Japan Panel Level Packaging Panel FOUP Activity Highlights
By Shoji Komatsu, Acteon NEXT
The activity of the Panel Level Packaging (PLP) Panel FOUP Task Force (TF) started in May 2018 and nearly 40 Task Force meetings have been held since its foundation. The number of participating companies exceeds 40, and 91 TF registered members are active.
We have standardized the panel FOUP, which is a storage container in the process, for the two panel sizes of 510 mm x 515 mm and 600 mm x 600 mm standardized in the SEMI 3D20: Specification for Panel Characteristics for Panel Level Packaging (PLP) Applications.
Task Force Activity Policy
In order to realize smooth implementation of PLP, standardization of physical interfaces such as FOUP and LP is considered to be prerequisite by the relevant suppliers from cost performance and time-to-market point of views. After several discussions, the Panel Level Packaging (PLP) Panel FOUP TF currently assumes two sizes of panels, 510 x 515 sizes and 600 x 600 sizes based on the SEMI 3D20 Standard.
To follow the concepts of the 450 PIC Standards Suite as for the Door I/F and Positioning I/F between FOUP and LP is acceptable for the Users.
TF Participating Companies
The Panel FOUP standard consists of one parent document and four subordinate documents.
Status: The original vote was TC approved but has ratified some technical changes.
The Panel FOUP LP standard consists of one parent document and two subordinate documents.
Status: TC approval is planned during this SEMICON Japan period.
The letter ballot review for Documents 6618, 6619, 6620, 6621 and 6622 was finally executed in September, which had been postponed by the impact of COVID-19, and the TC Chapter decided to incorporate technical changes to each ballot in order to address the negatives and technical issues. Now those Ratification Ballots are in voting Cycle 8-2020.
- R6618: New Standard – Specification for Panel FOUP for Panel Level Packaging
- R6619: New Subordinate Standard – Specification for Panel FOUP for 510mm-515mm Panel Size and 12 Slots
- R6620: New Subordinate Standard – Specification for Panel FOUP for 510mm-515mm Panel Size and 6 Slots
- R6621: New Subordinate Standard – Specification for Panel FOUP for 600mm-600mm Panel Size and 12 Slots
- R6622: New Subordinate Standard – Specification for Panel FOUP for 600mm-600mm Panel Size and 6 Slots
If there are no issue to be discussed, those ballots are expected to be published as SEMI Standards by early spring 2020.
For Loadport/EFEM, which is the opening/closing device for panel FOUP, we are developing a total of 3 documents, a parent document that describes common specifications and two Subordinate documents that are classified according to the panel size. Now those letter ballots are also in Cycle 8-2020 and are currently receiving votes from the PI&C Global TC members.
- 6684: New Standard – Specification for Panel FOUP Loadport for Panel Level Packaging
- 6685: New Subordinate Standard – Specification for Panel FOUP Loadport for 510mm-515mm Panel Size
- 6686: New Subordinate Standard – Specification for Panel FOUP Loadport for 600mm-600mm Panel Size
The voting results of those three letter ballots above will be reviewed at the Japan TC Chapter meeting held on December 22, 2020.
These Standards have been developed in a timely manner prior to the start of mass production of PLP, thanks to the task force members. We hope that these Standards could contribute to the development of the PLP industry. I am deeply grateful to the task force members for their cooperation.
Get Involved
SEMI Standards development activities take place throughout the year in all major manufacturing regions. To get involved, join the SEMI International Standards Program at: www.semi.org/standardsmembership.
For more information, please visit our main Web site and current events page. If you have any questions regarding SEMI Standards activities, please contact your local SEMI Standards staff.
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December 3, 2020