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Member Press Release
Alex Chow Joins YES as Asia Sales President & GM: YES Expands Direct Asia Presence
FREMONT, Calif. – Dec 7, 2020 – YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and AR/VR applications, today...
SEMI Press Release
SEMI Issues Statement Supporting Microelectronics Industry Incentive Provisions in U.S. National Defense Authorization Act
MILPITAS, Calif. – December 4, 2020 – SEMI, the industry association serving the global electronics design and manufacturing supply chain, today released the following statement from president...
Event
Information & Control Japan TC Chapter Meeting
Japan TC Chapter Meeting of
Information & Control Global Technical Committee
Friday, December 4, 2020
13:00-15:00
SEMI Japan office, Tokyo
Agenda
Welcome / Call to...
Member Company
Advanced Micro Optics Instruments Inc
基于DLP 技术开发的直接成像技术（DI）可通过DMD直接将UV光投射在感光材料上，这种直接成像技术科替代传统的掩模曝光生产方式。相比传统的掩模曝光生产方式，直接成像技术不但可以缩短生产时间和降低生产成本，而且还可以实现更高的精度和更细的线宽/线间距。
Direct Imaging(DI) technology based on DLP technology can directly...
Page
Electron Microscopy Workflow Task Force Update
Electron Microscopy Workflow Task Force Probes Industry Preferences for Automated TEM Workflow Solutions
By Laurens Kwakman, Thermo Fisher Scientific, and Laura Nguyen, SEMI
In 2020, the SEMI...
Page
Ballot for ATE TEMS Out for Voting
Ballot for Automated Test Equipment Tester Event Messaging Out for Voting
By Michelle Sun, SEMI
FEBRUARY 2021 UPDATE: Standard for Automated Test Equipment Tester Event Being...
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Japan PLP Panel FOUP Highlights
Japan Panel Level Packaging Panel FOUP Activity Highlights
By Shoji Komatsu, Acteon NEXT
The activity of the Panel Level Packaging (PLP) Panel FOUP Task Force (TF) started in May 2018 and...
Page
SEMI D75 Update
Display Brightness Calculation to Match the Human Perception
By Jongho Chong, Samsung Display and Natalie Shim, SEMI Korea
SEMI D75, Test Method for Color Reproduction and Perceptual Contrast...
Page
200 mm SiC Wafer Specification Update
200 mm Silicon Carbide Wafer Specification and Marking Update
By Kevin Nguyen, SEMI
FEBRUARY 2021 UPDATE:
The ballot for SiC Material and Wafer Specification Task Force is now available for...
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SEMI Standards – Official Virtual Meetings Underway
SEMI Standards – Official Virtual Technical Committee Chapter Meetings Underway
By James Amano, SEMI
While the COVID-19 pandemic has made...
Member Press Release
Plasma-Therm Announces Acquisition of OEM Group PVD, RTP and Etch Business
ST. PETERSBURG, Fla. (Dec. 3, 2020) — Plasma-Therm, a leading manufacturer of plasma-process equipment for the semiconductor industry, announced today the acquisition of OEM Group’s dry process...