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Member Press Release
Closing the Loop – Integrated Waste Gas & Water Treatment Solutions at SEMICON Southeast Asia 2026
Kuala Lumpur, Malaysia, 29 April 2026 – DAS Environmental Experts presents its latest sustainable technologies at SEMICON SEA 2026 (May 5–7, MITEC, Booth 1174). The focus is on closing resource loops...
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SPCC 2026 Bio Koji Nakata
Improvement of Hybrid Bonding By Controlling Surface with Copper Pads Using Functional WaterABSTRACTThe strong demand for higher device integration density in advanced semiconductor manufacturing has...
Blog
Connecting the Microelectronics Industry with Exceptional Talent – Insights From Swansea University
To help meet growing chip demand, more large chip manufacturers are building new fabs, especially in Europe and the United States, even as the semiconductor industry continues to struggle to attract...
Blog
Taking Microelectronics Learning Across Borders with SEMI High Tech U
SEMI High Tech U is making waves around the world, introducing students and educators to the fascinating world of microelectronics through hands-on, experiential STEM learning kits. The SEMI...
Member Company
Durex Industries
Durex Industries is an innovative, rooted company seeking the most challenging work to enable the future of semiconductor processing. Durex is an ISO 9001:2008 certified manufacturer of bespoke...
Member Company
NIKON CORPORATION
Nikon is one of the world's leading suppliers of products and solutions based on advanced opto-electronics and precision technologies. Nikon was first made famous by our cameras and binoculars,...
SEMI Press Release
ASML Wins SEMI Americas Award for EUV Technology at Virtual SEMICON West
MILPITAS, Calif. – July 20, 2020 – ASML, an innovation leader in the semiconductor industry that supplies chipmakers with key lithographic tools for imaging patterns on wafers, has won the 2020 SEMI...
Blog
X-FAB Tackles Workforce Challenges in Chip Manufacturing with Fab Owners Alliance Support
Now, more than ever, semiconductor companies are relying on their human resources departments to ensure employee safety, support facility access and hygiene measures, cope with staffing demands and...
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ISS Speaker Bio - Jean-Christophe Eloy, Yole Group
How Advanced Packaging is Enabling the Most Complicated Devices, Both for More Moore And More Than Moore Applications ?ABSTRACTWhat are the links between HBM, chiplet, Silicon photonics, and AR...
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ITPC Speaker Bio - Rick Gottscho, PhD
BIOGRAPHY
Richard (Rick) A. Gottscho is executive vice president and strategic advisor to the CEO – Innovation Ecosystem at Lam Research, where he develops strategies and leads collaborations to...
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ASMC 2020 - Session 1
Session 1—Yield Enhancement / Yield Methodologies
Chairs: Ishtiaq Ahsan, IBM Research; Janay Camp, KLA; Gary Green, Green Technology Consulting; Dieter Rathei, D R Yield
Yield improvement in...