investments in advanced technologies, particularly in leading-edge logic, DRAM, and packaging solutions for AI computing. Additionally, there was a notable rise in equipment shipments to the China region, contributing to the overall positive trend.

SEMI“Global semiconductor equipment billings year-to-date have reached nearly $100 billion – a record through three quarters – reflecting the industry’s sustained momentum and commitment to invest in technology innovation,” said Ajit Manocha, SEMI President and CEO. “Strong AI demand continues to drive spending in advanced logic and memory segments, as well as in packaging applications geared toward energy efficiency. This positive trajectory underscores the critical role semiconductors play in shaping a smarter and more connected world that powers next-generation digital solutions.”

Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the WWSEMS Report is a summary of the monthly billings figures for the global semiconductor equipment industry. 

Following are quarterly billings data in billions of U.S. dollars, with quarter-over-quarter and year-over-year changes by region:

The SEMI Equipment Market Data Subscription (EMDS) provides comprehensive market data for the global semiconductor equipment market. The subscription includes three reports:

  • Monthly SEMI Billings Report, a perspective on equipment market trends
  • Monthly WWSEMS, a detailed report of semiconductor equipment billings for seven regions and 24 market segments
  • SEMI Semiconductor Equipment Forecast, an outlook for the semiconductor equipment market

Download a sample of the EMDS report.

For more information about the report or to subscribe, please contact the SEMI Market Intelligence Team at [email protected]. More details are also available on the SEMI Market Data webpage.  

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

MILPITAS, Calif. — November 4, 2025 — The SEMI Silicon Manufacturers Group (SMG) reported today, in its quarterly analysis of the silicon wafer industry, that worldwide silicon wafer shipments increased 3.1% year-on-year to 3,313 million square inches (MSI) from the 3,214 MSI recorded during the same quarter of 2024. Sequentially, shipments slipped 0.4% quarter-over-quarter from the 3,327 MSI recorded during the second quarter of this year indicating softness in recovery particularly for epitaxial wafers slices. 

SEMI“January through September silicon shipments registered a significant year-on-year increase primarily driven by the growth of 300 mm shipments for advanced logic, cloud infrastructure, and memory demand,” said Lee Chungwei (李崇偉), Chairman of SEMI SMG and Vice President and Chief Auditor at GlobalWafers. “AI empowers significant investments expansion in advanced processes contributing to the wafer demand growth.”

Silicon wafers are the fundamental building material for the majority of semiconductors, which are vital components of all electronic devices. The highly engineered thin disks are produced in diameters of up to 300 mm and serve as the substrate material on which most semiconductors are fabricated.

The SMG is a sub-committee of the SEMI Electronic Materials Group (EMG) and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epitaxial). The SMG facilitates collective efforts on issues related to the silicon industry, including the development of statistics about the silicon industry.

For more information, visit SEMI Worldwide Silicon Wafer Shipment Statistics.

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

 

MILPITAS, Calif. ─ October 28, 2025 ─ Global shipments of silicon wafers are projected to increase 5.4% in 2025 to 12,824 million square inches (MSI) followed by steady growth through 2028 when the market is expected to reach a new industry record of 15,485 MSI, SEMI reported today in its annual silicon shipment forecast. 

SEMIIn 2025, the increase in silicon wafer shipments has been supported by strong AI-related growth, including advanced epitaxial wafers for leading edge logic devices and polished wafers for high bandwidth memory (HBM). Wafer shipments for non-AI applications, however, are just beginning to demonstrate a gradual recovery from the recent downcycle. The steady growth is expected to continue through 2028, driven by AI’s expanding compute footprint in data centers and at the edge.

Silicon wafers are the fundamental building material for the majority of semiconductors, which are vital components of all electronic devices. The highly engineered thin disks, produced in diameters of up to 300 mm, serve as the substrate material on which most semiconductor devices, or chips, are fabricated.

All data cited in this release include polished silicon wafers and epitaxial silicon wafers shipped by wafer manufacturers to end users. The data does not include non-polished or reclaimed wafers.

The annual silicon shipment forecast is developed based on input from the members of the Silicon Manufacturers Group (SMG). The SMG is a sub-committee of the SEMI Electronic Materials Group (EMG). This forecast reflects industry input gathered by SEMI and does not represent an official forecast of the SMG or any individual member company.  

For more information, please visit SEMI Worldwide Silicon Wafer Shipment Statistics, SEMI Market Data or contact [email protected].

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

 

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