Semiconductor Equipment Part Coating Opportunities with Atomic Layer Deposition (ALD)
ABSTRACT
As semiconductor architectures evolve toward 3D logic and memory, part coatings must address escalating challenges from aggressive plasma etching, heightened corrosion risks, and stricter particle control. Smaller logic designs with gate-all-around (GAA) structures and 3D NAND with increased layers and data density (e.g., QLC) amplify defect sensitivity, demanding superior contamination management and process control.
This presentation explores how atomic layer deposition (ALD) unlocks innovative coating solutions for critical chamber and component parts, complementing traditional methods like anodization and plasma spray. Attendees—including part coating vendors, equipment suppliers, and part manufacturers—will gain insights into market trends, material options, integration strategies, and market forecasts and positioning strategies. Discover opportunities to extend part lifetime, reduce defects, and boost yields in the global semiconductor ecosystem.
BIOGRAPHY
Dr. Alexander Perros leads business development for Beneq’s Advanced ALD Business Unit. With over 15 years in semiconductor R&D, manufacturing and materials, he brings deep expertise in ALD, process integration and thin films, built through roles at Beneq, Summa Semiconductor, and as co-founder of cleanroom services firm Nanovate.