Changes in MEMS Foundry Set Up for AI and Other Upcoming Challenges
ABSTRACT
Computational power, particularly for AI applications, is often limited by processor overheating and core-to-core communication bottlenecks. MEMS-based cooling presents an ideal solution for processors where traditional rack-level water cooling is unfeasible. Furthermore, thin-film lithium niobate offers a powerful complement to integrated photonics, which will be produced in MEMS fabs to avoid CMOS contamination concerns. This abstract will also explore other significant trends within the MEMS industry, including the advantages, disadvantages, and potential applications of 300mm MEMS wafer processing.
BIOGRAPHY
Stefan Majoni studied physical chemistry in Hannover and prepared his PhD in solid state electrochemistry. He has been working at IBM in DRAM wafer process development with focus on lithography driving KrF lithography down to 90nm line / 90nm space already in the year 2003. Subsequently, he had a similar task for Philips regarding ASIC process development. Since 2005 he joins Bosch in micromechanics in different management functions. This includes some experience in production and several roles in development, lately as head of department for MEMS process development. Currently he is responsible for the Bosch MEMS foundry service. Here he opened the Bosch manufacturing facility to support wafer processing for many customers in consumer, automotive, telecommunication, industrial and medical applications on 200mm and now also on 300mm. Additionally, wafer test, assembly, reliability testing and other services are available.