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Use of Silicon-Based Additives and Their Mechanistic Role in Enhancing the Selectivity of Wet Etching Process on Sige over Si/SioABSTACTSelective etching is a critical enabler for nascent advanced...

Challenges and Benefits of Using 2-in-1 Filtration Solutions for Contamination Control in Semiconductor Deionized Water (Diw) ApplicationsABSTACTUltrapure deionized water (DIW) is essential in...

NMP Free Positive Photo Resist Stripping with E-GRADE® MEOXABSTACTHuntsman is committed to delivering solutions that support a more sustainable future. Our technologies help address critical...

Development of Highly Sensitive Detection for Impurities and Nanoparticles in Liquid Chemicals Using Aerosol TechnologyABSTRACTIn semiconductor manufacturing, a wide variety of chemical solutions are...

Atmospheric Plasma–Based Surface Cleaning Solutions for Advanced Electronics ManufacturingABSTRACTSThe continuous scaling and increasing complexity of electronic devices demand advanced surface...

The Critical Role of Pre-Saturated Cleanroom Wipers in Contamination Control for Advanced Semiconductor ManufacturingABSTRACTAs semiconductor feature sizes continue to shrink and yield requirements...

Low Stiction PFR FFKM and Related Test Method ABSTRACTPerfluoroelastomers (FFKMs) are key raw materials for producing seal elements for applications in semiconductor manufacturing. Beside the...

BIOGRAPHY Mr. Wagner has been in the semiconductor wet processing and chemical wet bench industry since 1981. He joined Modutek in 1987 and has been with the company for over 30 years. He has...

Quantitative Analysis of Damage Depth in Highly Selective Etching and Cleaning Processes for Spacer Nitride PreservationABSTRACTIn advanced device integration, highly selective etching and post-etch...

Highly Selective SiOC Etch for Advanced Sub-3nm ApplicationsABSTRACTSilicon Oxycarbide (SiOC) is a hybrid low-k dielectric material which comprises between k-values and robustness.  It is widely...

Semiconductor Equipment Part Coating Opportunities with Atomic Layer Deposition (ALD)ABSTRACTAs semiconductor architectures evolve toward 3D logic and memory, part coatings must address escalating...