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Blog
A Year of Progress for Semiconductor Cybersecurity
2025 was a milestone year for the Semiconductor Manufacturing Cybersecurity Consortium (SMCC). Across standards development, industry collaboration, and community engagement, the SMCC major...
Event
Physical Interfaces & Carriers Japan TC Chapter Meeting
Physical Interfaces & Carriers Japan TC Chapter Meeting Date: Thursday, December 18, 2025Time: 9:00 am - 12:00 pm JSTVenue: Room 905, TFT Building 9F, Tokyo, Japan in conjunction with...
Event
Compound Semiconductor Materials Japan TC Chapter Meeting
Compound Semiconductor Materials Japan TC Chapter MeetingDate: Thursday, December 18, 2025Time: 2:00 pm - 4:00 pm JSTVenue: Room 907, TFT Building East 9F in junction with SEMICON Japan + OVTCCM...
Event
Compound Semiconductor Materials Japan TC Chapter Meeting
Compound Semiconductor Materials Japan TC Chapter MeetingDate: Thursday, December 18, 2025Time: 2:00PM - 4:00PM JST via OVTCCM/ TFT Builiding...
Event
Silicon Wafer Japan TC Chapter Meeting
Silicon Wafer Japan TC Chapter MeetingDate: Thursday, December 18, 2025Time: 9:00AM - 12:00PM JST via OVTCCM/ TFT Builiding (Hybrid) AGENDA Standards...
Event
Metrics Japan TC Chapter
Metrics Japan TC Chapter Meeting Date: Thursday, December 18, 2025Time: 2:30 PM - 4:30 PM (JST)via Official Virtual TC Chapter Meeting + TFT Building (Hybrid)Please note that the meeting venue...
Member Company
Taiwan Stock Exchange Corporation
Member Company
EcoPulse
EcoPulse is an Austin-based AI company addressing the PFAS (“forever chemicals”) challenge with PFAS AI (patent pending), an AI platform that analyzes materials and supply chains to detect, map, and...
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ISS Speaker Bio - Dylan Patel, SemiAnalysis
Tokens to InfrastructureABSTRACTThis presentation will cover model progress, track AI token growth and intensity to translate demand into real infrastructure needs, and analyze how hardware–software...
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ISS Speaker Bio - Paul Lindner, EV Group
Wafer Bonding: A Cornerstone of Future Semiconductor ArchitecturesABSTRACTAs the semiconductor industry moves beyond traditional scaling, wafer bonding has emerged as a key technology for...
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MSEC 2026 Speaker Abstract & Bio - Stefan Majoni, PhD
Changes in MEMS Foundry Set Up for AI and Other Upcoming ChallengesABSTRACTComputational power, particularly for AI applications, is often limited by processor overheating and core-to-core...