Wafer Bonding: A Cornerstone of Future Semiconductor Architectures
ABSTRACT
As the semiconductor industry moves beyond traditional scaling, wafer bonding has emerged as a key technology for heterogeneous integration and 3D architectures. Originally driven by MEMS applications, wafer bonding techniques such as fusion and hybrid bonding are now widely deployed in high-volume manufacturing for image sensors and advanced memory devices. Today, they support the scaling of advanced nodes and are critical for next-generation devices in artificial intelligence, high-performance computing, and photonics, addressing the growing demand for higher functionality and performance in compact form factors.
This presentation by EV Group will provide a comprehensive overview of wafer bonding’s impact on advanced semiconductor manufacturing. It will explore key application areas, highlight the synergy between wafer bonding and lithography, and discuss emerging integration flows for wafer-to-wafer as well as die-to-wafer bonding. Attendees will gain insights why wafer bonding is indispensable today and how it will shape the next generation of semiconductor technologies.
BIOGRAPHY
Paul Lindner is EV Group’s executive technology director. He heads the R&D, product
and project management, quality management, business development and process
technology departments. Customer orientation throughout all steps of product
development, innovation and implementation in a production environment are among the
main goals of EV Group's technology groups headed by Lindner.
Lindner joined the company in 1988 as a mechanical design engineer and has since
pioneered various semiconductor and MEMS processing systems, which have set industry
standards. His responsibilities included the design of semiconductor processing systems
and tooling for custom applications, including innovative system designs pioneered in the first commercially available wafer bonders, silicon-on-insulator (SOI) bonding systems and precision alignment systems for 3D interconnect applications. Prior to his appointment as
executive technology director, Lindner established a product management department at EV Group. During that time he was involved in marketing, sales, manufacturing and on-site process support.