How Advanced Packaging is Enabling the Most Complicated Devices, Both for More Moore And More Than Moore Applications ?
ABSTRACT
What are the links between HBM, chiplet, Silicon photonics, and AR displays ? They are very complex devices, with multiple different processes stacked/assembled together that needs to be packaged and tested in large volume, with a yield as high as possible as these devices (almost modules) are very expensive. Advanced packaging is all about that, putting together diverse devices to deliver a function at a limited cost. This presentation will highlight the expected market, technology and supply chain evolution of the advanced packaging, from AI chips to integrated photonics modules.
BIOGRAPHY
Jean-Christophe Eloy is President & Chairman of the Yole Group. Created in 1998, the market research & strategy consulting company has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to corporate finance services. His mission is to oversee the strategic direction of Yole Group.
All year long, Jean-Christophe builds deep relationships with leading semiconductor companies, discussing and sharing information across his global network. His aim is to get a comprehensive understanding of their strengths and guide their success.
Jean-Christophe is a graduate from EMLyon Business School (Lyon, France) and has a Ph.D. in Semiconductor Engineering from the National Polytechnic Institute of Grenoble (France).