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SiC—Silicon Carbide Material Properties, Key Applications, and Fabrication Basics: Making the Transition from Silicon Silicon (Si) power devices have dominated power electronics due to their...

Reflections from the Director’s Desk By Paul Trio, Director, Standards To our esteemed Program Members – As some of you have already heard, I was appointed earlier this year to lead our SEMI...

Detecting the Detection Limits for Semiconductor Materials – The SEMI C10 Workshop at SEMICON West 2022 Hybrid   Establishing detection limits for materials in semiconductor manufacturing has...

Overview on SEMI S2 Tutorial Seminar By Hidetoshi Sakura, SEMI Japan Region EHS Technical Committee co-chair and S2 Overview Seminar Program Chair, NuFlare Technology, Inc.  In this seminar,...

New China Advanced Backend Factory Integration Standards Activity By Clare Liu, Leader of the SEMI Information & Control China Advanced Backend Factory Integration Task Force, KXWARE As backend...

New China GEM300 Task Force By Lin Cui, Leader of the SEMI Information & Control China GEM 300 Task Force, NAURA During the SEMI Information & Control (I&C) China Technical Committee...

New Proposal for Equipment Operator Access Management By Michelle Sun, SEMI HQ In a typical manufacturing equipment setting, most operating equipment does not identify the specific operators during...

Standards for MEMS and Miniaturized Gas Sensors By Sreeni Rao, Leader of the SEMI MEMS/NEMS North America MEMS and Miniaturized Gas Sensing Task Force, TDK Invensense In recent years, general...

New SEMI Standard for Density and Porosity of the Chemical Mechanical Planarization Pads By Alexander Tregub, Leader of the SEMI Liquid Chemicals North America Chemical Mechanical Planarization...