semiconductors

As the Biden administration begins to advance its policy goals through U.S. government agencies, SEMI is eager to work with these new officials and appointees to advance innovation and strengthen U.S. leadership in the microelectronics industry. SEMI President and CEO Ajit Manocha today sent a letter to Commerce Secretary-Designate Gina Raimondo advocating for strengthening American manufacturing, investing in research and development and pursuing multilateral rather than unilateral U.S. export controls. SEMI also “requests Commerce perform a comprehensive review of recent policies and formally seek industry input via publication of a Notice of Inquiry (NOI), giving industry its first formal opportunity to provide its views on these significant regulations.” The letter discusses the importance of how export controls are implemented, advocating that “multilateral controls – where items of concern are controlled by all major producing nations – create a level playing field, maximize effectiveness, and minimize harm to U.S. national security and economic competitiveness. Unilateral U.S. controls over items for which there are comparable non-U.S.-origin items are generally ineffective in supporting national security goals and are likely to erode any technological advantages enjoyed by U.S.-origin items.” Foreign availability of semiconductor manufacturing equipment, materials and design software is an important consideration for U.S. export control policy related to those items. In an appendix to the letter, SEMI provided charts detailing the foreign availability of major types of semiconductor manufacturing equipment and materials. For nearly all items, there are competitive alternatives to U.S.-origin items available from non-U.S. sources. With many semiconductor technologies concentrated in a handful of key exporting nations, the letter encourages a unified approach via a plurilateral export control regime instead of unilateral U.S. controls for these technologies. SEMI provided a framework of issues that need to be considered and properly addressed in negotiating a plurilateral agreement related to semiconductor industry export controls. The previous administration created several unilateral controls that were implemented with little or no opportunity for public or industry comment and which created several unintended consequences. In addition to the request to publish an NOI, the letter asks Commerce to correct unintended controls related to the August 2020 expansion of EAR General Prohibition Three and reduce the backlog of license and classification requests. SEMI is pleased to work with the U.S. Department of Commerce and other policymakers by providing industry data, trends and perspectives to ensure export controls effectively serve national security interests without undue harm to technological development and leadership in this dynamic, globally competitive industry. Kimberly Ekmark is director of Public Policy and Advocacy at SEMI.

Back in March 2020, at the onset of the spread of COVID-19 in the U.S., SEMI quickly formed an Environment, Health and Safety (EHS) COVID-19 working group made up of EHS professionals who suddenly saw a critical need to share their experiences, validate untested policies, and collaborate on establishing best practices in response to an extraordinary public health crisis. The group, which today numbers 20 member companies, meets regularly to discuss an array of topics that have grown beyond their pressing need to react to a crisis earlier to a longer, more measured view of risk management as coronavirus cases continue to climb worldwide. While themes vary from one meeting to another, the recurring agenda remains the same to address the following topics: Phase approach – How to bring staff back on site Social distancing – How to manage people traffic flow on site Contact tracing – Track exposure to ensure workplace safety Space allocation – Changes to offices, cubicles and conference rooms HVAC systems – Optimizing workplace air flow and improving filtration systems Clean rooms – PPE and distancing protocols Training – Communications approaches to expanding awareness in order to reduce risk of spreading the virus Travel policies – Domestic and international travel guidelines Vaccines – Policies for vaccinating and monitoring personnel Site inspections – Preparing for an eventual increase in inspections from OSHA representatives In April, the SEMI EHS team issued a survey to assess the pandemic preparedness of member companies. Designed by the COVID-19 working group, the survey found that, despite having a pandemic plan in place, many member companies faced a shortage of PPE and sanitization equipment, their most significant challenge at the time. Members also pointed to operational challenges posed by the pandemic and raised questions about how to establish sound policies appropriate for their operations and geographic locations. Today, the SEMI EHS COVID-19 working group is well-established collaborative forum on public guidelines that members see as unclear as they continue to chart their own pandemic policies. With the first tranche of vaccines recently starting to ship in the U.S., the group has turned its attention to vaccine distribution and how companies will encourage employees to be vaccinated. For more information about the SEMI EHS COVID-19 working group or to join the group, please contact the SEMI EHS team at [email protected]. Olivier Corvez is senior manager of Environment, Health, Safety and Sustainability at SEMI.

The semiconductor industry must do far more to educate the electronics supply chain on the subtle differences among various fluoropolymers, 30 SEMI member companies learned in an October 13 webinar organized by SEMI to help maintain a unified voice on the critical importance of per- and polyfluoroalkyl substances (PFAS) in semiconductor manufacturing. At the same time, producers and customers of the substances used in chipmaking should work more closely together to steer clear of adopting policies that could limit the availability of safe fluoropolymers and the semiconductor industry’s ability to use them in the future.The insights were offered by representatives from the Performance Fluoropolymer Partnership – a group within the Washington, D.C.-based American Chemistry Council – on per- and poly-fluorinated substances including fluoropolymers. The Council is an industry trade association representing American chemical companies. Following are other key takeaways from the webinar. Fluorinated polymers and non-polymers are commonly found in components used in semiconductor manufacturing such as fittings, valves, tubes, O-rings, wafer carriers, filtration media, high purity air filters, greases and lubricants. The substances are ideal for use in corrosive chemicals, high temperatures and other harsh environments and are found in a variety of electro-technical components such as potentiometers, wiring, printed circuit boards and Lithium-ion batteries. Fluoropolymers are a diverse family of plastics also widespread in modern life, with applications ranging from food packaging and non-stick coatings on kitchen pans to rechargeable batteries for electric vehicles. The term PFAS (per- and poly-fluoroalkyl substances) covers more than 4,700 chemicals with diverse physical, chemical, environmental and biological properties and impacts. There are also significant differences among their chemical compositions. A careful appraisal of their risks and impacts should take into account any potentially hazardous properties, toxicity levels, their prevalence in the industry, and whether substitutes are readily available. Growing pressure from regulators worldwide threatens future access to fluorinated chemicals, increasing the importance of raising awareness on how to distinguish groups of chemicals and encouraging a measured approach towards eliminating only chemicals carrying the greatest risk. Fluoropolymer producers and opponents of the chemicals must look past their divergent interests to work together to voice common concerns to regulators. Various SEMI working groups respond to public consultations when opportunities to present the semiconductor industry’s position arise. Individual group members communicate both among each other regarding new regulatory developments and also with external constituents through SEMI about the importance of chemicals to chip manufacturing. As with other sectors, the semiconductor industry continuously seeks to “green” its manufacturing processes. SEMI believes the commitment of the supply chain to these efforts is crucial to protecting the industry’s interests and driving innovation.Olivier Corvez is senior manager of Environment, Health, Safety and Sustainability at SEMI.

While Artificial Intelligence (AI) emerged in the 1950s, only in recent years have AI applications proliferated with the explosion of data and continuing improvements in Moore’s law that have driven rising processing speeds. Voice assistants, image analysis software, search engines, and speech and facial recognition systems were among the first applications to use AI. Today, adoption has spread to sectors such as agriculture, cybersecurity, healthcare, software development, e-government and the intelligent enterprise to generate jobs and help spur economic growth. The Edge AI Opportunity and the Microelectronics IndustryAI can be embedded in hardware devices such as advanced robots, autonomous cars, drones or Internet of Things (IoT) applications. Today, according to the EU’s digital strategy, data centres and other centralized computing facilities account for the vast majority – 80% – of AI data processing and analysis, with smart connected objects such as automobiles, home appliances and manufacturing robots that bring the compute function closer to the user representing 20%. The latter, known as Edge AI applications, are powered by edge-based machine learning chipsets, not the AI chipsets designed to run cloud-based machine learning algorithms.The EU’s white paper on AI published in February 2020 anticipates that the way data are stored and processed for AI applications will change significantly over the coming five years as edge computing applications proliferate. Most AI applications need to connect with devices that collect data and manage data flows. When the applications connect with cloud infrastructures to train large volumes of data for a machine learning model, the interface devices often require hardware support. Edge AI can minimize data transport by processing data directly from local devices to accelerate data analysis and decision-making and make data transport or accelerator hardware unnecessary, critical in reducing power consumption and enhancing data security for applications such as autonomous driving. Over the past 40 years, the ICT sector has been continuously increasing greenhouse gas (GHG) emissions despite efforts to shift to renewable energy. Cloud-based AI applications require an ICT infrastructure for high-performance computing and high-speed connectivity. According to MIT Technology Review, data centres’ AI workloads could account for a tenth of the world’s electricity usage by 2025. a mass update of cloud-based AI applications may significantly increase energy consumption, unlike with Edge AI. This is why the strategy for developing Edge AI is well-aligned with the EU’s Green Deal objectives. Europe aspires to play a leadership role in Edge AI to strengthen the sector’s competitiveness and protect the European digital sovereignty. Europe’s strong industrial competencies in embedded systems and microcontrollers will help the region promote development of European domestic AI solutions for emerging high-value IoT applications in industrial processes such as Industry 4.0, Connected and Automated driving (CSA), smart cities, climate action, healthcare, and national defence and security. With this strong strategic position in technology, Europe is well-positioned to invest to become the leader in the Edge AI global market.Preparing the Workforce for the Microelectronics IndustryTo design and manufacture leading Edge AI chipsets, European education providers and industry will need to work closely together to train the current and future workforces. Within the framework of the METIS project, a four-year project co-funded by the European Commission through the Erasmus+ programme, SEMI and imec deployed experts in the field to survey and interview focus groups. The survey identified the following key focus areas for workforce development: 1. True Capability of AI and Data Science With AI’s heavy dependence on data, the workforce of the future must be trained in areas of data science including data integrity to ensure quality, unbiased sourcing, collection and accurate analysis necessary to interpret huge volumes of data. Europe also needs to train the next generation of AI chip designers in data security and privacy – key challenges to the widespread deployment of Edge AI chips. 2. Climate Change, Sustainable Development Goals (SDGs) and Social Inclusion TrainingSince the industry must be able to develop Edge AI solutions to enable the digital transformation while limiting GHG emissions, microelectronics engineers need to be schooled in climate change and understand how their work contributes to meeting the United Nation’s Sustainable Development Goals (SDGs). Workplace diversity and social inclusion are also important target areas for education since Edge AI applications should serve various groups of people with different needs.3. EthicsChip industry workers must also be educated in ethical issues of AI related to the technology’s potential societal impact in the near future[1]. With AI applications capable of monitoring Internet searches based on users’ personal preferences and biases to deliver tailored advertising, news and other information, developers must recognize how the technology can influence thinking and behaviour of individuals and groups. This awareness can help developers strike a balance between supporting commercial interests and societal good so the microelectronics industry can ensure ethical implementation of AI. 4. Cross-disciplinary Skills Required for AIAI development requires a comprehensive, cross-disciplinary skill-set to be able to integrate the work of specialists from diverse educational, cultural and professional backgrounds critical to developing non-biased AI solutions. For example, in addition to technical expertise, microelectronics AI developers must be able to communicate clearly and work in close-knit teams with non-technical experts from business, law, medicine and the social sciences.What’s Next?The microelectronics industry has a tremendous opportunity to develop new chip-based solutions for AI architectures, and apply AI techniques to improve operational efficiencies of design and manufacturing. To seize this opportunity, the industry must work closely with education providers to groom the next generation of skilled workers. This tight collaboration is critical to designing and delivering specialised courses to college and university students as well as engineers now working in the chip sector. The stakes are high. By preparing workers to develop Edge AI chipsets, the microelectronics industry can help the world confront some of the greatest challenges it faces today.For more information, see SEMI Responds to European Commission White Paper on Artificial Intelligence.METIS is a Sector Skills Alliance project co-funded by the European Commission’s Erasmus+ Program and coordinated by SEMI. The four year project, launched in November 2019, will develop a Microelectronics Skills Strategy. Based on the strategy, the METIS project will design 43 training modules for 1,100 hours learning in four key areas of the microelectronics sector.We thank Patrick Blouet (STMicroelectronics) and Jeroen Geusens (imec) for their valuable contributions to this article.[1] Ethics of Artificial Intelligence and Robotics, Stanford Encyclopedia of PhilosophyDr. Yanying Li is senior manager of Collaborative Projects at SEMI Europe.Dr. Pushkar P. Apte is the strategic technology advisor for the Smart Data AI Initiative at SEMI

Over the next five years the Taiwan government plans to invest NT$1.546 billion to build the workforce direly needed for future semiconductor industry research and development. The largesse is a tribute to efforts by SEMI president and CEO Ajit Manocha to enhance the competitiveness of the semiconductor industry by stressing the importance of talent development during his annual visits with the Taiwan president. He has been instrumental in bringing together Taiwan government agencies and local industry representatives – two players in developing the talent pool of the future – to discuss workforce initiatives.As the talent gaps threatens to choke the long-term growth potential of the chip industry, Manocha has emerged as a passionate champion of workforce development. In a letter to more than 2,000 semiconductor companies worldwide, he urged to executives act together to build the workforce vital to industry growth. In 2018, he met with Taiwan President Tsai Ing-wen to discuss ideas for attracting and retaining skilled workers to help ensure Taiwan remains a top investment destination for high-tech multinationals.In early 2019, SEMI Taiwan established its SEMI Taiwan Workforce Development Council to promote talent and career development. Already, the group’s work is resonating in the global semiconductor industry. In September last year, Manocha joined executives from industry heavyweights ASE, MediaTek and TSMC in a visit to President Tsai to urge the government to pursue industry sustainability through talent development. President Tsai responded by instructing her staff to review government resources available for talent development, help drive public-private dialogue and partnerships, and form talent development projects involving the government, industry, academia and research institutes.To carry out comprehensive workforce initiatives, SEMI Taiwan continues to work with the National Security Council and the Executive Yuan (the cabinet). We also launched the Semiconductor Industry Development Council in partnership with leading high-tech companies in Taiwan including ASE, TSMC, MediaTek, PSMC, VIS, MXIC, Nanya, Etron and UMC. Focused on developing semiconductor talent and technology, localizing equipment sourcing, and improving cybersecurity, the council has formed the following seven initiatives: Make existing government talent development programs more flexible to better meet the industry’s workforce needs. Recruit outstanding scholars and leading experts in scientific research, and solicit world-class scientific research teams. Extend age restrictions and other requirements for the Einstein Program (established by the Taiwan MOST, Ministry of Science and Technology) to attract outstanding foreign scholars to Taiwan. Establish a domestic semiconductor research ecosystem and provide sufficient research funding to cultivate R D talent. Strengthen female education in STEM (science, technology, engineering, mathematics) and encourage women to re-join the workforce to help meet the industry’s workforce needs. Continue to promote MOST University-Industry Collaboration Projects (Large Alliance) to connect the upstream academic and research sector with downstream industries. Encourage cooperation between science and technology universities and the chip industry to develop the talent necessary for smart manufacturing to thrive. SEMI’s advocacy efforts with the Taiwan government, the industry and academia are clearly paying off. The Executive Yuan recently announced three major talent development strategies – expanding the talent development capabilities of higher education institutions, promoting industrial-academic cooperation and encouraging businesses to strengthen recruiting efforts and increase funding for semiconductor talent development.The building momentum includes plans by the Taiwan Ministry of Education plans to establish semiconductor technology research centers at several national universities. By passing the sandbox law and loosening regulations organizational personnel, finance and education, the government is freeing up more funding to support semiconductor industry talent development. The ministry also plans to gradually expand the number of students enrolled in STEM curriculum and continues to promote talent training programs and recruiting strategies to help close the workforce gaps and reduce related industry risks. A highly skilled workforce is indispensable to the development of the semiconductor industry and among the most strategic resources in any region. It’s only through long-term partnerships between the government, industry and academia that impactful and sustainable workforce development goals and initiatives can be developed to help the chip industry realize its full potential to innovate and solve some of the world’s greatest challenges. The programs are key to the ability of Taiwan’s semiconductor industry to sharpen its competitive edge. More importantly, they are also the center of gravity in the region’s pursuit of its position as the global semiconductor hub. Jo-Ann Su is senior director and Winnie Chang is marketing and public relations specialist at SEMI Taiwan.

As the United States government has expanded semiconductor-related export controls, companies in the global electronics manufacturing and design supply chain have had to spend considerable time and effort navigating restrictions and managing significant new uncertainties emanating from recent policies. On November 9, SEMI submitted comments to the Department of Commerce’s Bureau of Industry and Security (BIS) urging the agency to proceed cautiously and adopt regulatory best practices and microelectronics industry recommendations to ensure that its identification of foundational technologies does not restrain U.S. innovation and exports without furthering essential U.S. national security interests. The comments specifically respond to the August 27 Advance Notice of Proposed Rulemaking (ANPRM), Identification and Review of Controls for Certain Foundational Technologies. The Export Control Reform Act (ECRA) of 2018 required BIS identify certain emerging and foundational technology that is “essential” to U.S. national security and requires such technology to be controlled to China and other nations subject to a U.S. arms embargo. Congress did not provide a specific definition for emerging or foundational technology, nor the term essential, further complicating the process to identify such technology.BIS has already implemented or proposed several emerging technology controls and the ANPRM starts the process to identify potential foundational technology controls. The SEMI comments focus on the fundamental question of how to define foundational technology, and are organized into three main sections: Requirements of ECRA Guidance from ECRA Regulatory best practices and industry recommendations Applying the statutory requirements and guidance, together with best practices and recommendations, to the identification of foundational technology indicates that most semiconductor-related technology, particularly semiconductor manufacturing equipment and materials, should be outside the bounds of the foundational technology initiative. In general, most technology related to semiconductor devices, manufacturing equipment, materials and design software is not essential to U.S. national security and, in cases where such technology does present material national security issues, it is generally subject to the U.S. list review process and multilateral controls. This technology is widely available outside the United States and due to substantial foreign availability, unilateral U.S. controls on such technology are likely to be ineffective in limiting its proliferation and harm U.S. development of or threaten U.S. leadership in this technology.While the SEMI comments focus on the effort to identify foundational technology, the recommendations and best practices apply in all export control contexts. Several of the statements pertain to policy in ECRA, including its imposition of controls to further specific essential U.S. national security interests only after full consideration of their impact on the economy.Other statements derive from factors ECRA requires BIS to consider, such as not seeking to control technology that’s already available outside the U.S. and not imposing controls that would harm U.S. technological development or leadership. An additional key factor is not imposing controls before multilateral controls are agreed to, nor when it is unlikely the relevant multilateral regimes will adopt similar controls, as is likely for technology that has been decontrolled by a regime.Finally, regulatory best practices suggest that technology-based controls should not be imposed when more targeted end-use or end-user controls can address national security concerns and duplicative controls in addition to recent, significant expansions of existing controls are unnecessary.SEMI is pleased to work with the U.S. Department of Commerce and other regulatory agencies, providing industry data, trends and perspectives to ensure export controls effectively serve national security interests without undue harm to technological development and leadership in this dynamic, globally competitive industry.Ways to Stay Connected and Learn MoreSEMI is committed to serving the global electronics manufacturing and design supply chain and present the collective voice of members to governments worldwide.The SEMI Global Update weekly newsletter provides updates on advocacy issues and technology trends and is available to all.Additionally, SEMI hosts live and virtual events that offer analysis and insights of geopolitical trends by industry experts, with the next opportunity to participate coming on December 3 with the SEMI CEO Webinar: Analyzing the Impact of the U.S. Election on the Microelectronics Industry.Joe Pasetti is Vice President of Global Public Policy and Advocacy at SEMI.

Europe is facing an acute shortage of skilled microelectronics workers that undermines the growth potential of not only the electronics industry but the European economy as a whole. Nearly 1.1 million job advertisements for electro-engineering workers were placed in the EU between mid-2018 and the end of 2019 (CEDEFOP, 2020). The shortfall looms large as a skilled and diverse workforce that can continuously innovate is the oxygen of microelectronics. In light of the critical importance of microelectronics to Europe’s ability to fulfill its growth potential, SEMI Europe participated in the high-level roundtable hosted by Commissioner Nicolas Schmit and Commissioner Thierry Breton on October 5. The discussion’s key takeaway: The skills challenge facing the microelectronics industry is too complex for one organization to tackle, and reskilling and upskilling its workforce should be a common priority for Europe. Only with a diverse, substantial and skilled microelectronics workforce can Europe achieve its R D, design and manufacturing ambitions while ensuring its sovereignty in the digital age. The roundtable highlighted the EU Pact for Skills as a key means to narrow the industry’s skills gap.An ever-growing part of our lives, microelectronics, with their ability to run billions of computations per second and store vast quantities of data, are the brains of modern technology. The digital sovereignty of nations around the world today relies on advanced microprocessors to collect, transfer, analyze and store immense amounts of data used in key end-user sectors such as mobility, telecommunications, energy, security and healthcare. Information and communication technologies (ICT) enabled by microelectronics are helping much of the world’s population to work and study from home and remain safe during the COVID-19 pandemic.According to the Smarter2030 Report, further deployment of ICT, including electronic components in critical sectors such as transportation, manufacturing, agriculture, construction and energy, could eliminate the equivalent of 12.1 billion tons of CO2 per year globally. These are some of the reasons why nations worldwide are making large-scale investments to advance a homegrown microelectronics R D, design and manufacturing base. It is no surprise, then, that semiconductors are now at the center of the so-called global techno-trade wars.Clearly, Europe urgently needs to mobilize and pool resources to develop effective lifelong learning programs for all workers and continue investing in microelectronics innovation. We need to instill the passion for creating technology among current and future workforce, in particular women and people with challenged backgrounds, and build a highly diverse talent pool. Working together, we can better demonstrate how computing technologies, including quantum, high-performance and edge AI, provide solutions to grand societal challenges and attract talented people to the fascinating world of electronic components and systems.Against this backdrop, the microelectronics industry finds the Pact for Skills very timely and crucial to advancing the talent pool underpinning Europe’s deep digital ecosystem. The Pact will play an instrumental role in improving the scope and the quality of training partnerships at regional, national and European levels, sharing best practices and helping the microelectronics industry and workforce adapt to the effects of COVID-19.The microelectronics industry is committed to building on the momentum created by the METIS Erasmus+ collaborative project and to mobilizing our ecosystem and education partners for a successful Pact for Skills in Microelectronics starting this year.The High-Level Roundtable: Skills for Microelectronics was hosted by Commissioner Thierry Breton and Commissioner Nicolas Schmit. Participants included Paul Boudre, CEO, SOITEC; Lars Reger, CEO Germany and CTO, NXP; Frits van Hout, Executive Vice-President and Chief Strategy Officer, ASML; Françoise Chombar, CEO, Melexis; Emmanuel Sabonnadiere, CEO, CEA-Leti; Luc Van den hove, President and CEO, imec; Sabine Nietzsche, Board member, Silicon Saxony and Vice President, GlobalFoundries; Laith Altimime, President, SEMI Europe (coordinator of METIS); Yolande Berbers, President, European Society for Engineering Education (SEFI); James Calleja, President, European Forum for Technical Vocational Education and Training (EFVET); Ludovic Voet, Confederal Secretary, European Trade Union Confederation (ETUC).Emir Demircan is director of Advocacy and Public Policy at SEMI Europe. To learn more about SEMI Europe advocacy, contact Emir at [email protected].

On 21 September, SEMI and a coalition of 40 industry organisations sent a letter to European Commission President Ursula von der Leyen calling for decisive action to solve implementation issues within the European Union Waste Framework Directive, specifically the Substances of Concern in Products (SCIP) database.The signatories, who represent a very significant part of the European economy, are requesting urgent resolution of implementation issues for the SCIP database, which is designed to support the circular economy as defined in the European Green Deal. The database is required under Article 9.1 of the updated Waste Framework Directive.In the letter, the signatories ask President von der Leyen to take immediate action to: Postpone the SCIP notification deadline of 5 January 2021 to at least one year after finalization of the database; Conduct a study on the usefulness, feasibility, proportionality and impact of the database; Instruct the European Chemicals Agency (ECHA) to adapt the SCIP database according to the outcome of the proposed study. ECHA failed to complete development of the database by the January 2020 deadline required by the Waste Framework Directive, leaving companies insufficient time to develop, test and adapt their own systems to meet the January 2021 SCIP notification deadline.Over the last two years, the signatories have repeatedly shared their serious concerns regarding the viability, proportionality and value of the SCIP database with the European Commission and the ECHA, yet those concerns remain unresolved.Contrary to the EU Better Regulation principles that call for open and transparent decision making, Article 9.1 was added to the revised Waste Framework Directive during the final stage of the co-decision process without any prior stakeholder consultation or impact assessment. A proper impact study should help shape the way forward to deliver on the EU ambition of driving a circular European economy.Coalition PartnersEmir Demircan is director of Advocacy and Public Policy at SEMI Europe.

Solving challenges in semiconductor manufacturing requires an ongoing collaborative effort by customers, device makers, equipment and materials suppliers, and academia. ASMC 2021 will continue efforts to help the industry overcome these hurdles. To that end, we are now soliciting abstracts from industry experts across all areas of semiconductor manufacturing for presentations at the event, May 3-6, 2021 at the Saratoga Hilton/Saratoga Springs City Center in Saratoga Springs, New York.The conference provides an unparalleled platform for semiconductor professionals to network and learn the latest information in the practical application of advanced manufacturing strategies and methodologies. ASMC 2021 will be co-chaired by Ishtiaq Ahsan, Ph.D. of IBM Research and Alexa Greer of KLA.We’re looking for presentations in topic areas including the following: Advanced Metrology Advanced Equipment Processes and Materials Contamination Free Manufacturing Big Data Management and Mining Defect Inspection and Reduction Equipment Optimization Factory Automation Industrial Engineering Smart Manufacturing Yield Methodologies Click here to submit an abstract for a technical presentation. Provide an extended abstract of no more than two pages (max. of 1000 words, MS Word or PDF) with supporting data, charts, figures embedded in the last page. See author kit for details. Summarize the topic and theme in as much detail as allowed by the word count limitation. Include title, author(s), company affiliation(s), contact information, topic and five key words describing the work. The final technical manuscript must show a complete set of data to support initial abstract. Here are key deadlines and dates for industry experts to keep in mind: Abstracts Due: October 30, 2020 Author Notification: December 15, 2020 Manuscripts Due: February 9, 2021 Final Manuscripts Due: April 6, 2021 Presentations Due: April 20, 2021 Conference Dates: May 3-6, 2021 ASMC 2021 could be held as a virtual event depending on progress in containing COVID-19. Whether the event is on-site or virtual, all abstracts accepted for presentation will be published by IEEE. Speakers should be prepared to present live or online.Speakers also may be invited to publish their papers in a special section of ASMC 2021, which will be featured in IEEE Transactions on Semiconductor Manufacturing. All technical presentations will be considered for the ASMC Best Paper Award sponsored by Entegris. Students presenting an oral paper or poster will be considered for the ASMC Best Student Paper Award sponsored by GLOBALFOUNDRIES.For a complete overview of topics and other information, please visit the ASMC 2021 Call for Papers web page.Margaret Kindling is senior manager of Programs for SEMI Americas.

Is your company working on the next big thing in flexible, hybrid and printed electronics – a breakthrough or innovation that will make the world safer, healthier or more productive for years to come? If so, we want to hear from you.You’re invited to deliver a technical presentation at virtual FLEX 2021, February 22-26, 2021. The call for abstracts is now open! Celebrating its 20th year, the online event will gather executives, product managers, business development professionals, and engineering directors as well as leading industry analysts and media for the latest developments, trends and innovations in flexible hybrid electronics (FHE). More than 400 companies, universities, R D labs, and government agencies from around the world have participated in FLEX conferences.Technical presentations should focus on the conference theme, 20 Years of Driving Innovation to Make the World Safer, covering flexible hybrid or printed electronics products, equipment, processes, materials, and the applications they enable. FLEX 2021 also takes aim at the future of the planet, so presentations on global sustainability in areas such as impacts, strategies, tactics, successes and progress area also a great fit. To submit your abstract, please complete the online form: Upload your abstract (100-300 words) describing the topic of your presentation and how it applies to the flexible, hybrid, and printed electronics products. Preference is given to original research and advancements in process and materials as they relate to end users. We also invite students from research universities to submit posters describing their work and results for the popular FLEX Poster Competition. As in the past, a panel of industry and academic experts will evaluate the posters and recognize the top three students and their work. Here are key deadlines and dates for industry experts and students to keep in mind: September 30, 2020 – Submit your abstract. October 31, 2020 – We’ll notify you whether your presentation has been accepted by this date. November 15, 2020 – Sign a Speaker Agreement and provide a bio and headshot. February 1, 2021 – Send us an electronic copy of your presentation. We’re looking for presentations in these topic areas: Flexible Hybrid Electronics Systems Materials Processing Sustainability and Power MEMS and Sensors Applications Presentations should include the following: Why the technology presented matters and to whom Practical recommendations for addressing commercialization issues or applications. This includes providing innovative technological or market solutions driven by a use case, the integration challenges you faced, and the system-level architecture decisions you made. Descriptions of how you overcame each challenge Ideas for what as an industry we should be working on and what are you working on to demonstrate sustainability For a full rundown on topics and other information, please visit the FLEX 2021 Call for Papers web page.Michelle Fabiano is a program and event manager for SEMI Americas.